CN102245006A - 电子设备的冷却方法以及冷却系统 - Google Patents
电子设备的冷却方法以及冷却系统 Download PDFInfo
- Publication number
- CN102245006A CN102245006A CN2011101077064A CN201110107706A CN102245006A CN 102245006 A CN102245006 A CN 102245006A CN 2011101077064 A CN2011101077064 A CN 2011101077064A CN 201110107706 A CN201110107706 A CN 201110107706A CN 102245006 A CN102245006 A CN 102245006A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- evaporator
- temperature
- refrigerant liquid
- cold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 163
- 239000003507 refrigerant Substances 0.000 claims abstract description 168
- 239000007788 liquid Substances 0.000 claims abstract description 127
- 230000004087 circulation Effects 0.000 claims abstract description 67
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 86
- 230000008859 change Effects 0.000 claims description 57
- 238000001704 evaporation Methods 0.000 claims description 47
- 238000000605 extraction Methods 0.000 claims description 26
- 239000006200 vaporizer Substances 0.000 claims description 15
- 238000002309 gasification Methods 0.000 claims description 12
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 238000009833 condensation Methods 0.000 abstract description 16
- 230000005494 condensation Effects 0.000 abstract description 16
- 239000007789 gas Substances 0.000 description 109
- 230000009467 reduction Effects 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008520 organization Effects 0.000 description 3
- 230000006641 stabilisation Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000009931 harmful effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/30—Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/70—Control systems characterised by their outputs; Constructional details thereof
- F24F11/72—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure
- F24F11/74—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure for controlling air flow rate or air velocity
- F24F11/76—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure for controlling air flow rate or air velocity by means responsive to temperature, e.g. bimetal springs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/06—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the arrangements for the supply of heat-exchange fluid for the subsequent treatment of primary air in the room units
- F24F3/065—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the arrangements for the supply of heat-exchange fluid for the subsequent treatment of primary air in the room units with a plurality of evaporators or condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
- F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combustion & Propulsion (AREA)
- Chemical & Material Sciences (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Air Conditioning Control Device (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010106788A JP2011237887A (ja) | 2010-05-06 | 2010-05-06 | 電子機器の冷却方法及び冷却システム |
JP2010-106788 | 2010-05-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102245006A true CN102245006A (zh) | 2011-11-16 |
Family
ID=44203182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011101077064A Pending CN102245006A (zh) | 2010-05-06 | 2011-04-28 | 电子设备的冷却方法以及冷却系统 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110271695A1 (ja) |
JP (1) | JP2011237887A (ja) |
CN (1) | CN102245006A (ja) |
GB (1) | GB2480152B (ja) |
NL (1) | NL2006727C2 (ja) |
SG (1) | SG176365A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105430997A (zh) * | 2014-09-22 | 2016-03-23 | 中国移动通信集团广东有限公司 | 一种热管内循环式二次冷媒环路服务器机柜散热系统 |
CN105746008A (zh) * | 2013-11-20 | 2016-07-06 | 日本电气株式会社 | 电子设备收纳装置以及电子设备冷却系统 |
CN108055813A (zh) * | 2017-12-28 | 2018-05-18 | 北京百度网讯科技有限公司 | 数据中心的制冷系统及制冷方法 |
CN108990392A (zh) * | 2018-09-06 | 2018-12-11 | 郑州云海信息技术有限公司 | 一种多冷源模块化数据中心 |
CN110164792A (zh) * | 2018-02-13 | 2019-08-23 | 东京毅力科创株式会社 | 冷却系统 |
CN110440522A (zh) * | 2019-06-28 | 2019-11-12 | 安徽国际商务职业学院 | 一种电子元件加工用冷却装置 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8789384B2 (en) * | 2010-03-23 | 2014-07-29 | International Business Machines Corporation | Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchanger |
SG10201507946QA (en) * | 2010-06-23 | 2015-10-29 | Inertech Ip Llc | Space-saving high-density modular data center and an energy-efficient cooling system |
EP2681978A1 (en) | 2011-03-02 | 2014-01-08 | Inertech IP LLC | Modular it rack cooling assemblies and methods for assembling same |
US8711563B2 (en) * | 2011-10-25 | 2014-04-29 | International Business Machines Corporation | Dry-cooling unit with gravity-assisted coolant flow |
EP2835715A4 (en) * | 2012-04-02 | 2015-12-16 | Fujitsu Ltd | DATA CENTER OF THE MODULAR TYPE |
WO2013171803A1 (ja) * | 2012-05-18 | 2013-11-21 | 三菱電機株式会社 | ヒートポンプ装置 |
CN103429022B (zh) * | 2012-05-23 | 2016-09-07 | 华为技术有限公司 | 一种集装箱数据中心 |
JPWO2013186904A1 (ja) * | 2012-06-14 | 2016-02-01 | 富士通株式会社 | 結露検知装置、冷却システム、及び冷却媒体流量制御方法 |
JP5902053B2 (ja) * | 2012-06-28 | 2016-04-13 | 株式会社日立製作所 | 冷却システム及び冷却方法 |
US20140209288A1 (en) * | 2013-01-28 | 2014-07-31 | Alcatel-Lucent Usa, Inc. | Cooling technique |
CN103278029B (zh) * | 2013-06-03 | 2015-10-21 | 上海华虹宏力半导体制造有限公司 | 高温半导体工艺的机台的热交换系统与方法 |
JP6282186B2 (ja) * | 2014-07-02 | 2018-02-21 | 株式会社日立製作所 | 冷却システムの冷媒漏洩検知方法 |
WO2016057854A1 (en) | 2014-10-08 | 2016-04-14 | Inertech Ip Llc | Systems and methods for cooling electrical equipment |
US10375901B2 (en) | 2014-12-09 | 2019-08-13 | Mtd Products Inc | Blower/vacuum |
JP6662374B2 (ja) * | 2015-03-13 | 2020-03-11 | 日本電気株式会社 | 冷媒供給装置、それを用いた相変化冷却装置、および冷媒供給方法 |
JP6904259B2 (ja) * | 2015-12-21 | 2021-07-14 | 日本電気株式会社 | 冷媒循環装置および冷媒循環方法 |
KR20230152767A (ko) | 2016-03-16 | 2023-11-03 | 이너테크 아이피 엘엘씨 | 유체 냉각기 및 칠러를 사용하여 일련의 열 방출 및 조정 냉각을 수행하는 시스템 및 방법 |
JP6980969B2 (ja) * | 2016-04-13 | 2021-12-15 | 富士通株式会社 | データセンタ及びデータセンタの制御方法 |
JP6790690B2 (ja) * | 2016-10-04 | 2020-11-25 | 富士通株式会社 | 情報処理システム、及び情報処理システムの制御方法 |
US10123461B2 (en) | 2017-04-05 | 2018-11-06 | Google Llc | Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly |
CN107473294B (zh) * | 2017-08-31 | 2024-01-26 | 上海晟兰石化工程技术有限公司 | 一种丙烯腈回收塔塔釜液的处理工艺及处理系统 |
WO2019070498A2 (en) * | 2017-10-05 | 2019-04-11 | Ice Qube, Inc. | MINIATURIZED CLOSED LOOP COOLING SYSTEM |
US11997830B2 (en) | 2020-10-29 | 2024-05-28 | Nvidia Corporation | Intelligent radiator-assisted power and coolant distribution unit for datacenter cooling systems |
KR102507362B1 (ko) * | 2021-06-17 | 2023-03-09 | 주식회사 삼화에이스 | 프리쿨링 냉동기를 구비한 데이터센터 국부 냉각시스템 |
CN113573545B (zh) * | 2021-06-25 | 2024-03-26 | 华为数字能源技术有限公司 | 制冷系统及数据中心 |
WO2024040144A1 (en) * | 2022-08-18 | 2024-02-22 | University Of Florida Research Foundation, Inc. | Variable air variable refrigerant flow (vavrf) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1896673A (zh) * | 2006-06-20 | 2007-01-17 | 青岛大学 | 双循环可控热管系统 |
EP2091314A2 (en) * | 2008-02-13 | 2009-08-19 | Hitachi Plant Technologies, Ltd. | Cooling system for electronic equipment |
JP2009196246A (ja) * | 2008-02-22 | 2009-09-03 | Dainippon Printing Co Ltd | 熱転写受像シート |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5613698U (ja) * | 1979-07-05 | 1981-02-05 | ||
JPH1019305A (ja) * | 1996-06-28 | 1998-01-23 | Furukawa Electric Co Ltd:The | 冷却システム |
JP3351307B2 (ja) * | 1997-08-08 | 2002-11-25 | 日立プラント建設株式会社 | 冷媒自然循環式熱交換システム |
JP4566023B2 (ja) * | 2005-02-25 | 2010-10-20 | 株式会社大気社 | ヒートポンプ式冷却装置、そのヒートポンプ式冷却装置を用いた空調装置、及び、ヒートポンプ式加熱装置 |
JP5041343B2 (ja) * | 2008-02-13 | 2012-10-03 | 株式会社日立プラントテクノロジー | 電子機器の冷却システム |
SG171566A1 (en) * | 2009-12-01 | 2011-06-29 | Hitachi Plant Technologies Ltd | Cooling method and cooling system of electronic device |
JP2011171499A (ja) * | 2010-02-18 | 2011-09-01 | Hitachi Plant Technologies Ltd | 電子機器の冷却方法及び冷却システム |
-
2010
- 2010-05-06 JP JP2010106788A patent/JP2011237887A/ja active Pending
-
2011
- 2011-04-28 CN CN2011101077064A patent/CN102245006A/zh active Pending
- 2011-04-29 SG SG2011030905A patent/SG176365A1/en unknown
- 2011-05-03 US US13/099,415 patent/US20110271695A1/en not_active Abandoned
- 2011-05-04 GB GB1107469.7A patent/GB2480152B/en not_active Expired - Fee Related
- 2011-05-06 NL NL2006727A patent/NL2006727C2/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1896673A (zh) * | 2006-06-20 | 2007-01-17 | 青岛大学 | 双循环可控热管系统 |
EP2091314A2 (en) * | 2008-02-13 | 2009-08-19 | Hitachi Plant Technologies, Ltd. | Cooling system for electronic equipment |
JP2009196246A (ja) * | 2008-02-22 | 2009-09-03 | Dainippon Printing Co Ltd | 熱転写受像シート |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105746008A (zh) * | 2013-11-20 | 2016-07-06 | 日本电气株式会社 | 电子设备收纳装置以及电子设备冷却系统 |
CN105746008B (zh) * | 2013-11-20 | 2017-11-17 | 日本电气株式会社 | 电子设备收纳装置以及电子设备冷却系统 |
CN105430997B (zh) * | 2014-09-22 | 2019-03-12 | 中国移动通信集团广东有限公司 | 一种热管内循环式二次冷媒环路服务器机柜散热系统 |
CN105430997A (zh) * | 2014-09-22 | 2016-03-23 | 中国移动通信集团广东有限公司 | 一种热管内循环式二次冷媒环路服务器机柜散热系统 |
US20190208668A1 (en) * | 2017-12-28 | 2019-07-04 | Beijing Baidu Netcom Science And Technology Co., Ltd. | Refrigeration system and refrigeration method for data center |
CN108055813A (zh) * | 2017-12-28 | 2018-05-18 | 北京百度网讯科技有限公司 | 数据中心的制冷系统及制冷方法 |
US11266042B2 (en) * | 2017-12-28 | 2022-03-01 | Beijing Baidu Netcom Science And Technology Co., Ltd. | Refrigeration system and refrigeration method for data center |
CN110164792A (zh) * | 2018-02-13 | 2019-08-23 | 东京毅力科创株式会社 | 冷却系统 |
CN110164792B (zh) * | 2018-02-13 | 2023-05-12 | 东京毅力科创株式会社 | 冷却系统 |
CN108990392A (zh) * | 2018-09-06 | 2018-12-11 | 郑州云海信息技术有限公司 | 一种多冷源模块化数据中心 |
CN108990392B (zh) * | 2018-09-06 | 2023-08-18 | 郑州云海信息技术有限公司 | 一种多冷源模块化数据中心 |
CN110440522A (zh) * | 2019-06-28 | 2019-11-12 | 安徽国际商务职业学院 | 一种电子元件加工用冷却装置 |
CN110440522B (zh) * | 2019-06-28 | 2021-01-05 | 安徽国际商务职业学院 | 一种电子元件加工用冷却装置 |
Also Published As
Publication number | Publication date |
---|---|
US20110271695A1 (en) | 2011-11-10 |
NL2006727C2 (en) | 2012-08-14 |
SG176365A1 (en) | 2011-12-29 |
GB201107469D0 (en) | 2011-06-15 |
JP2011237887A (ja) | 2011-11-24 |
GB2480152B (en) | 2012-11-21 |
NL2006727A (en) | 2011-11-08 |
GB2480152A (en) | 2011-11-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102245006A (zh) | 电子设备的冷却方法以及冷却系统 | |
CN102083298B (zh) | 电子设备的冷却系统 | |
US7855890B2 (en) | Cooling system for electronic equipment | |
US9188356B2 (en) | Air conditioning system and method for managing server room | |
JP4829147B2 (ja) | 空気調和設備 | |
CN103154624B (zh) | 冷却系统的异常时运转装置 | |
WO2012060218A1 (ja) | サーバ室管理用の空調システムおよび空調制御方法 | |
JP2011171499A (ja) | 電子機器の冷却方法及び冷却システム | |
JP2002168479A (ja) | 通信機器室等の空調方法および空調システム | |
JP4706836B2 (ja) | クーリングシステム | |
CN115103565A (zh) | 一种数据中心的散热系统 | |
JP2009193245A (ja) | 電子機器の冷却システム | |
CN206281106U (zh) | 蒸发冷却与机械制冷联合运行的冷水机组 | |
CN106556090A (zh) | 蒸发冷却与机械制冷联合运行的冷水机组 | |
JP2011155301A (ja) | 電子機器の冷却システム | |
JP2009194094A (ja) | 電子機器の冷却システム | |
CN102748812A (zh) | 一种机房空调 | |
JP2011163758A (ja) | 電子機器の冷却システム | |
JP2011117629A (ja) | 冷却システム | |
US20180035568A1 (en) | Data center cooling system | |
JP2012142026A (ja) | 電子機器の冷却システム | |
CA3020180A1 (en) | Data center cooling system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111116 |