CN102199404B - 膜状电路连接材料及电路部件的连接结构 - Google Patents

膜状电路连接材料及电路部件的连接结构 Download PDF

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CN102199404B
CN102199404B CN2011100931584A CN201110093158A CN102199404B CN 102199404 B CN102199404 B CN 102199404B CN 2011100931584 A CN2011100931584 A CN 2011100931584A CN 201110093158 A CN201110093158 A CN 201110093158A CN 102199404 B CN102199404 B CN 102199404B
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circuit
film
compound
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mass
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CN102199404A (zh
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望月日臣
有福征宏
小岛和良
小林宏治
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Resonac Corp
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Hitachi Chemical Co Ltd
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    • H01—ELECTRIC ELEMENTS
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  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
CN2011100931584A 2007-05-09 2008-05-07 膜状电路连接材料及电路部件的连接结构 Active CN102199404B (zh)

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CN2010105189647A Active CN101982515B (zh) 2007-05-09 2008-05-07 膜状电路连接材料及电路部件的连接结构
CN2008800141483A Active CN101675715B (zh) 2007-05-09 2008-05-07 膜状电路连接材料及电路部件的连接结构

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CN105176471A (zh) * 2010-07-26 2015-12-23 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
KR20130143673A (ko) * 2010-07-26 2013-12-31 히타치가세이가부시끼가이샤 접착제 조성물, 접속 구조체, 및 접속 구조체의 제조 방법
US9412717B2 (en) * 2011-11-04 2016-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for molded underfills in flip chip packaging
JP6398570B2 (ja) * 2013-10-09 2018-10-03 日立化成株式会社 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法
JP2015098575A (ja) * 2013-10-16 2015-05-28 日立化成株式会社 接着剤組成物及び接続体
JP6417675B2 (ja) * 2014-03-03 2018-11-07 日立化成株式会社 接着剤組成物及び接続体
JP6645499B2 (ja) * 2015-06-10 2020-02-14 日立化成株式会社 接着剤組成物及び接続体
JP6915544B2 (ja) * 2015-11-04 2021-08-04 昭和電工マテリアルズ株式会社 接着剤組成物及び構造体
CN110914324B (zh) 2017-05-31 2023-09-22 陶氏环球技术有限责任公司 溶剂基粘合剂组合物
CN107613675A (zh) * 2017-08-10 2018-01-19 维沃移动通信有限公司 一种柔性电路板的压合方法、集成电路板及移动终端
CN107946677A (zh) * 2017-12-15 2018-04-20 安徽中科中涣防务装备技术有限公司 一种安全锂电池芯阻燃结构
DE102018206632A1 (de) 2018-04-27 2019-10-31 Tesa Se Latent reaktiver Klebefilm
JP2018184607A (ja) * 2018-06-27 2018-11-22 日立化成株式会社 接着剤組成物及び接続体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1667069A (zh) * 2004-03-09 2005-09-14 琳得科株式会社 粘接剂组合物、光盘制造用薄片以及光盘
WO2007046190A1 (ja) * 2005-10-18 2007-04-26 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH674518A5 (https=) * 1987-09-09 1990-06-15 Inventa Ag
JP2578133B2 (ja) 1987-10-15 1997-02-05 サンスター技研株式会社 ポリウレタン接着剤
JP3538861B2 (ja) 1993-09-24 2004-06-14 綜研化学株式会社 異方導電性感圧接着シート
JP2002204052A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路端子の接続方法、接続構造
JP2003064331A (ja) * 2001-08-30 2003-03-05 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法
JP3858740B2 (ja) * 2002-03-27 2006-12-20 日立化成工業株式会社 回路接続用接着剤組成物及びそれを用いた回路接続構造体
JP4649815B2 (ja) * 2002-03-27 2011-03-16 日立化成工業株式会社 回路接続用接着剤組成物及びそれを用いた回路接続構造体
TWI276117B (en) * 2003-07-04 2007-03-11 Natoco Co Ltd Coated conductive particle, conductive material, anisotropic conductive adhesive and anisotropic conductive junction structure
JP2005347273A (ja) * 2005-06-06 2005-12-15 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1667069A (zh) * 2004-03-09 2005-09-14 琳得科株式会社 粘接剂组合物、光盘制造用薄片以及光盘
WO2007046190A1 (ja) * 2005-10-18 2007-04-26 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置

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