CN102199404B - Film-like circuit connecting material and connection structure for circuit member - Google Patents

Film-like circuit connecting material and connection structure for circuit member Download PDF

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Publication number
CN102199404B
CN102199404B CN2011100931584A CN201110093158A CN102199404B CN 102199404 B CN102199404 B CN 102199404B CN 2011100931584 A CN2011100931584 A CN 2011100931584A CN 201110093158 A CN201110093158 A CN 201110093158A CN 102199404 B CN102199404 B CN 102199404B
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circuit
compound
application
free
mass parts
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CN102199404A (en
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望月日臣
有福征宏
小岛和良
小林宏治
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Lishennoco Co ltd
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Hitachi Chemical Co Ltd
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Abstract

The invention provides a film-like circuit connecting material and a connection structure for a circuit member. The invention provides the uses of a bonding film as the circuit connecting material. The film-like circuit connecting material is used for electrically connecting a first circuit member, wherein a first circuit electrode is formed on a major surface of a first circuit board, with a second circuit member, wherein a second circuit electrode is formed on a major surface of a second circuit board, in such a manner that the first and second circuit electrodes face each other. The film-like circuit connecting material contains a film-forming material, a radically polymerizable compound, a radical polymerization initiator which generates a free radical when heated, and an isocyanate group-containing compound. In this film-like circuit connecting material, the isocyanate group-containing compound is contained in an amount of 0.09-5 parts by mass relative to 100 parts by mass of the total of the film-forming material and the radically polymerizable compound.

Description

The syndeton of film-like circuit connecting material and circuit block
The application is to be on May 7th, 2008 applying date of original application, and application number is 200880014148.3, and what denomination of invention was the Chinese patent application of " syndeton of film-like circuit connecting material and circuit block " divides an application.
Technical field
The present invention relates to the syndeton of a kind of film-like circuit connecting material and circuit block.
Background technology
In recent years, in the fields such as semi-conductor, liquid-crystal display, for fixing electronic unit or carry out the circuit connection, various adhesivess had been used.Among these purposes, growing along with densification, high-precision refinement, caking agent has also been required to high bonding force, reliability.
Particularly in the connection of the connection of connection, FPC and the TCP of liquid-crystal display and TCP or FPC and printing distributing board, will in caking agent, be dispersed with electroconductive particle and the anisotropic conductive adhesive that forms as circuit connection material.In addition, while being arranged on substrate by semiconductor silicon chips recently, replace wire bond in the past, carried out, by upside-down mounting, semiconductor silicon chips is directly installed on to so-called upside-down installation method basically, at this, also started the application of anisotropic conductive adhesive.
And in recent years in the precise electronic field of machines, along with the development of circuit densification, the wide and electrode space of electrode becomes extremely narrow.For this reason, used the condition of contact of the circuit connection material of epoxy resin to become easily to occur the coming off of distribution in the past, peeled off, position deviation.
In addition, in order to enhance productivity, the tie-time is shortened in expectation, thus seek a kind of can be at 10 seconds circuit connection materials with interior connection.Therefore, developing the circuit connection material (for example, with reference to patent documentation 1) that long electric and electronic of the rapid curing performance excellence of low temperature and serviceable time is used.
Patent documentation 1: Japanese kokai publication hei 11-97825 communique
Summary of the invention
The problem that invention will solve
But the bonding strength of foregoing circuit connecting material is different because of the material of connected circuit block.Particularly silicon nitride, silicone resin or polyimide resin coating for circuit block surface, or while being attached on the circuit block surface by these resins, bonding strength is tended to descend.Therefore, no matter expect a kind of material for which kind of circuit block, excellent in adhesion and circuit connection material that the serviceable time is very long.
The present invention In view of the foregoing makes, no matter the syndeton that provides a kind of material to which kind of circuit block all to demonstrate very long film-like circuit connecting material of very high cementability and serviceable time and use the circuit block of this circuit connection material is provided purpose.
The method of dealing with problems
The invention provides a kind of film-like circuit connecting material, it is, for on the interarea of the first circuit substrate, being formed with the film-like circuit connecting material be electrically connected under the state that the first circuit block of the first circuit electrode is relative at the first and second circuit electrodes with the second circuit parts that are formed with the second circuit electrode on interarea at the second circuit substrate, this film-like circuit connecting material contains film formation material, free-radical polymerised compound, through adding the radical polymerization initiator of the free free radical of thermogenesis, compound containing isocyanate group, total 100 mass parts with respect to film formation material and free-radical polymerised compound, containing the compound of isocyanate group containing proportional be 0.09～5 mass parts.
By thering is above-mentioned formation, no matter film-like circuit connecting material of the present invention all demonstrates very high cementability to the material of which kind of circuit block and the serviceable time is very long.The reason that can realize this effect is also indefinite, but the inventor etc. are presumed as follows.
Usually, in order to extend the serviceable time of circuit connection material, need the reactivity of pilot circuit connecting material.But, if controlled the reactivity of circuit connection material, have the tendency that is difficult to demonstrate enough cementabilities according to the kind by convered structure.On the other hand, although think above-mentioned containing the reactivity excellence under the temperature condition of compound when circuit connects of isocyanate group, at the temperature lower than it, be stable.Therefore think, film-like circuit connecting material of the present invention, by contain the compound containing isocyanate group of specified amount together with other composition simultaneously, can be taken into account good cementability and very long serviceable time.
Above-mentioned film-like circuit connecting material preferably contains fluorinated organic compound.This film-like circuit connecting material not only cementability further improves, and also plays the effect of transfer printing excellence.
In addition, preferably to comprise weight-average molecular weight be the organic compound with amino-formate bond more than 10000 to the film formation material of film-like circuit connecting material of the present invention.Thus, the flexibility that can further effectively bring into play film-like circuit connecting material improves, with the effect of the present invention excellent in adhesion of various circuit blocks.
Circuit connection material of the present invention preferably further contains electroconductive particle.Thus, circuit connection material himself can be easy to have electroconductibility.For this reason, this circuit connection material can be used as conductive adhesive in the electrical industries such as circuit electrode, semi-conductor or electronics industry.And now, because circuit connection material has electroconductibility, therefore can further reduce the contact resistance after solidifying.
The invention provides a kind of syndeton of circuit block, it has the first circuit block, second circuit parts and circuit connecting section, described the first circuit block for being formed with the circuit block of the first circuit electrode on the interarea of the first circuit substrate, the circuit block of described second circuit parts for being formed with the second circuit electrode and configuring according to the mode that makes the second circuit electrode with the relative configuration of the first circuit electrode on the interarea of second circuit substrate, described circuit connecting section is arranged between the first circuit substrate and second circuit substrate, connect the first circuit block and the second interconnecting piece to be electrically connected to the first and second circuit electrodes, circuit connecting section is formed by the cured article of above-mentioned film-like circuit connecting material.
The syndeton of sort circuit parts is because the cured article of the film-like circuit connecting material of the present invention that its circuit connecting section is very excellent by cementability, the serviceable time is grown very much forms, so, in the insulativity on maintaining same circuit block between adjacent circuit electrode, can reduce the resistance value between the first and second relative circuit electrodes.
In the syndeton of circuit block of the present invention, the surface of at least one party in the first and second circuit electrodes preferably forms by comprising the material that is selected from least one material in the group that gold and silver, tin, platinum metals and indium-tin-oxide form.In the syndeton of sort circuit parts, in the insulativity on maintaining same circuit block between adjacent circuit electrode, can further reduce the resistance value between relative circuit electrode.
In addition, in the syndeton of circuit block of the present invention, at least one party in the first and second circuit substrates is preferably by the substrate that comprises the material that is selected from least one material in the group that polyethylene terephthalate, polyethersulfone, epoxy resin, acrylic resin, polyimide resin and glass forms and form.When the circuit connection material of the invention described above solidify to form circuit connecting section, between the substrate formed with these certain materials, can realize higher cementability.
And, in the syndeton of foregoing circuit parts, be preferably formed with the layer that comprises at least one material in the group that is selected from silicon nitride, silicone resin, polyimide resin and acrylic resin composition between at least one party in the first and second circuit blocks and foregoing circuit connection section.Thus, with forming above-mentioned layer, do not compare, the cementability between circuit block and circuit connecting section further improves.
The effect of invention
According to the present invention, no matter the syndeton that can provide a kind of material to which kind of circuit block all to demonstrate very long film-like circuit connecting material of very high cementability and serviceable time and use the circuit block of these circuit connection materials.
The accompanying drawing explanation
Fig. 1 is the fragmentary cross sectional view of an embodiment of the circuit block syndeton in expression the present invention.
Fig. 2 is the process picture sheet of an example of the manufacture method of the circuit block syndeton by shown in fragmentary cross sectional view presentation graphs 1.
Nomenclature
Circuit connection structure 5 caking agent composition 7 electroconductive particles of 1 circuit block
Cured article 20 first circuit blocks of 10 circuit connecting section 11 caking agent compositions
21 first circuit substrate 21a the first circuit substrate interarea 22 first circuit electrodes
30 second circuit parts 31 second circuit substrate 31a second circuit substrate interareas
32 second circuit electrode 40 film-like circuit connecting materials
Embodiment
Below, as required with reference to accompanying drawing, the preferred embodiment of the present invention is elaborated.In addition, in the accompanying drawings, same parts has same-sign, and omits its repeat specification.In addition, wait the position relation unless otherwise specified up and down, based on position relationship shown in the drawings.And then the dimension scale of accompanying drawing is not limited to graphic scale.In addition, " (methyl) vinylformic acid " in this specification sheets refers to " vinylformic acid " and " methacrylic acid " corresponding with it, " (methyl) acrylate " refers to " acrylate " and " methacrylic ester " corresponding with it, and " (methyl) acryloyl " refers to " acryloyl " and " methacryloyl " corresponding with it.
(film-like circuit connecting material)
Film-like circuit connecting material of the present invention (circuit connecting adhesive film) will be formed with under the state that the first circuit block of the first circuit electrode is relative at the first and second circuit electrodes with the second circuit parts that are formed with the second circuit electrode on interarea at the second circuit substrate and be electrically connected on the interarea of the first circuit substrate.Film-like circuit connecting material of the present invention contains film formation material, free-radical polymerised compound, the radical polymerization initiator through adding the free free radical of thermogenesis and is used as the caking agent composition containing the compound of isocyanate group, with respect to total 100 mass parts of film formation material and free-radical polymerised compound, the content that contains the compound of isocyanate group is 0.09～5 mass parts.
Film formation material, be that liquid object is being solidified, and will form composition and form when membranaceous, and this film is easily processed, can pay and be difficult for splitting, break and the material of the mechanical characteristics of adhesion, and be to can be used as in the normal state the material that film is processed.As film formation material, such as enumerating polyvinyl formal, polystyrene resin, polyvinyl butyral resin, vibrin, polyester urethane resin, polyamide resin, urethane resin, polyamide-imide resin, polyimide resin, xylene resin, phenoxy resin etc.In addition, film formation material can carry out modification by free-radical polymerised functional group.
From cementability, more excellent viewpoint is considered, the film formation material of film-like circuit connecting material film formation material of the present invention preferably contains organic compound with amino-formate bond (below, be sometimes referred to as " carbamate compounds ").In addition, carbamate compounds preferably has amino-formate bond in its main chain, when more preferably having amino-formate bond, has ester bond.
This carbamate compounds for example can obtain by polyester polyol and di-isocyanate reaction.Usually, the carbamate compounds obtained by this reaction is sometimes referred to as polyester urethane resin.
As vulcabond, suitable use 2,4-tolylene diisocyanate (TDI), 4,4 '-diphenylmethanediisocyanate (MDI), 1, aromatic series, the alicyclic or aliphatic vulcabond such as 6-hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI).
Polyester polyol for example can obtain by dicarboxylic acid and glycol reaction.Aromatic series or the aliphatic dicarboxylic acids such as the preferred terephthalic acid of dicarboxylic acid, m-phthalic acid, hexanodioic acid, sebacic acid.The glycolss such as the preferred ethylene glycol of glycol, propylene glycol, BDO, hexylene glycol, neopentyl glycol, Diethylene Glycol, triethylene glycol.
The weight-average molecular weight of carbamate compounds is preferably more than 10000.If the weight-average molecular weight of carbamate compounds is less than 10000, film formation performance is tending towards reducing.In addition, the higher limit of the weight-average molecular weight of carbamate compounds is not particularly limited, if but weight-average molecular weight is too high, and solvability and the intermiscibility to solvent reduces, the modulation of being difficult to is arranged for being configured as the trend of membranaceous coating fluid, so preferred 200000 left and right.
Weight-average molecular weight in this specification sheets is measured by gel permeation chromatography (GPC) analysis according to the condition shown in table 1, by with the polystyrene standard working curve, converting and try to achieve.In addition, GPC condition 1 condition when measuring the weight-average molecular weight of polyimide resin, the condition of GPC condition 2 when measuring the weight-average molecular weight of the organic compound beyond polyimide resin.
Table 1
Figure BSA00000473776300061
Free-radical polymerised compound is the compound with functional group that can radical polymerization.Free-radical polymerised compound is suitable use (methyl) acrylic compound, maleimide compound or styrene derivatives for example.These free-radical polymerised compounds can be any in polymerizable monomer and polyreactive oligomers, also can and with polymerizable monomer and polyreactive oligomers.Because polyreactive oligomers is generally high viscosity, so, when using polyreactive oligomers, preferably also with polymerizable monomers such as low viscous polymerizability polyfunctional group (methyl) acrylate, carry out adjusting viscosity.
As (methyl) acrylic compound, such as enumerating the optical polymerism oligopolymer such as epoxy type (methyl) origoester acrylate, carbamate type (methyl) origoester acrylate, polyether-type (methyl) origoester acrylate and polyester type (methyl) origoester acrylate, trimethylolpropane tris (methyl) acrylate, polyoxyethylene glycol two (methyl) acrylate, polyalkylene glycol two (methyl) acrylate, (methyl) vinylformic acid two cyclopentenes esters, (methyl) vinylformic acid two cyclopentenes oxygen base ethyl esters, neopentyl glycol two (methyl) acrylate, Dipentaerythritol six (methyl) acrylate, isocyanuric acid modification 2 functional groups (methyl) acrylate, isocyanuric acid modification 3 functional groups (methyl) acrylate, 2, polyfunctional group (methyl) acrylic compound such as 2 '-bis-(methyl) acryloxy diethyl phosphoric acid ester and 2-(methyl) acryloxy ethyl phosphate ester acid, tetramethylolmethane (methyl) acrylate, (methyl) 2-cyanoethyl acrylate, (methyl) cyclohexyl acrylate, (methyl) vinylformic acid-2-(2-ethoxy ethoxy) ethyl ester, (methyl) vinylformic acid-2-ethoxy ethyl ester, (methyl) ethyl acrylate, the just own ester of (methyl) vinylformic acid, (methyl) vinylformic acid-2-hydroxyl ethyl ester, (methyl) Propylene glycol monoacrylate, (methyl) isobornyl acrylate, (methyl) isodecyl acrylate, (methyl) Isooctyl acrylate monomer, (methyl) vinylformic acid n-dodecane ester, (methyl) vinylformic acid-2-methoxyl group ethyl ester, (methyl) vinylformic acid-2-phenoxy ethyl, tetrahydrofurfuryl alcohol (methyl) acrylate, neopentyl glycol two (methyl) acrylate, (methyl) vinylformic acid tertiary butyl amino ethyl ester, (methyl) cyclohexyl acrylate, (methyl) vinylformic acid two cyclopentenes oxygen base ethyl esters, (methyl) vinylformic acid-2-hydroxyl ethyl ester, (methyl) isobornyl acrylate, (methyl) isodecyl acrylate, (methyl) vinylformic acid n-dodecane ester, stearyl (methyl) acrylate, (methyl) tridecyl acrylate and (methyl) glycidyl acrylate.
(methyl) acrylic compound is can be separately a kind of or combine two or more uses.In order to suppress the cure shrinkage of circuit connection material, provide flexible, preferably allocate carbamate type (methyl) origoester acrylate.
The compound that contains two above dimaleoyl iminos in the preferred molecule of maleimide compound.As its concrete example, can enumerate 1-methyl-2,4-bismaleimides benzene, N, N '-meta-phenylene bismaleimide, N, N '-TOPOT 2,2′ p phenylenebis maleimide, N, a N '-tolyl bismaleimides, N, N '-4,4-biphenylene bismaleimides, N, N '-4,4-(3,3 '-dimethyl-biphenylene) bismaleimides, N, N '-4,4-(3,3 '-dimethyl diphenylmethane) bismaleimides, N, N '-4,4-(3,3 '-the diethyl ditan) bismaleimides, N, N '-4,4-ditan bismaleimides, N, N '-4,4-diphenyl propane bismaleimides, N, N '-4,4-Diphenyl Ether Bismaleimide, N, N '-3,3 '-the sulfobenzide bismaleimides, two [4-(the 4-maleimide phenoxy group) phenyl] propane of 2,2-, two [3-sec-butyl-4-(the 4-maleimide phenoxy group) phenyl] propane of 2,2-, two [4-(the 4-maleimide phenoxy group) phenyl] decane of 1,1-, 4,4 '-cyclohexylene-bis-[1-(4-maleimide phenoxy group)-2-phenylcyclohexanes] and two [4-(the 4-maleimide phenoxy group) phenyl] HFC-236fa of 2,2-.
Maleimide compound is can be separately a kind of or combine two or more uses.
In order to improve cementability, the free-radical polymerised compound of film-like circuit connecting material of the present invention preferably contains phosphate type (methyl) acrylate.By containing phosphate type (methyl) acrylate, the cementability of film-like circuit connecting material, particularly with the cementability of the inorganic materials such as metal, improve.Phosphate type (methyl) acrylate is not particularly limited, and can use known phosphate type (methyl) acrylate.As its concrete example, can enumerate the compound that following general formula (2) means.
[Chemical formula 1]
Wherein, n means 1～3 integer.
Usually, phosphate type (methyl) acrylate can be used as the reactant of phosphoric anhydride and (methyl) vinylformic acid 2-hydroxyl ethyl ester and obtains.As phosphate type (methyl) acrylate, specifically can enumerate list (2-methacryloxyethyl) phosphate ester acid, two (2-methacryloxyethyl) phosphate ester acid.These esters are can be separately a kind of or combine two or more uses.
From cementability, more excellent viewpoint is considered, film-like circuit connecting material of the present invention can comprise (methyl) allyl acrylate.With respect to total 100 mass parts of film formation material and free-radical polymerised compound, the mixing ratio of (methyl) allyl acrylate is preferably 0.1～10 mass parts, more preferably 0.5～5 mass parts.
In addition, as through adding the radical polymerization initiator of the free free radical of thermogenesis, can use existing known peralcohol (organo-peroxide) and azo-compound.
Organo-peroxide and azo-compound are through heating the free free radical of main generation.When these compounds are used as to radical polymerization initiator, according to the connection temperature as purpose, tie-time, serviceable time (below, be sometimes referred to as " storage period ") etc., can from organo-peroxide and/or azo-compound, suitably select one or more.
From taking into account reactive viewpoint high and that storage period is long, consider, organo-peroxide preferably 10 hours half life temperatures is more than 40 ℃ and 1 minute half life temperature is the organo-peroxide below 180 ℃, and more preferably 10 hours half life temperatures are more than 60 ℃ and 1 minute half life temperature is the organo-peroxide below 170 ℃.In addition, for the circuit electrode (connection terminal) that prevents the open circuit potential parts, the preferred chlorion of organo-peroxide, organic acid content are below 5000 quality ppm.And then, the organo-peroxide that the organic acid more preferably produced after thermal degradation is less.
As organo-peroxide, the organo-peroxide of more than one that select the concrete group preferably formed from diacyl peroxide, peroxy dicarbonate, peroxyester, ketal peroxide, dialkyl peroxide, hydroperoxide and peroxidation silane.Among these organo-peroxides, the high viewpoint of reactivity when the storage stability height while preserving from taking into account and use is considered, the organo-peroxide of more than one that select the group more preferably formed from peroxyester, ketal peroxide, dialkyl peroxide, hydroperoxide and peroxidation silane.And then, in order to obtain higher reactivity, further preferred peroxyester and ketal peroxide.
As diacyl peroxide; for example can enumerate peroxidation isobutyryl, peroxidation-2; 4-dichloro-benzoyl, peroxidation-3,5,5-trimethyl acetyl, peroxidation decoyl, lauroyl peroxide, stearoyl, succinyl peroxide, benzoyl peroxide toluene and benzoyl peroxide.These diacyl peroxides are can be separately a kind of or combine two or more uses.
As dialkyl peroxide, for example can enumerate α, α '-bis-(tert-butyl peroxide) diisopropyl benzene, dicumyl peroxide, 2,5-dimethyl-2,5-bis-(tert-butyl peroxide) hexane and tertiary butyl cumyl peroxide.These dialkyl peroxides are can be separately a kind of or combine two or more uses.
As peroxy dicarbonate, for example can enumerate diη-propyl peroxy dicarbonate, diisopropyl peroxydicarbonate, two (4-tert-butylcyclohexyl) peroxy dicarbonate, two-2-oxyethyl group methoxy base peroxy dicarbonate, two (peroxidation-2-ethylhexyl) two carbonic ethers, dimethoxy butyl peroxyization two carbonic ethers and two (peroxidation-3-methyl-3-oxyethyl group butyl) two carbonic ethers.These peroxy dicarbonates are can be separately a kind of or combine two or more uses.
As peroxyester, for example can enumerate peroxidation neodecanoic acid cumyl ester, peroxidation neodecanoic acid-1,1,3,3-tetramethyl-butyl ester, peroxidation neodecanoic acid-1-cyclohexyl-1-methyl ethyl ester, the tertiary own ester of peroxidation neodecanoic acid, tert-Butyl peroxypivalate, peroxidation-2 ethyl hexanoic acid-1,1,3,3-tetramethyl-butyl ester, 2,5-dimethyl-2, two (peroxidation-2-ethyl hexyl acyl group) hexanes of 5-, peroxidation-2 ethyl hexanoic acid-1-cyclohexyl-1-methyl ethyl ester, the tertiary own ester of peroxidation-2 ethyl hexanoic acid, peroxide-2-ethyl hexanoic acid tert-butyl, the peroxidation tert-butyl isobutyrate, two (tert-butyl peroxide) hexanaphthenes of 1,1-, tertiary hexyl peroxidation sec.-propyl monocarbonate, peroxidation-3,5,5 Trimethylhexanoic acid tert-butyl ester, the peroxidation lauric acid tert-butyl ester, 2,5-dimethyl-2, two (m-toluyl peroxide base) hexanes of 5-, tert-butyl hydroperoxide sec.-propyl monocarbonate, tert-butyl hydroperoxide-2-ethylhexyl monocarbonate, the tertiary own ester of peroxidation M-nitro benzoic acid, peroxide acetic acid butyl ester and two (tert-butyl peroxide) hexahydro terephthalic acid ester.These peroxyesters are can be separately a kind of or combine two or more uses.
As ketal peroxide, for example can enumerate 1, two (the tertiary hexyls of peroxidation)-3,3 of 1-, 5-trimethyl-cyclohexane, 1, two (the tertiary hexyl of the peroxidation) hexanaphthenes, 1 of 1-, two (tert-butyl peroxide)-3,3 of 1-, 5-trimethyl-cyclohexane, 1, two (tert-butyl peroxide) cyclododecanes of 1-and two (tert-butyl peroxide) decane of 2,2-.These ketal peroxides are can be separately a kind of or combine two or more uses.
As hydroperoxide, for example can enumerate diisopropyl benzene hydroperoxide and cumene hydroperoxide.These hydroperoxide are can be separately a kind of or combine two or more uses.
As peroxidation silane, for example can enumerate tert-butyl peroxide trimethyl silane, two (tertiary butyl) dimethylsilane of peroxidation, tert-butyl peroxide trivinyl silane, two (tertiary butyl) divinyl silane of peroxidation, peroxidation three (tertiary butyl) vinyl silanes, tert-butyl peroxide triallyl silane, two (tertiary butyl) diallylsilanes of peroxidation and peroxidation three (tertiary butyl) allyl silicane.These peroxidation silane are can be separately a kind of or combine two or more uses.
While using these organo-peroxides, can further combine the uses such as decomposition accelerating agent, inhibitor.In addition, these organo-peroxides are if while carrying out the superoxide of micro encapsulation with coatings such as polyurethanes, polyester polymer substances, and the serviceable time extends, thereby preferably.
In addition, as azo-compound, for example can enumerate 2,2 '-azo is two-2,4-methyl pentane nitrile, 1,1 '-azo two (1-acetoxyl group-1-diphenylphosphino ethane), 2,2 '-Diisopropyl azodicarboxylate, 2,2 '-azo two (2-methylbutyronitrile), dimethyl-2,2 '-Diisopropyl azodicarboxylate, 4,4 '-azo two (4-cyanopentanoic acid) and 1,1 '-azo two (1-cyclohexane nitrile).These azo-compounds are can be separately a kind of or combine two or more uses.
Usually, with respect to total 100 mass parts of film formation material and free-radical polymerised compound, the mixing ratio of radical polymerization initiator is preferably 0.05～20 mass parts, more preferably 0.1～10 mass parts.The mixing ratio of radical polymerization initiator is during less than 0.05 mass parts, and transformation efficiency reduces, so have, is difficult to the tendency that makes film-like circuit connecting material curing.When the mixing ratio of radical polymerization initiator exceeds 20 mass parts, have the tendency that the serviceable time shortens.In addition, the mixing ratio of radical polymerization initiator can suitably be set according to the connection temperature as purpose, tie-time, storage period etc.For example, tie-time is below 25 seconds the time, and in order to obtain sufficient transformation efficiency, the mixing ratio of radical polymerization initiator is with respect to total 100 mass parts of film formation material and free-radical polymerised compound, be preferably 2～10 mass parts, more preferably 4～8 mass parts.
Containing the compound of isocyanate group, so long as there is the compound of isocyanate group in molecule and get final product, be not particularly limited.As the compound containing isocyanate group, such as enumerating tolysulfonyl based isocyanate, octadecylisocyanate, (methyl) acryl isocyanic ester, γ-monoisocyanates compounds such as triisocyanate propyl-triethoxysilicane; 2,4 toluene diisocyanate, 2,6-tolylene diisocyanate, xylylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, ditan-4, the diisocyanate cpds such as 4-vulcabond; The compound that there is endways isocyanate group obtained with reacting of isocyanate compound by various polyether polyols, polyester polyol, polymeric amide etc.Diisocyanate cpd can be used as commercially available product and obtains, for example, can use the trade(brand)name " Ke Laonuo (コ ロ ネ mono-ト) L ", " Mi Laonuo (ミ リ ォ ネ mono-ト) MR ", " Ke Laonuo EH ", " Ke Laonuo HL " etc. of Japanese polyurethane industry society system.In addition, from further improving, the viewpoint of the cementability by convered structure is considered preferably there is endways hydroxyl, nitro, polar group that the carboxyl isoreactivity is high containing the compound of isocyanate group.And then, while thering is the alkoxysilane group such as Trimethoxy silane base, triethoxysilicane alkyl containing the compound of isocyanate group, these groups with formed chemical bond by the planar water on convered structure surface, can be bonding securely, thereby more preferably.
With respect to total 100 mass parts of film formation material and free-radical polymerised compound, the content of the above-mentioned compound containing isocyanate group is 0.09～5 mass parts, is preferably 0.1～5 mass parts, more preferably 0.5～3 mass parts.During less than 0.09 mass parts, be difficult to obtain sufficient cementability containing the content of the compound of isocyanate group; While exceeding 5 mass parts, the serviceable time is tended to shorten.
In addition, the caking agent composition of film-like circuit connecting material of the present invention preferably contains fluorinated organic compound.Fluorinated organic compound so long as have the compound of fluorine in molecule and get final product, can be known fluorinated organic compound, can be also that above-mentioned film formation material or free-radical polymerised compound have fluorine atom.Particularly, such as enumerating fluorine-containing polyvinyl butyral resin, fluorine-containing vinyl-formal resin, fluorinated polyimide resin, fluorine-containing polyamide resin, fluorine-containing polyamide-imide resin, fluorine-containing vibrin, fluorine-containing resol, fluorine-containing epoxy resin, fluorine-containing phenoxy resin, fluorochemical urethane resin, fluorine-containing polyester urethane resin, fluorine-containing polyarylate resin, fluorine-containing styrene resin, fluorine-containing organic silicon resin, fluorine-containing propene acids rubber, fluorine-containing nitrile rubber, fluorine-containing NBR, fluorine-containing SBS etc.These fluorinated organic compounds are can be separately a kind of or mix two or more uses.When film-like circuit connecting material contains these fluorinated organic compounds, no matter the material of which kind of circuit block all embodied to better cementability, transfer printing is inhibited over time, and transfer printing is also excellent.
Stress retentivity excellence when solidifying, the viewpoint that cementability further improves considers, the weight-average molecular weight of fluorinated organic compound preferably 5000～1000000, more preferably 20000～200000.The weight-average molecular weight of fluorinated organic compound is less than 5000 o'clock, has film and forms the inadequate tendency of performance, and weight-average molecular weight exceeds at 1000000 o'clock, has the tendency with the intermiscibility variation of other composition.
And then excellent for stress is relaxed, film-like circuit connecting material of the present invention can contain acrylic rubber.As acrylic rubber, can use polymkeric substance or multipolymer that at least one the acrylic monomer polymerization in vinylformic acid, (methyl) acrylate or vinyl cyanide is obtained.Acrylic rubber also can be the multipolymer that above-mentioned monomer and (methyl) glycidyl acrylate copolymerization with glycidyl ether are obtained.From the angle of the cohesive force that improves film-like circuit connecting material, the weight-average molecular weight of acrylic rubber is preferably more than 200000.
In film-like circuit connecting material of the present invention, except mentioned component, also can add other material as the caking agent composition according to application target.For example, also can suitably add the bonding auxiliary agents such as coupling agent, closing force rising agent, flow agent in film-like circuit connecting material.Thus, can pay better cementability, treatability.
The angle consideration improved from cementability, coupling agent can preferably be used the material containing ketoimine, vinyl, propenyl, amino, epoxy group(ing) and isocyanate group.Particularly, can enumerate (3-methacryloxypropyl) Trimethoxy silane, (3-acryloyl-oxy propyl group) Trimethoxy silane, (3-methacryloxypropyl) dimethoxy-methyl silane, (3-acryloyl-oxy propyl group) dimethoxy-methyl silane as the silane coupling agent with propenyl, as containing amino silane coupling agent, enumerating N-β (amino-ethyl) gamma-amino propyl trimethoxy silicane, N-β (amino-ethyl) gamma-amino propyl group methyl dimethoxysilane, γ aminopropyltriethoxy silane, N-phenyl-gamma-amino propyl trimethoxy silicane.Make the above-mentioned silane coupling agent that the ketone compounds such as amino silane coupling agent and acetone, methyl ethyl ketone, mibk react and obtain that has as enumerating containing the silane coupling agent of ketoimine.In addition, can enumerate γ-glycidoxypropyltrimewasxysilane, γ-glycidoxypropyl triethoxyl silane, γ-glycidoxypropyl-methyl dimethoxysilane, γ-glycidoxypropyl-methyldiethoxysilane as the silane coupling agent containing epoxy group(ing).
With respect to total 100 mass parts of other batching in circuit connection material, the mixing ratio of coupling agent is 0.1～20 mass parts preferably.The mixing ratio of coupling agent during less than 0.1 mass parts, has the tendency of the additive effect that can not get essence.In addition, when the mixing ratio of coupling agent exceeds 20 mass parts, the film of the adhesive linkage while on support base material, forming the adhesive linkage of being made by circuit connection material forms performance and tends to reduce, and thickness intensity is also tended to reduce.
Film-like circuit connecting material of the present invention even do not contain electroconductive particle, also can be connected by the direct contact between relative circuit electrode when connecting.But, when film-like circuit connecting material contains electroconductive particle, can access the connection between more stable circuit electrode, thereby preferably.
In the present invention, as long as contained electroconductive particle has the electroconductibility of the electrical connection of can obtaining as required, be not particularly limited.As electroconductive particle, such as metallics and the carbon that can enumerate Au, Ag, Ni, Cu and scolding tin etc.In addition, electroconductive particle can be also the particle as core with one deck or two-layer above layer coating, and its outermost layer has the particle of electroconductibility.Now, from the viewpoint that obtains more excellent storage period, consider, with regard to outermost layer, with transition metal such as Ni, Cu, compare, the precious metals such as Au, Ag and/or platinum metals of preferably take are principal constituent, and more preferably at least one in these precious metals forms.Among these precious metals, Au most preferably.
Electroconductive particle can be further also principal constituent in order to precious metal layer carries out coating and forms the surface of the layer that transition metal is principal constituent of take of particle that transition metal is principal constituent or tegmental nuclei of take as core.In addition, electroconductive particle can be also to using insulativity particle that dielectric glass, pottery, plastics etc. are principal constituent as core, and the layer that is principal constituent in order to above-mentioned metal or carbon on the surface of this core carries out the particle that coating forms.
Electroconductive particle is when carrying out to the core of insulativity particle particle that coating forms with conductive layer, and preferably the insulativity particle be take plastics as principal constituent, and outermost layer be take precious metal as principal constituent.Thus, good distortion can occur for heating and pressurization in the electroconductive particle in film-like circuit connecting material.And, when junction circuit etc., with the circuit electrode of electroconductive particle, the contact area of connection terminal, increase.Therefore, can further improve the connection reliability of film-like circuit connecting material.According to identical viewpoint, electroconductive particle preferably comprises take the particle that the metal of above-mentioned heating generation melting is principal constituent.
Electroconductive particle is when carrying out to the core of insulativity particle particle that coating forms with conductive layer, and in order to obtain better electroconductibility, the thickness of conductive layer is preferably
Figure BSA00000473776300131
(10nm) more than.In addition, electroconductive particle for the layer that is further principal constituent in order to precious metal to as core take particle that transition metal is principal constituent or tegmental nuclei take the surface of the layer that transition metal is principal constituent while carrying out particle that coating forms, take the thickness of the layer that above-mentioned precious metal is principal constituent as outermost layer and be preferably
Figure BSA00000473776300132
(30nm) more than.This thickness is less than
Figure BSA00000473776300133
The time, outermost layer easily breaks.Result is that the transition metal exposed contacts with the caking agent composition, easily produces free free radical by the redoxomorphism of transition metal, so have the tendency that easily reduce storage period.On the other hand, when the thickness of above-mentioned conductive layer is too thick, because those effects also reach capacity, so its thickness preferably sets below 1 μ m.
When film-like circuit connecting material contains electroconductive particle, the mixing ratio of electroconductive particle is not particularly limited, but, with respect to caking agent composition 100 parts by volume in film-like circuit connecting material, is preferably 0.1～30 parts by volume, more preferably 0.1～10 parts by volume.This value during less than 0.1 parts by volume, has the tendency that is difficult to obtain good electroconductibility, while exceeding 30 parts by volume, has the tendency of the short circuit of easy circuit for generating etc.In addition, the volume of each composition of the mixing ratio of electroconductive particle (parts by volume) before can the film-like circuit connecting material when making 23 ℃ solidifying is determined.The volume of each composition can be tried to achieve according to following methods, utilize proportion to be scaled the method for volume by weight, maybe this composition is put into and be equipped with well wetting but do not dissolve or the containers such as graduated cylinder of the suitable solvent (water, alcohol etc.) of this composition of swelling, by the volumeter of increase, calculate the method for its volume.In addition, by circuit connection material be divided into two-layer more than, be divided into the layer that contains radical polymerization initiator and when layer of containing electroconductive particle, can improve storage period.
Film-like circuit connecting material in the present invention also can contain rubber.Thus, can carry heavily stressed mitigation and cementability.Rubber particle is so long as its median size is coordinated below 2 times of electroconductive particle median size, and the material below 1/2 that its storage elastic modulus under room temperature (25 ℃) is also electroconductive particle and circuit connection material storage elastic modulus at room temperature gets final product.The particulate that particularly material of rubber particle is polysiloxane, acrylic latex, SBR, NBR, polybutadiene rubber can be suitable for being used alone or in mixture of two or more.The solvent resistance excellence of these three-dimensional cross-linked rubber particles, and easily be dispersed in film-like circuit connecting material.
The film-like circuit connecting material formed with mentioned component, be when the junction circuit parts, and the material of connection is solidified and kept to the caking agent composition melt-flow in circuit connection material, after connecting relative circuit block.Therefore, the mobility of film-like circuit connecting material is important factor.
For example, the circuit connection material that is 35 μ m, 5mm * 5mm by thickness is clipped between the sheet glass that thickness is 0.7mm, 15mm * 15mm, heat under 150 ℃, the condition of 2MPa and pressurize 10 seconds the time, the value of the mobility (B)/(A) meaned with the area (B) after initial stage area (A) and heating and pressurizing is preferably 1.3～3.0, and more preferably 1.5～2.5.(B) value/(A), less than 1.3 o'clock, has poor fluidity, can not get the tendency of the connection of good circuit block.On the other hand, value (B)/(A) exceeds at 3.0 o'clock, easily produces bubble, has the tendency of connection reliability variation.
The stabilization of the contact resistance when hot and humid and keep the viewpoint of connection reliability to consider, the Young's modulus after film-like circuit connecting material solidifies in the time of 40 ℃ is preferably 100～3000MPa, more preferably 500～2000MPa.
And then, in order to control curing speed and to pay stability in storage, in this film-like circuit connecting material, can add stablizer.And then also can coordinate weighting agent, tenderizer, promotor, protective agent, tinting material, fire retardant, thixotropic agent, resol, melamine resin etc. in film-like circuit connecting material.
When film-like circuit connecting material contains packing material (filler), can improve connection reliability etc., thereby preferably.Packing material is the material with insulativity, as long as its maximum diameter is less than the median size of electroconductive particle, can use.With respect to caking agent composition 100 parts by volume, the mixing ratio of packing material is preferably 5～60 parts by volume.When the mixing ratio of packing material exceeds 60 parts by volume, have the saturated tendency of effect that reliability improves, during less than 5 parts by volume, have the tendency that the additive effect of weighting agent diminishes.
Film-like circuit connecting material of the present invention forms membranaceous obtaining by the circuit connection material that will comprise above-mentioned each composition.This film-like circuit connecting material can obtain as follows: will add solvent etc. to circuit connection material and obtain and the mixed solution that obtains is applied on support base material, perhaps make the base material such as non-woven fabrics containing being soaked with above-mentioned mixed solution and carrying on support base material, obtain except desolventizing etc.
The support base material used is preferably laminar or membranaceous.In addition, support base material also can be the stacked shape formed more than two-layer.As support base material, can enumerate polyethylene terephthalate (PET) film, oriented polypropylene (OPP) film, polyethylene (PE) film and polyimide film.Among these films, from the raising of dimensional precision and the angle of cost, consider, preferably the PET film.
Above-mentioned film-like circuit connecting material also can be used as different not of the same race by the circuit connection material of convered structure of thermal expansivity.Particularly, except the film-like circuit connecting material of the representatives such as anisotropically conducting adhesive film, silverskin, also can be used as the semiconductor element adhesives of elastomerics for CSP, the representatives such as bottom stopping composition, LOC adhesive tape for CSP.
(syndeton of circuit block)
Fig. 1 is the fragmentary cross sectional view of an embodiment of expression circuit block syndeton of the present invention.The syndeton 1 of the circuit block shown in Fig. 1 comprises between the first circuit block 20 respect to one another and second circuit parts 30, the first circuit blocks 20 and second circuit parts 30 and is provided with the circuit connecting section 10 that connects them.
The first circuit electrode 22 that the first circuit block 20 has the first circuit substrate 21, forms on the interarea 21a of the first circuit substrate 21.The second circuit electrode 32 that second circuit parts 30 have second circuit substrate 31, form on the interarea 31a of second circuit substrate 31.On the interarea 21a of the first circuit substrate 21 and/or on the interarea 31a of second circuit substrate 31, according to circumstances also can form insulation layer (not shown).That is, insulation layer is formed between at least one party and circuit connecting section 10 in the first circuit block 20 and second circuit parts 30.
As the first and second circuit substrates 21,31, can enumerate the substrate of being made by the organism such as the polyimide base material of the inorganicss such as semi-conductor, glass, pottery, TCP, FPC, COF representative, polycarbonate, polyethylene terephthalate, polyethersulfone, epoxy resin, acrylic resin, material that these inorganicss, organism are composited.From the viewpoint of the cementability of further raising and circuit connecting section 10, consider, preferably at least one party in the first and second circuit substrates is the substrate formed by comprising the material that is selected from least one material in the group that polyethylene terephthalate, polyethersulfone, epoxy resin, acrylic resin, polyimide resin and glass forms.
In addition, while forming insulation layer, insulation layer is preferably the layer that comprises at least one material of selecting the group formed from silicon nitride, silicone resin, polyimide resin and acrylic resin.Thus, with not forming above-mentioned layer, compare, the cementability between the first circuit substrate 21 and/or second circuit substrate 31 and circuit connecting section 10 further improves.
Preferably the surface of at least one party in the first circuit electrode 22 and second circuit electrode 32 forms by comprising the material that is selected from least one material in the group that gold and silver, tin, platinum metals and indium-tin-oxide form.Thus, maintaining circuit electrode 22 or 32 insulativity each other adjacent on same circuit block 20,30, can further reduce the resistance value between relative circuit electrode 22 and 33 simultaneously.
As the concrete example of the first and second circuit blocks 20,30, can enumerate for the glass substrate that is formed with the circuit electrodes such as ITO of liquid-crystal display or plastic base, printing distributing board, ceramic wiring board, flexible wiring sheet, semiconductor silicon chips etc.As required, these uses capable of being combined.
Circuit connecting section 10 is formed by the cured article of the above-mentioned film-like circuit connecting material that contains electroconductive particle.The cured article 11 of circuit connecting section 10 contained caking agent composition in circuit connection material forms with the electroconductive particles 7 in the cured article 11 that is dispersed in the caking agent composition.Electroconductive particle 7 in circuit connecting section 10 not only is configured between relative the first circuit electrode 22 and second circuit electrode 32, also is configured in interarea 21a, 31a each other.In the syndeton 1 of circuit block, the two directly contacts electroconductive particle 7 and the first and second circuit electrodes 22,32.Thus, the first and second circuit electrodes 22,32 are electrically connected by electroconductive particle 7.Therefore, between adjacent circuit electrode in insulativity, can fully reduce the contact resistance between the first circuit electrode 22 and second circuit electrode 32 on maintaining same circuit block.Therefore, the current flowing between the first and second circuit electrodes 22,32 can be carried out reposefully, the function that circuit has can be brought into play fully.In addition, when circuit connecting section 10 does not contain electroconductive particle 7, the first circuit electrode 22 is realized being electrically connected to by directly contacting with second circuit electrode 32.
Because circuit connecting section 10 consists of the cured article of above-mentioned film-like circuit connecting material as described later, so the bonding force of 10 pairs of the first circuit blocks 20 of circuit connecting section and second circuit parts 30 is very high.
(manufacture method of the syndeton of circuit block)
Fig. 2 is for meaning the process picture sheet of an embodiment of the manufacture method of circuit block syndeton of the present invention by fragmentary cross sectional view.
In present embodiment, at first, prepare above-mentioned the first circuit block 20 and film-like circuit connecting material 40.Film-like circuit connecting material 40 comprises caking agent composition 5 and electroconductive particle 7, and described caking agent composition 5 contains film formation material, free-radical polymerised compound, the radical polymerization initiator through adding the free free radical of thermogenesis and contains the compound of isocyanate group.
In addition, also can use the circuit connection material that does not contain electroconductive particle 7.Now, circuit connection material can be described as NCP (Non Conductive Paste, non-conductive adhesive).On the other hand, the circuit connection material that comprises electroconductive particle 7 can be described as ACP (Anisotropic Conductive Paste, anisotropy conductiving glue).
The thickness of film-like circuit connecting material 40 is preferably 5～50 μ m.The thickness of film-like circuit connecting material 40 during less than 5 μ m, has the tendency of film-like circuit connecting material 40 lack of fills between the first and second circuit electrodes 22,32.On the other hand, while exceeding 50 μ m, have the tendency that is difficult to guarantee the conducting between the first and second circuit electrodes 22,32.
Then, film-like circuit connecting material 40 is placed on the face that is formed with circuit electrode 22 of the first circuit block 20.Afterwards, arrow A and the pressurization of B direction by film-like circuit connecting material 40 along Fig. 2 (a), make film-like circuit connecting material 40 temporarily be connected in the first circuit block 20 (Fig. 2 (b)).
Pressure now, as long as in the scope of not damaging circuit block, is not particularly limited, but usually is preferably 0.1～30MPa.In addition, but also limit heating edge pressurization, and Heating temperature is film-like circuit connecting material 40 not curing temperature basically.Heating temperature is preferably 50～190 ℃ usually.Heating and pressurization are preferably carried out 0.5～120 second.
Then, as shown in Fig. 2 (c), the mode according to making second circuit electrode 32 towards first circuit block 20 sides, be placed on second circuit parts 30 on film-like circuit connecting material 40.In addition, film-like circuit connecting material 40 is close on support base material (not shown) while arranging, and second circuit parts 30 is placed on film-like circuit connecting material 40 after peeling off support base material.Afterwards, in the time of heating film-like circuit connecting material 40, along the arrow A of Fig. 2 (c) and B direction to all pressurizations.In addition, even film-like circuit connecting material 40 is placed with the original state be arranged on support base material, also there is the very long serviceable time, and the cementability very high with the circuit block maintenance.
Heating temperature for example is set as 90～200 ℃, and the tie-time for example is set as 1 second～and 10 minutes.These conditions can suitably be selected according to purposes, film-like circuit connecting material, the circuit block of use, as required, also can carry out after fixing.For example, Heating temperature when, film-like circuit connecting material contains free-radical polymerised compound is the temperature that radical polymerization initiator can produce free radical.Thus, radical polymerization initiator produces free radical, causes the polymerization of free-radical polymerised compound.
By heating film-like circuit connecting material 40, under the very little state of distance made between the first circuit electrode 22 and second circuit electrode 32, film-like circuit connecting material 40 is solidified, the first circuit block 20 and second circuit parts 30 are securely connected by circuit connecting section 10.
Form circuit connecting section 10 by solidifying film-like circuit connecting material 40, obtain the syndeton 1 of the circuit block shown in Fig. 1.In addition, condition of contact can suitably be selected according to purposes, film-like circuit connecting material, the circuit block of use.
According to present embodiment, in the syndeton 1 of the circuit block obtained, can make electroconductive particle 7 and relative first and second circuit electrode 22,32 the two contact, in insulativity on maintaining same circuit block between adjacent circuit electrode, can fully reduce the contact resistance between the first and second relative circuit electrodes 22,32.Because the cured article of circuit connecting section 10 by above-mentioned film-like circuit connecting material forms, so the bonding force of 10 pairs of the first circuit blocks 20 of circuit connecting section and second circuit parts 30 is very high.
Above, the preferred embodiment of the present invention is illustrated, but the invention is not restricted to this.The present invention can carry out various deformation in the scope that does not break away from its purport.
Embodiment
Below, based on embodiment, the present invention is illustrated, but the present invention is not limited to this.
(manufacture of electroconductive particle)
It is the layer of 0.2 μ m that the thickness formed by nickel is set on the surface of polystyrene particle, and then on the surface of the layer formed by nickel at this, layer that thickness formed by gold is 0.04 μ m is set.So obtain the electroconductive particle that median size is 10 μ m.
(modulation of carbamate type acrylate)
In 50 ℃ of heating, polycaprolactone glycol 400 mass parts, 2-hydroxypropyl acrylate 131 mass parts, catalyzer dibutyl tin laurate 0.5 mass parts and stopper hydroquinone monomethyl ether 1.0 mass parts that to stir and mix weight-average molecular weight be 800.Then, drip isophorone diisocyanate 222 mass parts, and then the urethane reaction is carried out in warming while stirring to 80 ℃.The transformation efficiency of confirming isocyanate group be 99% or more after, the reduction temperature, obtain carbamate type acrylate.
(modulation of polyester urethane resin)
Obtain polyester polyol by the terephthalic acid as dicarboxylic acid with as the reaction of the propylene glycol of glycol.This polyester polyol is dissolved in methyl ethyl ketone (MEK) and obtains solution.The solution made is added there is stirrer, in the stainless steel autoclave with having heaters of thermometer, condenser and vacuum generating device and nitrogen conduit.Then, to add in above-mentioned autoclave specified amount as 4,4 of isocyanic ester '-diphenylmethanediisocyanate, the amount that relative polyester polyol 100 mass parts of take are 0.02 mass parts adds the catalyzer dibutyl tin laurate, 75 ℃ of reactions 10 hours, be cooled to 40 ℃.And then, after adding the piperazine reaction to carry out chain in 30 minutes, with triethylamine, neutralize.
If above-mentioned reacted solution is splashed in pure water, when solvent and catalyzer are water-soluble, separates out polyester urethane resin.The polyester urethane resin of separating out by the Vacuumdrier drying afterwards.The weight-average molecular weight of measuring polyester urethane resin by gpc analysis is 27000.In addition, while modulating above-mentioned polyester urethane resin, terephthalic acid/propylene glycol/4,4 '-the cooperation mol ratio of diphenylmethanediisocyanate is 1.0/1.3/0.25.
(modulation of phenoxy resin)
By phenoxy resin (Union Carbide Corporation's system, trade(brand)name " PKHC ", weight-average molecular weight: 45000) 50g is dissolved in toluene (110.6 ℃ of boiling points, SP value 8.90)/ethyl acetate (77.1 ℃ of boiling points, SP value 9.10) in the mixed solvent that mass ratio is 50/50, the solution that the formation solids component is 40 quality %.
(modulation of fluorinated polyimide resin)
Preparation has the removable flask of the 1000ml of Dean-Stark recirculation cooler, thermometer, agitator.Add wherein the polypropyleneoxide diamine 15.0mmol, 2 as diamine compound, two [4-(4-amino-benzene oxygen) phenyl] the HFC-236fa 105.0mmol of 2-, as the METHYLPYRROLIDONE 287g of non-proton property polar solvent, stir 30 minutes room temperature (25 ℃) is lower.Then, add as can with the toluene 180g of the arene organic solvent of water azeotropic, as tetracarboxylic dianhydride's 4,4 '-the two O-phthalic acid dianhydride 114.0mmol of hexafluoro propylidene, be warming up to 50 ℃, stir at this temperature after 1 hour, and then be warming up to 160 ℃ and reflux 3 hours.If confirm that the water of theoretical amount lodges in the water and basis weight receptor, can not see water and flow out, remove water and toluene in the water and basis weight receptor, be warming up to 180 ℃ of toluene of removing in reaction soln, obtain the nmp solution of polyimide resin.
The nmp solution of above-mentioned polyimide resin is dropped in methyl alcohol, and after reclaiming precipitate, pulverizing, drying obtain the fluorinated polyimide resin.The weight-average molecular weight of the fluorinated polyimide resin obtained is 112000.By above-mentioned fluorinated polyimide resin dissolves in methyl ethyl ketone until be 40 quality %.
Regulate the circuit connection material of embodiment and comparative example by the proportioning shown in following table 2 and table 3 (mass parts: solids component converts), manufacture film-like circuit connecting material.
(embodiment 1)
Will be as polyester urethane resin 60 mass parts of film formation material, as above-mentioned carbamate type acrylate 40 mass parts of free-radical polymerised compound and phosphate type acrylate (grease society of common prosperity society system, trade(brand)name " P2M ") 1 mass parts, as methacryloyl based isocyanate 0.5 mass parts of the compound containing isocyanate group, as tertiary own ester 5 mass parts of the peroxidation-2 ethyl hexanoic acid of radical polymerization initiator, mix.Then, coordinate the above-mentioned electroconductive particle that disperse phase is 3 volume % to mentioned component 100 parts by volume, be modulated into circuit connection material.Then, with apparatus for coating by this circuit connection material be coated on thickness be 80 μ m, the one side carried out, on surface-treated PET film, being filmed.Then, by this being filmed 70 ℃ of warm air dryings 10 minutes, obtaining thickness, be 20 μ m film-like circuit connecting material.
(embodiment 2)
Except replace methacryloyl based isocyanate 0.5 mass parts by hexamethylene diisocyanate 0.5 mass parts, carry out operation similarly to Example 1, obtain film-like circuit connecting material.
(embodiment 3)
Except replace methacryloyl based isocyanate 0.5 mass parts by γ-isocyanic ester propyl-triethoxysilicane 0.5 mass parts, carry out operation similarly to Example 1, obtain film-like circuit connecting material.
(embodiment 4)
Except replace methacryloyl based isocyanate 0.5 mass parts by γ-isocyanic ester propyl-triethoxysilicane 0.1 mass parts, carry out operation similarly to Example 1, obtain film-like circuit connecting material.
(embodiment 5)
Except replace methacryloyl based isocyanate 0.5 mass parts by γ-isocyanic ester propyl-triethoxysilicane 3 mass parts, carry out operation similarly to Example 1, obtain film-like circuit connecting material.
(embodiment 6)
Except replace methacryloyl based isocyanate 0.5 mass parts by γ-isocyanic ester propyl-triethoxysilicane 5 mass parts, carry out operation similarly to Example 1, obtain film-like circuit connecting material.
(embodiment 7)
Except replace polyester urethane resin 60 mass parts by phenoxy resin 60 mass parts, carry out operation similarly to Example 5, obtain film-like circuit connecting material.
(embodiment 8)
Except replace polyester urethane resin 60 mass parts by polyester urethane resin 55 mass parts and fluorinated polyimide resin 5 mass parts, carry out operation similarly to Example 1, obtain film-like circuit connecting material.
(comparative example 1)
Except not using the methacryloyl based isocyanate, carry out operation similarly to Example 1, obtain film-like circuit connecting material.
(comparative example 2)
Except replace methacryloyl based isocyanate 0.5 mass parts by γ-isocyanic ester propyl-triethoxysilicane 0.05 mass parts, carry out operation similarly to Example 1, obtain film-like circuit connecting material.
(comparative example 3)
Except replace methacryloyl based isocyanate 0.5 mass parts by γ-isocyanic ester propyl-triethoxysilicane 7.5 mass parts, carry out operation similarly to Example 1, obtain film-like circuit connecting material.
Table 2
Figure BSA00000473776300211
Table 3
Figure BSA00000473776300221
The manufacture of the syndeton of<circuit block >
Prepare three layers of flexible base, board 1 (FPC substrate 1), this substrate is that 500 of the copper circuit distributions of live width 50 μ m, spacing 100 μ m and thickness 18 μ m are formed on to polyimide film A (emerging product society of space section system across bond layer, trade(brand)name " Upilex ", thickness 75 μ m) upper obtaining.In addition, prepare two sheets of flexible substrate 2 (FPC substrates 2), this substrate is 500 of the copper circuit distributions of live width 50 μ m, spacing 100 μ m and thickness 8 μ m to be formed directly into to polyimide film B (emerging product society of space section system, trade(brand)name " Upilex ", thickness 25 μ m) above obtain.And then, prepare glass substrate, this substrate is that 500 of the chromium circuit layouts of live width 50 μ m, spacing 100 μ m and thickness 0.4 μ m are formed directly into to upper the obtaining of glass (Corning Incorporated's system, trade(brand)name " " 1737 ").
Then, the film-like circuit connecting material that configuration obtains as mentioned above between above-mentioned each FPC substrate and glass substrate.Afterwards, use hot pressing device (type of heating: permanent pattern of fever, Dongli Engineering Co., Ltd's system) to carry out the heating and pressurizing in 10 seconds along their stacked direction under 160 ℃, the condition of 3MPa.So make the syndeton of circuit block, its cured article by circuit connection material is electrically connected to FPC substrate and glass substrate with wide 2mm.Using the syndeton of the circuit block made like this as initial stage evaluating characteristics sample.
[evaluation of cementability]
As follows, by the connection outward appearance in the syndeton of the contact resistance between the circuit in the syndeton of measuring the circuit block of making as mentioned above and bonding strength and observation circuit block, estimate cementability.In addition, for initial stage evaluating characteristics sample, using the whole syndeton of good sample very excellent circuit block as cementability of contact resistance, bonding strength and connection outward appearance.
The mensuration of<contact resistance >
By volt ohm-milliammeter (Advantest company system, trade(brand)name: TR6848) measure contact resistance, and mean with the mean value (x+3 σ) of 150 of the resistance between the circuit of adjacency.The results are shown in table 4 and 5.Wherein, table 4 is the evaluation result that the FPC2/ glass substrate connects sample for the evaluation result of FPC1/ glass substrate connection sample, table 5.
The mensuration of<bonding strength >
Bonding strength is measured according to the 90 degree stripping methods of JIS-Z0237.The determinator of bonding strength is used TENSILON UTM-4 (peeling rate 50mm/min, 25 ℃, Japan BALDWIN company system).The results are shown in table 4 and 5.
The observation of<connection outward appearance >
The syndeton of circuit block is put into to the constant temperature and humid test device 250 hours that 85 ℃, relative humidity are 85%RH, carry out humidity test.Afterwards, from the glass substrate side with microscopic examination bonding at once with humidity test after outward appearance.While peeling off between the interface, gap between circuit connecting section and circuit, the insulativity between circuit lowers greatly, thereby is judged to be NG.The results are shown in table 4 and 5.
[evaluation of serviceable time]
The film-like circuit connecting material that will obtain by embodiment and comparative example is put into respectively the vacuum packaging material, 40 ℃ of placements, after 5 days, with the above-mentioned syndeton of similarly manufacturing circuit block, as the serviceable time, estimates and uses sample.Afterwards, for the serviceable time, estimate and to use sample, also with estimating cementability above-mentioned.The results are shown in table 4 and 5.In the evaluation of cementability, estimate that to compare variation with each characteristic of sample and initial stage evaluating characteristics by each characteristic of sample less the serviceable time, the initial stage that maintains during characteristic, is judged to be the serviceable time long.
Table 4
Figure BSA00000473776300241
Table 5
Figure BSA00000473776300242
From table 4 and 5, no matter the contact resistance at initial stage is embodiment or comparative example, be 1 Ω left and right.In addition, no matter the bonding strength at initial stage is embodiment or comparative example, more than being 7N/cm.Particularly, in embodiment 5 and 6, along with the use level increase of the compound containing isocyanate group, bonding strength uprises.In addition, in embodiment 8, by using fluorinated polyimide, the bonding strength that the FPC2/ glass substrate connects sample raises.
While using the film-like circuit connecting material obtained in embodiment 1～3,5～8 and comparative example 3, all do not observe and peel off.In addition, the circuit connection material that embodiment 4 obtains is because the amount of the compound containing isocyanate group is few, and the FPC1/ glass substrate after humidity test connects in sample to be observed on a small quantity and peel off, but belongs to no problem in the use rank.On the other hand, in not containing comparative example 1 containing the compound of isocyanate group, use level comparative example 2 still less containing the compound of isocyanate group, after humidity test, peel off.
As mentioned above, the initial stage characteristic of the bonding strength of embodiment 1～8 and comparative example 3, contact resistance and connection outward appearance is all good, confirms to demonstrate very high cementability.
In addition, while using the film-like circuit connecting material after 40 ℃ are placed 5 days, in embodiment 1～8 and comparative example 1,2, all keeping the cementability identical with the initial stage characteristic, confirming that the serviceable time is long.On the other hand, in the comparative example 3 that the use level that contains the compound of isocyanate group is 7.5 mass parts, more than the contact resistance of 40 ℃ of placements after 5 days rises to the twice of initial stage contact resistance, the known serviceable time is short.
As known from the above, the film-like circuit connecting material of embodiment 1～8 is compared with the film-like circuit connecting material of comparative example 1～3, demonstrates very high cementability, and has the very long serviceable time.Thus, according to film-like circuit connecting material of the present invention, no matter confirmed the material to which kind of circuit block, all demonstrate very high cementability, and have the very long serviceable time.
Known in addition, film-like circuit connecting material of the present invention not only has the very long serviceable time, and there is good especially cementability for following such circuit block, described circuit block is that the circuit substrate of support circuit electrode is selected from polyethylene terephthalate by comprising, polyethersulfone, epoxy resin, acrylic resin, the circuit block that the material of at least one material in polyimide resin and glass forms, and the surface coated of circuit substrate or be attached with and be selected from silicon nitride, silicone resin, the circuit block of at least one material in polyimide resin and acrylic resin.
The possibility of utilizing on industry
According to the present invention, no matter the syndeton that can provide a kind of material to which kind of circuit block all to demonstrate very long film-like circuit connecting material of very high cementability and serviceable time and use the circuit block of these film-like circuit connecting materials.

Claims (49)

1. the application as circuit connection material of adhesive film, described circuit connection material is electrically connected under the described first state relative with described second circuit electrode on the interarea of the first circuit substrate, being formed with the first circuit block of the first circuit electrode and the second circuit parts that are formed with the second circuit electrode on interarea at the second circuit substrate
This adhesive film contains film formation material, free-radical polymerised compound, through adding radical polymerization initiator and the monoisocyanates compound of the free free radical of thermogenesis,
With respect to total 100 mass parts of described film formation material and described free-radical polymerised compound, described monoisocyanates compound containing proportional be 0.09～5 mass parts.
2. application according to claim 1, wherein, described adhesive film further contains fluorinated organic compound.
3. application according to claim 1, wherein, it is the organic compound that has amino-formate bond in main chain more than 10000 that described film formation material comprises weight-average molecular weight.
4. application according to claim 3, wherein, the described organic compound that has amino-formate bond in main chain has ester bond.
5. application according to claim 3, wherein, the described organic compound that has amino-formate bond in main chain obtains by the reaction of polyester polyol and vulcabond.
6. application according to claim 5, wherein, described polyester polyol obtains by the reaction of dicarboxylic acid and glycol.
7. application according to claim 5, wherein, described vulcabond is aromatic diisocyanate, alicyclic diisocyanate or aliphatic diisocyanate.
8. application according to claim 3, wherein, the described weight-average molecular weight that has the organic compound of amino-formate bond in main chain is more than 10000 below 200000.
9. application according to claim 1, wherein, described free-radical polymerised compound is (methyl) acrylic compound.
10. application according to claim 1, wherein, described free-radical polymerised compound contains phosphate type (methyl) acrylate.
11. application according to claim 1, wherein, described radical polymerization initiator contains organo-peroxide and/or azo-compound.
12. according to the described application of any one in claim 1～11, wherein, with respect to total 100 mass parts of described film formation material and described free-radical polymerised compound, described monoisocyanates compound containing proportional be 0.1～5 mass parts.
13. according to the described application of any one in claim 1～11, wherein, with respect to total 100 mass parts of described film formation material and described free-radical polymerised compound, described monoisocyanates compound containing proportional be 0.5～3 mass parts.
14., according to the described application of any one in claim 1～11, wherein, described adhesive film further contains electroconductive particle.
15. application according to claim 14, wherein, electroconductive particle is to using insulativity particle that dielectric glass, pottery or plastics are principal constituent as core, and the layer that is principal constituent in order to metal or carbon on the surface of described core carries out the particle that coating forms.
16., according to the described application of any one in claim 1～11, wherein, described adhesive film is anisotropic conductive adhesive.
17. the application for the manufacture of circuit connection material of adhesive film, described circuit connection material is electrically connected under the described first state relative with described second circuit electrode on the interarea of the first circuit substrate, being formed with the first circuit block of the first circuit electrode and the second circuit parts that are formed with the second circuit electrode on interarea at the second circuit substrate
This adhesive film contains film formation material, free-radical polymerised compound, through adding radical polymerization initiator and the monoisocyanates compound of the free free radical of thermogenesis,
With respect to total 100 mass parts of described film formation material and described free-radical polymerised compound, described monoisocyanates compound containing proportional be 0.09～5 mass parts.
18. application according to claim 17, wherein, described adhesive film further contains fluorinated organic compound.
19. application according to claim 17, wherein, it is the organic compound that has amino-formate bond in main chain more than 10000 that described film formation material comprises weight-average molecular weight.
20. application according to claim 19, wherein, the described organic compound that has amino-formate bond in main chain has ester bond.
21. application according to claim 19, wherein, the described organic compound that has amino-formate bond in main chain obtains by the reaction of polyester polyol and vulcabond.
22. application according to claim 21, wherein, described polyester polyol obtains by the reaction of dicarboxylic acid and glycol.
23. application according to claim 21, wherein, described vulcabond is aromatic diisocyanate, alicyclic diisocyanate or aliphatic diisocyanate.
24. application according to claim 19, wherein, the described weight-average molecular weight that has the organic compound of amino-formate bond in main chain is more than 10000 below 200000.
25. application according to claim 17, wherein, described free-radical polymerised compound is (methyl) acrylic compound.
26. application according to claim 17, wherein, described free-radical polymerised compound contains phosphate type (methyl) acrylate.
27. application according to claim 17, wherein, described radical polymerization initiator contains organo-peroxide and/or azo-compound.
28. according to the described application of any one in claim 17～27, wherein, with respect to total 100 mass parts of described film formation material and described free-radical polymerised compound, described monoisocyanates compound containing proportional be 0.1～5 mass parts.
29. according to the described application of any one in claim 17～27, wherein, with respect to total 100 mass parts of described film formation material and described free-radical polymerised compound, described monoisocyanates compound containing proportional be 0.5～3 mass parts.
30., according to the described application of any one in claim 17～27, wherein, described adhesive film further contains electroconductive particle.
31. application according to claim 30, wherein, electroconductive particle is to using insulativity particle that dielectric glass, pottery or plastics are principal constituent as core, and the layer that is principal constituent in order to metal or carbon on the surface of described core carries out the particle that coating forms.
32., according to the described application of any one in claim 17～27, wherein, described adhesive film is anisotropic conductive adhesive.
33. the application for the manufacture of circuit connection material of adhesive film, described circuit connection material is electrically connected under the described first state relative with described second circuit electrode on the interarea of the first circuit substrate, being formed with the first circuit block of the first circuit electrode and the second circuit parts that are formed with the second circuit electrode on interarea at the second circuit substrate
This adhesive film contains film formation material, free-radical polymerised compound, the radical polymerization initiator through adding the free free radical of thermogenesis and has the compound containing isocyanate group of alkoxysilane group,
With respect to total 100 mass parts of described film formation material and described free-radical polymerised compound, described have alkoxysilane group containing the compound of isocyanate group containing proportional be 0.09～5 mass parts.
34. application according to claim 33, wherein, described adhesive film further contains fluorinated organic compound.
35. application according to claim 33, wherein, it is the organic compound that has amino-formate bond in main chain more than 10000 that described film formation material comprises weight-average molecular weight.
36. application according to claim 35, wherein, the described organic compound that has amino-formate bond in main chain has ester bond.
37. application according to claim 35, wherein, the described organic compound that has amino-formate bond in main chain obtains by the reaction of polyester polyol and vulcabond.
38., according to the described application of claim 37, wherein, described polyester polyol obtains by the reaction of dicarboxylic acid and glycol.
39., according to the described application of claim 37, wherein, described vulcabond is aromatic diisocyanate, alicyclic diisocyanate or aliphatic diisocyanate.
40. application according to claim 35, wherein, the described weight-average molecular weight that has the organic compound of amino-formate bond in main chain is more than 10000 below 200000.
41. application according to claim 33, wherein, described free-radical polymerised compound is (methyl) acrylic compound.
42. application according to claim 33, wherein, described free-radical polymerised compound contains phosphate type (methyl) acrylate.
43. application according to claim 33, wherein, described radical polymerization initiator contains organo-peroxide and/or azo-compound.
44. application according to claim 33, wherein, described alkoxysilane group is Trimethoxy silane base or triethoxysilicane alkyl.
45. according to the described application of any one in claim 33～44, wherein, with respect to total 100 mass parts of described film formation material and described free-radical polymerised compound, the described compound containing isocyanate group containing proportional be 0.1～5 mass parts.
46. according to the described application of any one in claim 33～44, wherein, with respect to total 100 mass parts of described film formation material and described free-radical polymerised compound, the described compound containing isocyanate group containing proportional be 0.5～3 mass parts.
47., according to the described application of any one in claim 33～44, wherein, described adhesive film further contains electroconductive particle.
48. according to the described application of claim 47, wherein, electroconductive particle is to using insulativity particle that dielectric glass, pottery or plastics are principal constituent as core, and the layer that is principal constituent in order to metal or carbon on the surface of described core carries out the particle that coating forms.
49., according to the described application of any one in claim 33～44, wherein, described adhesive film is anisotropic conductive adhesive.
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