CN103029033A - Grinding apparatus and grinding method - Google Patents
Grinding apparatus and grinding method Download PDFInfo
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- CN103029033A CN103029033A CN2012103570012A CN201210357001A CN103029033A CN 103029033 A CN103029033 A CN 103029033A CN 2012103570012 A CN2012103570012 A CN 2012103570012A CN 201210357001 A CN201210357001 A CN 201210357001A CN 103029033 A CN103029033 A CN 103029033A
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- workpiece
- pinion frame
- following table
- retaining hole
- table face
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
- B24B13/015—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor of television picture tube viewing panels, headlight reflectors or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
Abstract
The invention discloses a grinding apparatus and a grinding method. The grinding apparatus includes: an upper surface plate; a lower surface plate disposed facing the upper surface plate and rotating in an opposite direction to the upper surface plate; a sun gear rotated by a same rotational shaft as the upper surface plate and the lower surface plate; an internal gear rotated by the same rotational shaft as the upper surface plate and the lower surface plate; and a planetary carrier in which a holding hole that holds a workpiece is formed and which revolves while rotating in engagement with the sun gear and the internal gear. The holding hole in the planetary carrier is provided with a cutaway in a side of the holding hole that contacts a side surface of the workpiece when the planetary carrier rotates. The grinding apparatus and the grinding method at least can prevent crack of a starting point at an end surface of a workpiece during a grinding period.
Description
The cross reference of related application
The application comprises the relevant theme of the disclosed content of Japanese priority patent application JP 2011-218469 of submitting to Japan Office with on September 30th, 2011, therefore incorporates by reference the full content of this Japanese priority application into this paper.
Technical field
The present invention relates to the lapping device and the Ginding process that grind such as the object such as employed display board in the glass plate of smoothing of surface and the liquid crystal display.
Background technology
In recent years, except the traditional mobile phone that only has function of voice communication, the advanced mobile phone (being called as " smart mobile phone ") that can be also used as the mobile personal computer has all become common.Under many circumstances, in the display unit of such mobile terminal apparatus, used such as liquid crystal panel or organic electroluminescent (electroluminescence; EL) flat-panel monitor (the flat panel display such as panel; FPD).Before being mounted to mobile terminal apparatus, the surface (and back side) of flat-panel monitor (perhaps, hereinafter being called " display floater ") will be through grinding.As an example, as shown in Figure 11, passing through colour filter 15 and thin film transistor (TFT) (Thin Film Transistor; TFT) substrate 16 combines (that is, bonding together) and in the grinding step of the liquid crystal panel that produces, need to make liquid crystal panel thinner and firmer.Colour filter 15 and TFT substrate 16 all with glass substrate as critical piece.
Known twin grinder is the grinder that can grind display floater.Twin grinder can grind two surfaces that are polished workpiece as follows simultaneously: the pinion frame (planetary carrier) that has for the retaining hole of holding workpiece is moved in the mode (epicyclically) of turnover, and between upper surface dish and following table face the workpiece in the retaining hole is ground.During grinding, the slurry (abrasive material) of supplying with from the upper surface dish is placed between upper surface dish and the following table face, thereby makes it possible to the surface of workpiece is ground.
As the example to the grinding technique of workpiece, the clear 61-230866 communique of Japanese Patent Laid-Open has disclosed in any position of locating hole and has been provided with breach (cutaway) in order to be easy to take out workpiece in the situation of a surface of workpiece being ground (single face is shelved), and Japanese Patent Laid-Open 2001-198805 communique has disclosed and a kind of workpiece has been ground and had the lapping device of clearance portion (hand-hole 5), and these clearance portion are arranged at the roughly place, four angles of rectangular recess hole 2 in the workholding component.
Yet, when the working strength tester is measured the fracture strength of the display floater that ground with twin grinder, shown in Figure 12 A and Figure 12 B, found two kinds of fracture modes.Figure 12 A shows the fracture 21 that starting point is positioned at the end, and Figure 12 B shows the fracture 22 that starting point is positioned at place, surperficial centre position.Most generations is the fracture that starting point is positioned at the end in according to the strength test of JIS method.Most generations is the fracture that starting point is positioned at place, surperficial centre position in according to the strength test of DIG method.
Recently, the functional of mobile terminal apparatus develops rapidly, and crowd's quantity of carrying such mobile terminal apparatus constantly increases.Consistent with such user's trend is the display floater that expectation has higher fracture strength.
Grinder disclosed in the clear 61-230866 communique of Japanese Patent Laid-Open can't improve the intensity of the workpiece after being polished, and its purpose is not to improve the intensity of workpiece.About the lapping device according to Japanese Patent Laid-Open 2001-198805 communique, the intensity of workpiece contacts owing in the longer zone at the center that is comprising this edge between the edge of the end face (side) of workpiece and the recess hole 2 of workpiece holding clamp (workpiece holding jig), exist, so can reduce.
Summary of the invention
In view of the foregoing, the object of the invention is to: in the process of utilizing the lapping device of having used pinion frame such as twin grinder etc. to grind, prevent that at least the fracture take end face as starting point from appearring in display floater.
The lapping device of the embodiment of the invention comprises: the upper surface dish; Following table face, described following table face are configured to rotate facing to described upper surface dish and in the direction opposite with the direction of rotation of described upper surface dish; Central gear, described central gear is around described upper surface dish and the rotation of described following table face common axis of rotation; Internal gear, described internal gear is around described upper surface dish and the common described rotating shaft rotation of described following table face; And pinion frame, in described pinion frame, be formed with the retaining hole for holding workpiece, and described pinion frame with described central gear and described internal gear interlock carry out rotation in the revolution.Described retaining hole in the described pinion frame is provided with breach, and described breach is positioned at that side described retaining hole when described pinion frame time rotational and contacts side surfaces described workpiece.
According to the Ginding process by the lapping device execution of the embodiment of the invention, described lapping device comprises: the upper surface dish; Following table face, described following table face are configured to rotate facing to described upper surface dish and in the direction opposite with the direction of rotation of described upper surface dish; Central gear, described central gear is around described upper surface dish and the rotation of described following table face common axis of rotation; Internal gear, described internal gear is around described upper surface dish and the common described rotating shaft rotation of described following table face; And pinion frame, in described pinion frame, be formed with the retaining hole for holding workpiece, and described pinion frame with described central gear and described internal gear interlock carry out rotation in the revolution.Described Ginding process may further comprise the steps: breach is set for the described retaining hole in the described pinion frame, described breach is positioned at that side described retaining hole when described pinion frame time rotational and contacts side surfaces described workpiece; And described workpiece remained in the described retaining hole that is provided with described breach in the described pinion frame, and between described upper surface dish and described following table face, grind at least one surface of described workpiece.
According to the abovementioned embodiments of the present invention, by forming described breach, the length that contacts or reduced this contact (or area) between the side of having avoided described workpiece during grinding and the limit of the described retaining hole of described pinion frame.
According to the abovementioned embodiments of the present invention, can prevent from during grinding, occurring the fracture that starting point is positioned at the end of workpiece.
Description of drawings
Fig. 1 is the stereogram that schematically shows the lapping device of first embodiment of the invention;
Fig. 2 is the stereogram for the pinion frame of the lapping device of explanation the first embodiment;
Fig. 3 shows the plane of an example of the pinion frame among the first embodiment;
Fig. 4 is under workpiece has been resting on state in the retaining hole, the sectional view that obtains along near the line A-A the clearance portion of the retaining hole in pinion frame;
Example when Fig. 5 is used for from explanation to lapping device supply slurry;
Fig. 6 is the schematic diagram for the exemplary operation of explanation lapping device;
Fig. 7 is used for explanation, and strength test comes the method for the intensity of measuring workpieces according to JIS;
Fig. 8 shows the chart that concerns example between fracture strength and the accumulation mortality;
Fig. 9 A and Fig. 9 B are for illustrating the example of analyzing the result who obtains according to the Taguchi method, and wherein Fig. 9 A shows the result of signal to noise ratio (S/N ratio) (stability), and Fig. 9 B shows the result of sensitivity (characteristic value);
Figure 10 shows at the chart that has carried out the lifting degree of the mean intensity of workpiece in the situation of grinding according to more suitable condition;
Figure 11 shows the stereogram of an example of display floater; And
Figure 12 A and Figure 12 B are used for the kind of the fracture of explanation display floater appearance, and wherein Figure 12 A shows the fracture that starting point is positioned at the end, and Figure 12 B shows the fracture that starting point is positioned at place, surperficial centre position.
The specific embodiment
Hereinafter, describe with reference to the accompanying drawings the preferred embodiments of the present invention in detail.It should be noted that in this specification and accompanying drawing the composed component with identical in fact function and structure represents with identical Reference numeral, and omission is to the repeat specification of these composed components.
Following explanation is carried out in the following order.
1, foreword
2, the first embodiment (pinion frame: the example that is provided with clearance portion at the retaining hole place)
3, the second embodiment (grinding condition: the example of suitably having set governing factor)
1, foreword
In above-mentioned two kinds of fracture modes, what the present inventor considered is, whether the reason that starting point is arranged in the fracture (referring to Figure 12 A) of the end of workpiece is: because contacting and produced crackle in the side between workpiece and the pinion frame during grinding causes undercapacity thus.Therefore, the inventor whether studied the side that prevents workpiece effective with contacting for preventing that starting point is positioned at for the fracture of end of workpiece between the pinion frame.The first following embodiment will be elaborated to this.
Simultaneously, what the inventor also considered is, whether the reason of fracture (referring to Figure 12 B) that starting point is arranged in the place, surperficial centre position of workpiece is: owing to adopt best grinding condition so that during grinding the particle of abrasive material produced microcrack (perhaps " micro-crack ") on above-mentioned surface, also can cause undercapacity thus.Therefore, the inventor has drawn the technical conceive of grinding condition optimization (that is, according to minimizing to calculate optimal value) as being used for preventing that starting point is positioned at the effective ways of fracture at the place, surperficial centre position of workpiece.The second following embodiment will be elaborated to this.
2, the first embodiment
The example arrangement of lapping device
The lapping device of first embodiment of the invention is described now with reference to accompanying drawing.In the first embodiment of the present invention, with the example of twin grinder as " lapping device " of the present invention.At first, with reference to Fig. 1 to Fig. 3 structure as this twin grinder of the lapping device of the embodiment of the invention is described.
Fig. 1 is the stereogram that schematically shows the lapping device of first embodiment of the invention.It should be noted that this figure has omitted pinion frame.Fig. 2 is the stereogram for the pinion frame of the lapping device of explanation the first embodiment.Fig. 3 shows the plane of an example of the pinion frame among the first embodiment.
As shown in Fig. 1 and Fig. 2, the lapping device of present embodiment comprises upper surface dish 1, following table face 2, central gear 3 and internal gear 4 to arrange in the face of the mode of upper surface dish 1.These four wheel bodys (rotary body) can be rotated with the rotating speed of independent selection.
Be arranged in the disc-shape that pinion frame 5 between upper surface dish 1 and the following table face 2 is formed relative thin.Pinion frame 5 has the tooth (groove) of incision to its external peripheral surface, and with central gear 3 and internal gear 4 interlocks carry out rotation in revolution.The direction of rotation Ds of central gear 3 is identical with the direction of rotation Di of internal gear 4, and the sense of rotation of pinion frame 5 is that difference by the rotating speed of above-mentioned these two gears decides.Use steel plate, glass epoxy resin or vinyl chloride sheet etc. as the material of pinion frame 5.
For example, if central gear 3 rotates than internal gear 4 fast (in the counterclockwise direction), the sense of rotation of pinion frame 5 will be clockwise direction Dc1 so.In addition, if internal gear 4 rotates than central gear 3 fast (in the counterclockwise direction), the sense of rotation of pinion frame 5 will be counter clockwise direction Dc2 so.Note that if following table face 2 rotate to be counterclockwise Dl, so pinion frame 5 in the clockwise direction the rotation on the Dc1 be " forward rotation ".Otherwise, if following table face 2 rotate to be counterclockwise Dl, so pinion frame 5 in the counterclockwise direction the rotation on the Dc2 be " reverse rotation ".
As shown in Figure 3, in the flat surfaces part of each pinion frame 5, be formed with a plurality of retaining holes 10, wanting polished workpiece to be inserted in the retaining hole 10.The display floater that has been cut into the liquid crystal panel etc. of single-piece is inserted in the retaining hole 10 of pinion frame 5 and is maintained at during grinding step in the retaining hole 10.
The shape of retaining hole 10 is substantially rectangle, and is formed the radial parallel of its length direction and pinion frame 5.Breach (or " clearance portion ") 11a and 11b are formed on for consisting of each retaining hole 10 and being positioned at two opposite side 10a on the length direction and near the substantial middle section (that is, the central authorities) of 10b.By forming by this way the breach of retaining hole 10, be clearance portion 11a and clearance portion 11b, contacting between the limit 10a on the length direction of the retaining hole 10 in having avoided during grinding in the side of workpiece and the pinion frame 5 and the limit 10b perhaps reduced the contact length (contact area) of this contact.
Fig. 4 is under workpiece has been inserted into state in the retaining hole 10, the sectional view that obtains along clearance portion 11a and near the line A-A the clearance portion 11b of retaining hole 10.As an example, if the rotation of pinion frame 5 is reverse rotation (in the counterclockwise direction on Dc2), so workpiece will owing to inertia force move and be pressed against retaining hole 10 limit 10a(its have clearance portion 11a) side.The side of workpiece is subject to from drag F pinion frame 5 and limit 10a this contacts side surfaces, and drag F can cause in the side of workpiece and crackle occur.
In the present embodiment, as mentioned above, by forming clearance portion, contacting between the limit 10a of the side of workpiece and the retaining hole 10 of pinion frame 5 and the limit 10b in having avoided during grinding, perhaps reduced contact length (or contact area), this is so that can suppress the generation of crackle than the past.
It should be noted that in the present embodiment retaining hole 10 is formed and is slightly larger than the size that just in time can put into workpiece.Accordingly, between each retaining hole 10 and workpiece, provide space to a certain degree (play), thereby so that the limit of retaining hole 10 and the touch opportunity between the workpiece still less, and have further reduced the generation of crackle.
It should be noted that, although be formed semicircle or oval arc notch at the example intermediate gap of Fig. 3 11a of section and clearance portion 11b, other example of clearance portion 11a and clearance portion 11b can be to utilize the shape on tetragonal three limits or leg-of-mutton two limits.
By above-mentioned structure, driven so that workpiece is polished between upper surface dish 1 and following table face 2 thereby the pinion frame 5 that is keeping workpiece is in the mode of turnover, thereby can carry out simultaneously machining to two surfaces of workpiece.
The exemplary operation of lapping device
Now explanation has the operation of the lapping device of said structure.Example when Fig. 5 is used for from explanation to lapping device supply slurry.Fig. 6 is the schematic diagram for the exemplary operation of explanation lapping device.
Usually, in case grinding step begins, the slurry that is supplied to as shown in Figure 5 (abrasive material) 7 just falls towards following table face 2 by being formed on hole in the upper surface dish 1 etc.Between upper surface dish 1 and following table face 2, have in the situation of slurry 7, at the P(that exerts pressure referring to Fig. 6) in make relative motion between upper surface dish 1 or following table face 2 and the workpiece, and utilize the particle that comprises in the slurry 7 rolling, swipe and the surface that action is finished workpiece in smooth, accurate mode such as scratch.
Strength test
This measurement is by the working strength tester strength test that workpiece carries out to be carried out after grinding, and described strength tester is to operate according to the principle shown in Fig. 7.Example among Fig. 7 shows the principle of JIS strength test.This JIS strength test is shelved the liquid crystal panel that wherein combines colour filter 15 and TFT substrate 16 to two the bar-shaped supporter 18A and 18B of the 30cm of for example being separated by as the workpiece water level land.Subsequently, fall from the top with the object 17 of the protuberance method with regulation, then observe the state of generation and any fracture of crackle.In addition, except the JIS method, also carry out the intensity that the workpiece after the grinding is measured in DIG strength test (not shown).Note that the target strength as display floater, 11N (newton) must be arranged at present.
Fig. 8 shows in the situation that is provided with clearance portion 11a and clearance portion 11b in the retaining hole 10 of pinion frame 5, the chart of the measurement result of the strength test of liquid crystal panel (referring to Figure 11) (being according to the JIS method in this example).Chart among Fig. 8 is so-called " Weibull distribution ", and it shows the example of fracture strength (N) and the relation of accumulation mortality F (t) between (%).At first, in order to draw the intensity before clearance portion 11a and clearance portion 11b are set, 1000 liquid crystal panels have been carried out strength test and discovery exists the liquid crystal panel that fracture strength is the such fracture strength deficiency of 8N.On the other hand, by using the pinion frame 5 wherein be provided with clearance portion 11a and clearance portion 11b, it is 3 times of 8N at least can to obtain 25N() fracture strength.This has satisfied the target strength of the present desired 11N of display floater.
According to above-mentioned the first embodiment, by at the workpiece maintaining part place that is arranged on the pinion frame clearance portion (breach) being set, can realize the significantly lifting of intensity.As an example, observed the strength enhancing more than three times in the Weibull distribution.
3, the second embodiment
Now with reference to table 1 and Fig. 9 A and Fig. 9 B the second embodiment of the present invention is described.As shown in table 1, provided eight and be used for the governing factor of process of lapping and be every Three Estate of all having set.It should be noted that " proportion " item, " granularity " item, " flow " item and " slurry temperature " item in this table are relevant with slurry." the forth day of a lunar month a step " item refers to that the rotating speed of each gear rises until reach the time of fixing speed according to four-stage.The sense of rotation of " direction of rotation " expression pinion frame 5." thrust " is by upper surface dish 1(or following table face 2) be applied to the pressure on the workpiece.It should be noted that the rotating speed of upper surface dish 1 for example is respectively 10.2rpm, 11.9rpm and 13.6rpm when the rotating speed of lower surface dish 2 is respectively 30rpm, 35rpm and 40rpm.
Table 1
| Sequence number | Governing | Grade | 1 | |
|
| 1 | Proportion | 60g/cm 3 | 70g/cm 3 | 80g/ |
|
| 2 | |
1000 | 1500 | 3000 | |
| 3 | Flow | 10cc/min | 20cc/min | 30cc/min | |
| 4 | Slurry temperature | 22°C | 30° |
40° |
|
| 5 | The rotating speed of following table face | 30rpm | 35rpm | 40rpm | |
| 6 | The forth day of a lunar month a |
5 minutes | 11 |
15 minutes | |
| 7 | Direction of rotation | Forward | Reverse | Reverse | |
| 8 | Thrust | 9kpa | 12kpa | 15kpa |
Fig. 9 A and Fig. 9 B show and utilize grade 1 that the Taguchi method obtains to the analysis result of grade 3.Note that some every in the table 1 grade 1 is different from the grade of the respective items shown in Fig. 9 A and Fig. 9 B to grade 3 because test environment is different.Chart among Fig. 9 A has provided the stability (signal to noise ratio) of intensity when workpiece is manufactured to product.Simultaneously, the chart among Fig. 9 B has provided the every intensity (perhaps sensitivity (characteristic value)) that is directed in the governing factor.Be labeled as higher stability or the higher intensity (sensitivity) of direction indication of " good ".
Shown in the block diagram among Figure 10, the mean intensity of liquid crystal panel is 10.9N before with the every condition optimization in the governing factor.Then, by with every condition optimization, so that certainly the transferring to of pinion frame 5 " reverse ", slurry proportion is " 70g/cm
3", the slurry granularity is " #1500 ", initial time to be that the rotating speed of " 19 minutes ", following table face is " 35rpm ", and thrust is " 15kpa ", the result who then obtains is: the mean intensity of liquid crystal panel is 13.9N.This has satisfied the target strength of the present desired 11N of display floater and 25% lifting has been arranged.
From the chart of Fig. 9 A and Fig. 9 B, note that can be in stability high and can keep setting under the condition of intensity every.For example, as shown in signal to noise ratio chart and sensitivity chart, intensity increases in the direction that is shown as " good ".Yet, be that 1500 slurry is easier to obtain because granularity is 1000 slurry than granularity, so select the stock control etc. during the former slurry just is conducive to make.In addition, if the productivity ratio of paying the utmost attention to can be selected " 12 minutes " so for " the forth day of a lunar month a step ".If expectation reduces the damage to product, can expect selecting " 12Kpa " as thrust.
According to above-mentioned the second embodiment, by the every condition in the governing factor during grinding is carried out optimization, perhaps in other words, by grinding condition is carried out optimization, can improve the intensity of workpiece.
It should be noted that and to carry out the Ginding process that optimized method is applied to use according to the first embodiment the pinion frame that is formed with clearance portion according to the second embodiment to the every condition in the governing factor during grinding.In the case, can obtain simultaneously the effect of two embodiment.
In the first embodiment, the clearance portion (breach) that is formed at the retaining hole place of pinion frame is arranged on two positions.Yet, usually exist trend as follows: when pinion frame certainly transfer the forward time rotational to, the load on the pinion frame (that is the load on the workpiece) increases.Therefore, can only on a side of each retaining hole, namely only when pinion frame forward time rotational that side with contacts side surfaces workpiece each retaining hole breach be set.The reverse rotation of pinion frame it is evident that, if so similarly, can arrange breach on the limit with that side of the contacts side surfaces of workpiece.Note that when as shown in the first embodiment, on two limits of retaining hole, all arranging the time jaggy, just can be implemented in the process of lapping that switches between the forward rotation of pinion frame and the reverse rotation.
For the example of twin grinder, the above has illustrated lapping device and the Ginding process of various embodiments of the present invention.Yet the invention is not restricted to twin grinder, but can be applicable to following any grinder: this grinder remains on workpiece in the pinion frame and by the surface dish is pressed on the workpiece and grinds.
In addition, the present invention can also be achieved as follows scheme.
(1) a kind of lapping device, described lapping device comprises:
The upper surface dish;
Following table face, described following table face are configured to rotate facing to described upper surface dish and in the direction opposite with the direction of rotation of described upper surface dish;
Central gear, described central gear is around described upper surface dish and the rotation of described following table face common axis of rotation;
Internal gear, described internal gear is around described upper surface dish and the common described rotating shaft rotation of described following table face; And
Pinion frame is formed with the retaining hole for holding workpiece in described pinion frame, and described pinion frame with described central gear and described internal gear interlock carry out rotation in the revolution,
It is characterized in that the described retaining hole in the described pinion frame is provided with breach, described breach is positioned at that side described retaining hole when described pinion frame time rotational and contacts side surfaces described workpiece.
(2) according to (1) described lapping device, it is characterized in that described retaining hole is roughly rectangular, and described breach is arranged in the limit of that side of and described contacts side surfaces described workpiece described retaining hole when described pinion frame time rotational.
(3) according to (1) or (2) described lapping device, it is characterized in that, described breach is arranged in the described limit of that side of roughly rectangular described retaining hole and described contacts side surfaces described workpiece, and is arranged in the another side of facing mutually with described limit.
(4) according to (2) or (3) described lapping device, it is characterized in that the described limit of that side of and described contacts side surfaces described workpiece described retaining hole when described pinion frame time rotational is corresponding to the length direction of rectangle.
(5) a kind of Ginding process of being carried out by lapping device, described lapping device comprises: the upper surface dish; Following table face, described following table face are configured to rotate facing to described upper surface dish and in the direction opposite with the direction of rotation of described upper surface dish; Central gear, described central gear is around described upper surface dish and the rotation of described following table face common axis of rotation; Internal gear, described internal gear is around described upper surface dish and the common described rotating shaft rotation of described following table face; And pinion frame, in described pinion frame, be formed with the retaining hole for holding workpiece, and described pinion frame with described central gear and described internal gear interlock carry out rotation in the revolution,
Described Ginding process may further comprise the steps:
Breach is set for the described retaining hole in the described pinion frame, described breach is positioned at that side described retaining hole when described pinion frame time rotational and contacts side surfaces described workpiece; And
Described workpiece is remained in the described retaining hole that is provided with described breach in the described pinion frame, and between described upper surface dish and described following table face, grind at least one surface of described workpiece.
(6) according to (5) described Ginding process, it is characterized in that allow the in the counterclockwise direction rotation of described pinion frame under the state that counterclockwise rotates in described lower surface rim, slurry proportion is 70g/cm
3, the slurry granularity is 1500, and the rise of rotational speed of each gear is until to reach the time of fixing speed be 19 minutes, and the rotating speed of described following table face is 35rpm, and the thrust that described upper surface dish or described following table face are applied on the described workpiece is 15kpa.
In this manual, described the various processes of chronological processing and certainly can process in chronological order according to above-mentioned order, but be not to process with such time sequencing.In addition, can process various processes individually or in parallel mode various processes is processed (for example, parallel processing or object-based processing).
The invention is not restricted to the various embodiments described above, and obviously in the scope of claims of the present invention, can comprise various variation and application examples.
That is, because the various embodiments described above are concrete preferred exemplary of the present invention, so they have been subject to various preferred technical limitations.Yet, unless stated especially such restriction in the superincumbent explanation, technical scope of the present invention is not limited to these embodiment.For example, value conditions of employed material, consumption, processing time, processing sequence and various parameters etc. only is preferred example.In addition, also be schematic expression at size, shape and the position relationship shown in the accompanying drawing used in the present invention.
Claims (6)
1. lapping device, described lapping device comprises:
The upper surface dish;
Following table face, described following table face are configured to rotate facing to described upper surface dish and in the direction opposite with the direction of rotation of described upper surface dish;
Central gear, described central gear is around described upper surface dish and the rotation of described following table face common axis of rotation;
Internal gear, described internal gear is around described upper surface dish and the common described rotating shaft rotation of described following table face; And
Pinion frame is formed with the retaining hole for holding workpiece in described pinion frame, and described pinion frame with described central gear and described internal gear interlock carry out rotation in the revolution,
It is characterized in that the described retaining hole in the described pinion frame is provided with breach, described breach is positioned at that side described retaining hole when described pinion frame time rotational and contacts side surfaces described workpiece.
2. lapping device according to claim 1 is characterized in that, described retaining hole is roughly rectangular, and described breach is arranged in the limit of described pinion frame time rotational that side with described contacts side surfaces described workpiece described retaining hole.
3. lapping device according to claim 2, it is characterized in that, described breach is arranged in the described limit of that side of roughly rectangular described retaining hole and described contacts side surfaces described workpiece, and is arranged in the another side of facing mutually with described limit.
4. according to claim 2 or 3 described lapping devices, it is characterized in that the described limit of that side of and described contacts side surfaces described workpiece described retaining hole when described pinion frame time rotational is corresponding to the length direction of rectangle.
5. Ginding process of being carried out by lapping device, described lapping device comprises: the upper surface dish; Following table face, described following table face are configured to rotate facing to described upper surface dish and in the direction opposite with the direction of rotation of described upper surface dish; Central gear, described central gear is around described upper surface dish and the rotation of described following table face common axis of rotation; Internal gear, described internal gear is around described upper surface dish and the common described rotating shaft rotation of described following table face; And pinion frame, in described pinion frame, be formed with the retaining hole for holding workpiece, and described pinion frame with described central gear and described internal gear interlock carry out rotation in the revolution,
Described Ginding process may further comprise the steps:
Breach is set for the described retaining hole in the described pinion frame, described breach is positioned at that side described retaining hole when described pinion frame time rotational and contacts side surfaces described workpiece; And
Described workpiece is remained in the described retaining hole that is provided with described breach in the described pinion frame, and between described upper surface dish and described following table face, grind at least one surface of described workpiece.
6. Ginding process according to claim 5 is characterized in that,
Allow the in the counterclockwise direction rotation of described pinion frame under the state that counterclockwise rotates in described lower surface rim, slurry proportion is 70g/cm
3, the slurry granularity is 1500, and the rise of rotational speed of each gear is until to reach the time of fixing speed be 19 minutes, and the rotating speed of described following table face is 35rpm, and the thrust that described upper surface dish or described following table face are applied on the described workpiece is 15kpa.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011218469A JP2013078808A (en) | 2011-09-30 | 2011-09-30 | Polishing apparatus and polishing method |
| JP2011-218469 | 2011-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103029033A true CN103029033A (en) | 2013-04-10 |
Family
ID=47993006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103570012A Pending CN103029033A (en) | 2011-09-30 | 2012-09-21 | Grinding apparatus and grinding method |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20130084783A1 (en) |
| JP (1) | JP2013078808A (en) |
| KR (1) | KR20130035884A (en) |
| CN (1) | CN103029033A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103447906A (en) * | 2013-09-04 | 2013-12-18 | 南昌欧菲光学技术有限公司 | Glass bending correcting device and use method of glass bending correcting device |
| CN104097139A (en) * | 2014-07-15 | 2014-10-15 | 浙江固特气动机械有限公司 | Eccentric grinding machine for sealing pairs and method for eccentric grinding machine |
| CN104551961A (en) * | 2013-10-23 | 2015-04-29 | 有研新材料股份有限公司 | Double-side polishing method of 12-inch silicon wafer |
| CN110936286A (en) * | 2019-12-03 | 2020-03-31 | 江西合力泰科技有限公司 | Repair jig, repair machine and repair method |
| CN113183028A (en) * | 2021-04-08 | 2021-07-30 | 江西钨业控股集团有限公司 | Planet disc clamp, process for machining diamond-shaped blade by using planet disc clamp and diamond-shaped blade |
| CN113442065A (en) * | 2021-07-12 | 2021-09-28 | 浙江开利电子有限公司 | Thickness easily-adjustable planetary wheel |
| TWI817982B (en) * | 2018-02-14 | 2023-10-11 | 日商信越半導體股份有限公司 | Double-sided grinding method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN204366726U (en) * | 2015-01-04 | 2015-06-03 | 京东方光科技有限公司 | Polishing clamp |
| CN106392877B (en) * | 2016-09-30 | 2018-08-10 | 浙江星星科技股份有限公司 | It is a kind of to clear off machine for AG disk glass |
| CN106363485B (en) * | 2016-09-30 | 2018-08-10 | 浙江星星科技股份有限公司 | It is a kind of to clear off device for clearing off in machine for AG disk glass |
| JP6431560B2 (en) * | 2017-03-08 | 2018-11-28 | 日清工業株式会社 | Double-head surface grinding machine and grinding method |
| CN110039381B (en) * | 2019-04-23 | 2020-04-07 | 新昌浙江工业大学科学技术研究院 | Ultra-precision polishing method for cylindrical roller |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3089292A (en) * | 1961-04-14 | 1963-05-14 | Norton Co | Lapping machine |
| US3662498A (en) * | 1968-08-29 | 1972-05-16 | Peter Wolters Kratzenfabrik Un | Redressing of laps in lapping or honing machines |
| US3593462A (en) * | 1969-03-24 | 1971-07-20 | Western Electric Co | Apparatus for abrading articles |
| US3813828A (en) * | 1973-01-05 | 1974-06-04 | Westinghouse Electric Corp | Method for controlling finished thickness of planetary-lapped parts |
| US4132311A (en) * | 1977-09-29 | 1979-01-02 | Shorewood Packaging Corp. | Tape cartridge/cassette receptacle |
| DE3644854A1 (en) * | 1985-07-31 | 1987-07-30 | Speedfam Corp | Workpiece holder |
| TW404875B (en) * | 1996-07-24 | 2000-09-11 | Komatsu Denshi Kinzoku Kk | Method for lapping semiconductor wafers |
-
2011
- 2011-09-30 JP JP2011218469A patent/JP2013078808A/en not_active Withdrawn
-
2012
- 2012-09-12 US US13/611,110 patent/US20130084783A1/en not_active Abandoned
- 2012-09-19 KR KR1020120103833A patent/KR20130035884A/en not_active Application Discontinuation
- 2012-09-21 CN CN2012103570012A patent/CN103029033A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103447906A (en) * | 2013-09-04 | 2013-12-18 | 南昌欧菲光学技术有限公司 | Glass bending correcting device and use method of glass bending correcting device |
| CN104551961A (en) * | 2013-10-23 | 2015-04-29 | 有研新材料股份有限公司 | Double-side polishing method of 12-inch silicon wafer |
| CN104097139A (en) * | 2014-07-15 | 2014-10-15 | 浙江固特气动机械有限公司 | Eccentric grinding machine for sealing pairs and method for eccentric grinding machine |
| TWI817982B (en) * | 2018-02-14 | 2023-10-11 | 日商信越半導體股份有限公司 | Double-sided grinding method |
| CN110936286A (en) * | 2019-12-03 | 2020-03-31 | 江西合力泰科技有限公司 | Repair jig, repair machine and repair method |
| CN113183028A (en) * | 2021-04-08 | 2021-07-30 | 江西钨业控股集团有限公司 | Planet disc clamp, process for machining diamond-shaped blade by using planet disc clamp and diamond-shaped blade |
| CN113442065A (en) * | 2021-07-12 | 2021-09-28 | 浙江开利电子有限公司 | Thickness easily-adjustable planetary wheel |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130035884A (en) | 2013-04-09 |
| JP2013078808A (en) | 2013-05-02 |
| US20130084783A1 (en) | 2013-04-04 |
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Application publication date: 20130410 |