CN104858783A - Polishing pad trimming method - Google Patents
Polishing pad trimming method Download PDFInfo
- Publication number
- CN104858783A CN104858783A CN201410067627.9A CN201410067627A CN104858783A CN 104858783 A CN104858783 A CN 104858783A CN 201410067627 A CN201410067627 A CN 201410067627A CN 104858783 A CN104858783 A CN 104858783A
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- China
- Prior art keywords
- grinding pad
- circle
- center
- edge
- trimmer
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a polishing pad trimming method. A trimmer is used for trimming a polishing pad. The method comprises steps as follows: the length of a radius from the center of the polishing pad to the edge of the polishing pad is divided into a plurality of parts; a depth value of a polishing pad groove in each part is acquired; staying time of the trimmer in each part is adjusted according to the acquired depth value of each polishing pad groove. Through adjustment of the staying time of the trimmer in different areas of the polishing pad, the surface appearance of the polishing pad is improved, and the surface flatness of the polishing pad is improved.
Description
Technical field
The present invention relates to cmp field, particularly relate to a kind of grinding pad method for trimming.
Background technology
Cmp a kind ofly chemical attack effect is combined to realize the planarized technology of surface global with mechanical removal effect.As shown in Figure 3, be the structural representation of existing chemical mechanical polishing device.Existing chemical mechanical polishing device comprises grinding head 101, be arranged on grinding pad 102 on rotating disk and lapping liquid supply line 103.During grinding, be fixed on by wafer on grinding head 101, grinding head 101 pairs of wafers apply downforce, make the face to be ground of wafer be close on grinding pad 102, grinding pad 102 has some concentric grooves, to store lapping liquid with to be ground the surface distributed contacted of wafer.Lapping liquid is sprinkled upon on grinding pad 102 with fixing flow velocity by lapping liquid supply line 103 uniformly.In process of lapping, grinding head 101 and rotating disk all rotate, and grinding head 101 is rotary motion and horizontal movement on the rotating disk being provided with grinding pad 102.
As shown in Figure 4, be the actual motion track schematic diagram of grinding head 101 on grinding pad 102.Usually, the radius of grinding pad 102 can be longer than the diameter of grinding head 101, and for the grinding pad of 12 inches, the radius of grinding pad grows 1.5 inches than the diameter of grinding head.As can be seen from Figure 5, grinding head 101 moves in the radius of the center of circle of grinding pad 102 to the edge of grinding pad 102, and the center of circle of grinding pad 102 can be polished to the zone line (shadow region as in Fig. 5) of the radius at the edge of grinding pad 102 always.Along with the growth of milling time, on grinding pad 102, other regions of loss ratio of this subregion are many, cause the degree of depth of groove on grinding pad 102 inconsistent, as shown in Figure 5, are the pattern schematic diagram of the grinding pad 102 after wearing and tearing.Grinding pad 102 is uneven with the surface of wafer contacts, will directly affect the flattening effect of crystal column surface, reduces crystal column surface lapping uniformity.
Summary of the invention
The object of this invention is to provide a kind of grinding pad method for trimming, to repair grinding pad, improve the flatness on grinding pad surface.
For achieving the above object, the grinding pad method for trimming that the present invention proposes, utilize trimmer to repair grinding pad, the method comprises the steps: the radius length at the center of circle of grinding pad to the edge of grinding pad to be divided into some parts; Obtain the depth value of every a interior grinding pad groove; According to the time that the depth value adjustment trimmer of obtained grinding pad groove stops in every portion.
According to an embodiment of grinding pad method for trimming of the present invention, the number radius length at the center of circle of grinding pad to the edge of grinding pad be divided into is consistent with the sum of the radius internal channel at the center of circle to the edge of grinding pad of grinding pad, only comprises a groove in every portion.
According to an embodiment of grinding pad method for trimming of the present invention, the radius length at the center of circle of grinding pad to the edge of grinding pad is divided into some equal portions, a groove is chosen in each equal portions, measure the depth value of this groove, the ratio of the ratio of the depth value of each groove chosen is trimmer in each equal portions time of staying.
According to an embodiment of grinding pad method for trimming of the present invention, the time ratio that trimmer is stopping near region, the grinding pad center of circle and close grinding pad fringe region is long to the time that the zone line of the radius at the edge of grinding pad stops in the center of circle of grinding pad.
According to an embodiment of grinding pad method for trimming of the present invention, the total time that trimmer is moved to the center of circle of grinding pad by the edge of grinding pad to the border movement of grinding pad by the center of circle of grinding pad is again 5-60 second.
In sum, the time that the present invention is stopped in grinding pad zones of different by adjustment trimmer, improve grinding pad surface topography, improve grinding pad surface flatness.
Accompanying drawing explanation
Fig. 1 discloses the flow chart of grinding pad method for trimming of the present invention.
Fig. 2 discloses the schematic diagram of the grinding pad method for trimming according to preferred embodiment of the present invention.
Fig. 3 is the structural representation of existing chemical mechanical polishing device.
Fig. 4 is the actual motion track schematic diagram of grinding head on grinding pad.
Fig. 5 is the pattern schematic diagram of the grinding pad after wearing and tearing.
Detailed description of the invention
By describing technology contents of the present invention in detail, reached object and effect, coordinate graphic being described in detail below in conjunction with embodiment.
Wear extent in order to the zone line of the radius at the edge in the center of circle to grinding pad that solve the grinding pad described by background technology is greater than the technical problem of the wear extent in other regions of grinding pad, the present invention utilizes trimmer to repair grinding pad, trimmer can not only repair grinding pad, improve the uniformity of grinding pad, lapping liquid can also be made to be evenly distributed on grinding pad, prevent the material ground away to be filled in the groove of grinding pad, reduce the risk that grinding pad skids.
As shown in Figure 1, the preferred embodiment of the grinding pad method for trimming of the present invention's proposition comprises the steps:
S201, is divided into some parts by the radius length at the center of circle of grinding pad to the edge of grinding pad;
S202, obtains the depth value of every a interior grinding pad groove;
S203, according to the time that the depth value adjustment trimmer of obtained grinding pad groove stops in every portion.
The time that the present invention is stopped in grinding pad zones of different by adjustment trimmer, improve grinding pad surface topography, improve grinding pad surface flatness.
In one embodiment, the radius length at the center of circle of grinding pad to the edge of grinding pad is divided into some equal portions, such as, five equal portions, a groove is chosen in each equal portions, measure the depth value of this groove, the ratio of the ratio of the depth value of each groove chosen is trimmer in each equal portions time of staying.It will be appreciated by those skilled in the art that, the number radius length at the center of circle of grinding pad to the edge of grinding pad be divided into is more, and the precision of trimmer finishing grinding pad is higher.Preferably, the number radius length at the center of circle of grinding pad to the edge of grinding pad be divided into is consistent with the sum of the radius internal channel at the center of circle to the edge of grinding pad of grinding pad, namely only comprises a groove in every portion.
The center of circle to the wear extent of the zone line of the radius at the edge of grinding pad due to grinding pad is greater than the wear extent in other regions of grinding pad, in one embodiment, so that the radius length at the center of circle of grinding pad to the edge of grinding pad is divided into five equal portions, the time that adjustment trimmer stops in each equal portions, as shown in Figure 2, when trimmer is moved to the center of circle of grinding pad by the border movement of the center of circle to grinding pad of grinding pad or the edge by grinding pad, the time ratio that trimmer is stopping near region, the grinding pad center of circle and close grinding pad fringe region is long to the time that the zone line of the radius at the edge of grinding pad stops in the center of circle of grinding pad, thus make the region near the grinding pad center of circle and the region trim amount near grinding pad edge higher than the grinding pad center of circle to the trim amount of the zone line of the radius at grinding pad edge, and then make the degree of depth of groove on grinding pad consistent to the degree of depth of the zone line internal channel of the radius at grinding pad edge with the grinding pad center of circle.
Trimmer by grinding pad border movement from the center of circle to grinding pad again by controlling total time of moving to the center of circle of grinding pad of the edge of grinding pad in 5-60 second.
In sum, the present invention is illustrated by above-mentioned embodiment and correlative type, and what oneself was concrete, full and accurate discloses correlation technique, and those skilled in the art can be implemented according to this.And the above embodiment be only used to illustrate the present invention, instead of be used for restriction of the present invention, interest field of the present invention, should be defined by claim of the present invention.
Claims (5)
1. a grinding pad method for trimming, utilizes trimmer to repair grinding pad, it is characterized in that, comprise the steps:
The radius length at the center of circle of grinding pad to the edge of grinding pad is divided into some parts;
Obtain the depth value of every a interior grinding pad groove;
According to the time that the depth value adjustment trimmer of obtained grinding pad groove stops in every portion.
2. grinding pad method for trimming according to claim 1, it is characterized in that, the number radius length at the center of circle of grinding pad to the edge of grinding pad be divided into is consistent with the sum of the radius internal channel at the center of circle to the edge of grinding pad of grinding pad, only comprises a groove in every portion.
3. grinding pad method for trimming according to claim 1, it is characterized in that, the radius length at the center of circle of grinding pad to the edge of grinding pad is divided into some equal portions, a groove is chosen in each equal portions, measure the depth value of this groove, the ratio of the ratio of the depth value of each groove chosen is trimmer in each equal portions time of staying.
4. grinding pad method for trimming according to claim 1, it is characterized in that, the time ratio that trimmer is stopping near region, the grinding pad center of circle and close grinding pad fringe region is long to the time that the zone line of the radius at the edge of grinding pad stops in the center of circle of grinding pad.
5. grinding pad method for trimming according to claim 1, is characterized in that, the total time that trimmer is moved to the center of circle of grinding pad by the edge of grinding pad to the border movement of grinding pad by the center of circle of grinding pad is again 5-60 second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410067627.9A CN104858783A (en) | 2014-02-26 | 2014-02-26 | Polishing pad trimming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410067627.9A CN104858783A (en) | 2014-02-26 | 2014-02-26 | Polishing pad trimming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104858783A true CN104858783A (en) | 2015-08-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410067627.9A Pending CN104858783A (en) | 2014-02-26 | 2014-02-26 | Polishing pad trimming method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104858783A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109807749A (en) * | 2017-11-20 | 2019-05-28 | 台湾积体电路制造股份有限公司 | Chemical-mechanical polisher and its operating method |
| CN113547446A (en) * | 2020-04-03 | 2021-10-26 | 中芯国际集成电路制造(上海)有限公司 | Method for correcting grinding rate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002025955A (en) * | 2000-06-08 | 2002-01-25 | Internatl Business Mach Corp <Ibm> | Chemical mechanical polishing pad conditioner |
| JP2004025413A (en) * | 2002-06-28 | 2004-01-29 | Nikon Corp | Determination method for life/quality of polishing pad or the like, conditioning method, device, semiconductor device and its manufacturing method |
| JP2004342985A (en) * | 2003-05-19 | 2004-12-02 | Nec Yamagata Ltd | Polishing device and method for dressing polishing pad |
| US20060260745A1 (en) * | 2004-01-28 | 2006-11-23 | Nikon Corporation | Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, CMP polisher, and method of manufacturing semiconductor device |
| JP2008103517A (en) * | 2006-10-19 | 2008-05-01 | Elpida Memory Inc | Method of controlling semiconductor manufacturing process and polishing apparatus |
-
2014
- 2014-02-26 CN CN201410067627.9A patent/CN104858783A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002025955A (en) * | 2000-06-08 | 2002-01-25 | Internatl Business Mach Corp <Ibm> | Chemical mechanical polishing pad conditioner |
| JP2004025413A (en) * | 2002-06-28 | 2004-01-29 | Nikon Corp | Determination method for life/quality of polishing pad or the like, conditioning method, device, semiconductor device and its manufacturing method |
| JP2004342985A (en) * | 2003-05-19 | 2004-12-02 | Nec Yamagata Ltd | Polishing device and method for dressing polishing pad |
| US20060260745A1 (en) * | 2004-01-28 | 2006-11-23 | Nikon Corporation | Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, CMP polisher, and method of manufacturing semiconductor device |
| JP2008103517A (en) * | 2006-10-19 | 2008-05-01 | Elpida Memory Inc | Method of controlling semiconductor manufacturing process and polishing apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109807749A (en) * | 2017-11-20 | 2019-05-28 | 台湾积体电路制造股份有限公司 | Chemical-mechanical polisher and its operating method |
| CN113547446A (en) * | 2020-04-03 | 2021-10-26 | 中芯国际集成电路制造(上海)有限公司 | Method for correcting grinding rate |
| CN113547446B (en) * | 2020-04-03 | 2024-01-26 | 中芯国际集成电路制造(上海)有限公司 | Polishing rate correction method |
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Application publication date: 20150826 |
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