CN102240966A - Grinding pad and grinding device using the grinding pad - Google Patents
Grinding pad and grinding device using the grinding pad Download PDFInfo
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- CN102240966A CN102240966A CN201110128677XA CN201110128677A CN102240966A CN 102240966 A CN102240966 A CN 102240966A CN 201110128677X A CN201110128677X A CN 201110128677XA CN 201110128677 A CN201110128677 A CN 201110128677A CN 102240966 A CN102240966 A CN 102240966A
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- Prior art keywords
- slurries
- grinding pad
- abradant surface
- supply hole
- grinding
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
- B24B7/245—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass discontinuous
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention relates to a grinding pad and a grinding device using the grinding pad. The grinding pad which is applied for grinding glass plates comprises a first slurry supplying hole for supplying slurry to a part between a grinding face of the grinding pad and a ground face of a glass plate. The first slurry supplying hole passes through the grinding pad on the center of the grinding face which forms plural grooves towards the outer side from the center and is cut into a radial shape.
Description
Technical field
The present invention relates to grinding pad and used the lapping device of grinding pad.
Background technology
(Flat Panel Display: flat-panel monitor) glass substrate of usefulness is configured as melten glass tabular by the glass method for making that is called as the float glass process method FPD that uses in the LCD etc., and the lapping device by disclosed continous ways such as patent documentations 1 is to the small concavo-convex of its surface and rise and fall to grind and remove, thereby produces the glass substrate that the thin plate that satisfies desired flatness is used as FPD.
In this kind continous way lapping device, usually as patent documentation 2 the record, the grinding pad that rotation and revolution are carried out in utilization grinds glass plate.
Patent documentation 1: the spy of Japan opens the 2007-190657 communique
Patent documentation 2: the spy of Japan opens the 2001-293656 communique
Above-mentioned lapping device uses slurries that the surface (hereinafter referred to as by abradant surface) of glass plate is ground.Slurries from the slurries supply hole of the central portion setting of grinding pad to the abradant surface of grinding pad and glass plate by abradant surface between supply with.Supply to the abradant surface of grinding pad and glass plate by the amount of the slurries between the abradant surface on abradant surface when inhomogeneous, polished glass plate by the flatness variation of abradant surface.Therefore, the slurries of supply need spread all over abradant surface equably.
Yet its size increases glass plate along with upgrading, follows in this, and grinding pad also maximizes.Be accompanied by the maximization of this grinding pad, the uniformity of the amount of the slurries of supply on abradant surface becomes problem.
Summary of the invention
Given this present invention plants situation and makes, its purpose be to provide a kind of improves the mobile of slurries and make grainding capacity on the abradant surface of grinding pad evenly, and improve glass plate by the grinding pad of the flatness of abradant surface and used the lapping device of grinding pad.
To achieve these goals, grinding pad of the present invention is used for the abrading glass plate, possesses the first slurries supply hole, this first slurries supply hole be used for to the abradant surface of this grinding pad and described glass plate by abradant surface between supply with the slurries supply hole of slurries, and run through this grinding pad at the center of this abradant surface, described abradant surface is divided into radial by a plurality of grooves of the side formation outwardly from the center.
According to the present invention, owing to possess the first slurries supply hole at the center of running through grinding pad, and with abradant surface by from the center outwardly a plurality of grooves of forming of side be divided into radial, therefore the slurries of supplying with from the first slurries supply hole flow into a plurality of grooves that abradant surface forms, and by making grinding pad rotation, and spread all over whole of abradant surface equably.Therefore, can make grainding capacity on abradant surface evenly and improve glass plate by the flatness of abradant surface.Need to prove,, can use the circular grinding pad or the grinding pad of rectangle as grinding pad.In addition, the position of the first slurries supply hole also can be the approximate centre of grinding pad.
In addition, preferred, grinding pad of the present invention possesses a plurality of second slurries supply holes, and described a plurality of second slurries supply holes run through this grinding pad in the position from the misalignment of described abradant surface.
According to the present invention, also supply with slurries by first slurries supply hole that is provided with from center and a plurality of second slurries supply holes that are provided with in off-centered position at grinding pad, can make slurries spread all over whole of abradant surface equably, thereby can make grainding capacity even on abradant surface.
In addition, preferred, the described second slurries supply hole of the present invention runs through the zone of described groove.Thus, according to the present invention, can make grainding capacity more even.
In addition, the described second slurries supply hole of the present invention also can run through the abrasive areas that is split to form by described groove.Thus, according to the present invention, can make grainding capacity more even.
In addition, preferred, described abradant surface of the present invention is implemented cancellous groove processing.Thus, according to the present invention, can make grainding capacity more even.
In addition, to achieve these goals, used the lapping device of grinding pad of the present invention to possess: grinding pad; Make the abradant surface of described grinding pad and glass plate by the abradant surface butt and make the unit of this grinding pad rotation; Reach the feed unit of between this grinding pad and described glass plate, supplying with slurries, wherein, between this grinding pad and described glass plate, supply with slurries via the first slurries supply hole of described grinding pad.
According to the present invention, the slurries of supplying with from the first slurries supply hole flow into a plurality of grooves that the abradant surface at grinding pad forms, and spread all over whole of abradant surface equably by making grinding pad rotation, therefore, grainding capacity is become on abradant surface evenly and improve glass plate by the flatness of abradant surface.
In addition, to achieve these goals, used the lapping device of grinding pad of the present invention to possess: grinding pad; Make the abradant surface of described grinding pad and glass plate by the abradant surface butt and make the unit of this grinding pad rotation; Reach the feed unit of between this grinding pad and described glass plate, supplying with slurries, wherein, between this grinding pad and described glass plate, supply with slurries via the first slurries supply hole and the second slurries supply hole of described grinding pad.
According to the present invention, because first slurries supply hole that is provided with from the center at grinding pad and the second slurries supply hole that is provided with in off-centered position are supplied with slurries, therefore can make slurries spread all over whole of abradant surface equably, grainding capacity is become on abradant surface evenly, thus can improve glass plate by the flatness of abradant surface.
In addition, used the lapping device of grinding pad of the present invention to possess control module, the amount of the slurries that described control module is supplied with to the amount of the slurries supplied with from the described first slurries supply hole with from the described second slurries supply hole is controlled.
According to the present invention owing to can make slurries spread all over whole of abradant surface more equably, therefore grainding capacity is become evenly on abradant surface, thereby the raising glass plate by the flatness of abradant surface.Need to prove that described control module preferably is controlled to so that the mode that the total amount of the amount of the slurries of supplying with from the first slurries supply hole and the slurries supplied with from the second whole slurries supply holes equates is supplied with slurries.
The invention effect
According to grinding pad of the present invention and used the lapping device of grinding pad, can improve the mobile of slurries and make grainding capacity on abradant surface evenly, thereby improve glass plate by the flatness of abradant surface.
Description of drawings
Fig. 1 is the figure of major part of the lapping device of expression glass plate.
Fig. 2 (a), Fig. 2 (b), Fig. 2 (c), Fig. 2 (d) and Fig. 2 (e) are the figure of the abradant surface of expression grinding pad.
Fig. 3 is the figure of major part of the lapping device of expression glass plate.
Label declaration
1 glass plate
1A is by abradant surface
10,20,30,40,50 grinding pads
The 10A abradant surface
12,16 grooves
14 slurries supply holes
14a central authorities slurries supply hole
14b periphery slurries supply hole
100,101 lapping devices
102 work piece platform
104 grinding plates
106 rotating shafts
108 slurries supply units
The specific embodiment
Below, with reference to the accompanying drawings, grinding pad of the present invention is described and has used the preferred implementation of the lapping device of grinding pad.
＜embodiment 〉
Fig. 1 is the figure of major part of the lapping device 100 of expression glass plate.Lapping device 100 is the devices that the LCD of the above size of for example 1100mm (width) * 1300mm (length) carried out continuously grinding with glass plate.
Rotating shaft 106 is supported to axis of rotation O
1For the center rotates freely, under the effect of not shown driver element, with axis of rotation O
1For carrying out rotation in the center, and with hollow shaft O
2For revolving round the sun at the center.Follow the rotation, revolution of this rotating shaft 106 and grinding plate 104 carries out rotation, revolution.
Under the effect of the external pump that is disposed at slurries supply unit 108 (not shown), slurries supply unit 108 makes slurries via the slurries supply hole 14 that is provided with on swivel joint, slurry path and the grinding pad 10, supply to the abradant surface 10A of grinding pad 10 and glass plate 1 by between the abradant surface 1A.As slurries, use the slurries that contain polishing particles such as silica, cerium oxide.Then, the slurries of discharging from the peripheral part of glass plate 1 are reclaimed by not shown cycling element, reuse after filtration.
In the lapping device 100 that so constitutes, the abradant surface 10A by abradant surface 1A and grinding pad 10 of glass plate 1 is pushed, and the rotation by grinding pad 10 and revolution come abrading glass plate 1 by abradant surface 1A.At this moment, if the slurries of supplying with from slurries supply hole 14 glass plate 1 by abradant surface 1A on exist unevenly, grinding pad 10 abrading glass plate 1 equably then, and the glass plate 1 after grinding by the flatness variation of abradant surface 1A.Therefore, need make the slurries of supply spread all over whole of abradant surface 10A equably.
Fig. 2 (a) is the outside drawing of the abradant surface 10A of grinding pad 10 in the past.Use circular pad as grinding pad 10 at this, but also can be the pad of rectangle.
In addition, be provided with the slurries supply hole 14 that diameter is the circle of 20mm at the center of grinding pad 10.The diameter of slurries supply hole 14 is not defined as 20mm, but preferred 5～100mm.And slurries supply hole 14 also can be a rectangle.Also can implement tapering processing, so that slurries flow out easily to the abradant surface 10A side of slurries supply hole 14.
In addition, on the abradant surface 10A of grinding pad 10, implement the processing of the cancellous groove 12 of width 2mm, degree of depth 1.5mm, spacing width 20mm.Do not limit especially about these numerical value yet, and can suitably change.Need to prove that preferable width is that 1～30mm, the degree of depth are that 0.5～5mm, spacing width are 2～30mm.
The slurries of supplying with from slurries supply hole 14 flow into this groove 12, and pass through the rotation of grinding pad 10, and spread all over whole of abradant surface 10A.At this moment, preferably spread all over whole of abradant surface 10A equably, but when the size of grinding pad as present embodiment 10 is big, have situation about spreading all over unevenly.
The outside drawing of the abradant surface of the grinding pad 20 of Fig. 2 (b) expression present embodiment.On the abradant surface of grinding pad 20, be provided with cancellous groove 12 and the slurries supply hole 14 same with grinding pad 10.In addition, on abradant surface, be provided with four grooves 16 outwardly week from the center, abradant surface is and is divided into four zones radially.This groove 16 forms width 20mm, degree of depth 1.5mm.In other words, the abradant surface of grinding pad 20 by from the center outwardly a plurality of grooves of forming of side be divided into radially, the abradant surface after cutting apart is implemented cancellous groove processing again.Need to prove that this groove 16 is so long as width is 1～30mm, the degree of depth is that 0.5～5mm gets final product.
By formation abradant surface like this, and flow into groove 12 and groove 16, pass through the rotation of grinding pad 20 then, and spread all over whole of abradant surface from the slurries that slurries supply hole 14 is supplied with.By groove 16, can slurries be spread all over.
In addition, the grinding pad 30 shown in Fig. 2 (c) is compared with the grinding pad 20 shown in Fig. 2 (b), is being provided with difference on 8 groove 16 this point.As shown in the drawing, the abradant surface of grinding pad 30 is by groove 16 and is divided into 8 zones radially.
So, also can increase the therefrom number of the groove 16 of mind-set periphery.
Need to prove that in the present embodiment, groove 12 forms the mesh-shape of straight line, but groove 12 also can form the mesh-shape of curve.
In addition, also can supply with slurries from a plurality of slurries supply holes.On the abradant surface of the grinding pad 40 shown in Fig. 2 (d), similarly be provided with cancellous groove 12 and groove 16 with the grinding pad 20 shown in Fig. 2 (b).In addition, center at grinding pad 40, the central slurries supply hole 14a (the first slurries supply hole) of the circle of diameter 20mm runs through grinding pad 40, in each groove 16, for the peripheral slurries supply hole 14b (second slurries supply hole) of the rectangle of 2mm (square) run through grinding pad 40 on one side.Need to prove that the diameter of central slurries supply hole 14a is that 5～100mm gets final product, one side peripheral slurries supply hole 14b's is that 2～10mm gets final product.In the present embodiment, it is the position of 500mm that peripheral slurries supply hole 14b is arranged on apart from the center of grinding pad 40, but this distance suitably determines to get final product.And the shape of peripheral slurries supply hole 14b is not defined as rectangle, can be circular yet.
Fig. 3 represents to be used to use the major part of the lapping device 101 of grinding pad 40.Need to prove that the additional same numeral of part to common with Fig. 1 omits its detailed description.
The slurries supply unit 108 of lapping device 101 constitutes and can supply with slurries via central slurries supply hole 14a and peripheral slurries supply hole 14b.Slurries amount adjustment part can also be set on lapping device 101, and this slurries amount adjustment part is used to adjust slurries amount of supplying with via central slurries supply hole 14a and the slurries amount of supplying with via peripheral slurries supply hole 14b.
By using the lapping device 101 that constitutes as mentioned above, the slurries that can supply with desirable amount respectively from the central slurries supply hole 14a and the peripheral slurries supply hole 14b of grinding pad 40.
So, a plurality of slurries supply holes are set, and in lapping device, supply with slurries, thereby can make the slurries of supply spread all over abradant surface equably via a plurality of slurries supply holes in the position of the groove of grinding pad.
Described a plurality of slurries supply hole also can be arranged on the position different with groove 16.On the abradant surface of the grinding pad 50 shown in Fig. 2 (e), with the grinding pad 40 shown in Fig. 2 (d) differently, the peripheral slurries supply hole 14b of the rectangle (square) that 2mm is square is arranged on the abrasive areas of being separated by groove 16.With grinding pad 40 similarly, it is the position of 500mm that peripheral slurries supply hole 14b is arranged on apart from the center of grinding pad 50, but apart from the distance at center suitably decision get final product.And, about the length or the shape on one side of peripheral slurries supply hole 14b, as long as with the suitably decision of mode of easy supply slurries.
So, by a plurality of slurries supply holes are set on the zone of abradant surface, also can make the slurries of supply spread all over abradant surface equably.
Need to prove that the number of peripheral slurries supply hole 14b is not limited to four.For example, when 8 grooves 16 are set, both can be arranged on the zone of each groove 16 and be provided with 8, also can be provided with 8 in the abrasive areas that is divided into 8.And, also can be arranged on the zone of groove 16 and these both sides of abrasive areas that are divided into.
＜embodiment 〉
Make the grid model of each grinding pad shown in Figure 2, the slurries pressure of each grinding pad is simulated.CFD (numerical value hydrodynamics) software has been used in simulation, and this CFD software has used finite volume method.The condition of simulation is, the diameter of grinding pad is 1690mm, and the width of groove 12 is 2mm, and the spacing width of groove 12 is 20mm, the width of groove 16 is 20mm, the diameter of circular central slurries supply hole 14a (14) is 20mm, and the position of peripheral slurries supply hole 14b is 500mm apart from the grinding pad center, one side that the peripheral slurries supply hole 14b of rectangle is 20mm, the pad rotational velocity is 50rpm, the pad revolution speed is 120rpm, and pad revolution radius is 75mm, and the slurries quantity delivered is 40 liters of per minutes.
It is as shown in table 1 that grinding under the described condition begins the result of calculation of slurries pressure (abradant surface mean value) of each grinding pad after 9 seconds.Need to prove that the slurries pressure that calculates is low more, represent that then supply～the discharge of slurries is smooth more.That is, slurries pressure is low more, represent that then slurries spread all over abradant surface more equably, and the grainding capacity of grinding pad is even more.
[table 1]
Result of calculation on the grinding pad in the past 10 shown in the No.1 presentation graphs 2 (a) of table 1.The slurries pressure (mean value) of abradant surface 10A is 6013Pa.
With respect to this, No.2 is the result of calculation on the grinding pad that is provided with four grooves 16 20 shown in Fig. 2 (b).The slurries pressure (mean value) of abradant surface is 4761Pa.Can confirm that so by four grooves 16 are set, (No.1) compares with the situation that does not have groove 16, has the effect that slurries spread all over abradant surface equably.
In addition, No.3 and 4 is the result of calculation on the grinding pad that is provided with eight grooves 16 30 shown in Fig. 2 (c), is the degree of depth of groove 16 result of calculation when being respectively 1.5mm and 3.0mm.
The slurries pressure of No.3 is 4345Pa, becomes the result lower than No.2.Can confirm from this result, compare, 8 grooves 16 are set have the effect that slurries spread all over abradant surface more equably with 4 grooves 16 are set.
In addition, the slurries pressure of No.4 is 2247Pa, becomes the result lower than No.3.Can confirm from this result, be that 1.5mm compares with the degree of depth of groove 16, and the degree of depth of groove 16 is that 3.0mm has the effect that slurries spread all over abradant surface more equably.
Next, No.5 and 6 is the result of calculation on the grinding pad 40 that is provided with peripheral slurries supply hole 14b on the groove 16 shown in Fig. 2 (d).In any case all with No.1～4 similarly per minute supply with 40 liters slurries, but No.5 is the result of calculation when central slurries supply hole 14a and four peripheral slurries supply hole 14b per minutes are supplied with 8 liters equably, and No.6 supplies with 20 liters and result of calculation when four peripheral slurries supply hole 14b per minutes are supplied with 5 liters from central slurries supply hole 14a per minute.
The slurries pressure of No.5 is 3023Pa, and the slurries pressure of No.6 is 4009Pa.Can confirm from this result, when a plurality of slurries supply holes are supplied with slurries, with from central slurries supply hole 14a emphasis ground (more ground) supply with slurries and compare, supply with slurries equably from central slurries supply hole 14a and four peripheral slurries supply hole 14b and can make slurries spread all over abradant surface equably.
In addition, No.7 and 8 is the result of calculation on the grinding pad 50 that is provided with peripheral slurries supply hole 14b on the abrasive areas shown in Fig. 2 (e).All per minute is supplied with 40 liters slurries in any case, but No.7 is the result of calculation when central slurries supply hole 14a and four peripheral slurries supply hole 14b per minutes are supplied with 8 liters equably, and No.8 supplies with 20 liters and result of calculation when four peripheral slurries supply hole 14b per minutes are supplied with 5 liters from central slurries supply hole 14a per minute.
The slurries pressure of No.7 is 3340Pa, and the slurries pressure of No.8 is 3916Pa.Can confirm from this result, with the situation of grinding pad 40 similarly, when a plurality of slurries supply holes are supplied with slurries, with supply with slurries from central slurries supply hole 14a emphasis ground and compare, supply with slurries equably from central slurries supply hole 14a and four peripheral slurries supply hole 14b and can make slurries spread all over abradant surface equably.
In addition,, the situation that peripheral slurries supply hole 14b is arranged on the situation on the groove 16 and be arranged on the abrasive areas is compared as can be known, be arranged on the slurries pressure step-down of the No.5 on the groove 16 according to the result of No.5 and No.7.Can confirm thus,, peripheral slurries supply hole 14b is arranged on makes slurries spread all over abradant surface equably on the groove 16 when central slurries supply hole 14a and four peripheral slurries supply hole 14b supply with slurries equably.
In addition,, the situation that peripheral slurries supply hole 14b is arranged on the situation on the groove 16 and be arranged on the abrasive areas is compared as can be known, be arranged on the slurries pressure step-down of the No.8 on the abrasive areas according to the result of No.6 and No.8.Can confirm thus, when supplying with slurries, peripheral slurries supply hole 14b is arranged on makes slurries spread all over abradant surface equably on the abrasive areas from central slurries supply hole 14a emphasis ground.
Therefore as mentioned above,, spread all over abradant surface equably, can grind equably owing to the flowability of improving slurries makes the slurries of supply according to grinding pad in the present embodiment and lapping device, and can improve glass plate by the flatness of abradant surface.
At length the present invention has been described with reference to specific embodiment, but those skilled in the art do not depart from the scope of the present invention with aim as can be known and can apply various corrections or change.
The application is based on the Japanese patent application 2010-111116 of on May 13rd, 2010 application, and with its content as with reference to being contained in this.
Claims (9)
1. a grinding pad is used for the abrading glass plate, wherein,
Possess the first slurries supply hole, this first slurries supply hole be used for to the abradant surface of this grinding pad and described glass plate by abradant surface between supply with the slurries supply hole of slurries, and run through this grinding pad at the center of this abradant surface,
Described abradant surface is divided into radial by a plurality of grooves of the side formation outwardly from the center.
2. grinding pad according to claim 1, wherein,
Possess a plurality of second slurries supply holes, described a plurality of second slurries supply holes run through this grinding pad in the position from the misalignment of described abradant surface.
3. grinding pad according to claim 2, wherein,
The described second slurries supply hole runs through the zone of described groove.
4. grinding pad according to claim 2, wherein,
The described second slurries supply hole runs through the abrasive areas that is split to form by described groove.
5. grinding pad according to claim 1, wherein,
Described abradant surface is implemented cancellous groove processing.
6. according to each described grinding pad in the claim 2～4, wherein,
Described abradant surface is implemented cancellous groove processing.
7. lapping device possesses:
Grinding pad;
Make the abradant surface of described grinding pad and glass plate by the abradant surface butt and make the unit of this grinding pad rotation; And
Between this grinding pad and described glass plate, supply with the feed unit of slurries, wherein,
Described grinding pad is claim 1 or 5 described grinding pads,
The first slurries supply hole via described grinding pad is supplied with slurries between this grinding pad and described glass plate.
8. lapping device possesses:
Grinding pad;
Make the abradant surface of described grinding pad and glass plate by the abradant surface butt and make the unit of this grinding pad rotation; And
Between this grinding pad and described glass plate, supply with the feed unit of slurries, wherein,
Described grinding pad is each described grinding pad in the claim 2～4,6,
The first slurries supply hole and the second slurries supply hole via described grinding pad are supplied with slurries between this grinding pad and described glass plate.
9. lapping device according to claim 8, wherein,
Possess control module, the amount of the slurries that described control module is supplied with to the amount of the slurries supplied with from the described first slurries supply hole with from the described second slurries supply hole is controlled.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-111116 | 2010-05-13 | ||
| JP2010111116A JP5516051B2 (en) | 2010-05-13 | 2010-05-13 | Polishing apparatus using polishing pad and glass plate manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102240966A true CN102240966A (en) | 2011-11-16 |
Family
ID=44959308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110128677XA Pending CN102240966A (en) | 2010-05-13 | 2011-05-13 | Grinding pad and grinding device using the grinding pad |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5516051B2 (en) |
| KR (1) | KR20110125615A (en) |
| CN (1) | CN102240966A (en) |
| TW (1) | TW201200296A (en) |
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| US20190381630A1 (en) * | 2018-06-15 | 2019-12-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same |
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| JP2019136837A (en) * | 2018-02-14 | 2019-08-22 | 信越半導体株式会社 | Double-sided polishing method |
| KR102256204B1 (en) * | 2018-06-29 | 2021-05-26 | 주식회사 엘지화학 | A glass substrate polishing pad |
| JP7098240B2 (en) * | 2018-08-22 | 2022-07-11 | 株式会社ディスコ | Abrasive pad |
| CN113084696B (en) * | 2021-03-08 | 2022-05-06 | 长江存储科技有限责任公司 | Polishing pad and grinding device |
| CN115026705B (en) * | 2022-06-28 | 2024-04-12 | 广东先导微电子科技有限公司 | Polishing machine |
| CN117862986B (en) * | 2024-03-06 | 2024-05-10 | 长沙韶光芯材科技有限公司 | Glass substrate grinding device and grinding method |
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| JP3334139B2 (en) * | 1991-07-01 | 2002-10-15 | ソニー株式会社 | Polishing equipment |
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| JP4087581B2 (en) * | 2001-06-06 | 2008-05-21 | 株式会社荏原製作所 | Polishing equipment |
| JP5311731B2 (en) * | 2005-09-26 | 2013-10-09 | Ｈｏｙａ株式会社 | Manufacturing method of glass substrate for magnetic disk, manufacturing method of magnetic disk, and polishing cloth |
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- 2010-05-13 JP JP2010111116A patent/JP5516051B2/en not_active Expired - Fee Related
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- 2011-04-28 TW TW100114962A patent/TW201200296A/en unknown
- 2011-05-13 KR KR1020110044912A patent/KR20110125615A/en not_active Application Discontinuation
- 2011-05-13 CN CN201110128677XA patent/CN102240966A/en active Pending
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| JPH01153263A (en) * | 1987-12-05 | 1989-06-15 | Daicel Chem Ind Ltd | Device for polishing back of optical disk molding stamper |
| CN1138745A (en) * | 1995-04-10 | 1996-12-25 | 松下电器产业株式会社 | Grinding appts. of retaining device basilar plate of grinded basilar plate and grinding method of basilar plate |
| CN1407606A (en) * | 2001-08-24 | 2003-04-02 | 株式会社罗捷士井上 | Grinding pad |
| JP2003145402A (en) * | 2001-11-09 | 2003-05-20 | Nippon Electric Glass Co Ltd | Grinder for glass products |
| US20050260929A1 (en) * | 2004-05-20 | 2005-11-24 | Jsr Corporation | Chemical mechanical polishing pad and chemical mechanical polishing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109420975A (en) * | 2017-08-22 | 2019-03-05 | 株式会社迪思科 | Grinding pad |
| US20190381630A1 (en) * | 2018-06-15 | 2019-12-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same |
| US11878388B2 (en) * | 2018-06-15 | 2024-01-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same |
| CN110421479A (en) * | 2019-07-19 | 2019-11-08 | 许昌学院 | A kind of electronic device semiconductor wafer polishing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011235425A (en) | 2011-11-24 |
| KR20110125615A (en) | 2011-11-21 |
| JP5516051B2 (en) | 2014-06-11 |
| TW201200296A (en) | 2012-01-01 |
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Application publication date: 20111116 |