KR20110125615A - Polishing pad and polishing device using polishing pad - Google Patents

Abstract

PURPOSE: A grinding pad and a grinding device using the grinding pad are provided to enhance the flatness of the ground surface of a glass plate by making the grinding surface of the grinding pad uniform by improving the circulation of slurry. CONSTITUTION: A grinding pad(10) for grinding a glass plate comprises a first slurry supply hole(14). The slurry supply hole supplies slurry to between the grinding surface(10A) of the grinding pad and the ground surface(1A) of a glass plate(1). The first slurry supply hole pass through the grinding pad on the central part of the grinding surface. The grinding surface is radially divided by a plurality of grooves formed outward from the central part.

Description

Polishing pad and polishing device using polishing pad {POLISHING PAD AND POLISHING DEVICE USING POLISHING PAD}

The present invention relates to a polishing pad and a polishing apparatus using the polishing pad.

The glass substrate for flat panel display (FPD) used for a liquid crystal display etc. shape | molds molten glass into plate shape by the glass manufacturing method called the float method, and surface it by the continuous polishing apparatus disclosed in following patent document 1 etc. By grinding | polishing removal of the minute unevenness | corrugation and curvature, it is manufactured by the thin plate which satisfy | filled the flatness required as a glass substrate for FPD.

In such a continuous polishing apparatus, as described in Patent Document 2 below, polishing of a glass plate is generally performed by a polishing pad rotating and revolving.

Japanese Patent Publication No. 2007-190657 Japanese Patent Laid-Open No. 2001-293656

The above polishing apparatus uses a slurry to polish the surface of the glass plate (hereinafter referred to as the surface to be polished). Slurry is supplied between the polishing surface of a polishing pad and the to-be-polished surface of a glass plate from the slurry supply hole formed in the center part of a polishing pad. If the amount of slurry supplied between the polishing surface of the polishing pad and the surface to be polished of the glass plate becomes uneven at the polishing surface, the flatness of the surface to be polished of the polished glass plate is deteriorated. Therefore, the supplied slurry needs to spread uniformly on the polishing surface.

However, the glass plate is increasing in size as generational replacement proceeds, and thus the polishing pad is also enlarged. With the enlargement of this polishing pad, the uniformity in the polishing surface of the quantity of the supplied slurry has become a problem.

This invention is made | formed in view of such a situation, and polishing using the polishing pad and polishing pad which improves the circulation of a slurry, makes polishing ability uniform on the polishing surface of a polishing pad, and improves the flatness of the to-be-polished surface of a glass plate. It is an object to provide a device.

In order to achieve the above object, in the polishing pad for polishing a glass plate, the polishing pad is a slurry supply hole for supplying a slurry between the polishing surface of the polishing pad and the surface to be polished of the glass plate, and the polishing pad In the center of a surface, it is provided with the 1st slurry supply hole which penetrates the said polishing pad, and the said polishing surface is divided radially by the some groove formed toward the outer side from the center.

According to the present invention, there is provided a first slurry supply hole penetrating the center of the polishing pad, and the polishing surface is radially divided by a plurality of grooves formed outward from the center, and is supplied from the first slurry supply hole. The slurry flows into a plurality of grooves formed in the polishing surface, and the polishing pad rotates to spread uniformly over the entire surface of the polishing surface. Therefore, the polishing ability can be made uniform at the polishing surface, thereby improving the flatness of the surface to be polished of the glass plate. As the polishing pad, a circular or rectangular one can be used. In addition, the position of a 1st slurry supply hole may be substantially the center of a polishing pad.

Moreover, it is preferable that the polishing pad of this invention is equipped with the some 2nd slurry supply hole which penetrates the said polishing pad in the position spaced apart from the center of the said polishing surface.

According to the present invention, the slurry is also supplied from the plurality of second slurry supply holes formed at a position spaced apart from the center together with the first slurry supply hole formed at the center of the polishing pad, so that the slurry is uniformly spread over the entire surface of the polishing surface. It can spread, and can make a grinding | polishing ability uniform at a grinding | polishing surface.

Moreover, it is preferable that the said 2nd slurry supply hole of this invention penetrates the area | region of the said groove | channel. Thereby, according to this invention, polishing ability can be made more uniform.

Moreover, the said 2nd slurry supply hole of this invention may penetrate the grinding | polishing area divided by the said groove | channel. Thereby, according to this invention, polishing ability can be made more uniform.

Moreover, it is preferable that the said grinding | polishing surface of this invention is subjected to mesh groove. Thereby, according to this invention, polishing ability can be made more uniform.

Moreover, in order to achieve the said objective, the grinding | polishing apparatus using the grinding | polishing pad of this invention is a grinding | polishing pad, a means which makes the grinding | polishing surface of the said polishing pad contact the to-be-polished surface of a glass plate, and rotates the said polishing pad, and the said grinding | polishing A polishing apparatus having a supply means for supplying a slurry between the pad and the glass plate, wherein the slurry is supplied between the polishing pad and the glass plate through the first slurry supply hole of the polishing pad.

According to the present invention, the slurry supplied from the first slurry supply hole flows into a plurality of grooves formed in the polishing surface of the polishing pad, and the polishing pad rotates to spread uniformly over the entire surface of the polishing surface, thereby providing polishing ability. It becomes uniform in this grinding | polishing surface, and the flatness of the to-be-polished surface of a glass plate can be improved.

Moreover, in order to achieve the said objective, the grinding | polishing apparatus using the grinding | polishing pad of this invention is a grinding | polishing pad, a means which makes the grinding | polishing surface of the said polishing pad contact the to-be-polished surface of a glass plate, and rotates the said polishing pad, and the said grinding | polishing A polishing apparatus having a supply means for supplying a slurry between the pad and the glass plate, wherein the slurry is supplied between the polishing pad and the glass plate through the first slurry supply hole and the second slurry supply hole of the polishing pad.

According to the present invention, the slurry is supplied from the first slurry supply hole formed at the center of the polishing pad and the second slurry supply hole formed at a position spaced apart from the center, so that the slurry is uniformly widely spread on the entire surface of the polishing surface. Ability becomes uniform at a grinding | polishing surface, and the flatness of the to-be-polished surface of a glass plate can be improved.

Further, the polishing apparatus using the polishing pad of the present invention includes control means for controlling the amount of slurry supplied from the first slurry supply hole and the amount of slurry supplied from the second slurry supply hole.

According to the present invention, the slurry can be spread more uniformly over the entire surface of the polishing surface, so that the polishing ability becomes uniform on the polishing surface, and the flatness of the surface to be polished of the glass plate can be improved. Further, the control means preferably controls to supply the slurry such that the amount of the slurry supplied from the first slurry supply hole and the total amount of the slurry supplied from all the second slurry supply holes are equal.

According to the polishing pad and the polishing apparatus using the polishing pad of the present invention, the circulation ability of the slurry can be improved to make the polishing ability uniform on the polishing surface, and the flatness of the polished surface of the glass plate can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS The figure which shows the principal part of the grinding | polishing apparatus of a glass plate.
(A), (b), (c), (d) and (e) are figures showing the polishing surface of the polishing pad.
3 is a diagram showing a main part of a polishing apparatus of a glass plate;

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of the grinding | polishing apparatus using the polishing pad and polishing pad which concerns on this invention is described according to an accompanying drawing.

<Embodiment>

FIG. 1: is a figure which shows the principal part of the grinding | polishing apparatus 100 of a glass plate. The grinding | polishing apparatus 100 is an apparatus which continuously polishes the glass plate for liquid crystal displays of the magnitude | size more than 1100 mm (width) x 1300 mm (length), for example.

The polishing apparatus 100 includes a work table 102 holding the glass plate 1, a polishing table 104 provided with the polishing pad 10, a rotating shaft 106 for rotating the polishing table 104, and a polishing pad 10. ) And a slurry supply unit 108 for supplying a slurry between the glass plate 1. The slurry supply part 108 is connected with the slurry channel | path (not shown) which penetrates the grinding surface 104 via a rotary joint (not shown). The slurry passage is connected with the slurry supply hole 14 mentioned later.

The work surface plate 102 holds the glass plate 1 which is a polished object and conveys it in a predetermined direction. The polishing plate 10 is provided with a polishing pad 10 at a position in contact with the glass plate 1.

The rotation shaft 106 is rotatably supported about the rotation axis O ₁ , rotates about the rotation axis O ₁ by a driving means (not shown), and revolves around the rotation axis O ₂ . do. The polishing platen 104 rotates and revolves in accordance with the rotation and the revolution of the rotary shaft 106.

The slurry supply section 108 is formed by the external pump (not shown) disposed in the slurry supply section 108 through the slurry supply hole 14 formed in the rotary joint, the slurry passage, and the polishing pad 10. The slurry is supplied between the polishing surface 10A and the to-be-polished surface 1A of the glass plate 1. As the slurry, one containing abrasive particles such as silica or cerium oxide is used. Then, the slurry discharged | emitted from the outer peripheral part of the glass plate 1 is collect | recovered by the circulation means not shown, and is used again after filtering.

In the polishing apparatus 100 configured as described above, the polishing pad 10 rotates and revolves while the polishing surface 1A of the glass plate 1 and the polishing surface 10A of the polishing pad 10 are pressed. 1A to be polished is polished. At this time, if the slurry supplied from the slurry supply hole 14 exists unevenly on the to-be-polished surface 1A of the glass plate 1, the polishing pad 10 cannot polish the glass plate 1 uniformly, The flatness of the to-be-polished surface 1A of the glass plate 1 deteriorates. Therefore, it is necessary to spread the supplied slurry uniformly over the entire surface of the polishing surface 10A.

2A is an external view of the polishing surface 10A of the conventional polishing pad 10. Although a circular pad is used as the polishing pad 10 here, a rectangular pad may be used.

In addition, a circular slurry supply hole 14 having a diameter of 20 mm is formed at the center of the polishing pad 10. The diameter of the slurry supply hole 14 is not limited to 20 mm, but is preferably 5 to 100 mm. In addition, the slurry supply hole 14 may be rectangular shape. You may taper so that a slurry may flow out to the grinding | polishing surface 10A side of the slurry supply hole 14 easily.

The polishing surface 10A of the polishing pad 10 is subjected to a mesh groove 12 having a width of 2 mm, a depth of 1.5 mm, and a pitch width of 20 mm. These numerical values are also not particularly limited and may be appropriately changed. Moreover, it is preferable that width is 1-30 mm, depth is 0.5-5 mm, and pitch width is 2-30 mm.

The slurry supplied from the slurry supply hole 14 flows into this groove 12, and the polishing pad 10 is rotated to spread widely over the entire surface of the polishing surface 10A. At this time, although it is preferable to spread uniformly on the whole surface of 10 A of polishing surfaces, when the size of the polishing pad 10 is large like the present embodiment, it may not spread uniformly uniformly.

An external view of the polishing surface of the polishing pad 20 according to the present embodiment is shown in FIG. 2B. On the polishing surface of the polishing pad 20, a mesh groove 12 and a slurry supply hole 14 similar to the polishing pad 10 are formed. Further, four grooves 16 are formed in the polishing surface from the center toward the outer circumference, and the polishing surface is radially divided into four regions. The groove 16 is formed with a width of 20 mm and a depth of 1.5 mm. In other words, the polishing surface of the polishing pad 20 is radially divided by a plurality of grooves formed from the center toward the outside, and the divided polishing surface is further subjected to mesh grooves. Moreover, the groove | channel 16 should just be 1-30 mm in width, and 0.5-5 mm in depth.

By constituting the polishing surface in this way, the slurry supplied from the slurry supply hole 14 flows into the grooves 12 and the grooves 16, and the polishing pad 20 rotates to spread over the entire surface of the polishing surface. The grooves 16 can spread the slurry more uniformly than the conventional polishing pad 10.

The polishing pad 30 shown in Fig. 2C differs from the polishing pad 20 shown in Fig. 2B in that eight grooves 16 are formed. As shown in the same figure, the polishing surface of the polishing pad 30 is divided into eight regions radially by the grooves 16.

In this way, the number of the grooves 16 from the center to the outer peripheral portion may be increased.

In addition, although the groove 12 is formed in linear mesh shape in this embodiment, the groove 12 may be formed in curved mesh shape.

Moreover, you may make it supply a slurry from a some slurry supply hole. In the polishing surface of the polishing pad 40 shown in FIG. 2D, a mesh-shaped groove 12 and a groove 16 are formed in the same manner as the polishing pad 20 shown in FIG. 2B. have. In addition, a circular central slurry supply hole 14a (first slurry supply hole) having a diameter of 20 mm penetrates the polishing pad 40 at the center of the polishing pad 40, and each groove 16 has one side of 2 mm. A peripheral slurry supply hole 14b (second slurry supply hole) of a phosphorus rectangle (square) penetrates through the polishing pad 40. In addition, the diameter of the center slurry supply hole 14a may be 5 to 100 mm, and one side of the peripheral slurry supply hole 14b may be 2 to 10 mm. In the present embodiment, the peripheral slurry supply hole 14b is formed at a position of 500 mm from the center of the polishing pad 40, but this distance may be appropriately determined. In addition, the shape of the peripheral slurry supply hole 14b is not limited to a rectangle, It may be circular.

3 shows the main part of the polishing apparatus 101 for using the polishing pad 40. In addition, the same code | symbol is attached | subjected to the part common to FIG. 1, and the detailed description is abbreviate | omitted.

The slurry supply part 108 of the grinding | polishing apparatus 101 is comprised so that a slurry can be supplied through the center slurry supply hole 14a and the surrounding slurry supply hole 14b. The polishing apparatus 101 may further be provided with a slurry amount adjusting unit for adjusting the amount of slurry supplied through the central slurry supply hole 14a and the amount of slurry supplied through the peripheral slurry supply hole 14b.

By using the polishing apparatus 101 configured as described above, a desired amount of slurry can be supplied from the central slurry supply hole 14a and the peripheral slurry supply hole 14b of the polishing pad 40, respectively.

In this way, a plurality of slurry supply holes are formed at positions of the grooves of the polishing pad, and the slurry is supplied through the plurality of slurry supply holes in the polishing apparatus, so that the supplied slurry can be spread evenly on the polishing surface.

These slurry supply holes may be formed in the position different from the groove | channel 16. As shown in FIG. In the polishing surface of the polishing pad 50 shown in Fig. 2E, unlike the polishing pad 40 shown in Fig. 2D, a peripheral slurry supply hole of a square (square) having a side of 2 mm ( 14b) is formed on the polishing region divided by the groove 16. Similarly to the polishing pad 40, the peripheral slurry supply hole 14b is formed at a position of 500 mm from the center of the polishing pad 50, but the distance from the center may be appropriately determined. In addition, what is necessary is just to determine suitably also the length and shape of one side of the peripheral slurry supply hole 14b so that a slurry may be easily supplied.

Thus, also by providing a some slurry supply hole in the area | region of a grinding | polishing surface, it can spread | distribute the supplied slurry uniformly on a grinding | polishing surface.

In addition, the number of the surrounding slurry supply holes 14b is not limited to four. For example, in the case where eight grooves 16 are formed, eight grooves 16 may be formed in the regions of the grooves 16, or eight grooves may be formed in eight divided polishing regions. Moreover, you may form in both the area | region of the groove | channel 16 and the divided grinding | polishing area | region.

<Examples>

The mesh model of each polishing pad shown in FIG. 2 was created, and the slurry pressure for every polishing pad was simulated. Simulations were performed using numerical fluid dynamics (CFD) software using finite volume method. The conditions for the simulation were that the polishing pad had a diameter of 1690 mm, the groove 12 had a width of 2 mm, the groove 12 had a pitch width of 20 mm, the groove 16 had a width of 20 mm, and a circular center slurry supply hole 14a (14). ) 20 mm in diameter, the position of the peripheral slurry supply hole 14b is 500 mm from the center of the polishing pad, and one side of the rectangular peripheral slurry supply hole 14b is 20 mm, the pad rotation speed is 50 rpm, the pad rotation speed is 120 rpm, the pad idle The radius was 75 mm and the slurry supply amount was 40 liters per minute.

Table 1 shows the calculation results of the slurry pressure (polishing surface average value) of each polishing pad 9 seconds after the start of polishing under these conditions. In addition, the lower the calculated slurry pressure, the smoother the supply and discharge of the slurry is. In other words, the lower the slurry pressure, the more uniform the slurry is spread on the polishing surface, which indicates that the polishing ability of the polishing pad is uniform.

No. of Table 1 1 has shown the calculation result in the conventional polishing pad 10 shown to Fig.2 (a). The slurry pressure (average value) of 10 A of grinding surfaces is 6013 Pa.

In this regard, 2 is a calculation result in the polishing pad 20 in which four grooves 16 shown in FIG. 2B are formed. The slurry pressure (average value) of the polished surface was 4761 Pa. By forming four grooves 16 in this way, the effect that the slurry spreads more uniformly on the polishing surface than in the case where there was no groove 16 (No. 1) was confirmed.

In addition, 3 and 4 are calculation results in the polishing pad 30 in which eight grooves 16 shown in FIG. 2C are formed, and the calculation results when the depths of the grooves 16 are 1.5 mm and 3.0 mm, respectively. to be.

No. The slurry pressure of 3 is 4345 Pa, and the no. The result is lower than 2. From these results, eight grooves 16 could confirm the effect that the slurry spreads uniformly on the polishing surface.

In addition, The slurry pressure of 4 was 2247 Pa, and No. The result is lower than 3. From this result, the depth of the groove | channel 16 could confirm the effect that a slurry spreads uniformly on the grinding | polishing surface by 3.0 mm rather than 1.5 mm.

Then, No. 5 and 6 are calculation results in the polishing pad 40 in which the peripheral slurry supply holes 14b were formed on the grooves 16 shown in FIG. In either case, Like 1 to 4, 40 liters of slurry are supplied every minute, but No. 5 is an arithmetic result when 8 liters are supplied uniformly every minute from the center slurry supply hole 14a and four peripheral slurry supply holes 14b. 6 is a calculation result in the case of supplying 20 liters per minute from the center slurry supply hole 14a, and 5 liters per minute from each of the four peripheral slurry supply holes 14b.

No. 5, the slurry pressure is 3023 Pa, and No. The slurry pressure of 6 is 4009 Pa. When the slurry is supplied from the plurality of slurry supply holes from this result, the central slurry supply hole 14a and the four peripheral slurry supplies are supplied rather than the slurry is supplied from the central slurry supply hole 14a in a central (multipurpose) manner. It was confirmed that the slurry was evenly supplied from the holes 14b to spread the slurry evenly on the polishing surface.

In addition, 7 and 8 are calculation results in the polishing pad 50 in which the peripheral slurry supply holes 14b were formed on the polishing region shown in Fig. 2E. In either case, 40 liters of slurry were supplied every minute. 7 is a calculation result when 8 liters were supplied uniformly every minute from the center slurry supply hole 14a and four peripheral slurry supply holes 14b, and No. 8 is a calculation result in the case of supplying 20 liters per minute from the center slurry supply hole 14a, and 5 liters per minute from each of the four peripheral slurry supply holes 14b.

No. 7, the slurry pressure is 3340Pa, No. The slurry pressure of 8 is 3916 Pa. As a result, in the case of supplying the slurry from the plurality of slurry supply holes as in the case of the polishing pad 40, the center slurry supply hole 14a and It was confirmed that the slurry was evenly supplied from the four peripheral slurry supply holes 14b to spread the slurry evenly on the polishing surface.

In addition, 5 and No. In comparison with the case where the peripheral slurry supply hole 14b was formed on the groove 16 and the case where it was formed on the grinding | polishing area | region from the result of 7, the No. formed on the groove | channel 16 was carried out. It turns out that 5 has become low in slurry pressure. As a result, when the slurry is evenly supplied from the center slurry supply hole 14a and the four peripheral slurry supply holes 14b, the one in which the peripheral slurry supply holes 14b are formed on the groove 16 It was confirmed that it spreads uniformly on the polished surface.

In addition, 6 and No. From the result of 8, when the peripheral slurry supply hole 14b was formed in the groove 16 and the case in which it was formed on the polishing region, the No. It turns out that 8 has a low slurry pressure. Thereby, when supplying a slurry mainly from the center slurry supply hole 14a, it was confirmed that the one where the peripheral slurry supply hole 14b is formed on the grinding | polishing area | region is spread | distributed uniformly to a grinding | polishing surface uniformly. .

As described above, according to the polishing pad and the polishing apparatus of the present embodiment, since the circulation of the slurry is improved and the slurry supplied is uniformly widely spread on the polishing surface, the polishing surface can be uniformly polished and the surface to be polished of the glass plate Can improve the flatness.

Although this invention was detailed also demonstrated with reference to the specific embodiment, it is clear for those skilled in the art that various correction and changes can be added without deviating from the range and mind of this invention.

This application is based on the JP Patent application 2010-111116 of an application on May 13, 2010, The content is taken in here as a reference.

1: glass plate
1A: Polished surface
10, 20, 30, 40, 50: polishing pad
10A: polished surface
12, 16: home
14: slurry feed hole
14a: central slurry feed hole
14b: surrounding slurry supply hole
100, 101: polishing apparatus
102: work surface plate
104: polishing table
106: axis of rotation
108: slurry supply part

Claims (9)

A polishing pad for polishing a glass plate,
It is a slurry supply hole for supplying a slurry between the polishing surface of the said polishing pad and the to-be-polished surface of the said glass plate, Comprising: The 1st slurry supply hole which penetrates the said polishing pad in the center of the said polishing surface,
And the polishing surface is divided radially by a plurality of grooves formed from the center toward the outside. The polishing pad according to claim 1, further comprising: a plurality of second slurry supply holes penetrating the polishing pad at a position spaced from the center of the polishing surface. 3. The polishing pad of claim 2 wherein said second slurry feed hole penetrates an area of said groove. The polishing pad of claim 2, wherein the second slurry supply hole penetrates the polishing region divided by the groove. The polishing pad according to claim 1, wherein the polishing surface is provided with a mesh groove. The polishing pad according to any one of claims 2 to 4, wherein the polishing surface is provided with a mesh groove. With polishing pad,
Means for contacting the polishing surface of the polishing pad with the surface to be polished of the glass plate to rotate the polishing pad;
It is a polishing apparatus provided with the supply means which supplies a slurry between the said polishing pad and the said glass plate,
The said polishing pad is a polishing pad of Claim 1 or 5,
And a slurry is supplied between the polishing pad and the glass plate through the first slurry supply hole of the polishing pad. With polishing pad,
Means for contacting the polishing surface of the polishing pad with the surface to be polished of the glass plate to rotate the polishing pad;
It is a polishing apparatus provided with the supply means which supplies a slurry between the said polishing pad and the said glass plate,
The polishing pad is the polishing pad according to any one of claims 2 to 4 and 6,
And a slurry is supplied between the polishing pad and the glass plate through the first slurry supply hole and the second slurry supply hole of the polishing pad. The polishing apparatus according to claim 8, further comprising control means for controlling the amount of slurry supplied from the first slurry supply hole and the amount of slurry supplied from the second slurry supply hole.

Images