CN105397617B - A kind of grinding pad and its replacing options - Google Patents
A kind of grinding pad and its replacing options Download PDFInfo
- Publication number
- CN105397617B CN105397617B CN201510703868.2A CN201510703868A CN105397617B CN 105397617 B CN105397617 B CN 105397617B CN 201510703868 A CN201510703868 A CN 201510703868A CN 105397617 B CN105397617 B CN 105397617B
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- Prior art keywords
- grinding
- grinding pad
- region
- junction
- region band
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Abstract
The present invention relates to technical field of manufacturing semiconductors, specifically related to a kind of grinding pad and its replacing options, applied to including the grinder station of abrasive disk, grinding head and grinding mat trimmer, the grinding pad upper surface includes several region bands, according to the residence time of the grinding head or the grinding mat trimmer in the grinding pad upper table Surface scan, by the residence time identical and connected region division into a region band, changed according to the abrasion condition of different zones band, so as to reach effect that is cost-effective and maintaining grinding rate stabilization.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, and in particular to a kind of grinding pad and its replacing options.
Background technology
In chemically mechanical polishing (CMP) process of lapping, in order to obtain required grinding rate, grinding head is repaiied with grinding pad
Whole device can all be scanned (sweep) centered on grinding disk center.Their usual sweep region can all be divided into different areas
Domain (zone), and grinding head and grinding mat trimmer the residence time difference in these zone can cause these region grinding pads
Grinding loss it is different.When grinding pad close to grinding processing procedure allow maximum time when, some regions grinding pad raceway groove shoal or
Polish.Grinding pad must just be replaced when grinding pad subregion generation raceway groove shoals or polished, so
In the presence of certain waste, and the change of grinding rate can be caused, the uniformity to silicon chip after grinding is impacted, finally influence production
Quality.
The content of the invention
In view of the shortcomings of the prior art, the present invention provides a kind of grinding pad and its replacing options, by grinding pad according to grinding
Head or residence time destribution is designed to several regions in different zones during grinding mat trimmer sweep, according to different zones
Abrasion condition changed, so as to reach cost-effective and maintain the stable effect of grinding rate.
The technical purpose of the present invention is realized by following technological means：
A kind of grinding pad, applied to the grinder station of abrasive disk, grinding head and grinding mat trimmer is included, its feature exists
In, the grinding pad upper surface is provided with several region bands, and
Each region band is to sweep the grinding head or the grinding mat trimmer in the grinding pad upper surface
Residence time when retouching identical and connected region division into region band.
It is preferred that, above-mentioned grinding pad, wherein, the grinding pad is rotationally arranged on the abrasive disk, and described
The center of grinding pad and the center of the abrasive disk are coincided with the upper and lower.
It is preferred that, above-mentioned grinding pad, wherein, the grinding head and the grinding mat trimmer are with the abrasive disk
Centered on center, the upper surface of the grinding pad is scanned apart from equal radii, so that several described region bands are by institute
The upper surface for stating grinding pad is divided into several donuts.
It is preferred that, above-mentioned grinding pad, wherein, each region band is provided with a junction, and the junction
One end is provided with a tang, and the other end is provided with a bayonet socket matched with the tang, and each region band is fixed.
It is preferred that, above-mentioned grinding pad, wherein, the junction is an inclined-plane, and the direction on the inclined-plane is ground with described
The direction of rotation for grinding pad is consistent, to prevent the junction from being rolled in rotary course.
The present invention also provides a kind of replacing options of grinding pad, applied to including the finishing of abrasive disk, grinding head and grinding pad
The grinder station of device, it is characterised in that methods described includes：
According to the residence time of the grinding head or the grinding mat trimmer in the grinding pad upper table Surface scan,
By the residence time identical and connected region division into a region band；
It is different according to the abrasion condition of each region band, the region band having worn out is dismantled and changes, and protect
Stay unworn region band.
Compared with prior art, it is an advantage of the invention that：
A kind of grinding pad and its replacing options that the present invention is provided, by grinding pad according to grinding head or grinding mat trimmer
Residence time destribution is designed to several region bands in different zones during sweep, is entered according to the abrasion condition of different zones band
Row is changed, so as to reach effect that is cost-effective and maintaining grinding rate stabilization.
Brief description of the drawings
Fig. 1 a and Fig. 1 b are the schematic diagram that grinding pad is divided into several region bands；
Fig. 2 is the connected mode schematic diagram of grinding pad area band；
Fig. 3 is grinding mat trimmer residence time ratio chart in different zones band in embodiment；
Fig. 4 is the schematic diagram for the grinding pad that region band is marked off according to Fig. 3.
Embodiment
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, but not as limiting to the invention.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art obtained on the premise of creative work is not made it is all its
His embodiment, belongs to the scope of protection of the invention.
It should be noted that in the case where not conflicting, the embodiment in the present invention and the feature in embodiment can phases
Mutually combination.
The present invention new grinding pad, its upper surface include several region bands, applied to including abrasive disk, grinding head and
The grinder station of grinding mat trimmer, during according to the stop in grinding pad upper table Surface scan of grinding head or grinding mat trimmer
Between, by residence time identical and connected region division into a region band.According to the abrasion condition of different zones band to grinding
The different zones of pad are individually changed, so as to reach effect that is cost-effective and maintaining grinding rate profile stabilizations.
Specifically, grinding pad is rotationally arranged on abrasive disk, and above and below the center of grinding pad and the center of abrasive disk
Overlap.Grinding head or grinding mat trimmer, in grinding pad upper table Surface scan, are centered on the center of abrasive disk, apart from phase
It is scanned Deng radius, such grinding head or grinding mat trimmer just divide the upper surface of grinding pad during scanning
Into different regions, our residence times grinding head or grinding mat trimmer in grinding pad upper table Surface scan it is identical and
Connected region division is into a region band, to cause a grinding pad to be divided into several region bands, this several region band
(zone) upper surface of grinding pad is divided into several concentric circles.As shown in Figure 1a two region bands (zone1 and
Grinding pad upper surface is divided into by three region bands (zone1, zone2 and zone3) zone2), either as shown in Figure 1 b
More regions band.Depending on the number of specific region band is according to the different residence times, the invention is not limited in this regard.
Further, the connected mode of these region bands takes the method that middle part is connected, i.e., take setting in each region
One junction, and one end of junction is provided with a tang, the other end is provided with a bayonet socket matched with the tang, will be every
Individual region band is fixed.
As a preferred embodiment, the present embodiment as shown in Fig. 2 trapezoidal inclined plane is taken in the junction of each region band
The method of connection, the width on inclined-plane is about the bayonet socket for having a semi-cylindrical in the middle part of 1~3mm, inclined-plane, and the width of semicolumn is about
1mm, for preventing lapping liquid from slowly penetrating, influences the Adhesion property of gum, and the direction of trapezoidal inclined plane must be with rotation
Direction is consistent, to prevent that junction is rolled in grinding pad rotary course.The direction that such as grinding pad rotates in grinding is
Counterclockwise, then connected mode of the region with junction is as shown in Figure 2.
The grinding pad and its replacing options of the present invention is elaborated with reference to a specific embodiment.
The approach application of above-mentioned grinding pad will now be designed in scanning (sweep) formula of a grinding mat trimmer, the journey
Formula sweep processes are divided into 9 scanning areas, and sweep original position is 1.5 inches of disk center of distance grinding, sweep termination
15 inches of disk center of distance grinding is set to, the width of each scanning area is 1.5 inches, work of the grinding pad in each scanning area
It is as shown in Figure 3 with time ratio.
From the figure 3, it may be seen that the Annual distribution between 3~scanning area of scanning area 7 is 8%, and scanning area 2 and scanning
The Annual distribution in region 8 is 9%, and two kinds of Annual distribution differences are little, and 2~scanning area of scanning area 8 is continuously to sweep
Region is retouched, then 2~scanning area of scanning area 8 can be defined as to a region band when designing grinding pad.So can be by
The sweep formulas that grinding pad is correspondingly divided into 3 region bands with grinding pad is arranged are corresponding, as shown in figure 4, being respectively to grind
The scanning area 1 of dresser sweep formulas is region band 1 (zone1), and 2~scanning area of scanning area 8 is region band 2
(zone2), scanning area 9 is region band 3 (zone3), and the width of 3 region bands of grinding pad is with grinding mat trimmer sweep's
The width of scanning area is relevant.
Specifically, region band is 3*2.25+5 (5 be abrasive disk disk radius)=11.75cm in zone1 radius, i.e.,
Zone1 is radius 11.75cm circle, zone3 radius be 13.5*2.25-5 (5 be abrasive disk disk radius)=
25.375cm, if the width of grinding pad is 80cm, zone3 is that 80/2-25.375=14.625cm, i.e. zone3 are that radius is
25.375cm width be 14.625cm annulus, remaining position be zone2, width 25.375-11.75=13.625cm, i.e.,
Zone2 is that radius is the annulus that 11.75cm width is 13.625cm.On designed new grinding pad, grinding mat trimmer exists
Zone1 sweep time and zone3 sweep times are at twice of sweep time of zone2, so zone2 life-span
(lifetime) should be twice of zone1 and zone3, so zone1 and zone3 be depleted need to be changed when it is individually right
Zone1 and zone3 addition particulate matters can extend the use time of grinding pad, and can ensure stable grinding rate
profile。
In summary, a kind of new grinding pad and its replacing options that provide of the present invention, by grinding pad according to grinding head or
Residence time destribution is designed to several region bands in different zones during grinding mat trimmer sweep, according to each region band
The PM ratios of the residence time ratio calculation grinding pad different zones band of grinding head or grinding mat trimmer, to different region bands
Changed respectively, so as to reach effect that is cost-effective and maintaining grinding rate stabilization.
It should be appreciated by those skilled in the art that those skilled in the art combine prior art and above-described embodiment can be with
Various change example is realized, such change case has no effect on the substantive content of the present invention, will not be described here.
Presently preferred embodiments of the present invention is described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, wherein the equipment and structure be not described in detail to the greatest extent are construed as giving reality with the common mode in this area
Apply；Any those skilled in the art, without departing from the scope of the technical proposal of the invention, all using the disclosure above
Methods and techniques content make many possible variations and modification to technical solution of the present invention, or be revised as equivalent variations etc.
Embodiment is imitated, this has no effect on the substantive content of the present invention.Therefore, every content without departing from technical solution of the present invention, foundation
The technical spirit of the present invention still falls within the present invention to any simple modifications, equivalents, and modifications made for any of the above embodiments
In the range of technical scheme protection.
Claims (4)
1. a kind of grinding pad, applied to including the grinder station of abrasive disk, grinding head and grinding mat trimmer, it is characterised in that
The grinding pad upper surface is provided with several region bands, and
Each region band be by the grinding head or the grinding mat trimmer in the grinding pad upper table Surface scan
Residence time identical and connected region division into region band；
Wherein, each region band is provided with a junction, and one end of the junction is provided with a tang, and the other end is set
A bayonet socket matched with the tang is equipped with, each region band is fixed；The junction be an inclined-plane, and it is described tiltedly
The direction in face is consistent with the direction of rotation of the grinding pad, to prevent the junction from being rolled in rotary course.
2. grinding pad according to claim 1, it is characterised in that the grinding pad is rotationally arranged at the abrasive disk
On, and the center of the grinding pad and the center of the abrasive disk coincide with the upper and lower.
3. grinding pad according to claim 1, it is characterised in that the grinding head and the grinding mat trimmer are with institute
Centered on the center for stating abrasive disk, the upper surface of the grinding pad is scanned apart from equal radii so that it is described several
The upper surface of the grinding pad is divided into several donuts by region band.
4. a kind of replacing options of grinding pad, applied to including the grinder station of abrasive disk, grinding head and grinding mat trimmer, its
It is characterised by, methods described includes：
According to the residence time of the grinding head or the grinding mat trimmer in the grinding pad upper table Surface scan, by institute
Residence time identical and connected region division is stated into a region band；
It is different according to the abrasion condition of each region band, the region band having worn out is dismantled and changes, and retain not
The region band of abrasion；
Wherein, one junction is set in each region band, and one tang is set in one end of the junction, the other end is set
A bayonet socket matched with the tang is put, each region band is fixed；The junction is an inclined-plane, and the inclined-plane
Direction it is consistent with the direction of rotation of the grinding pad, to prevent the junction from being rolled in rotary course.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510703868.2A CN105397617B (en) | 2015-10-26 | 2015-10-26 | A kind of grinding pad and its replacing options |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510703868.2A CN105397617B (en) | 2015-10-26 | 2015-10-26 | A kind of grinding pad and its replacing options |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105397617A CN105397617A (en) | 2016-03-16 |
| CN105397617B true CN105397617B (en) | 2017-10-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510703868.2A Active CN105397617B (en) | 2015-10-26 | 2015-10-26 | A kind of grinding pad and its replacing options |
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| CN (1) | CN105397617B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109202695A (en) * | 2017-06-30 | 2019-01-15 | 盖多·瓦伦蒂尼 | The polishing pad of hand-hold power tool and power tool with this polishing pad |
| CN113561060B (en) * | 2021-07-28 | 2022-10-21 | 北京烁科精微电子装备有限公司 | Control method, device and system of diamond collator |
| CN113635216A (en) * | 2021-08-26 | 2021-11-12 | 业成科技（成都）有限公司 | Abrasive paper, metallographic grinding method and device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001001255A (en) * | 1999-04-21 | 2001-01-09 | Seiko Epson Corp | Polishing cloth, polishing device and manufacture of semiconductor device |
| US6248006B1 (en) * | 2000-01-24 | 2001-06-19 | Chartered Semiconductor Manufacturing Ltd. | CMP uniformity |
| CN201677232U (en) * | 2010-05-21 | 2010-12-22 | 武汉新芯集成电路制造有限公司 | Grinding sheet |
| JP6239354B2 (en) * | 2012-12-04 | 2017-11-29 | 不二越機械工業株式会社 | Wafer polishing equipment |
| CN104149023A (en) * | 2014-07-17 | 2014-11-19 | 湖北鼎龙化学股份有限公司 | Chemical-mechanical polishing pad |
| CN204135871U (en) * | 2014-10-09 | 2015-02-04 | 中芯国际集成电路制造(北京)有限公司 | A kind of grinding pad |
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2015
- 2015-10-26 CN CN201510703868.2A patent/CN105397617B/en active Active
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| CN105397617A (en) | 2016-03-16 |
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