CN105397617A - Grinding pad and replacing method thereof - Google Patents
Grinding pad and replacing method thereof Download PDFInfo
- Publication number
- CN105397617A CN105397617A CN201510703868.2A CN201510703868A CN105397617A CN 105397617 A CN105397617 A CN 105397617A CN 201510703868 A CN201510703868 A CN 201510703868A CN 105397617 A CN105397617 A CN 105397617A
- Authority
- CN
- China
- Prior art keywords
- grinding
- grinding pad
- region
- region bands
- bands
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to the technical field of semiconductor manufacturing, in particular to a grinding pad and a replacing method thereof. The grinding pad is applied to a grinding machine table comprising a grinding disc, a grinding head and a grinding pad dresser. The upper surface of the grinding pad comprises a plurality of regional zones. Connected regions with the same standing time are divided into one regional zone according to the standing time when the grinding head or the grinding pad dresser scans the upper surface of the grinding pad, and replacement is conducted according to abrasion conditions of different regional zones, and thus the effects that the cost is reduced and the stable grinding rate is maintained can be achieved.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, be specifically related to a kind of grinding pad and replacing options thereof.
Background technology
In chemically mechanical polishing (CMP) process of lapping, in order to obtain required grinding rate, grinding head and grinding mat trimmer all can carry out scanning (sweep) centered by abrasive disk center.Usually the region of their sweep all can be divided into different regions (zone), and the time difference that grinding head and grinding mat trimmer stop in these zone can cause the grinding loss of these region grinding pads different.When the maximum time that grinding pad allows close to grinding processing procedure, some region grinding pad raceway groove shoals or polishes.When grinding pad subregion occurs just grinding pad to be replaced time raceway groove shoals or polishes, there is certain waste like this, and the change of grinding rate can be caused, the uniformity of silicon chip after grinding is impacted, finally affects product quality.
Summary of the invention
For the deficiencies in the prior art, the invention provides a kind of grinding pad and replacing options thereof, by grinding pad according to when grinding head or grinding mat trimmer sweep in zones of different residence time destribution be designed to several regions, abrasion condition according to zones of different is changed, thus can reach cost-saving and maintain the stable effect of grinding rate.
Technical purpose of the present invention is realized by following technological means:
A kind of grinding pad, be applied to the grinder station comprising abrasive disk, grinding head and grinding mat trimmer, it is characterized in that, described grinding pad upper surface is provided with several region bands, and
Each described region bands is the region bands of the Region dividing one-tenth that the time of staying when described grinding pad upper surface scans is identical and connected by described grinding head or described grinding mat trimmer.
Preferably, above-mentioned grinding pad, wherein, described grinding pad is rotatably arranged on described abrasive disk, and the center of the center of described grinding pad and described abrasive disk coincides with the upper and lower.
Preferably, above-mentioned grinding pad, wherein, described grinding head and described grinding mat trimmer are centered by the center of described abrasive disk, the upper surface of distance equal radii to described grinding pad scans, and to make several region bands described, the upper surface of described grinding pad is divided into several donuts.
Preferably, above-mentioned grinding pad, wherein, each described region bands is provided with a junction, and one end of described junction is provided with a tang, and the other end is provided with a bayonet socket mated with described tang, each described region bands to be fixed.
Preferably, above-mentioned grinding pad, wherein, described junction is an inclined-plane, and the direction on described inclined-plane is consistent with the direction of rotation of described grinding pad, rolls in rotary course to prevent described junction.
The present invention also provides a kind of replacing options of grinding pad, is applied to the grinder station comprising abrasive disk, grinding head and grinding mat trimmer, it is characterized in that, described method comprises:
The time of staying when described grinding pad upper surface scans according to described grinding head or described grinding mat trimmer, the Region dividing identical and connected the described time of staying is become a region bands;
Different according to the abrasion condition of each described region bands, dismantle and change the described region bands of experience wear, and retaining unworn region bands.
Compared with prior art, advantage of the present invention is:
A kind of grinding pad provided by the invention and replacing options thereof, by grinding pad according to when grinding head or grinding mat trimmer sweep in zones of different residence time destribution be designed to several region bands, abrasion condition according to zones of different band is changed, thus can reach cost-saving and maintain the stable effect of grinding rate.
Accompanying drawing explanation
Fig. 1 a and Fig. 1 b is the schematic diagram that grinding pad is divided into several region bands;
Fig. 2 is the connected mode schematic diagram of grinding pad region bands;
Fig. 3 is the time ratio figure that in embodiment, grinding mat trimmer stops in zones of different band;
Fig. 4 is the schematic diagram of the grinding pad marking off region bands according to Fig. 3.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the invention will be further described, but not as limiting to the invention.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of protection of the invention.
It should be noted that, when not conflicting, the embodiment in the present invention and the feature in embodiment can combine mutually.
New grinding pad of the present invention, its upper surface comprises several region bands, be applied to the grinder station comprising abrasive disk, grinding head and grinding mat trimmer, the time of staying when grinding pad upper surface scans according to grinding head or grinding mat trimmer, the Region dividing identical and connected the time of staying is become a region bands.The zones of different of abrasion condition to grinding pad according to zones of different band is changed separately, thus can reach cost-saving and maintain the stable effect of grinding rate profile.
Concrete, grinding pad is rotatably arranged on abrasive disk, and the center of the center of grinding pad and abrasive disk coincides with the upper and lower.Grinding head or grinding mat trimmer are when grinding pad upper surface scans, centered by the center of abrasive disk, distance equal radii scans, such grinding head or grinding mat trimmer are just divided into different regions the upper surface of grinding pad in the process of scanning, we become a region bands at the time of staying when grinding pad upper surface scans is identical and connected grinding head or grinding mat trimmer Region dividing, several region bands are divided into make a grinding pad, the upper surface of grinding pad is divided into several concentric circles by these several region bands (zone).Two region bands (zone1 and zone2) as shown in Figure 1a, or three region bands (zone1, zone2 and zone3) as shown in Figure 1 b, or grinding pad upper surface is divided into more region bands.The number of concrete region bands was determined according to the different time of staying, and the present invention is not restricted this.
Further, the connected mode of these region bands takes the method for middle part connection, and namely in each region bands, arrange a junction, and one end of junction is provided with a tang, the other end is provided with a bayonet socket mated with this tang, each region bands to be fixed.
As a preferred embodiment, the present embodiment as shown in Figure 2, the method that the junction of each region bands takes trapezoidal inclined plane to connect, the width on inclined-plane is about 1 ~ 3mm, and there is a half-terete bayonet socket at the middle part on inclined-plane, and the width of semicolumn is about 1mm, slowly infiltrate for preventing lapping liquid, affect the Adhesion property of gum, and the direction of trapezoidal inclined plane must be consistent with the direction rotated, and rolls to prevent junction in grinding pad rotary course.The direction that such as grinding pad rotates when grinding is that counterclockwise then the connected mode of region bands junction as shown in Figure 2.
Grinding pad of the present invention and replacing options thereof is elaborated below in conjunction with a specific embodiment.
Now will design the approach application of above-mentioned grinding pad in scanning (sweep) formula of a grinding mat trimmer, this formula sweep process is divided into 9 scanning areas, the original position of sweep is distance 1.5 inches, abrasive disk center, the termination of sweep is set to distance 15 inches, abrasive disk center, the width of each scanning area is 1.5 inches, grinding pad each scanning area action time ratio as shown in Figure 3.
As shown in Figure 3, Annual distribution between scanning area 3 ~ scanning area 7 is 8%, and the Annual distribution of scanning area 2 and scanning area 8 is 9%, two kinds of Annual distribution differences are little, and scanning area 2 ~ scanning area 8 is continuous print scanning area, then scanning area 2 ~ scanning area 8 can be defined as a region bands when designing grinding pad.So it is corresponding with the sweep formula that grinding pad arranges grinding pad correspondingly can be divided into 3 region bands, as shown in Figure 4, the scanning area 1 being respectively grinding mat trimmer sweep formula is region bands 1 (zone1), scanning area 2 ~ scanning area 8 is region bands 2 (zone2), scanning area 9 is region bands 3 (zone3), and the width of grinding pad 3 region bands is relevant with the width of the scanning area of grinding mat trimmer sweep.
Concrete, region bands is the 3*2.25+5 radius of abrasive disk disk (5 be)=11.75cm at the radius of zone1, namely zone1 is the circle of radius 11.75cm, the radius of zone3 is the 13.5*2.25-5 radius of abrasive disk disk (5 be)=25.375cm, if the width of grinding pad is 80cm, then zone3 is 80/2-25.375=14.625cm, the annulus of namely zone3 is radius to be 25.375cm width be 14.625cm, remaining position is zone2, width 25.375-11.75=13.625cm, the annulus of namely zone2 is radius to be 11.75cm width be 13.625cm.On the new grinding pad designed, grinding mat trimmer is the twice of the sweep time at zone2 in sweep time of zone1 and zone3 sweep time, so the life-span of zone2 (lifetime) should be the twice of zone1 and zone3, separately added to zone1 and zone3 the service time that particle can extend grinding pad when zone1 and zone3 is depleted and needs to change like this, and stable grinding rate profile can be ensured.
In sum, a kind of new grinding pad provided by the invention and replacing options thereof, by grinding pad according to when grinding head or grinding mat trimmer sweep in zones of different residence time destribution be designed to several region bands, the PM ratio of grinding pad zones of different band is calculated according to the time of staying ratio of each region bands grinding head or grinding mat trimmer, different region bands is changed respectively, thus can reach cost-saving and maintain the stable effect of grinding rate.
It should be appreciated by those skilled in the art that those skilled in the art can realize various change case in conjunction with prior art and above-described embodiment, such change case does not affect flesh and blood of the present invention, does not repeat them here.
Above preferred embodiment of the present invention is described.It is to be appreciated that the present invention is not limited to above-mentioned particular implementation, the equipment wherein do not described in detail to the greatest extent and structure are construed as to be implemented with the common mode in this area; Any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the Method and Technology content of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or being revised as the Equivalent embodiments of equivalent variations, this does not affect flesh and blood of the present invention.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (6)
1. a grinding pad, is applied to the grinder station comprising abrasive disk, grinding head and grinding mat trimmer, it is characterized in that, described grinding pad upper surface is provided with several region bands, and
Each described region bands is the region bands of the Region dividing one-tenth that the time of staying when described grinding pad upper surface scans is identical and connected by described grinding head or described grinding mat trimmer.
2. grinding pad according to claim 1, is characterized in that, described grinding pad is rotatably arranged on described abrasive disk, and the center of the center of described grinding pad and described abrasive disk coincides with the upper and lower.
3. grinding pad according to claim 1, it is characterized in that, described grinding head and described grinding mat trimmer are centered by the center of described abrasive disk, the upper surface of distance equal radii to described grinding pad scans, and to make several region bands described, the upper surface of described grinding pad is divided into several donuts.
4. grinding pad according to claim 1, is characterized in that, each described region bands is provided with a junction, and one end of described junction is provided with a tang, and the other end is provided with a bayonet socket mated with described tang, each described region bands to be fixed.
5. grinding pad according to claim 4, is characterized in that, described junction is an inclined-plane, and the direction on described inclined-plane is consistent with the direction of rotation of described grinding pad, rolls in rotary course to prevent described junction.
6. a replacing options for grinding pad, is applied to the grinder station comprising abrasive disk, grinding head and grinding mat trimmer, it is characterized in that, described method comprises:
The time of staying when described grinding pad upper surface scans according to described grinding head or described grinding mat trimmer, the Region dividing identical and connected the described time of staying is become a region bands;
Different according to the abrasion condition of each described region bands, dismantle and change the described region bands of experience wear, and retaining unworn region bands.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510703868.2A CN105397617B (en) | 2015-10-26 | 2015-10-26 | A kind of grinding pad and its replacing options |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510703868.2A CN105397617B (en) | 2015-10-26 | 2015-10-26 | A kind of grinding pad and its replacing options |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105397617A true CN105397617A (en) | 2016-03-16 |
| CN105397617B CN105397617B (en) | 2017-10-03 |
Family
ID=55463541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510703868.2A Active CN105397617B (en) | 2015-10-26 | 2015-10-26 | A kind of grinding pad and its replacing options |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105397617B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109202695A (en) * | 2017-06-30 | 2019-01-15 | 盖多·瓦伦蒂尼 | The polishing pad of hand-hold power tool and power tool with this polishing pad |
| CN113561060A (en) * | 2021-07-28 | 2021-10-29 | 北京烁科精微电子装备有限公司 | Control method, device and system of diamond collator |
| CN113635216A (en) * | 2021-08-26 | 2021-11-12 | 业成科技（成都）有限公司 | Abrasive paper, metallographic grinding method and device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001001255A (en) * | 1999-04-21 | 2001-01-09 | Seiko Epson Corp | Polishing cloth, polishing device and manufacture of semiconductor device |
| US6248006B1 (en) * | 2000-01-24 | 2001-06-19 | Chartered Semiconductor Manufacturing Ltd. | CMP uniformity |
| CN201677232U (en) * | 2010-05-21 | 2010-12-22 | 武汉新芯集成电路制造有限公司 | Grinding sheet |
| CN103846781A (en) * | 2012-12-04 | 2014-06-11 | 不二越机械工业株式会社 | Wafer polishing apparatus |
| CN104149023A (en) * | 2014-07-17 | 2014-11-19 | 湖北鼎龙化学股份有限公司 | Chemical-mechanical polishing pad |
| CN204135871U (en) * | 2014-10-09 | 2015-02-04 | 中芯国际集成电路制造(北京)有限公司 | A kind of grinding pad |
-
2015
- 2015-10-26 CN CN201510703868.2A patent/CN105397617B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001001255A (en) * | 1999-04-21 | 2001-01-09 | Seiko Epson Corp | Polishing cloth, polishing device and manufacture of semiconductor device |
| US6248006B1 (en) * | 2000-01-24 | 2001-06-19 | Chartered Semiconductor Manufacturing Ltd. | CMP uniformity |
| CN201677232U (en) * | 2010-05-21 | 2010-12-22 | 武汉新芯集成电路制造有限公司 | Grinding sheet |
| CN103846781A (en) * | 2012-12-04 | 2014-06-11 | 不二越机械工业株式会社 | Wafer polishing apparatus |
| CN104149023A (en) * | 2014-07-17 | 2014-11-19 | 湖北鼎龙化学股份有限公司 | Chemical-mechanical polishing pad |
| CN204135871U (en) * | 2014-10-09 | 2015-02-04 | 中芯国际集成电路制造(北京)有限公司 | A kind of grinding pad |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109202695A (en) * | 2017-06-30 | 2019-01-15 | 盖多·瓦伦蒂尼 | The polishing pad of hand-hold power tool and power tool with this polishing pad |
| CN113561060A (en) * | 2021-07-28 | 2021-10-29 | 北京烁科精微电子装备有限公司 | Control method, device and system of diamond collator |
| CN113635216A (en) * | 2021-08-26 | 2021-11-12 | 业成科技（成都）有限公司 | Abrasive paper, metallographic grinding method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105397617B (en) | 2017-10-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105397617A (en) | Grinding pad and replacing method thereof | |
| JP5741497B2 (en) | Wafer double-side polishing method | |
| CN101100048A (en) | Grinding cushion with surface texture | |
| TWM459065U (en) | Polishing pad and polishing system | |
| JP6032155B2 (en) | Wafer double-side polishing method | |
| CN101116953A (en) | Chemical mechanism grinding and finishing device | |
| CN104139336A (en) | A trimming tool | |
| CN102862121B (en) | Chemical mechanical polishing (CMP) grinding pad finishing structure | |
| KR101292227B1 (en) | Apparatus for dressing pads for polishing wafer | |
| CN201645323U (en) | Diamond dresser for chemical mechanical grinding | |
| KR20160063362A (en) | Carrier plate and workpiece double-side polishing device | |
| CN101722468A (en) | Chemical mechanical polishing method, grinding fluid nozzle and chemical mechanical polishing device | |
| KR20100062369A (en) | Polishing pad dresser | |
| KR100962090B1 (en) | Polishing pad dressing unit | |
| CN101422882B (en) | Grinding mat and method | |
| KR100680880B1 (en) | Retainer ring and chemical mechanical polishing apparatus having the same | |
| JP5892389B2 (en) | Polishing pad and polishing method | |
| KR20100062372A (en) | Polishing pad dresser | |
| CN207724098U (en) | Snap ring structure part and chemical mechanical polishing device | |
| JP2004327577A (en) | Semiconductor wafer grinder | |
| KR20120001816U (en) | Cmp dresser | |
| JP2018039079A (en) | Polishing pad | |
| KR20230169683A (en) | Polishing pad having improved polishing speed and chemical mechanical polishing apparatus including the same | |
| KR20050079096A (en) | Pad for chemical mechanical polishing | |
| CN104162847A (en) | Diamond grinding disk for road surface grinding |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |