CN102244025B - 被处理体的输送方法和被处理体的输送装置 - Google Patents

被处理体的输送方法和被处理体的输送装置 Download PDF

Info

Publication number
CN102244025B
CN102244025B CN201110120235.0A CN201110120235A CN102244025B CN 102244025 B CN102244025 B CN 102244025B CN 201110120235 A CN201110120235 A CN 201110120235A CN 102244025 B CN102244025 B CN 102244025B
Authority
CN
China
Prior art keywords
handled object
mentioned
abnormal
semiconductor crystal
automatic transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201110120235.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN102244025A (zh
Inventor
远洞征树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN102244025A publication Critical patent/CN102244025A/zh
Application granted granted Critical
Publication of CN102244025B publication Critical patent/CN102244025B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201110120235.0A 2010-05-11 2011-05-10 被处理体的输送方法和被处理体的输送装置 Active CN102244025B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010109712A JP5452349B2 (ja) 2010-05-11 2010-05-11 被処理体の搬送方法、被処理体の搬送装置、及び、プログラム
JP2010-109712 2010-05-11

Publications (2)

Publication Number Publication Date
CN102244025A CN102244025A (zh) 2011-11-16
CN102244025B true CN102244025B (zh) 2016-01-20

Family

ID=44910816

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110120235.0A Active CN102244025B (zh) 2010-05-11 2011-05-10 被处理体的输送方法和被处理体的输送装置

Country Status (5)

Country Link
US (1) US20110278205A1 (enExample)
JP (1) JP5452349B2 (enExample)
KR (1) KR101510498B1 (enExample)
CN (1) CN102244025B (enExample)
TW (1) TWI533391B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5921200B2 (ja) * 2012-01-05 2016-05-24 株式会社日立国際電気 基板処理装置、基板処理方法、半導体装置の製造方法、縮退運用プログラムおよび生産リストの作成プログラム
DE102012100929A1 (de) * 2012-02-06 2013-08-08 Roth & Rau Ag Substratbearbeitungsanlage
CN105807732B (zh) * 2014-12-31 2018-11-06 北京北方华创微电子装备有限公司 半导体工艺控制方法及半导体工艺控制系统
CN107507788B (zh) * 2017-07-21 2019-11-08 志圣科技（广州）有限公司 晶圆加工机及其加工处理方法
CN109976100B (zh) * 2017-12-28 2021-12-07 长鑫存储技术有限公司 光刻系统及其光刻方法
JP7246256B2 (ja) * 2019-05-29 2023-03-27 東京エレクトロン株式会社 搬送方法及び搬送システム
CN110783236B (zh) * 2019-11-12 2023-06-16 北京北方华创微电子装备有限公司 腔室离线控制方法及系统
JP7682711B2 (ja) * 2021-06-16 2025-05-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置およびプログラム
CN114843181B (zh) * 2022-07-06 2022-09-16 华海清科股份有限公司 控制方法、晶圆倒传方法、后处理装置和晶圆加工设备
CN116884901B (zh) * 2023-09-08 2023-12-22 四川明泰微电子有限公司 一种引线框架自动下料设备
CN119281666A (zh) * 2024-09-30 2025-01-10 苏州天准科技股份有限公司 一种硅片筛选输送装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5101979A (en) * 1988-07-08 1992-04-07 Hitachi, Ltd. Paper sheet depositing and dispensing apparatus, abnormality recovery process of the paper sheet depositing and dispensing apparatus, and automatic cashier
US6914233B2 (en) * 2001-12-12 2005-07-05 Shinko Electric Co., Ltd. Wafer mapping system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6102164A (en) * 1996-02-28 2000-08-15 Applied Materials, Inc. Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
US7313262B2 (en) * 2003-08-06 2007-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for visualization of process chamber conditions
WO2005031851A1 (ja) * 2003-09-25 2005-04-07 Hitachi Kokusai Electric Inc. 基板処理装置及び基板の製造方法
DE102006015686C5 (de) * 2006-03-27 2013-05-29 Thieme Gmbh & Co. Kg Verfahren zum Transportieren von Druckgut und Drucktisch für Flachbettdruckmaschine
JP4863985B2 (ja) * 2007-12-20 2012-01-25 大日本スクリーン製造株式会社 基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5101979A (en) * 1988-07-08 1992-04-07 Hitachi, Ltd. Paper sheet depositing and dispensing apparatus, abnormality recovery process of the paper sheet depositing and dispensing apparatus, and automatic cashier
US6914233B2 (en) * 2001-12-12 2005-07-05 Shinko Electric Co., Ltd. Wafer mapping system

Also Published As

Publication number Publication date
KR20110124712A (ko) 2011-11-17
KR101510498B1 (ko) 2015-04-08
CN102244025A (zh) 2011-11-16
TWI533391B (zh) 2016-05-11
TW201203436A (en) 2012-01-16
JP2011238808A (ja) 2011-11-24
US20110278205A1 (en) 2011-11-17
JP5452349B2 (ja) 2014-03-26

Similar Documents

Publication Publication Date Title
CN102244025B (zh) 被处理体的输送方法和被处理体的输送装置
US4364766A (en) Control system for monitoring and controlling the processing of glass sheets in a glass processing environment
CN102760673B (zh) 基板处理装置及其异常显示方法、参数设定方法
EP2623437B1 (en) Transfer system
US7274971B2 (en) Methods and apparatus for electronic device manufacturing system monitoring and control
KR101801526B1 (ko) 스프레더 카메라 영상을 이용한 컨테이너 적재 장치의 자동 랜딩 시스템 및 방법
US12043498B2 (en) Overhead carrier vehicle and overhead carrier vehicle system
CN103826995A (zh) 物流系统和物流系统的自异常修复的修复方法
CN102951401A (zh) 一种搬运卡匣的装置及方法
CN106429144A (zh) 玻璃卡匣的处理方法、装置和系统
CN111785662B (zh) 应用于槽式清洗机的晶圆检测系统及方法
JP2000236011A (ja) 基板の搬出入システム及び搬出入方法
JP2008225987A (ja) 工程異常条件自動抽出方式
JP4797108B2 (ja) 半導体製造装置における表示方法及び半導体製造装置
CN114348670A (zh) 上下料装置和控制方法
JPH07330286A (ja) トングの掴み状況監視方法
JP5166575B2 (ja) 半導体製造装置における表示方法及び半導体製造装置
JP2003017379A (ja) 処理システム及び複数の処理システム間の制御装置
JP4563356B2 (ja) 半導体製造装置
CN211017111U (zh) 一种传送装置
JP2012227539A (ja) ウエハ搭載状況の表示方法、表示プログラム、半導体製造装置及び半導体装置の表示方法
JP2005306591A (ja) 搬送システム
JP4797101B2 (ja) 半導体製造装置における表示方法及び半導体製造装置
KR101595447B1 (ko) 워킹빔 제어 시스템
CN119330202A (zh) 无人化库区行车取卷方法及取卷机构

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant