CN104342080A - Adhesive composition, circuit connecting material, circuit connection structure, and adhesive sheet - Google Patents
Adhesive composition, circuit connecting material, circuit connection structure, and adhesive sheet Download PDFInfo
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- CN104342080A CN104342080A CN201410363049.3A CN201410363049A CN104342080A CN 104342080 A CN104342080 A CN 104342080A CN 201410363049 A CN201410363049 A CN 201410363049A CN 104342080 A CN104342080 A CN 104342080A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
Abstract
The invention provides an adhesive composition, a circuit connecting material, a circuit connection structure, and an adhesive sheet. The adhesive composition comprises free radical polymerized substances and an initiator for free radical polymerization, the free radical polymerized substances comprise a first free radical polymerized substance as shown in formula (1) and a second free radical polymerized substance containing more than two (methyl) acryl groups except the first free radical polymerized substance, and the initiator for free radical polymerization comprises dilauroyl peroxide. X1-O-(CH2)n-O-X2 (1), X1 and X2 can be identical or different, and represent acryloyl groups, methacryloyl groups or hydrogen atoms, at least one of the X1 and X2 is a acryloyl group or a methacryloyl group, and n represents an integer in a range from 8 to 15.
Description
Technical field
The present invention relates to a kind of adhesive composite, circuit connection material, circuit connection structure and caking agent sheet material.
Background technology
As semiconductor element, circuit connection material used for liquid crystal display element, knownly employ high adhesion and show the compositions of thermosetting resin (for example, referring to patent documentation 1) of the epoxy resin of high reliability.As the constituent of compositions of thermosetting resin, generally use epoxy resin, there is the solidifying agent such as reactive resol with epoxy resin and promote the potentiality solidifying agent that epoxy resin and solidifying agent react.In addition, in order to ensure storage stability at room temperature, sometimes potentiality solidifying agent is used.Potentiality solidifying agent becomes the important factor determining solidification value and curing speed, from the view point of curing speed when storage stability at room temperature and heating, uses various compound.
Recently, and receive concern with the free-radical polymerised material such as acrylate derivative, methacrylate derivative with as the radical-curable caking agent of the superoxide of radical polymerization initiator.For radical-curable caking agent, because the free radical as reactive behavior kind is rich reactive, therefore, it is possible to be cured in the short period of time (for example, referring to patent documentation 2,3) at low temperature.
In addition, along with the multifunction of display unit, be that the input unit of representative is widely used with touch-screen.In the manufacture of this touch-screen, the sensor of touch-screen and the connection of peripheral circuit component also use circuit connection material.
According to display unit, the formation of the touch-screen of lift-launch is different, and diversified.When multifunctional portable phone (smart mobile phone), dull and stereotyped PC, from low price, light-weighted viewpoint, studying or be suitable for the basement membrane of the films such as polyethylene terephthalate (PET), polycarbonate (PC), PEN (PEN) as touch panel sensor.On the other hand, when liquid-crystal display, due to the Circuit Formation Technology of turning out in the manufacture of liquid-crystal display can be diverted, many liquid crystal display manufacturers are therefore had to produce the example being provided with the touch-screen of touch panel sensor on glass.In the liquid-crystal display possessing this touch-screen, in order to slimming, the glass of the glass and liquid-crystal display that arrange touch panel sensor is common, and the Polarizer film that therefore thermotolerance is low is positioned near the connection section of circuit member.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 1-113480 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2002-203427 publication
Patent documentation 3: International Publication WO98/044067 publication
Summary of the invention
The problem that invention will solve
As mentioned above, when the substrate of touch panel sensor is resin molding and when there is the low component of thermotolerance, in order to the connection of the sensor and circuit member that carry out touch-screen, even radical-curable caking agent also requires further low temperature.
In order to improve the low temperature active of radical-curable caking agent, the use level increasing radical polymerization initiator can be considered.But the research according to the present inventor etc. judges, ensure that the circuit connection structure of bonding strength by this method, under hot and humid environment, the interelectrode contact resistance value of subtend can rise sometimes.
Even if when the object of the invention to be to provide under a kind of low temperature near 120 DEG C junction circuit component each other, also can obtain that there is sufficient bonding strength, even and if also maintain the circuit connection material of the circuit connection structure of the connection reliability excellence of the contact resistance between fully low counter electrode, adhesive composite and caking agent sheet material under hot and humid environment.In addition, the object of the invention is also to provide one to have sufficient bonding strength, even and if also maintain the circuit connection structure of the connection reliability excellence of the contact resistance between fully low counter electrode under hot and humid environment.
The method of dealing with problems
The invention provides a kind of adhesive composite; it contains free-radical polymerised material and radical polymerization initiator; as free-radical polymerised material; the second free-radical polymerised material with more than 2 (methyl) acryls beyond the first free-radical polymerised material represented containing following general formula (1) and the first free-radical polymerised material; as radical polymerization initiator, containing dilauroyl peroxide.
In formula (1), X
1and X
2can be the same or different, represent acryl [CH
2=CH-C (=O)-], methacryloyl [CH
2=C (CH
3)-C (=O)-] or hydrogen atom [H-], and at least one party is acryl or methacryloyl, n represents the integer of 8 ~ 15.
According to the adhesive composite of the invention described above, even if be between low-temperature short-time, also sufficient bonding strength can be shown.In addition, when adhesive composite of the present invention is used for circuit connection material, even if under the low temperature near 120 DEG C junction circuit component each other time, also can obtain that there is sufficient bonding strength, even and if also maintain the circuit connection structure of the connection reliability excellence of the contact resistance between fully low counter electrode under hot and humid environment.
About the reason producing above-mentioned effect when adhesive composite of the present invention is used for circuit connection material, be still not clear, but the present inventor etc. are presumed as follows.First, the present inventor etc. confirm: use the circuit connection material containing more dilauroyl peroxide to carry out the circuit connection structure connected, can be deteriorated by the connection reliability under connection section produces more bubble, particularly narrow-pitch after reliability test under hot and humid.Therefore, as the major cause that the interelectrode contact resistance value connected under hot and humid environment rises, can think that the dilauroyl peroxide contained in a large number in circuit connection material exists at material surface crystallization or local.The present inventor etc. think, when using adhesive composite of the present invention in circuit connection material, used by free-radical polymerised material (the first free-radical polymerised material) that dilauroyl peroxide and above-mentioned general formula (1) are represented, even if the bonding strength when connecting in order to ensure low temperature and when having coordinated dilauroyl peroxide, also the crystallization of dilauroyl peroxide or local effectively can be suppressed to exist, therefore, it is possible to take into account the stability of bonding strength and contact resistance by the first free-radical polymerised material with ad hoc structure.
The content of dilauroyl peroxide in adhesive composite of the present invention, relative to total amount 100 mass parts of the free-radical polymerised material contained in adhesive composite, is preferably 10 ~ 40 mass parts.By making the content of dilauroyl peroxide in this numerical range, even if be between low-temperature short-time, also can show sufficient bonding strength, fully can suppress the crystallization of dilauroyl peroxide simultaneously.
In addition, the content of the first free-radical polymerised material, relative to content 100 mass parts of dilauroyl peroxide, is preferably 30 ~ 100 mass parts.By making the content of the first free-radical polymerised material in this numerical range, even if be between low-temperature short-time, also can show sufficient bonding strength, fully can suppress the crystallization of dilauroyl peroxide simultaneously.
Adhesive composite of the present invention is preferably further containing thermoplastic resin.At this moment, the operability of adhesive composite improves, and the stress that simultaneously can realize when solidifying relaxes excellent adhesive composite.
In addition, the invention provides a kind of circuit connection material formed by the adhesive composite of the invention described above, it is for being connected to each other the circuit member with relative circuit electrode.
According to the circuit connection material of the invention described above, even if under the low temperature near 120 DEG C junction circuit component each other time, also can obtain that there is sufficient bonding strength, even and if also maintain the circuit connection structure of the connection reliability excellence of the contact resistance between fully low counter electrode under hot and humid environment.
The content of dilauroyl peroxide in circuit connection material of the present invention, relative to total amount 100 mass parts of the free-radical polymerised material contained in circuit connection material, is preferably 10 ~ 40 mass parts.By making the content of dilauroyl peroxide in this numerical range, with sufficient bonding strength junction circuit component each other, can fully can suppress the rising of contact resistance value under hot and humid environment simultaneously.
In addition, the content of the first free-radical polymerised material, relative to content 100 mass parts of dilauroyl peroxide, is preferably 30 ~ 100 mass parts.By making the content of the first free-radical polymerised material in this numerical range, with sufficient bonding strength junction circuit component each other, can fully can suppress the rising of contact resistance value under hot and humid environment simultaneously.
Circuit connection material of the present invention is preferably further containing thermoplastic resin.At this moment, the operability of circuit connection material improves, and the stress that simultaneously can realize when solidifying relaxes excellent circuit connection material.
In addition, the invention provides a kind of circuit connection structure, it possesses: have first substrate and the first circuit member being formed in the first circuit electrode on this substrate interarea; Second circuit component, this second circuit component has second substrate and is formed in the second circuit electrode on this substrate interarea, and second circuit electrode and the first circuit electrode subtend configure, and second circuit electrode is electrically connected with the first circuit electrode; And the connection section between the first circuit member and second circuit component, connection section is the cured article of the circuit connection material of the invention described above.
Circuit connection structure of the present invention, be the cured article of the circuit connection material of the invention described above by making connection section, sufficient bonding strength can be had, even and if there is the connection reliability of the excellence also maintaining the contact resistance between fully low counter electrode under hot and humid environment.In addition, therefore circuit connection structure of the present invention, owing to can form connection section at low temperatures, even if having the impact that the low component of thermotolerance also can reduce the generation due to heat.
In addition, the invention provides a kind of caking agent sheet material, it possesses support membrane and is arranged on the film-like adhesive formed by adhesive composite of the present invention on this support membrane.
According to caking agent sheet material of the present invention, by having the film-like adhesive formed by adhesive composite of the present invention, even if also sufficient bonding strength can be shown between low-temperature short-time.
Invention effect
According to the present invention, even if under a kind of low temperature near 120 DEG C can be provided junction circuit component each other time, also can obtain that there is sufficient bonding strength, even and if also maintain the circuit connection material of the circuit connection structure of the connection reliability excellence of the contact resistance between fully low counter electrode, adhesive composite and caking agent sheet material under hot and humid environment.In addition, according to the present invention, one can be provided to have sufficient bonding strength, even and if also maintain the circuit connection structure of the connection reliability excellence of the contact resistance between fully low counter electrode under hot and humid environment.
Accompanying drawing explanation
Fig. 1 is the schematic section of the embodiment representing caking agent sheet material.
Fig. 2 is the schematic section of an embodiment of indication circuit connection structural bodies.
Fig. 3 is the schematic section of an embodiment of manufacture method for illustration of circuit connection structure.
Embodiment
Below, as required with reference to accompanying drawing, while be described in detail to the preferred embodiment of the present invention.But the present invention is not limited to following embodiment.It should be noted that, the dimensional ratios of accompanying drawing is not limited to illustrated ratio.In addition; " (methyl) acrylate " in this specification sheets refers to " acrylate " and " methacrylic ester " corresponding with it, and " (methyl) acryl " refers to " acryl " and corresponding with it " methacryloyl ".
The adhesive composite of present embodiment contains free-radical polymerised material and radical polymerization initiator; as free-radical polymerised material; the second free-radical polymerised material with more than 2 (methyl) acryls beyond the first free-radical polymerised material represented containing following general formula (1) and the first free-radical polymerised material; as radical polymerization initiator, containing dilauroyl peroxide.
In formula (1), X
1and X
2can be the same or different, represent acryl [CH
2=CH-C (=O)-], methacryloyl [CH
2=C (CH
3)-C (=O)-] or hydrogen atom [H-], and at least one party is acryl or methacryloyl, n represents the integer of 8 ~ 15.
Below, the situation of the adhesive composite being suitable for present embodiment as the circuit connection material for being connected to each other by the circuit member with relative circuit electrode is described.
First free-radical polymerised material be have represented by above-mentioned general formula (1) length-specific hydrocarbon skeleton (methene chain) and there is the compound of more than 1 (methyl) acryl.Specifically, can 1 be enumerated, 10-decanediol diacrylate, 1, 10-decanediol dimethacrylate, 1, 9-nonanediol diacrylate, 1, 9-decanediol dimethacrylate, 1, 8-ethohexadiol diacrylate, 1, 8-ethohexadiol dimethacrylate, 1, 11-undecane diacrylate, 1, 11-undecane dimethacrylate, 1, 12-dodecanediol diacrylate, 1, 12-decanediol dimethacrylate, 1, 13-tridecane diols diacrylate, 1, 13-tridecane diols dimethacrylate, 1, 14-tetradecane diols diacrylate, 1, 14-tetradecane diols dimethacrylate, 1, 15-pentadecane diols diacrylate, 1, 15-pentadecane diols dimethacrylate etc.
The compound that above-mentioned general formula (1) represents can be used alone one, or can be used in combination of two or more.
As the second free-radical polymerised material, such as, carbamate (methyl) acrylate can be enumerated, ethylene glycol bisthioglycolate (methyl) acrylate, Diethylene Glycol two (methyl) acrylate, trimethylolpropane tris (methyl) acrylate, tetramethylol methane four (methyl) acrylate, 2-hydroxyl-1, 3-bis-(methyl) acryloxy propane, 2, 2-bis-[4-((methyl) acryloyl-oxy ylmethoxy) phenyl] propane, 2, 2-bis-[4-((methyl) acryloyl-oxy Quito oxyethyl group) phenyl] propane, dicyclopentenyl (methyl) acrylate, three ring decyl (methyl) acrylate, three ((methyl) acryloyl-oxyethyl) isocyanuric acid ester etc.They can be used alone one, or can be used in combination of two or more.
In addition, from the viewpoint of improving the thermotolerance of circuit connection material, the second free-radical polymerised material preferably have in dicyclopentenyl, three ring decyls and triazine ring more than one.
Second free-radical polymerised material is not limited to monomer, also can use oligopolymer.As this free-radical polymerised material, such as, carbamate (methyl) origoester acrylate etc. can be enumerated.
From the viewpoint of the intermiscibility with resin, the molecular weight of above-mentioned oligopolymer is preferably 2000 ~ 20000.
Above-mentioned second free-radical polymerised material can be used alone one, or can be used in combination of two or more.
The circuit connection material of present embodiment can further containing the triradicals polymeric agents with phosphate ester structure.At this moment, the bonding strength to mineral surfaces such as metals can be improved.
As triradicals polymeric agents, from the viewpoint of cementability, the compound that preferred following general formula (2) represents.As the compound that following general formula (2) represents, such as, list (2-(methyl) acryloyl-oxyethyl) phosphate ester acid, two (2-(methyl) acryloyl-oxyethyl) phosphate ester acid etc. can be enumerated.These compounds such as can obtain as the reactant of phosphoric anhydride and (methyl) vinylformic acid 2-hydroxy methacrylate.
In formula (2), R represents methyl or hydrogen atom, and n represents the integer of 1 ~ 2.
Triradicals polymeric agents can be used alone one, or can be used in combination of two or more.
In the circuit connection material of present embodiment, also can containing the free-radical polymerised material beyond above-mentioned first, second, and third free-radical polymerised material.As this free-radical polymerised material, be not particularly limited, simple function (methyl) acrylate etc. can be used.As simple function (methyl) acrylate, such as, simple function (methyl) acrylate with ring structure, (methyl) acrylate with carbamate groups can be enumerated.
As simple function (methyl) acrylate with ring structure, acryloyl morpholine can be used, methacryloyl morpholine, isobornyl acrylate, isobornyl methacrylate, tetrahydrochysene-2H-pyrans-2-base-acrylate, tetrahydrochysene-2H-pyrans-2-base-methacrylic ester, 1-(cyclohexyloxy) ethyl propylene acid esters, 1-(cyclohexyloxy) ethylmethyl acrylate, 1-(cyclohexyloxy) propyl acrylate, 1-(cyclohexyloxy) propyl methacrylate, 1-(cyclohexyloxy) ethylmethyl acrylate, 1-(cyclohexyloxy) butyl propyleneglycol acid esters, 1-(cyclohexyloxy) butyl methyl acrylate, 1-(cyclohexyloxy) acrylate, 1-(cyclohexyloxy) phenyl-methyl acrylate, cyclohexyl acrylate, cyclohexyl methacrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, vinylformic acid phenoxy group methyl esters, methacrylic acid phenoxy group methyl esters, acrylate, phenoxyethyl methacrylate, vinylformic acid phenoxy-propyl, methacrylic acid phenoxy-propyl, vinylformic acid phenoxy group butyl ester, gamma-butyrolactone acrylate, δ-valerolactone acrylate etc.
As (methyl) acrylate with carbamate groups, such as, the reactant as the polyvalent alcohols such as polytetramethylene glycol and polymeric polyisocyanate and the acrylic compound containing hydroxyl can be enumerated and the material that obtains.This compound due to excellent in adhesion, therefore preferably.
Balance from the viewpoint of contact resistance and cementability, the total content of free-radical polymerised material in the circuit connection material of present embodiment, when being 100 mass parts with circuit connection material total amount, be preferably 25 ~ 55 mass parts, be more preferably 30 ~ 50 mass parts, more preferably 35 ~ 45 mass parts.In addition, the total content of free-radical polymerised material in the circuit connection material of present embodiment, when being 100 mass parts with circuit connection material total amount, also can be 20 ~ 70 mass parts or 30 ~ 65 mass parts.
The circuit connection material of present embodiment contains dilauroyl peroxide as radical polymerization initiator, and according to the condition etc. of junction circuit, also can suitably and with the radical polymerization initiator beyond dilauroyl peroxide.
As the radical polymerization initiator beyond dilauroyl peroxide, the radical polymerization initiator usually used in radical polymerization can being used, such as, the peroxide compound, Azo etc. that produce free free radical by heating can being used.Specifically, can select from diacyl peroxide class, peroxy dicarbonates, peroxyesters, ketal peroxide class, dialkyl peroxide class, hydroperoxide type etc.
Above-mentioned radical polymerization initiator, by a kind of with dilauroyl peroxide and use, also can combine two or more with dilauroyl peroxide and use.
Improve from the viewpoint of keeping quality, in the circuit connection material of present embodiment, preferably contain the coated radical polymerization initiators such as the polymer substance of useful polyurethane series or Polyester and carry out the material of micro encapsulation gained.
In addition, in the circuit connection material of present embodiment, can also by radical polymerization initiator and decomposition accelerating agent or decomposing inhibitor used in combination.
The content of dilauroyl peroxide in the circuit connection material of present embodiment, relative to total amount 100 mass parts of the free-radical polymerised material contained in circuit connection material, be preferably 10 ~ 40 mass parts, be more preferably 15 ~ 35 mass parts, more preferably 20 ~ 30 mass parts.By making the content of dilauroyl peroxide in above-mentioned numerical range, with sufficient bonding strength junction circuit component each other, can fully can suppress the rising of contact resistance value under hot and humid environment simultaneously.
The content of the first free-radical polymerised material in the circuit connection material of present embodiment, relative to content 100 mass parts of dilauroyl peroxide, is preferably 30 ~ 100 mass parts, is more preferably 50 ~ 80 mass parts.By making the content of the first free-radical polymerised material in above-mentioned numerical range, with sufficient bonding strength junction circuit component each other, can fully can suppress the rising of contact resistance value under hot and humid environment simultaneously.
From the viewpoint of cementability, the content of the second free-radical polymerised material in the circuit connection material of present embodiment, relative to total 100 mass parts of free-radical polymerised material, is preferably 70 ~ 90 mass parts, be more preferably 72 ~ 88 mass parts, more preferably 75 ~ 90 mass parts.
Balance from the viewpoint of cementability and corrodibility, the content of triradicals polymeric agents in the circuit connection material of present embodiment, relative to total 100 mass parts of free-radical polymerised material, be preferably 3 ~ 10 mass parts, be more preferably 4 ~ 8 mass parts, more preferably 5 ~ 6 mass parts.
The circuit connection material of present embodiment, the stress when raising and the solidification of operability relax excellent in, preferably further containing thermoplastic resin.
As thermoplastic resin, phenoxy resin, urethane resin, polyester polyurethane resin, acrylic resin, polyvinyl butyral resin, vinyl-formal resin, polyimide resin, polyamide resin, vibrin, resol, polystyrene resin, polyvinyl resin, polyvinyl chloride (PVC) RESINS, polyphenylene oxide resin, xylene resin, polyisocyanate resin etc. can be used.
Phenoxy resin can by making two sense phenols and epihalohydrins reacts until high molecular, or make difunctional epoxy resin and two sense phenols carry out polyaddition reaction and obtain.
In addition, as thermoplastic resin, the multipolymers such as vinyl-vinyl acetate copolymer can be used.
Thermoplastic resin can be used alone one, or can be used in combination of two or more.
In above-mentioned thermoplastic resin, from the viewpoint of the intermiscibility with other resin, preferred phenoxy resin, urethane resin, polyester polyurethane resin, acrylic resin.Thermoplastic resin can carry out modification with free-radical polymerised functional group (such as, (methyl) acryl).
The weight-average molecular weight of thermoplastic resin is preferably greater than or equal to 10000, is more preferably 10000 ~ 1000000, and more preferably 10000 ~ 150000.When the weight-average molecular weight of thermoplastic resin is for being more than or equal to 10000, there is the tendency that masking when being shaped to membranaceous improves, on the other hand, when for being less than or equal to 1000000, solvability in a solvent, to improve with the intermiscibility of other composition, there is the tendency of easily modulating for being shaped to membranaceous coating fluid.
It should be noted that, the weight-average molecular weight specified in this specification sheets refers to and uses the value of the calibrating curve determining of polystyrene standard according to following condition by gel permeation chromatography (GPC).
[GPC condition determination]
Use equipment: Hitachi L-6000 type [(strain) Hitachi]
Post: Gelpack GL-R420+Gelpack GL-R430+Gelpack GL-R440 (amounting to 3) [Hitachi Chemical Co., Ltd.'s system]
Elutriant: tetrahydrofuran (THF)
Measure temperature: 40 DEG C
Flow: 1.75mL/min
Detector: L-3300RI [(strain) Hitachi]
In addition, the second-order transition temperature (Tg) of thermoplastic resin is preferably greater than or equal to 40 DEG C, is more preferably 50 ~ 90 DEG C, more preferably 60 ~ 80 DEG C.
It should be noted that, in this manual, the peak temperature of the tan δ obtained when the second-order transition temperature of thermoplastic resin refers to and uses dynamic viscoelastic device to measure the resin of masking film-like under the condition of heat-up rate 10 DEG C/min, frequency 10Hz.
In the present embodiment, from the viewpoint of cementability and the intermiscibility with other resin, preferably use polyester polyurethane resin as thermoplastic resin.
Polyester polyurethane resin, such as, can be obtained by the reaction of polyester polyol and vulcabond.Polyester polyurethane resin preferably has carbamate groups and ester group in its main chain.
Polyester polyol is the polymkeric substance with multiple ester group and multiple hydroxyl.Polyester polyol, such as, can be obtained by the reaction of dicarboxylic acid and dibasic alcohol.As dicarboxylic acid, aromatic series, the aliphatic dicarboxylic acids etc. such as preferred terephthalic acid, m-phthalic acid, hexanodioic acid, sebacic acid.As dibasic alcohol, the glycolss such as preferred ethylene glycol, propylene glycol, BDO, hexylene glycol, neopentyl glycol, Diethylene Glycol, triethylene glycol.
As vulcabond, can be suitable for using 2,4-tolylene diisocyanate (TDI), 4, aromatic series, the alicyclic or aliphatic diisocyanates such as 4 '-diphenylmethanediisocyanate (MDI), 1,6-hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI).
Polyester polyurethane resin preferably has anionic property.Thus, bonding strength improves further.There is the polyester polyurethane resin of anionic property, can by when polyester polyol and vulcabond react, side chain is had sulfonic group, the glycol of carboxyl, Diamines copolymerization and obtaining.That is, polyester polyurethane resin preferably has sulfonic group or carboxyl.
Polyester polyurethane resin preferably has the aromatic group comprising phenyl ring etc., the cyclic aliphatic group etc. comprising cyclohexane ring etc.
Polyester polyurethane resin can be use mixing two or more.Such as, can by by the resin be obtained by reacting of aromatic polyester polyol and aliphatic diisocyanate and the resin combination be obtained by reacting by aliphatic polyester polyols and aromatic diisocyanate.
The weight-average molecular weight of polyester polyurethane resin is preferably 5000 ~ 100000.When weight-average molecular weight is for being more than or equal to 5000, there is the tendency that masking when being shaped to membranaceous improves, when weight-average molecular weight is for being less than or equal to 100000, solvability in a solvent, intermiscibility improve, and have the easily tendency of modulation for being shaped to membranaceous coating fluid.
Balance from the viewpoint of contact resistance and cementability, the content of thermoplastic resin in the circuit connection material of present embodiment, when being 100 mass parts with circuit connection material total amount, is preferably 10 ~ 50 mass parts, be preferably 20 ~ 40 mass parts, be more preferably 25 ~ 35 mass parts.In addition, the content of thermoplastic resin in the circuit connection material of present embodiment, when being 100 mass parts with circuit connection material total amount, also can be 30 ~ 80 mass parts or 35 ~ 70 mass parts.
The circuit connection material of present embodiment, can further containing the compound with aminooxy structure.At this moment, the storage stability of circuit connection material can be improved further.
In order to improve storage stability, the circuit connection material of present embodiment also can contain the stopper such as quinhydrones, methylether hydroquinone class.
The circuit connection material of present embodiment can contain electroconductive particle.As electroconductive particle, metallics, the carbon etc. such as Au, Ag, Ni, Cu, solder can be enumerated.In addition, can also be the particle formed with transition metal-type surfaces such as the coated Ni of precious metal such as Au.In order to obtain sufficient working life, preferred top layer is not the transition metal-types such as Ni, Cu but the precious metal of Au, Ag, platinum family, is more preferably Au.In addition, conductting layer is being formed on the surface in non-conductive particles by methods such as the surfaces by non-conductive particles such as the coated glass of said conductive material, pottery, plastics, and when forming outermost particle or hot molten metal particle by precious metal further, owing to having the deformability to heating and pressurizing, therefore when connecting and the contact area of electrode increase, reliability improves, thus preferably.
The circuit connection material of present embodiment, even if not containing electroconductive particle, also can be connected by the direct contact of relative circuit electrode when connecting, and if further containing electroconductive particle, then can obtain more stable connection.
The content of electroconductive particle in the circuit connection material of present embodiment, suitably can set according to the purposes of circuit connection material, such as, relative to circuit connection material 100 parts by volume containing electroconductive particle, can be the scope of 0.1 ~ 30 parts by volume.In order to prevent causing adjacent short circuit etc. because of excessive electroconductive particle, the content of preferred electroconductive particle is 0.1 ~ 10 parts by volume.
The circuit connection material of present embodiment, can contain packing material, tenderizer, promotor, anti-aging agent, tinting material, fire retardant, thixotropic agent, coupling agent etc.
Circuit connection material according to the present embodiment, even if under the low temperature near 120 DEG C junction circuit component each other time, also can obtain that there is sufficient bonding strength, even and if also maintain the circuit connection structure of the connection reliability excellence of the contact resistance between fully low counter electrode under hot and humid environment.
Circuit connection material for present embodiment can produce the reason of above-mentioned effect, and the present inventor etc. are presumed as follows.First, the present inventor etc. confirm: use the circuit connection material containing more dilauroyl peroxide to carry out the circuit connection structure connected, can be deteriorated by the connection reliability under connection section produces more bubble, particularly narrow-pitch after reliability test under hot and humid.Therefore, as the major cause that the interelectrode contact resistance value connected under hot and humid environment rises, can think that the dilauroyl peroxide contained in a large number in circuit connection material exists at material surface crystallization or local.The present inventor etc. think, in the circuit connection material of present embodiment, used by free-radical polymerised material (the first free-radical polymerised material) that dilauroyl peroxide and above-mentioned general formula (1) are represented, even if the bonding strength when connecting in order to ensure low temperature and when having coordinated dilauroyl peroxide, also the by having ad hoc structure first free-radical polymerised material and restrained effectively dilauroyl peroxide crystallization or local exist, therefore taken into account the stability of bonding strength and contact resistance.
Then, reference accompanying drawing is while be described caking agent sheet material of the present invention.
Fig. 1 is the schematic section of the embodiment representing caking agent sheet material of the present invention.Caking agent sheet material 4 shown in Fig. 1 has support membrane 1, be arranged on the film-like adhesive 2 on support membrane and be arranged on film-like adhesive 2 with the protective membrane 3 on the face of support membrane 1 opposition side.
Film-like adhesive 2 is formed with the of the present invention adhesive composite of the circuit connection material of above-mentioned present embodiment with sample ingredient by comprising, its electroconductive particle 7 comprising caking agent composition 5 and be dispersed in caking agent composition 5.Caking agent composition herein, refers to from adhesive composite and removes the composition after electroconductive particle.
As support membrane 1, such as, the various film such as polyethylene terephthalate film, poly (ethylene naphthalate) film, polyethylene glycol isophthalate film, polybutylene terephthalate film, polyolefine mesentery, poly-acetate membrane, polycarbonate membrane, polyphenylene sulfide film, polyamide membrane, vinyl-vinyl acetate copolymer film, polychloroethylene film, polyvinylidene chlorida film, synthetic rubber mesentery, liquid crystalline polymer film can be used.Above-mentioned film also can be that effects on surface implements the film of Corona discharge Treatment, primary coat process, antistatic treatment etc. as required.
In addition, in order to easily peel off film-like adhesive 2 from support membrane 1, also stripping treatment agent can be coated with on the surface of support membrane 1.As stripping treatment agent, the multipolymer of silicone resin, organosilicon and organic system resin, Synolac, amino-alkyd resin can be used, there is the various stripping treatment agents such as the resin of chain alkyl, the resin with fluoro-alkyl, sclerolac.
For the thickness of support membrane 1, consider the convenience the etc. when keeping of the caking agent sheet material 4 of making, use, be preferably 4 ~ 200 μm, consider material cost, productivity etc., be more preferably 15 ~ 75 μm.
Film-like adhesive 2 can contain the coating solution of adhesive composite of the present invention by using apparatus for coating be coated with on support membrane 1, the warm air drying that professional etiquette of going forward side by side is fixed time and making.In the present embodiment, adhesive composite of the present invention preferably contains above-mentioned thermoplastic resin as film forming material.
The thickness of film-like adhesive 2 is preferably 10 ~ 30 μm.If the thickness of film-like adhesive 2 is within the scope of this, then can be applicable to most towards the available circuit specification of anisotropic conductive film.
Film-like adhesive 2 also can be formed by more than 2 layers.Such as, when the layer made containing electroconductive particle and this 2 layers the structure of layer not containing electroconductive particle, the raising of the raising of working life, particle capturing efficiency can be realized.
Caking agent sheet material 4 can by after forming film-like adhesive 2 on support membrane 1, uses known laminating machine etc. to fit on it protective membrane 3 and making.
As protective membrane 3, the film same with support membrane 1 can be enumerated.Wherein, preferably there is the film of separability higher than support membrane as protective membrane.For the thickness of protective membrane, consider the convenience the etc. when keeping of the caking agent sheet material 4 of making, use, be preferably 4 ~ 200 μm, consider material cost, productivity, be more preferably 15 ~ 75 μm.
Then, circuit connection structure of the present invention and manufacture method thereof are described.
Fig. 2 is the schematic section of an embodiment of indication circuit connection structural bodies.Circuit connection structure 100 shown in Fig. 2 possesses: there is the first circuit substrate 21 and be formed in the first circuit electrode (the first splicing ear) 22 on this substrate interarea 21a the first circuit member 20, there is second circuit substrate 31 and be formed in the second circuit electrode (the second splicing ear) 32 on this substrate interarea 31a second circuit component 30 and between the first circuit member 20 and second circuit component 30 by they bonding connection sections 10.Second circuit component 30 configures with the mode of second circuit electrode 32 and the first circuit electrode 22 subtend and the first circuit member 20 subtend.
Connection section 10 makes the circuit connection material of present embodiment between the first circuit member 20 and second circuit component 30, and in this condition the first circuit member 20 and second circuit component 30 to be pressurizeed thus to be formed, be the cured article of the circuit connection material of present embodiment.It should be noted that, in the present embodiment, show example when using the circuit connection material containing electroconductive particle and form connection section 10, connection section 10 is made up of the insulation layer 11 of the composition come from beyond electroconductive particle and the electroconductive particle 7 be dispersed in insulation layer 11.
First circuit electrode 22 of subtend and second circuit electrode 32, be electrically connected by electroconductive particle 7.On the other hand, be formed in the first circuit electrode 22 on same circuit substrate each other and second circuit electrode 32 insulated from each other.
As the first circuit substrate 21 and second circuit substrate 31, the substrates such as chip part, printed base plate etc. such as semi-conductor chip, resistance chip, electric capacity chip can be enumerated.Usually, circuit member is provided with multiple splicing ear, but according to circumstances, splicing ear also can be single.
As circuit substrate, more specifically, the substrate of the inorganic materials such as semi-conductor, glass and pottery, plastic base, glass/epoxy substrate etc. can be enumerated.Circuit substrate can also be by the substrate of these combination of materials gained.
As plastic base, polyimide film, polycarbonate (PC) film and polyester film can be enumerated.Consider from low price, light-weighted viewpoint, optimization polycarbonate (PC) film, polyethylene terephthalate (PET) or PEN (PEN).
First circuit electrode and second circuit electrode are formed by metals such as copper.In order to obtain better electrical connection, preferably make the surface of at least one party of the first circuit electrode and second circuit electrode for being selected from more than one metals of gold and silver, tin and platinum family.Such as, as copper/nickel/gold, various metals combination can be formed multilayered structure.At this moment, layer gold can be made to be most surface layer.
In addition, the side in the first circuit member 20 and second circuit component 30 has glass substrate or plastic base as circuit substrate, and has the panel of LCD of the splicing ear formed by ITO etc.In addition, the side in the first circuit member 20 and second circuit component 30 has polyimide film as flexible printing patch panel (FPC), the carrier package (TCP) of circuit substrate or cover brilliant film (COF) or have the semiconductor silicon chips of semiconductor substrate as circuit substrate.Connection structural bodies can be formed as required by appropriately combined for these various circuit members.
Such as, when the first circuit member is the solar battery cell with the electrode such as finger electrode, bus electrode, when second circuit component is lug line, the connection structural bodies connecting their gained possesses solar battery cell, lug line and their solar module of transom (cured article of adhesive composite) bonding.
Circuit connection structure 100 such as by the circuit connection material of the first circuit member 20, present embodiment is overlapping in the mode that the first splicing ear 22 is relative with the second splicing ear 32 in this order with second circuit component 30, and carries out pressurizeing or and then heating and formed in this condition.
As long as pressure, producing in the scope of damage bonded object, is just not particularly limited, but is usually preferably 0.1 ~ 10MPa.Heating temperature is not particularly limited, and is preferably 100 ~ 200 DEG C.These pressurizations and heating preferably 0.5 second ~ 100 seconds scope in carry out, 120 ~ 180 DEG C or 130 ~ 180 DEG C, 3MPa, the heating in 10 seconds also can be carried out bonding.
Further, with reference to Fig. 3, while be described the manufacture method of the circuit connection structure of present embodiment.In the present embodiment, first prepare above-mentioned first circuit member 20 and the circuit connection material of present embodiment is shaped to membranaceous film-like adhesive 40 (with reference to Fig. 3 (a)).In the present embodiment, circuit connection material contains electroconductive particle 7.Caking agent composition 5 represents the composition to remove electroconductive particle from circuit connection material after.It should be noted that, when circuit connection material is not containing electroconductive particle 7, it is bonding that this circuit connection material also can be used for anisotropic conductive as insulativity caking agent.
Then, film-like adhesive 40 is placed on the face being formed with circuit electrode 22 of the first circuit member 20.Then, the arrow A and B direction of Fig. 3 (a) are pressurizeed to film-like adhesive 40, film-like adhesive 40 is connected to (with reference to Fig. 3 (b)) on the first circuit member 20 temporarily.At this moment, can heat and pressurize.Wherein, Heating temperature is set to the temperature of the solidification value lower than the adhesive composite in film-like adhesive 40.Heating temperature during interim connection is preferably 50 ~ 120 DEG C, is more preferably 60 ~ 110 DEG C.In addition, pressure during interim connection is preferably 0.1 ~ 3MPa.
In the present embodiment, the caking agent sheet material 4 of above-mentioned present embodiment can be used to be configured on the first circuit member by film-like adhesive.Specifically, the film-like adhesive 2 using laminating machine to expose peeling off protective membrane 3 from caking agent sheet material 4 is fitted on the first circuit member 20.Adhesion condition such as can be set to Heating temperature 70 DEG C, pressure 1MPa, second tie-time 2.Support membrane 1 is peeled off after adhering to.
Then, as shown in Fig. 3 (c), second circuit component 30 is placed on film-like adhesive 40 towards the mode of the first circuit member 20 to make second circuit electrode.At this moment, after carrying out contraposition in the mode that the first and second circuit electrodes are relative, carry out heating, pressurizeing from the top of second circuit component, thus can by temporary fixed for second circuit component.Operation like this, can suppress electrode position during next formal connection to depart from.Heating temperature time temporary fixed is set to the temperature of the solidification value lower than the adhesive composite in film-like adhesive 40, in order to shorten the production time, is preferably less than or equal to for 5 seconds from contraposition to the temporary fixed time completed.In addition, Heating temperature time temporary fixed is preferably 50 ~ 100 DEG C, is more preferably 60 ~ 90 DEG C.In addition, Heating temperature time temporary fixed also can be 50 ~ 120 DEG C, 60 ~ 110 DEG C.In addition, pressure time temporary fixed is preferably 0.1 ~ 3MPa.
Then, film-like adhesive 40 is heated, while pressurize across the first circuit member 20 and second circuit component 30 in the arrow A and B direction of Fig. 3 (c).At this moment Heating temperature is set to can the temperature of initiated polymerization.In the present embodiment, condition of contact as previously mentioned, Heating temperature 110 ~ 160 DEG C can be set to, be preferably 115 ~ 150 DEG C, be more preferably 120 ~ 140 DEG C, pressure 0.1 ~ 10MPa, be preferably 0.5 ~ 5MPa, tie-time 0.5 second ~ 120 seconds, be preferably 4 second ~ 30 seconds.In addition, as required, also after fixing can be carried out.
So, film-like adhesive 40 solidifies, and obtains circuit connection structure as shown in Figure 2.
The manufacture method of circuit connection structure according to the present embodiment, by using the film-like adhesive 40 formed by the circuit connection material of present embodiment, circuit connection structure can be obtained, even if also can with the bonding circuit member 20,30 of sufficient bonding strength each other when described circuit connection structure connects under above-mentioned cold condition, contact resistance between the circuit electrode that simultaneously fully can reduce electrical connection, even and if then the long-time increase that also fully inhibit contact resistance when placing under hot and humid environment.
The adhesive composite of present embodiment and caking agent sheet material, due to sufficient bonding strength can be obtained at low temperatures, fully can reduce because of the unfavorable condition caused by radical polymerization initiator simultaneously, therefore be suitable for the bonding of the component containing the low material of thermotolerance.
Embodiment
[making of caking agent sheet material]
(embodiment 1)
Mix the polyester polyurethane resin (UR-8200 of 40 mass parts that convert in nonvolatile component as thermoplastic resin, Japan spins, 30% solution), vinyl-vinyl acetate copolymer (the EV40W of 10 mass parts that convert in nonvolatile component, Mitsui Du Pont polymerization length of schooling, 20% solution), as 5 mass parts 1 of the first free-radical polymerised material, 10-decanediol diacrylate (A-DOD-N, Xin Zhong village chemical industry system), as the urethane acrylate oligomer (UA5500 of 33 mass parts that convert in nonvolatile component of the second free-radical polymerised material, Xin Zhong village chemical industry system) toluene solute 70 quality % solution, as 2 mass parts 2-methacryloxyethyl phosphate ester acid (P-2M of triradicals polymeric agents, common prosperity society chemistry system), as 10 mass parts dilauroyl peroxide (PEROYL L of radical polymerization initiator, day oil system), with the electroconductive particle of 5 mass parts median size 10 μm, this electroconductive particle is provided with the nickel dam of thickness 0.2 μm on the particle surface taking polystyrene as core, and the layer gold (gold plate) of thickness 0.04 μm is provided with in the outside of this nickel dam.Use applicator to be coated on by this mixing solutions as in the PET film of support membrane, by the warm air drying of 70 DEG C, 10 minutes, form the film-like adhesive that thickness is 20 μm, obtain caking agent sheet material.It should be noted that, in film-like adhesive, the volumetric ratio of electroconductive particle is 2 volume %.
(embodiment 2)
5 mass parts decamethylene-glycol dimethacrylates (DOD-N, Xin Zhong village chemical industry system) are coordinated to replace 1,10-decanediol diacrylate (A-DOD-N), in addition, and embodiment 1 is carried out equally, obtains caking agent sheet material.
(embodiment 3)
Coordinate 5 mass parts 1,9-nonanediol diacrylates (A-NOD-N, Xin Zhong village chemical industry system) to replace decamethylene-glycol diacrylate (A-DOD-N), in addition, and embodiment 1 is carried out equally, obtains caking agent sheet material.
(embodiment 4)
5 mass parts 1,9-nonanediol dimethacrylates (NOD-N, Xin Zhong village chemical industry system) are coordinated to replace 1,10-decanediol diacrylate (A-DOD-N), in addition, and embodiment 1 is carried out equally, obtains caking agent sheet material.
(embodiment 5)
By 1, the use level of 10-decanediol diacrylate (A-DOD-N) changes to 8 mass parts, the use level of urethane acrylate oligomer (UA5500) is changed to 30 mass parts, in addition, carry out equally with embodiment 1, obtain caking agent sheet material.
(embodiment 6)
The use level of urethane acrylate oligomer (UA5500) is changed to 27 mass parts, further cooperation 3 mass parts isocyanuric acid EO modified diacrylate (M-215, East Asia synthesis system) as the second free-radical polymerised material, the use level of dilauroyl peroxide is changed to 13 mass parts, in addition, carry out equally with embodiment 1, obtain caking agent sheet material.
(embodiment 7)
The use level of urethane acrylate oligomer (UA5500) is changed to 30 mass parts, further cooperation 3 mass parts isocyanuric acid EO modified diacrylate (M-215, East Asia synthesis system) as the second free-radical polymerised material, the use level of dilauroyl peroxide is changed to 7 mass parts, further cooperation is in the di-tert-butyl peroxide hexahydro terephthalic acid ester (HTP-65W of nonvolatile component conversion 3 mass parts, KAYAKU AKZO system, 20% solution) as radical polymerization initiator, in addition, carry out equally with embodiment 1, obtain caking agent sheet material.
(comparative example 1)
Mismatch decamethylene-glycol diacrylate (A-DOD-N), coordinate 5 mass parts isocyanuric acid EO modified diacrylate (M-215, East Asia synthesis system), in addition, and embodiment 1 is carried out equally, obtains caking agent sheet material.
(comparative example 2)
Mismatch decamethylene-glycol diacrylate (A-DOD-N), coordinate 5 mass parts isocyanuric acid EO modified triacrylate (M-315, East Asia synthesis system), in addition, and embodiment 1 is carried out equally, obtains caking agent sheet material.
(comparative example 3)
Mismatch decamethylene-glycol diacrylate (A-DOD-N), coordinate 5 mass parts dicyclopentadiene-type diacrylates (DCP-A, common prosperity society chemistry system), in addition, and embodiment 1 is carried out equally, obtains caking agent sheet material.
Film-like adhesive composition in embodiment and comparative example is shown in table 1.Unit in table is mass parts.In addition, for the content of dilauroyl peroxide in film-like adhesive and the first free-radical polymerised material (compound that above-mentioned general formula (1) represents), dilauroyl peroxide is shown in table 2 relative to the ratio (mass parts) of total amount 100 mass parts of free-radical polymerised material and the first free-radical polymerised material relative to the ratio (mass parts) of dilauroyl peroxide 100 mass parts.
[table 1]
[table 2]
[making of circuit connection structure]
Use the caking agent sheet material of embodiment 1 ~ 7 and comparative example 1 ~ 3 respectively, flexible PCB (FPC) and PET film is connected with 120 DEG C of-2MPa-10 seconds, wide 2.0mm, described flexible PCB is directly formed with the copper circuit of live width 50 μm, spacing 100 μm, thickness 18 μm on the polyimide of thickness 75 μm, and implement the tin coating of thickness 0.1 μm on copper surfaces, described PET film is use silicon-dioxide cover the PET film on surface or use silver to stick with paste the PET film covering surface.At this moment, in above-mentioned PET film, adhere to the bonding plane of the film-like adhesive of caking agent sheet material in advance, then with 70 DEG C, 1MPa heating and pressurizing 2 connects second temporarily, then peel off the PET film as support membrane from caking agent sheet material, be connected with FPC.
For the evaluation of bonding strength, use the PET film of silica sphere and the circuit connection structure (FPC-SiO of FPC
2pET film), for the evaluation of contact resistance, use silver to stick with paste the PET film on surface and the circuit connection structure (FPC-Ag sticks with paste PET film) of FPC.
[mensuration of bonding strength]
Circuit connection structure (the FPC-SiO made is measured by 90 degree of stripping methods based on JIS-Z0237
2pET film) bonding strength.As the determinator of bonding strength, use Japan BALDWIN (strain) system " Tensilon UTM-4 " (trade(brand)name) (peeling rate is 50mm/min, 25 DEG C).The obtained results are shown in table 3.
[mensuration of contact resistance]
Keep the reliability test of 250 hours after just connecting and under the environment of 85 DEG C/85%RH after, the resistance value between the counter electrode of the circuit connection structure (FPC-Ag sticks with paste PET film) using multitester measuring to make respectively.For resistance value, the mean value of 37 resistance values between the circuit electrode of mensuration subtend and maximum value.The obtained results are shown in table 3.
[table 3]
As shown in table 3, according to the caking agent sheet material of embodiment 1 ~ 7, obtain bonding strength for being more than or equal to 5N/cm, the maximum value of the resistance value simultaneously after reliability test is the circuit connection structure within 2 times of mean value.On the other hand, the caking agent sheet material of comparative example 1 ~ 3, although bonding strength is good, the deviation of the contact resistance of circuit connection structure after reliability test becomes large, and connection reliability is insufficient.In addition, the caking agent sheet material of embodiment, compared with comparative example, alleviates the crystallization of the dilauroyl peroxide on film-like adhesive surface.
Nomenclature
1: support membrane, 2: film-like adhesive, 3: protective membrane, 4: caking agent sheet material, 5: caking agent composition, 7: electroconductive particle, 10: connection section, 11: insulation layer, 20: the first circuit members, 21: the first circuit substrates, 22: the first circuit electrodes (the first splicing ear), 30: second circuit component, 31: second circuit substrate, 32: second circuit electrode (the second splicing ear), 40: film-like adhesive, 100: circuit connection structure.
Claims (7)
1. an adhesive composite, it contains free-radical polymerised material and radical polymerization initiator,
As described free-radical polymerised material; the second free-radical polymerised material with more than 2 (methyl) acryls beyond the first free-radical polymerised material represented containing following general formula (1) and described first free-radical polymerised material
As described radical polymerization initiator, containing dilauroyl peroxide,
In formula (1), X
1and X
2can be the same or different, represent acryl, methacryloyl or hydrogen atom, and at least one party is acryl or methacryloyl, n represents the integer of 8 ~ 15.
2. adhesive composite as claimed in claim 1, the content of described dilauroyl peroxide is 10 ~ 40 mass parts relative to total amount 100 mass parts of the free-radical polymerised material contained in described adhesive composite.
3. adhesive composite as claimed in claim 1 or 2, the content of described first free-radical polymerised material is 30 ~ 100 mass parts relative to content 100 mass parts of described dilauroyl peroxide.
4. the adhesive composite according to any one of claims 1 to 3, it is further containing thermoplastic resin.
5. a circuit connection material, it is the circuit connection material for being connected to each other by the circuit member with relative circuit electrode, and the adhesive composite of described circuit connection material according to any one of Claims 1 to 4 is formed.
6. a circuit connection structure, it possesses:
There is first substrate and the first circuit member being formed in the first circuit electrode on this substrate interarea;
Second circuit component, this second circuit component has second substrate and is formed in the second circuit electrode on this substrate interarea, and this second circuit electrode and described first circuit electrode subtend configure, and this second circuit electrode is electrically connected with described first circuit electrode; With
Connection section between described first circuit member and described second circuit component,
Described connection section is the cured article of circuit connection material according to claim 5.
7. a caking agent sheet material, it possesses support membrane and is arranged on the film-like adhesive that the adhesive composite according to any one of Claims 1 to 4 on this support membrane formed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013155691A JP6123547B2 (en) | 2013-07-26 | 2013-07-26 | Circuit connection material, circuit connection structure, method for manufacturing circuit connection structure, adhesive composition, and adhesive sheet |
| JP2013-155691 | 2013-07-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104342080A true CN104342080A (en) | 2015-02-11 |
| CN104342080B CN104342080B (en) | 2019-03-08 |
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| CN201410363049.3A Active CN104342080B (en) | 2013-07-26 | 2014-07-28 | Adhesive composite, circuit connection material, circuit connection structure and bonding agent sheet material |
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| Country | Link |
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| JP (1) | JP6123547B2 (en) |
| KR (1) | KR102261617B1 (en) |
| CN (1) | CN104342080B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11901096B2 (en) | 2018-06-06 | 2024-02-13 | Dexerials Corporation | Method for manufacturing connection body and method for connecting component |
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| JP6864505B2 (en) * | 2016-06-24 | 2021-04-28 | 日東電工株式会社 | Heat-bonding sheet and heat-bonding sheet with dicing tape |
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2013
- 2013-07-26 JP JP2013155691A patent/JP6123547B2/en active Active
-
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| KR102261617B1 (en) | 2021-06-04 |
| JP2015025074A (en) | 2015-02-05 |
| JP6123547B2 (en) | 2017-05-10 |
| KR20150013044A (en) | 2015-02-04 |
| CN104342080B (en) | 2019-03-08 |
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