CN102265388A - 热固型芯片接合薄膜 - Google Patents

热固型芯片接合薄膜 Download PDF

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Publication number
CN102265388A
CN102265388A CN200980152612XA CN200980152612A CN102265388A CN 102265388 A CN102265388 A CN 102265388A CN 200980152612X A CN200980152612X A CN 200980152612XA CN 200980152612 A CN200980152612 A CN 200980152612A CN 102265388 A CN102265388 A CN 102265388A
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China
Prior art keywords
die
bonding film
bonding
weight
film
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CN200980152612XA
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English (en)
Chinese (zh)
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林美希
高本尚英
大西谦司
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Nitto Denko Corp
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Nitto Denko Corp
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Publication of CN102265388A publication Critical patent/CN102265388A/zh
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    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
CN200980152612XA 2008-12-24 2009-12-22 热固型芯片接合薄膜 Pending CN102265388A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2008-328341 2008-12-24
JP2008328341 2008-12-24
JP2009288001A JP2010171402A (ja) 2008-12-24 2009-12-18 熱硬化型ダイボンドフィルム
JP2009-288001 2009-12-18
PCT/JP2009/071292 WO2010074060A1 (ja) 2008-12-24 2009-12-22 熱硬化型ダイボンドフィルム

Publications (1)

Publication Number Publication Date
CN102265388A true CN102265388A (zh) 2011-11-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980152612XA Pending CN102265388A (zh) 2008-12-24 2009-12-22 热固型芯片接合薄膜

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Country Link
US (1) US20120153508A1 (https=)
JP (1) JP2010171402A (https=)
KR (1) KR20110099116A (https=)
CN (1) CN102265388A (https=)
TW (2) TWI504715B (https=)
WO (1) WO2010074060A1 (https=)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101864249A (zh) * 2009-04-17 2010-10-20 古河电气工业株式会社 粘接膜及晶片加工用带
CN104119812A (zh) * 2013-04-25 2014-10-29 日东电工株式会社 胶粘薄膜、切割/芯片接合薄膜、半导体装置的制造方法以及半导体装置
CN104946150A (zh) * 2014-03-31 2015-09-30 日东电工株式会社 芯片接合膜、带有切割片的芯片接合膜、半导体装置及半导体装置的制造方法
CN104946153A (zh) * 2014-03-31 2015-09-30 日东电工株式会社 热固型芯片接合薄膜、切割/芯片接合薄膜及半导体装置的制造方法
CN105324240A (zh) * 2013-06-24 2016-02-10 日东电工株式会社 透明导电性层叠膜、其制造方法及触摸面板
CN107868404A (zh) * 2016-09-23 2018-04-03 住友电木株式会社 热固性树脂组合物、树脂密封基板和电子装置
CN108780782A (zh) * 2017-01-25 2018-11-09 深圳市汇顶科技股份有限公司 晶片封装结构及封装方法
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