CN102257640B - 雪崩光电二极管 - Google Patents
雪崩光电二极管 Download PDFInfo
- Publication number
- CN102257640B CN102257640B CN200980150764.6A CN200980150764A CN102257640B CN 102257640 B CN102257640 B CN 102257640B CN 200980150764 A CN200980150764 A CN 200980150764A CN 102257640 B CN102257640 B CN 102257640B
- Authority
- CN
- China
- Prior art keywords
- layer
- mentioned
- electrode layer
- avalanche multiplication
- light absorbing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005684 electric field Effects 0.000 claims description 56
- 239000000758 substrate Substances 0.000 claims description 15
- 230000007935 neutral effect Effects 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 6
- 230000031700 light absorption Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 9
- 238000000576 coating method Methods 0.000 claims 9
- 238000007598 dipping method Methods 0.000 claims 2
- 230000015556 catabolic process Effects 0.000 abstract description 23
- 238000000098 azimuthal photoelectron diffraction Methods 0.000 description 60
- 238000002347 injection Methods 0.000 description 14
- 239000007924 injection Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 4
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/225—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier working in avalanche mode, e.g. avalanche photodiodes
- H10F30/2255—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier working in avalanche mode, e.g. avalanche photodiodes in which the active layers form heterostructures, e.g. SAM structures
Landscapes
- Light Receiving Elements (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-321298 | 2008-12-17 | ||
JP2008321298A JP4728386B2 (ja) | 2008-12-17 | 2008-12-17 | アバランシ・フォトダイオード |
PCT/JP2009/070783 WO2010071088A1 (ja) | 2008-12-17 | 2009-12-11 | アバランシ・フォトダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102257640A CN102257640A (zh) | 2011-11-23 |
CN102257640B true CN102257640B (zh) | 2014-03-12 |
Family
ID=42268759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980150764.6A Active CN102257640B (zh) | 2008-12-17 | 2009-12-11 | 雪崩光电二极管 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8575650B2 (und) |
EP (1) | EP2378567B1 (und) |
JP (1) | JP4728386B2 (und) |
CN (1) | CN102257640B (und) |
WO (1) | WO2010071088A1 (und) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5631668B2 (ja) * | 2010-09-02 | 2014-11-26 | Nttエレクトロニクス株式会社 | アバランシ・フォトダイオード |
JP5327892B2 (ja) * | 2010-09-02 | 2013-10-30 | Nttエレクトロニクス株式会社 | アバランシ・フォトダイオード |
JP5649219B2 (ja) | 2011-01-24 | 2015-01-07 | Nttエレクトロニクス株式会社 | 半導体装置 |
EP2850665A4 (en) * | 2012-05-17 | 2016-03-02 | Picometrix Llc | PLANARE LAWINEN PHOTODIODE |
US20150179863A1 (en) * | 2013-12-20 | 2015-06-25 | The Regents Of The University Of California | Avalanche photodiode utilizing interfacial misfit array |
JP6130318B2 (ja) * | 2014-03-18 | 2017-05-17 | 日本電信電話株式会社 | アバランシェフォトダイオード |
JP2016032034A (ja) * | 2014-07-29 | 2016-03-07 | Nttエレクトロニクス株式会社 | アバランシェフォトダイオード |
JP5844445B2 (ja) * | 2014-09-10 | 2016-01-20 | Nttエレクトロニクス株式会社 | アバランシ・フォトダイオード |
WO2016088668A1 (ja) | 2014-12-05 | 2016-06-09 | 日本電信電話株式会社 | アバランシェ・フォトダイオード |
CN105514186B (zh) * | 2015-12-29 | 2017-09-26 | 中国计量学院 | 一种宽波段探测的光电探测器 |
CN108351366A (zh) * | 2016-01-25 | 2018-07-31 | 京瓷株式会社 | 测量传感器用封装体以及测量传感器 |
US9466751B1 (en) * | 2016-03-04 | 2016-10-11 | National Central University | Avalanche photodiode having electric-field confinement by mesas |
EP3680941B1 (en) * | 2017-09-06 | 2022-09-28 | Nippon Telegraph and Telephone Corporation | Avalanche photodiode and method for manufacturing same |
US11329179B2 (en) * | 2017-09-15 | 2022-05-10 | Mitsubishi Electric Corporation | Semiconductor light-receiving device and method for manufacturing the same |
CN110611000A (zh) * | 2018-08-02 | 2019-12-24 | 深圳市芯思杰联邦国际科技发展有限公司 | 一种背入式雪崩光电探测器芯片及其制作方法 |
EP4064369B1 (en) * | 2019-11-18 | 2025-04-30 | Nippon Telegraph And Telephone Corporation | Avalanche photodiode |
JP7452552B2 (ja) * | 2019-11-18 | 2024-03-19 | 日本電信電話株式会社 | 受光素子の製造方法 |
CN111403540B (zh) * | 2020-01-15 | 2022-02-15 | 华中科技大学 | 一种雪崩光电二极管 |
TWI728694B (zh) * | 2020-02-12 | 2021-05-21 | 國立中央大學 | 混層複合式充電層累增崩潰光二極體 |
US11056604B1 (en) * | 2020-02-18 | 2021-07-06 | National Central University | Photodiode of avalanche breakdown having mixed composite charge layer |
JP7615412B1 (ja) * | 2024-03-26 | 2025-01-16 | 三菱電機株式会社 | 半導体受光素子、半導体受光素子の製造方法、光回線終端装置、多値強度変調送受信装置、デジタルコヒーレント受信装置、光ファイバ無線システム、spadセンサーシステム、及びライダー装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1445864A (zh) * | 2001-09-06 | 2003-10-01 | 住友电气工业株式会社 | ZnMgSSe系正-本-负光电二极管以及ZnMgSSe系雪崩二极管 |
CN1933187A (zh) * | 2005-09-12 | 2007-03-21 | 三菱电机株式会社 | 雪崩光电二极管 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5654080A (en) * | 1979-10-08 | 1981-05-13 | Kokusai Denshin Denwa Co Ltd <Kdd> | Avalanche photodiode |
JP2601231B2 (ja) * | 1994-12-22 | 1997-04-16 | 日本電気株式会社 | 超格子アバランシェフォトダイオード |
US5610416A (en) * | 1995-02-16 | 1997-03-11 | Hewlett-Packard Company | Avalanche photodiode with epitaxially regrown guard rings |
JPH11330536A (ja) * | 1998-05-13 | 1999-11-30 | Nec Corp | 半導体受光素子 |
JP3141847B2 (ja) * | 1998-07-03 | 2001-03-07 | 日本電気株式会社 | アバランシェフォトダイオード |
US6891202B2 (en) * | 2001-12-14 | 2005-05-10 | Infinera Corporation | Oxygen-doped Al-containing current blocking layers in active semiconductor devices |
US7122734B2 (en) * | 2002-10-23 | 2006-10-17 | The Boeing Company | Isoelectronic surfactant suppression of threading dislocations in metamorphic epitaxial layers |
JP4191564B2 (ja) * | 2003-09-10 | 2008-12-03 | Nttエレクトロニクス株式会社 | アバランシ・フォトダイオード |
JP4127815B2 (ja) * | 2003-11-10 | 2008-07-30 | 日本電信電話株式会社 | アバランシェフォトダイオード |
JP2005223022A (ja) * | 2004-02-03 | 2005-08-18 | Ntt Electornics Corp | アバランシ・フォトダイオード |
JP4234116B2 (ja) * | 2005-06-27 | 2009-03-04 | Nttエレクトロニクス株式会社 | アバランシ・フォトダイオード |
KR101384247B1 (ko) * | 2006-04-28 | 2014-04-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 광전변환소자 및 광전변환소자의 제작 방법 |
JP2009252769A (ja) | 2008-04-01 | 2009-10-29 | Nec Corp | 半導体受光素子 |
-
2008
- 2008-12-17 JP JP2008321298A patent/JP4728386B2/ja active Active
-
2009
- 2009-12-11 US US13/133,990 patent/US8575650B2/en active Active
- 2009-12-11 EP EP09833391.7A patent/EP2378567B1/en active Active
- 2009-12-11 WO PCT/JP2009/070783 patent/WO2010071088A1/ja active Application Filing
- 2009-12-11 CN CN200980150764.6A patent/CN102257640B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1445864A (zh) * | 2001-09-06 | 2003-10-01 | 住友电气工业株式会社 | ZnMgSSe系正-本-负光电二极管以及ZnMgSSe系雪崩二极管 |
CN1933187A (zh) * | 2005-09-12 | 2007-03-21 | 三菱电机株式会社 | 雪崩光电二极管 |
Non-Patent Citations (1)
Title |
---|
JP特开2007-5697A 2007.01.11 |
Also Published As
Publication number | Publication date |
---|---|
US8575650B2 (en) | 2013-11-05 |
WO2010071088A1 (ja) | 2010-06-24 |
EP2378567A4 (en) | 2015-08-12 |
CN102257640A (zh) | 2011-11-23 |
JP4728386B2 (ja) | 2011-07-20 |
US20110241150A1 (en) | 2011-10-06 |
JP2010147177A (ja) | 2010-07-01 |
EP2378567A1 (en) | 2011-10-19 |
EP2378567B1 (en) | 2019-06-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102257640B (zh) | 雪崩光电二极管 | |
US7880197B2 (en) | Avalanche photodiode having doping region with monotonically increasing concentration distribution | |
CN101312221B (zh) | 半导体受光元件及其制造方法 | |
US8729602B2 (en) | Avalanche photodiode | |
US9006854B2 (en) | Avalanche photodiode | |
CN103811586B (zh) | 雪崩光电二极管及其制造方法 | |
JP2010135360A (ja) | アバランシェフォトダイオード | |
JP2007311720A (ja) | 半導体受光素子 | |
CN103403848B (zh) | 半导体器件 | |
JP2010147158A (ja) | 半導体受光素子および半導体受光素子の製造方法 | |
CN116601779A (zh) | 雪崩光电二极管 | |
US10079324B2 (en) | Semiconductor light-receiving device | |
US9406830B1 (en) | Semiconductor light-receiving device | |
JPS6358382B2 (und) | ||
JP5303793B2 (ja) | フォトダイオード | |
JP4191564B2 (ja) | アバランシ・フォトダイオード | |
JP2016004936A (ja) | 受光素子およびエピタキシャルウエハ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |