CN101100048A - Grinding cushion with surface texture - Google Patents
Grinding cushion with surface texture Download PDFInfo
- Publication number
- CN101100048A CN101100048A CNA2006100901728A CN200610090172A CN101100048A CN 101100048 A CN101100048 A CN 101100048A CN A2006100901728 A CNA2006100901728 A CN A2006100901728A CN 200610090172 A CN200610090172 A CN 200610090172A CN 101100048 A CN101100048 A CN 101100048A
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- groove
- grinding pad
- surface pattern
- grinding
- hole
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Abstract
The present invention is one kind of grinding pad with surface grains. The surface grains on one polished surface of the grinding pad includes at least one first groove, at least one second groove and several holes. The second groove extends from the centre of the grinding pad to its margin, the first groove interleaves to the second groove to form several intersection points, and the holes located in the intersection points have depth greater than that of the first groove. The second groove makes impurity suspended on the grinding slurry leave fast from the grinding pad, while the holes can store grinding slurry to prolong the time for the grinding particles to stay in the grinding pad.
Description
Technical field
The present invention relates to a kind of grinding pad, have hole to store the grinding pad of grinding milk in particular to a kind of with surface pattern.
Background technology
Polishing refers generally in cmp (CMP) processing procedure, for the abrasion control that just is rough surface, the grinding milk that its utilization contains polishing particles on average is scattered in the upper surface of a grinding pad, rubs mill with the hands to repeat the rule action after simultaneously a polished object being propped up described grinding pad.Described polished object is such as objects such as semiconductor, Storage Media base material, integrated circuit, LCD flat panel glass, optical glass and photoelectric panels.For the distribution of keeping described grinding milk with flow and cmp after planarization and grinding efficiency, can offer a plurality of grooves on the upper surface of described grinding pad usually or form a surface pattern.Therefore, described grinding pad is vulnerable to the influence of described groove or described surface pattern for the polishing effect of described polished object.
With reference to figure 1, the demonstration TaiWan, China is announced the schematic top plan view of No. 504429 grinding pad with surface pattern that patent disclosed.The surface pattern of described grinding pad 1 comprises a plurality of concentric circular groove 11, and the degree of depth of wherein said circular groove 11 and width are to design according to required.The shortcoming of described grinding pad 1 is that the impurity that is produced in the process of lapping is difficult for leaving described grinding pad 1 apace, thereby influences the service life of grinding precision and described grinding pad 1.
With reference to figure 2, the demonstration TaiWan, China is announced the schematic top plan view of No. 562716 grinding pad with surface pattern that patent disclosed.The surface pattern of described grinding pad 2 comprises a plurality of radial grooves 21, and wherein said radial groove 21 connects the center 22 of described grinding pad 2 and the edge 23 of described grinding pad 2.The advantage of described grinding pad 2 is that the impurity that is produced in the process of lapping leaves described grinding pad 2 easily apace, but its shortcoming is the polishing particles in the grinding milk also leaves described grinding pad 2 apace, thereby influences the service life of grinding precision and described grinding pad 2.
Therefore, be necessary to provide the grinding pad with surface pattern of a kind of innovation and tool progressive, to address the above problem.
Summary of the invention
Main purpose of the present invention is to provide a kind of grinding pad with surface pattern, it comprises a surface pattern, described surface pattern is positioned on the burnishing surface of described grinding pad, and described surface pattern comprises at least one first groove, at least one second groove and a plurality of hole.Described second groove is connected to described grinding pad edge, and described first groove and described second groove are staggered and form a plurality of cross-points.Described hole is positioned on the described cross-point, and the degree of depth of described hole is greater than the degree of depth of described first groove.
By this, described second groove can make the impurity that is suspended in grinding milk leave described grinding pad apace, and described hole then can store grinding milk to prolong the time that polishing particles in the described grinding milk leaves described grinding pad.
Description of drawings
Fig. 1 shows that TaiWan, China announces the schematic top plan view of No. 504429 grinding pad with surface pattern that patent disclosed;
Fig. 2 shows that TaiWan, China announces the schematic top plan view of No. 562716 grinding pad with surface pattern that patent disclosed;
Fig. 3 shows the schematic top plan view of the grinding pad of example 1 of the present invention;
Fig. 4 shows the schematic top plan view of the grinding pad of example 2 of the present invention;
Fig. 5 shows the schematic top plan view of the grinding pad of example 3 of the present invention;
Fig. 6 shows the schematic top plan view of the grinding pad of example 4 of the present invention;
Fig. 7 shows the schematic top plan view of the grinding pad of example 5 of the present invention; With
Fig. 8 shows the schematic top plan view of the grinding pad of example 6 of the present invention.
The specific embodiment
The invention provides a kind of grinding pad with surface pattern, described grinding pad is applied in cmp (CMP) processing procedure a polished object be ground or polishes.Described polished object includes but not limited to objects such as semiconductor, Storage Media base material, integrated circuit, LCD flat panel glass, optical glass and photoelectric panel.
The grinding pad that the present invention has surface pattern comprises a surface pattern, and described surface pattern is positioned on the burnishing surface of described grinding pad, and described surface pattern comprises at least one first groove, at least one second groove and a plurality of hole.In a preferred embodiment, to watch be to comprise that the circular groove of plural number circle different radii and described circular groove are for one heart to described first groove by overlooking, to watch can also be the square trench of the different length of sides of plural number circle and described square trench for one heart yet described first groove is by overlooking, or described first groove can also be a spiral groove or the groove of other shape.
Described second groove extends to an edge of described grinding pad by a central portion of described grinding pad, and described first groove and described second groove are staggered and form a plurality of cross-points.Preferably, described second groove is that by overlooking to watch a plurality of radial grooves, each second groove can be linearity groove or arcuation groove.Described hole is positioned on the described cross-point, and the degree of depth of described hole is greater than the degree of depth of described first groove and described second groove.By this, described second groove can make the impurity that is suspended in grinding milk leave described grinding pad apace, and described hole then can store grinding milk to prolong the time that polishing particles in the described grinding milk leaves described grinding pad.
Now described in detail the present invention, but do not meaned the content that the present invention only is confined to these examples and is disclosed with following example.
Example 1:
With reference to figure 3, show the schematic top plan view of the grinding pad of example 1 of the present invention.The surface pattern of the grinding pad 3 of this example comprises a plurality of first grooves 31, a plurality of second groove 32 and a plurality of hole 33.Described first groove 31 is by overlooking the circular groove of watching to plural number circle different radii, and described circular groove is concentric.Described second groove 32 is a plurality of radial grooves, and each second groove 32 is linearity groove and the edge 34 that is extended to described grinding pad 3 by a central portion of described grinding pad 3.Described first groove 31 and described second groove 32 interlock and form a plurality of cross-points.Described hole 33 is positioned on the described cross-point, and the degree of depth of described hole 33 is greater than the degree of depth of described first groove 31 and described second groove 32.
Example 2:
With reference to figure 4, show the schematic top plan view of the grinding pad of example 2 of the present invention.The surface pattern of the grinding pad 4 of this example comprises a plurality of first grooves 41, a plurality of second groove 42 and a plurality of hole 43.Described first groove 41 is a plurality of circular concentric grooves.Described second groove 42 is a plurality of radial grooves, and each second groove 42 is linearity groove and the edge 44 that is extended to described grinding pad 4 by a central portion of described grinding pad 4.Described first groove 41 and described second groove 42 interlock and form a plurality of cross-points.Described hole 43 is positioned on the described cross-point, and the degree of depth of described hole 43 is greater than the degree of depth of described first groove 41 and described second groove 42.Not existing together of the surface pattern of the surface pattern of the grinding pad 4 of this example and the grinding pad 3 of described example 1 only be, first groove 411 of the inner ring of described grinding pad 4 is staggered with described second groove 42.
Example 3:
With reference to figure 5, show the schematic top plan view of the grinding pad of example 3 of the present invention.The surface pattern of the grinding pad 5 of this example comprises a plurality of first grooves 51, a plurality of second groove 52, a plurality of first hole 53 and a plurality of second hole 55.Described first groove 51 is a plurality of circular concentric grooves.Described second groove 52 is a plurality of radial grooves, and each second groove 52 is linearity groove and the edge 54 that is extended to described grinding pad 5 by a central portion of described grinding pad 5.Described first groove 51 and described second groove 52 interlock and form a plurality of cross-points.Described first hole 53 is positioned on the described cross-point, and the degree of depth of described first hole 53 is greater than the degree of depth of described first groove 41 and described second groove 42.Described second hole 55 is positioned on described second groove 52 but not in the position of described cross-point, and the degree of depth of described second hole 55 is identical with the degree of depth of described first hole 53.
Example 4:
With reference to figure 6, show the schematic top plan view of the grinding pad of example 4 of the present invention.The surface pattern of the grinding pad 6 of this example comprises a plurality of first grooves 61, a plurality of second groove 62 and a plurality of hole 63.To watch be the square trench that plural number encloses the different length of sides to described first groove 61 to overlook, and described square trench is concentric.Described second groove 62 is a plurality of radial grooves, and each second groove 62 is linearity groove and the edge 64 that is extended to described grinding pad 6 by a central portion of described grinding pad 6.Described first groove 61 and described second groove 62 interlock and form a plurality of cross-points.Described hole 63 is positioned on the described cross-point, and the degree of depth of described hole 63 is greater than the degree of depth of described first groove 61 and described second groove 62.
Example 5:
With reference to figure 7, show the schematic top plan view of the grinding pad of example 5 of the present invention.The surface pattern of the grinding pad 7 of this example comprises one first groove 71, a plurality of second groove 72 and a plurality of hole 73.To watch be a spiral groove to described first groove 71 to overlook.Described second groove 72 is a plurality of radial grooves, and each second groove 72 is linearity groove and the edge 74 that is extended to described grinding pad 7 by a central portion of described grinding pad 7.Described first groove 71 and described second groove 72 interlock and form a plurality of cross-points.Described hole 73 is positioned on the described cross-point, and the degree of depth of described hole 73 is greater than the degree of depth of described first groove 71 and described second groove 72.
Example 6:
With reference to figure 8, show the schematic top plan view of the grinding pad of example 6 of the present invention.The surface pattern of the grinding pad 8 of this example comprises a plurality of first grooves 81, a plurality of second groove 82 and a plurality of hole 83.Described first groove 81 is a plurality of circular concentric grooves.Described second groove 82 is a plurality of radial grooves, and each second groove 82 is arcuation groove and the edge 84 that is extended to described grinding pad 8 by a central portion of described grinding pad 8.Described first groove 81 and described second groove 82 interlock and form a plurality of cross-points.Described hole 83 is positioned on the described cross-point, and the degree of depth of described hole 83 is greater than the degree of depth of described first groove 81 and described second groove 82.
But the foregoing description only is explanation principle of the present invention and its effect, but not in order to restriction the present invention.Therefore, the those skilled in the art can make amendment to the foregoing description under the situation of spirit of the present invention and change.Interest field of the present invention should be listed as appending claims.
Claims (11)
1. grinding pad with surface pattern comprises:
One surface pattern, described surface pattern comprises:
At least one first groove;
At least one second groove extends to an edge of described grinding pad by a central portion of described grinding pad, and described first groove and described second groove are staggered and form a plurality of cross-points; With
A plurality of holes are positioned on the described cross-point, and the degree of depth of described hole is greater than the degree of depth of described first groove.
2. grinding pad according to claim 1, to watch be the circular groove that comprises plural number circle different radii to wherein said first groove by overlooking, and described circular groove is concentric.
3. grinding pad according to claim 1, to watch be the square trench that comprises the different length of sides of plural number circle to wherein said first groove by overlooking, and described square trench is concentric.
4. grinding pad according to claim 1, to watch be a spiral groove to wherein said first groove by overlooking.
5. grinding pad according to claim 1, wherein said second groove is watched to comprising a plurality of radial grooves by overlooking.
6. grinding pad according to claim 5, wherein each described second groove is a straight-line groove.
7. grinding pad according to claim 5, wherein each described second groove is an arcuation groove.
8. grinding pad with surface pattern comprises:
One surface pattern, described surface pattern comprises:
The circular groove of plural number circle different radii, described circular groove is concentric;
A plurality of radial type trench extend to an edge of described grinding pad by a central portion of described grinding pad, and
Described circular groove and described radial type trench interlock and form a plurality of cross-points; With
A plurality of first holes, described first hole is positioned on the described cross-point, and the degree of depth of described first hole is greater than the degree of depth of described circular groove.
9. grinding pad according to claim 8, wherein each described radial type trench is a straight-line groove.
10. grinding pad according to claim 8, wherein each described radial type trench is an arcuation groove.
11. grinding pad according to claim 8 more comprises a plurality of second holes, described second hole is positioned on the described circular groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100901728A CN100478138C (en) | 2006-07-03 | 2006-07-03 | Grinding cushion with surface texture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100901728A CN100478138C (en) | 2006-07-03 | 2006-07-03 | Grinding cushion with surface texture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101100048A true CN101100048A (en) | 2008-01-09 |
| CN100478138C CN100478138C (en) | 2009-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100901728A Expired - Fee Related CN100478138C (en) | 2006-07-03 | 2006-07-03 | Grinding cushion with surface texture |
Country Status (1)
| Country | Link |
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| CN (1) | CN100478138C (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101817160A (en) * | 2010-04-13 | 2010-09-01 | 王敬 | Silicon ingot polishing method, system and polishing plate |
| CN102554784A (en) * | 2012-02-10 | 2012-07-11 | 上海宏力半导体制造有限公司 | Method for manufacturing fine polishing cushion and chemical mechanical polishing method |
| CN103068525A (en) * | 2010-07-28 | 2013-04-24 | 3M创新有限公司 | Hybrid abrasive hand pad and method of abrading a surface |
| CN101637888B (en) * | 2008-08-01 | 2013-09-18 | 智胜科技股份有限公司 | Grinding pad and method for manufacturing same |
| CN104552033A (en) * | 2013-10-16 | 2015-04-29 | 三芳化学工业股份有限公司 | Method for manufacturing grinding pad and grinding device |
| CN105619238A (en) * | 2011-01-26 | 2016-06-01 | 内克斯普拉纳公司 | Polishing pad with concentric or approximately concentric polygon groove pattern |
| CN106463383A (en) * | 2014-07-17 | 2017-02-22 | 应用材料公司 | Method, system and polishing pad for chemical mechancal polishing |
| CN106564004A (en) * | 2016-11-17 | 2017-04-19 | 湖北鼎龙控股股份有限公司 | Polishing pad |
| CN106607749A (en) * | 2015-10-22 | 2017-05-03 | 中芯国际集成电路制造(上海)有限公司 | Blocking type chemical mechanical grinding pad and grinding device |
| CN110732933A (en) * | 2019-10-23 | 2020-01-31 | 中国科学院光电技术研究所 | Polishing liquid supply and recovery polishing tool head device suitable for large-caliber optical element |
| TWI823988B (en) * | 2018-08-22 | 2023-12-01 | 日商迪思科股份有限公司 | polishing pad |
-
2006
- 2006-07-03 CN CNB2006100901728A patent/CN100478138C/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101637888B (en) * | 2008-08-01 | 2013-09-18 | 智胜科技股份有限公司 | Grinding pad and method for manufacturing same |
| CN101817160A (en) * | 2010-04-13 | 2010-09-01 | 王敬 | Silicon ingot polishing method, system and polishing plate |
| CN103068525A (en) * | 2010-07-28 | 2013-04-24 | 3M创新有限公司 | Hybrid abrasive hand pad and method of abrading a surface |
| CN105619238A (en) * | 2011-01-26 | 2016-06-01 | 内克斯普拉纳公司 | Polishing pad with concentric or approximately concentric polygon groove pattern |
| CN102554784A (en) * | 2012-02-10 | 2012-07-11 | 上海宏力半导体制造有限公司 | Method for manufacturing fine polishing cushion and chemical mechanical polishing method |
| CN104552033A (en) * | 2013-10-16 | 2015-04-29 | 三芳化学工业股份有限公司 | Method for manufacturing grinding pad and grinding device |
| CN106463383A (en) * | 2014-07-17 | 2017-02-22 | 应用材料公司 | Method, system and polishing pad for chemical mechancal polishing |
| CN112123196A (en) * | 2014-07-17 | 2020-12-25 | 应用材料公司 | Method and system for chemical mechanical polishing and polishing pad |
| CN106607749A (en) * | 2015-10-22 | 2017-05-03 | 中芯国际集成电路制造(上海)有限公司 | Blocking type chemical mechanical grinding pad and grinding device |
| CN106607749B (en) * | 2015-10-22 | 2019-01-22 | 中芯国际集成电路制造(上海)有限公司 | A kind of barrier type chemical and mechanical grinding cushion and grinding device |
| CN106564004A (en) * | 2016-11-17 | 2017-04-19 | 湖北鼎龙控股股份有限公司 | Polishing pad |
| TWI823988B (en) * | 2018-08-22 | 2023-12-01 | 日商迪思科股份有限公司 | polishing pad |
| CN110732933A (en) * | 2019-10-23 | 2020-01-31 | 中国科学院光电技术研究所 | Polishing liquid supply and recovery polishing tool head device suitable for large-caliber optical element |
| CN110732933B (en) * | 2019-10-23 | 2021-07-16 | 中国科学院光电技术研究所 | Polishing liquid supply and recovery polishing tool head device suitable for large-caliber optical element |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100478138C (en) | 2009-04-15 |
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| SE01 | Entry into force of request for substantive examination | ||
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Granted publication date: 20090415 Termination date: 20200703 |