1332684 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種具有表面紋路之研磨墊，詳言之，係 關於一種具有孔洞以儲存研磨漿液之研磨墊。 【先前技術】1332684 IX. Description of the Invention: [Technical Field] The present invention relates to a polishing pad having a surface texture, and more particularly to a polishing pad having a hole for storing an abrasive slurry. [Prior Art]
拋光一般係指化學機械研磨（CMP)製程中，對於初為粗 链表面的磨耗控制’其係利用含研磨粒子的研磨漿液平均 分散於一研磨墊之上表面，同時將一待拋光物件抵住該研 磨墊後以重覆規律動作搓磨。該待拋光物件係諸如半導 體、儲存媒體基材、積體電路、LCD平板玻璃、光學玻璃 與光電面板等物體。為了維持該研磨漿液之分佈與流動， 以及化學機械研磨後之平坦化及研磨效率，該研磨墊之上 表面上通常會開設有複數個溝槽或形成一表面紋路。因 此，該研磨墊對於該待拋光物件的拋光效果，易受到該等 溝槽或該表面紋路的影響。 參考圖1，顯示中華民國公告第504429號專利所揭示之 具有表面紋路之研磨墊之俯視示意圖。該研磨墊】之表面 紋路包括複數個同心之圓形溝槽u，其中該等圓形溝槽u 之深度及寬度係依所需而設計。該研磨墊丨之缺點為研磨 過程中所產生之雜質不易快速地離開該研磨墊丨，因而影 響研磨精度及該研磨墊1之使用壽命。 / 參考圓2，顯示中華民國公告第562716號專利所揭示之 具有表面紋路之研磨墊之俯視示意圖。該研磨墊2之表面 紋路包括複數個放射狀之溝槽21，其中該等放射狀之溝槽 109891.doc 21係連接該研磨墊2之中心22及該研磨墊2之邊緣23 ^該研 磨塾2之優點為研磨過程中所產生之雜質容易快速地離開 該研磨塾2’但是其缺點為研磨漿液内之研磨粒子也快速 地離開該研磨塾2’因而影響研磨精度及該研磨墊2之使用 胥命。 因此’有必要提供一種創新且具進步性的具有表面紋路 之研磨墊’以解決上述問題。 【發明内容】 本發明之主要目的在於提供一種具有表面紋路之研磨 墊其包括一表面紋路’該表面紋路係位於該研磨墊之一 拋光面上，該表面紋路包括至少一第一溝槽、至少一第二 溝槽及複數個H該第：溝槽係連接至該研磨塾邊緣， 且該第/冓槽及該第二溝槽交錯而形成複數個交錯點。該 等孔洞係位於該等交錯點上，且料孔洞之深度係大於該 第一溝槽之深度。 藉此該第一溝槽可使懸浮於研磨漿液之雜質快速地離 開該研磨墊’而該等孔洞則可以儲存研磨漿液以延長該研 磨漿液内之研磨粒子離開該研磨墊之時間。 【實施方式】 本發月提供種具有表面紋路之研磨墊，該研磨墊係應 用於化學機械研磨（CMP)製程中對—待拋光物件進行研磨 或拋光1¾待抱光物件包括但不限於半導體 '儲存媒體基 材積體電路' LCD平板玻璃、光學玻璃與光電面板等物 體0 109891.doc 1332684 本發明具有表面紋路之研磨墊包括一表面紋路，該表面 紋路係位於該研磨墊之一拋光面上，該表面紋路包括至少 第溝槽至少一第二溝槽及複數個孔洞。在一較佳實 施例中，該第一溝槽以俯視觀之係為複數圈不同半徑之圓 形溝槽且該等圓形溝槽係為同心，然而該第一溝槽亦可以 是複數圈不同邊長之方形溝槽且該等方形溝槽係為同心，Polishing generally refers to the chemical mechanical polishing (CMP) process, in which the initial control of the wear of the thick chain surface is carried out by using an abrasive slurry containing abrasive particles dispersed on the upper surface of a polishing pad while holding a workpiece to be polished. The polishing pad is honed in a repeated regular motion. The object to be polished is an object such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat glass, an optical glass, and a photovoltaic panel. In order to maintain the distribution and flow of the slurry, as well as the planarization and polishing efficiency after chemical mechanical polishing, a plurality of grooves or a surface grain are usually formed on the surface of the polishing pad. Therefore, the polishing effect of the polishing pad on the object to be polished is susceptible to the grooves or the surface texture. Referring to Figure 1, there is shown a top plan view of a polishing pad having a surface grain disclosed in the Republic of China Publication No. 504,429. The surface of the polishing pad includes a plurality of concentric circular grooves u, wherein the depth and width of the circular grooves u are designed as desired. A disadvantage of the polishing pad is that impurities generated during the grinding process do not easily leave the polishing pad, thereby affecting the polishing accuracy and the life of the polishing pad 1. / Reference circle 2, showing a top view of a polishing pad having a surface grain disclosed in the Republic of China Publication No. 562716. The surface of the polishing pad 2 includes a plurality of radial grooves 21, wherein the radial grooves 109891.doc 21 are connected to the center 22 of the polishing pad 2 and the edge 23 of the polishing pad 2 The advantage of 2 is that the impurities generated during the grinding process are easily and quickly leave the polishing crucible 2' but the disadvantage is that the abrasive particles in the abrasive slurry also quickly leave the polishing crucible 2' thus affecting the grinding precision and the use of the polishing pad 2. Commandment. Therefore, it is necessary to provide an innovative and progressive surface-patterned polishing pad to solve the above problems. SUMMARY OF THE INVENTION A primary object of the present invention is to provide a surface pad having a surface texture that includes a surface texture on a polishing surface of the polishing pad, the surface texture including at least one first trench, at least A second trench and a plurality of H: the trench are connected to the edge of the polishing pad, and the first groove and the second groove are staggered to form a plurality of staggered points. The holes are located at the staggered points, and the depth of the holes is greater than the depth of the first grooves. Thereby, the first trench allows impurities suspended in the slurry to be quickly separated from the polishing pad' and the holes can store the slurry to extend the time during which the abrasive particles in the polishing slurry exit the polishing pad. [Embodiment] This month provides a polishing pad having a surface texture, which is applied to a chemical mechanical polishing (CMP) process for grinding or polishing an object to be polished, including but not limited to a semiconductor. Storage medium substrate integrated circuit 'LCD flat glass, optical glass and photoelectric panel, etc. 0 109891.doc 1332684 The surface of the polishing pad of the present invention comprises a surface texture on a polishing surface of the polishing pad. The surface texture includes at least a second trench and at least a plurality of holes in the first trench. In a preferred embodiment, the first trench is a circular trench having a plurality of different radii in a plan view and the circular trenches are concentric, but the first trench may also be a plurality of circles. Square grooves of different sides and the square grooves are concentric,
或是該第一溝槽亦可以是一螺旋狀溝槽或是其他形狀之溝 槽。Alternatively, the first groove may be a spiral groove or a groove of other shapes.
該第二溝槽係係由該研磨墊之一申央部延伸至該研磨墊 之一邊緣，且該第一溝槽及該第二溝槽交錯而形成複數個 交錯點。較佳地，該第二溝槽由俯視觀之係為複數條放射 狀之溝槽，每一第二溝槽可以是直線狀溝槽或是弧狀溝 槽。該等孔洞係位於該等交錯點上，且該等孔洞之深度係 大於該第一溝槽及該第二溝槽之深度。藉此，該第二溝槽 可使懸浮於研磨漿液之雜質快速地離開該研磨墊，而該等 孔洞則可以儲存研磨漿液以延長該研磨漿液内之研磨粒子 離開該研磨墊之時間。 兹以下列實例予以詳細說明本發明，唯並不意咮本發明 僅侷限於此等實例所揭示之内容。 實例1 : 參考圖3，顯示本發明實例丨之研磨墊之俯視示意圖。本 實例之研磨墊3之表面紋路包括複數個第一溝槽31、複數 個第二溝槽32及複數個孔洞33 ^該等第一溝槽31係為複數 個同心圓形溝槽，且該等第一溝槽31以俯視觀之係為複數 109891.docThe second groove system extends from one of the polishing pads to an edge of the polishing pad, and the first groove and the second groove are staggered to form a plurality of staggered points. Preferably, the second groove is a plurality of radial grooves in a plan view, and each of the second grooves may be a linear groove or an arc groove. The holes are located at the staggered points, and the depth of the holes is greater than the depth of the first groove and the second groove. Thereby, the second groove allows impurities suspended in the slurry to quickly exit the polishing pad, and the holes can store the slurry to extend the time during which the abrasive particles in the slurry leave the polishing pad. The invention is illustrated by the following examples, which are not intended to be limited to the details disclosed herein. Example 1: Referring to Figure 3, a top plan view of a polishing pad of an example of the present invention is shown. The surface texture of the polishing pad 3 of the present example includes a plurality of first trenches 31, a plurality of second trenches 32, and a plurality of holes 33. The first trenches 31 are a plurality of concentric circular trenches, and the plurality of concentric circular trenches Waiting for the first trench 31 to look at the system as a plural number 109891.doc