CN102256909B - 用于制造有机光电子结构元件的方法以及有机光电子结构元件 - Google Patents

用于制造有机光电子结构元件的方法以及有机光电子结构元件 Download PDF

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Publication number
CN102256909B
CN102256909B CN200980151500.2A CN200980151500A CN102256909B CN 102256909 B CN102256909 B CN 102256909B CN 200980151500 A CN200980151500 A CN 200980151500A CN 102256909 B CN102256909 B CN 102256909B
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substrate
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area
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Chinese (zh)
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CN102256909A (zh
Inventor
安杰拉·埃贝哈特
蒂尔曼·施伦克尔
马克·菲利彭斯
乌尔丽克·比尔
约阿基姆·维特-舍恩
弗洛里安·佩什科勒
埃瓦尔德·珀斯尔
卡斯藤·霍伊泽尔
阿尔弗雷德·兰格
马丁·穆勒
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
CN200980151500.2A 2008-12-18 2009-12-10 用于制造有机光电子结构元件的方法以及有机光电子结构元件 Active CN102256909B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008063636.3 2008-12-18
DE102008063636A DE102008063636A1 (de) 2008-12-18 2008-12-18 Verfahren zur Herstellung eines organischen optoelektronischen Bauelements und organisches optoelektronisches Bauelement
PCT/EP2009/066843 WO2010079038A1 (de) 2008-12-18 2009-12-10 Verfahren zur herstellung eines organischen optoelektronischen bauelements und organisches otpoelektronisches baulelement

Publications (2)

Publication Number Publication Date
CN102256909A CN102256909A (zh) 2011-11-23
CN102256909B true CN102256909B (zh) 2014-11-26

Family

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CN200980151500.2A Active CN102256909B (zh) 2008-12-18 2009-12-10 用于制造有机光电子结构元件的方法以及有机光电子结构元件

Country Status (7)

Country Link
US (1) US20120139001A1 (enExample)
EP (1) EP2367768A1 (enExample)
JP (1) JP5611226B2 (enExample)
KR (1) KR20110112359A (enExample)
CN (1) CN102256909B (enExample)
DE (1) DE102008063636A1 (enExample)
WO (1) WO2010079038A1 (enExample)

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US20120017980A1 (en) * 2010-07-21 2012-01-26 Du Pont Apollo Limited Photovoltaic panel and method of manufacturing the same
DE102011084276B4 (de) 2011-10-11 2019-10-10 Osram Oled Gmbh Verkapselung für ein organisches elektronisches bauelement, ein organisches elektronisches bauelement mit der verkapselung und ein verfahren zur herstellung eines organischen elektronischen bauelements mit der verkapselung
DE102012222760A1 (de) * 2012-12-11 2014-06-12 Osram Opto Semiconductors Gmbh Abdunkelbare spiegelvorrichtung
TWI508171B (zh) * 2013-02-05 2015-11-11 Ind Tech Res Inst 半導體元件結構及其製造方法
CN103325813B (zh) * 2013-05-24 2015-12-02 京东方科技集团股份有限公司 一种oled显示面板及其封装方法、显示装置
KR102135453B1 (ko) * 2013-05-24 2020-07-20 삼성디스플레이 주식회사 접착필름 및 이를 이용해 제조된 유기전계발광 표시장치
DE102014101489B4 (de) * 2014-02-06 2023-03-02 Pictiva Displays International Limited Verfahren zur Herstellung einer optoelektronischen Anordnung
US9535173B2 (en) * 2014-09-11 2017-01-03 General Electric Company Organic x-ray detector and x-ray systems
CN104538561B (zh) 2015-01-13 2016-08-31 京东方科技集团股份有限公司 封装方法、显示面板及显示装置
CN104576967A (zh) * 2015-01-26 2015-04-29 深圳市华星光电技术有限公司 Oled封装结构及oled封装方法
CN108630829B (zh) * 2017-03-17 2019-11-08 京东方科技集团股份有限公司 显示面板的制作方法、显示面板及显示装置
JP7579201B2 (ja) * 2021-04-23 2024-11-07 シャープ福山レーザー株式会社 発光装置

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JP2004087369A (ja) * 2002-08-28 2004-03-18 Nippon Sheet Glass Co Ltd Ｅｌ素子用封止板及びその製造方法、並びに該封止板多面取り用マザーガラス基板

Also Published As

Publication number Publication date
JP5611226B2 (ja) 2014-10-22
EP2367768A1 (de) 2011-09-28
JP2012513079A (ja) 2012-06-07
US20120139001A1 (en) 2012-06-07
KR20110112359A (ko) 2011-10-12
DE102008063636A1 (de) 2010-06-24
WO2010079038A1 (de) 2010-07-15
CN102256909A (zh) 2011-11-23

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C06 Publication
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SE01 Entry into force of request for substantive examination
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Effective date of registration: 20160527

Address after: Regensburg, Germany

Patentee after: OSRAM OPTO SEMICONDUCTORS GMBH

Address before: Regensburg, Germany

Patentee before: Osram Opto Semiconductors GmbH