CN103589384A - Adhesive composition, connection structure, connection structure manufacturing method and application of adhesive composition - Google Patents

Adhesive composition, connection structure, connection structure manufacturing method and application of adhesive composition Download PDF

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Publication number
CN103589384A
CN103589384A CN201310462149.7A CN201310462149A CN103589384A CN 103589384 A CN103589384 A CN 103589384A CN 201310462149 A CN201310462149 A CN 201310462149A CN 103589384 A CN103589384 A CN 103589384A
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Prior art keywords
adhesive composite
methyl
circuit
circuit block
acid
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Granted
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CN201310462149.7A
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Chinese (zh)
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CN103589384B (en
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伊泽弘行
加藤木茂树
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Lishennoco Co ltd
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Hitachi Chemical Co Ltd
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6603—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6607—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
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    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Abstract

The invention relates to an adhesive composition, a connection structure, a connection structure manufacturing method and an application of adhesive composition. The adhesive composition is used for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface, wherein the first and/or the second circuit members are configured from a substrate containing a thermoplastic resin with a glass transition temperature of 200C or less.

Description

Adhesive composite, syndeton body, the manufacture method of syndeton body and the application of adhesive composite
The present invention is that application number is that 2011800010169(international application no is PCT/JP2011/062417), the applying date is dividing an application of on May 30th, 2011, the denomination of invention patent application that is " adhesive composite, syndeton body, the manufacture method of syndeton body and the application of adhesive composite ".
Technical field
Present embodiment relates to adhesive composite, syndeton body, the manufacture method of syndeton body and the application of adhesive composite.
Background technology
In semiconductor element and liquid crystal display device, in order to make the various parts combinations in element, use various caking agents all the time.Requirement to caking agent, take cementability as representative, relates to widely reliability under thermotolerance, humid tropical condition etc.In addition, about bonding used adherend, can use and take the organic substrates such as printed-wiring board (PWB) or polyimide, polyethylene terephthalate (PET), polycarbonate (PC), PEN (PEN) as main, the metals such as copper, aluminium or ITO (composite oxides of indium and tin), SiN, SiO 2deng the base material with various condition of surface, therefore need to meet the molecular designing of each adherend.
All the time, as the caking agent of above-mentioned semiconductor element, used for liquid crystal display element, can use and adopt the thermosetting resin (for example,, with reference to patent documentation 1) that shows the epoxy resin of high adhesion and high reliability.As the constituent of resin, generally use epoxy resin, there is the solidifying agent such as reactive resol with epoxy resin, promote the hot Latence catalyst that epoxy resin reacts with solidifying agent.Hot Latence catalyst is under the storing temps such as room temperature, not react and show the material of hyperergy in when heating, it is the important factor that determines solidification value and curing speed, the viewpoint of the curing speed during from caking agent stability in storage at room temperature and heating, can be used various compounds.Condition of cure in actual operation is, by the temperature-curable at 170～250 ℃ 1～3 hour, obtained required bonding.
Yet, recently, sometimes on the low organic substrate of the thermotolerances such as PET, PC, PEN, form semiconductor element, liquid crystal display device and circuit, but heating owing to solidifying may bring detrimentally affect to organic substrate and circumferential component, thereby require bonding under low-temperature curing condition more.In order to adopt above-mentioned epoxy resin etc. to realize low temperature fast setting, need to use the hot Latence catalyst that activation energy is low, but be difficult to have both the stability in storage of near room temperature.
Wherein, radical-curable caking agent receives publicity, and the free-radical polymerised compounds such as acrylate derivative, methacrylate derivative and superoxide as radical polymerization initiator have been used in its merging.About radically curing, because the free radical as reactive behavior kind is rich reactive, therefore can the short period of time solidify (for example,, with reference to patent documentation 2).Yet, the caking agent of radically curing system, the cure shrinkage during due to heating is large, therefore compares with using the situation of epoxy resin, and bonding strength is poor.About the reduction of such bonding strength, proposed by application urethane acrylate give flexible, make the improved method of bonding strength (for example,, with reference to patent documentation 3).In addition proposed by being ITO, SiN, SiO to adherend, 2deng inorganic substrate, add the bonding auxiliary agents such as silane coupling agent to improve the method (for example,, with reference to patent documentation 4) of bonding strength.
Patent documentation 1: Japanese kokai publication hei 1-113480 communique
Patent documentation 2: No. 98/44067 brochure of International Publication
Patent documentation 3: No. 3503740 communique of Japanese Patent
Patent documentation 4: Japanese kokai publication sho 62-62874 communique
Summary of the invention
Invent problem to be solved
Yet, because the organic substrates such as the PET as thermoplastic resin, PC, PEN are straight chain shapes, and easily by the interaction between the molecule being caused by phenyl ring, form crystallising part, it is extremely difficult therefore forming covalent linkage with adhesive composite, silane coupling agent.Therefore,, in the method for recording, can not get sufficient bonding strength in above-mentioned patent documentation 4.In addition,, because the surfaces such as PET, PC, PEN are level and smooth, the adhesive effect therefore being caused by the grappling effect (anchoring effect) of physics is little.Therefore, need application can obtain the wettability to adherend, abundant flexible adhesive composite, but in the method for recording at above-mentioned patent documentation 3, can not get the sufficient wettability of adherend, flexible.
Therefore, the object of this invention is to provide for organic substrates such as polyethylene terephthalate, polycarbonate, PENs, even if even if also can obtain excellent bonding strength, and adhesive composite, the syndeton body that has used the circuit block of this adhesive composite, the manufacture method of syndeton body and the application of adhesive composite that also can keep afterwards stable performance (bonding strength, contact resistance) in long reliability test (high temperature and humidity test) under the condition of cure of low temperature.
Solve the embodiment of problem
In order to achieve the above object, the invention provides a kind of adhesive composite, it is on interarea, to have the adhesive composite on the first circuit block of the first splicing ear and interarea with the second circuit parts of the second splicing ear for connecting, the first circuit block and/or second circuit parts are that the base material of 200 ℃ of following thermoplastic resins forms by comprising second-order transition temperature, adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, (b) urethane (methyl) acrylate that free-radical polymerised compound comprises the critical surface tension with 25～40mN/m.
(b) free-radical polymerised compound that above-mentioned adhesive composite contains urethane (methyl) acrylate that comprises the critical surface tension with 25～40mN/m, therefore can improve and comprise the wettability that Tg is the base material (such as PET, PC, PEN etc.) of 200 ℃ of thermoplastic resins below, bonding under low-temperature curing condition can be realized, the bonding strength between circuit block can be improved.In addition, even if also can keep stable performance after reliability test for a long time.
In addition, in adhesive composite of the present invention, the material shown in urethane (methyl) the preferred following general formula of acrylate (A) that (b) free-radical polymerised compound comprises.
[changing 1]
Figure BDA0000391300420000031
[in formula (A), R 1and R 2represent independently of one another hydrogen atom or methyl, R 3represent ethylidene, propylidene, by the group shown in the derivative group of the opened loop compound of 6-caprolactone or following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5represent the group shown in following general formula (B), a represents 1～40 integer.]
[changing 2]
Figure BDA0000391300420000032
[in formula (B), R 6and R 7the alkylidene group that represents independently of one another the straight or branched of carbonatoms 2～12, b represents 1～10 integer, c represents 1～25 integer.In addition, in formula, R 6r each other, 7each other, b is identical or different each other with c each other.]
Owing to having proportionlity between critical surface tension and cohesive energy density, therefore think and can improve critical surface tension by importing the high functional group of cohesive energy density.Therefore, carbamate (methyl) acrylate comprising due to (b) free-radical polymerised compound is the structure shown in above-mentioned general formula (A), and can improve cohesive energy density, improve adhesive composite and comprise the wettability that Tg is the base material (such as PET, PC, PEN etc.) of the thermoplastic resin below 200 ℃, bonding strength between the circuit block that raising consists of the base material that comprises the thermoplastic resins such as PET, PC, PEN, obtains excellent connection reliability.In addition, urethane (methyl) acrylate comprising due to (b) free-radical polymerised compound is the structure shown in above-mentioned general formula (A), and can give flexible with appropriateness of adhesive composite, bonding strength between the circuit block that raising consists of the base material that comprises the thermoplastic resins such as PET, PC, PEN, obtains excellent connection reliability.
In addition, the invention provides a kind of adhesive composite, it is on interarea, to have the adhesive composite on the first circuit block of the first splicing ear and interarea with the second circuit parts of the second splicing ear for connecting, the first circuit block and/or second circuit parts are that the base material of 200 ℃ of following thermoplastic resins forms by comprising second-order transition temperature, adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, (b) free-radical polymerised compound comprises urethane (methyl) acrylate shown in following general formula (A).
[changing 3]
Figure BDA0000391300420000041
[in formula (A), R 1and R 2represent independently of one another hydrogen atom or methyl, R 3represent ethylidene, propylidene, by the group shown in the derivative group of the opened loop compound of 6-caprolactone or following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5represent the group shown in following general formula (B), a represents 1～40 integer.]
[changing 4]
Figure BDA0000391300420000042
[in formula (B), R 6and R 7the alkylidene group that represents independently of one another the straight or branched of carbonatoms 2～12, b represents 1～10 integer, c represents 1～25 integer.In addition, in formula, R 6r each other, 7each other, b is identical or different each other with c each other.]
This adhesive composite, carbamate (methyl) acrylate comprising due to (b) free-radical polymerised compound is the structure shown in above-mentioned general formula (A), and can improve cohesive energy density, improve adhesive composite and comprise the wettability that Tg is the base material (such as PET, PC, PEN etc.) of the thermoplastic resin below 200 ℃, bonding strength between the circuit block that raising consists of the base material that comprises the thermoplastic resins such as PET, PC, PEN, obtains excellent connection reliability.In addition, urethane (methyl) acrylate comprising due to (b) free-radical polymerised compound is the structure shown in above-mentioned general formula (A), and can give flexible with appropriateness of adhesive composite, bonding strength between the circuit block that raising consists of the base material that comprises the thermoplastic resins such as PET, PC, PEN, obtains excellent connection reliability.In addition, even if also can keep stable performance after reliability test for a long time.
In adhesive composite of the present invention, optimization polyurethane (methyl) acrylate is used aliphatic poly esterdiol and obtains.Because being used aliphatic poly esterdiol, urethane (methyl) acrylate obtains, therefore can improve the flexible of adhesive composite, bonding strength between the circuit block that raising consists of the base material that comprises the thermoplastic resins such as PET, PC, PEN, obtains excellent connection reliability.
In addition,, in adhesive composite of the present invention, the weight-average molecular weight of optimization polyurethane (methyl) acrylate is more than 8000 and is less than 25000.By making the weight-average molecular weight of urethane (methyl) acrylate in above-mentioned scope, further the bonding strength of the organic substrate such as raising and PET, PC, PEN, obtains excellent connection reliability.
In addition, in adhesive composite of the present invention, preferably (b) free-radical polymerised compound contains a kind of above vinyl compound with phosphate and a kind of above free-radical polymerised compound except having the vinyl compound of phosphate.Because (b) free-radical polymerised compound possesses such formation, and further improve and the bonding strength of wrapping metallic base material especially.
In addition,, in adhesive composite of the present invention, preferably, as (a) thermoplastic resin, contain at least a kind of resin being selected from phenoxy resin, urethane resin, polyester urethane resin, butyral resin, acrylic resin and polyimide resin.As (a) thermoplastic resin, by containing such resin, can further improve thermotolerance, the cementability of adhesive composite.
In addition, in adhesive composite of the present invention, preferably also contain (d) electroconductive particle.By containing (d) electroconductive particle, can give adhesive composite with good electroconductibility or anisotropic conductive, therefore can be more suitable for circuit block for thering is splicing ear bonding purposes each other etc.In addition, can reduce more fully Jie has been carried out the circuit block of electrical connection contact resistance by above-mentioned adhesive composite.
In addition, the invention provides a kind of syndeton body of circuit block, comprising: on interarea, there is second circuit parts and the interconnecting piece on first circuit block, interarea of the first splicing ear with the second splicing ear; In the first splicing ear mode relative with the second splicing ear, the first circuit block and second circuit parts Jie are configured by the interconnecting piece that comprises above-mentioned adhesive composite, and the first splicing ear and the second splicing ear are electrically connected, the first circuit block and/or described second circuit parts are that the base material of 200 ℃ of following thermoplastic resins forms by containing second-order transition temperature.
The first circuit block and/or second circuit parts are to be the circuit block that the base material of 200 ℃ of following thermoplastic resins forms by containing second-order transition temperature, can improve thus with the wettability of adhesive composite, further improve bonding strength, obtain excellent connection reliability.
Preferred above-mentioned second-order transition temperature is that 200 ℃ of following thermoplastic resins are at least a kind of resins being selected from the group that polyethylene terephthalate, polycarbonate and PEN form.Owing to being the circuit block being formed by the base material that contains polyethylene terephthalate etc., and can improve with the wettability of adhesive composite, further improve bonding strength, obtain excellent connection reliability.
In addition, in the syndeton body of circuit block of the present invention, a circuit block in the first circuit block or second circuit parts forms by containing the base material that is selected from least a kind of material in the group that polyethylene terephthalate, polycarbonate and PEN form, and another circuit block in the first circuit block or second circuit parts preferably forms by containing the base material that is selected from least a kind of material in polyimide resin and polyethylene terephthalate.The first circuit block and the second circuit parts of this syndeton body consist of base material as described above, can further improve thus wettability and bonding strength with adhesive composite, obtain excellent connection reliability.
The manufacture method that the invention provides a kind of syndeton body of circuit block, comprises following operation: the operation that first circuit block on interarea with the first splicing ear is situated between and is configured in the first splicing ear mode relative with the second splicing ear by above-mentioned adhesive composite with the second circuit parts on interarea with the second splicing ear; And heat, make it to solidify adhesive composite, thereby connect the operation of the first circuit block and second circuit parts.According to this manufacture method, by the first circuit block is connected with above-mentioned adhesive composite with second circuit parts, can obtain the syndeton body of the circuit block with excellent connection reliability.
In addition, the invention provides a kind of application of adhesive composite, be used for connecting the first circuit block and second circuit parts, described adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, (b) urethane (methyl) acrylate that free-radical polymerised compound comprises the critical surface tension with 25～40mN/m, described the first circuit block is first circuit block on interarea with the first splicing ear, described second circuit parts are the second circuit parts on interarea with the second splicing ear, at least one circuit block consists of the base material that comprises 200 ℃ of following thermoplastic resins of second-order transition temperature.This adhesive composite of (b) free-radical polymerised compound that contains urethane (methyl) acrylate that comprises the critical surface tension with 25～40mN/m, can improve and comprise the wettability that Tg is the base material (such as PET, PC, PEN etc.) of 200 ℃ of thermoplastic resins below, can be bonding under low-temperature curing condition, therefore, be suitable as for the adhesive composite of junction circuit parts and apply.
In above-mentioned application, optimization polyurethane (methyl) acrylate is urethane (methyl) acrylate shown in following general formula (A).Because urethane (methyl) acrylate is the structure shown in following general formula (A), therefore can improve the bonding strength between circuit block, obtain excellent connection reliability.
[in formula (A), R 1and R 2represent independently of one another hydrogen atom or methyl, R 3represent ethylidene, propylidene, by the derivative group of the opened loop compound of 6-caprolactone, or the group shown in following general formula (B), R 4represent the group saturated aliphatic groups shown in following general formula (B) or saturated fat ring type group, R 5represent the group shown in following general formula (B), a represents 1～40 integer.]
[changing 6]
Figure BDA0000391300420000072
[in formula (B), R 6and R 7the alkylidene group that represents independently of one another the straight or branched of carbonatoms 2～12, b represents 1～10 integer, c represents 1～25 integer.In addition, in formula, R 6r each other, 7each other, b is identical or different each other with c each other.]
In addition, the invention provides a kind of application of adhesive composite, be used for connecting the first circuit block and second circuit parts, described adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, (b) free-radical polymerised compound comprises urethane (methyl) acrylate shown in following general formula (A), described the first circuit block is first circuit block on interarea with the first splicing ear, described second circuit parts are the second circuit parts on interarea with the second splicing ear, at least one circuit block consists of the base material that comprises 200 ℃ of following thermoplastic resins of second-order transition temperature.Urethane (methyl) acrylate is the structure shown in following general formula (A), can improve the bonding strength between circuit block thus, obtains excellent connection reliability.
[changing 7]
Figure BDA0000391300420000081
[in formula (A), R 1and R 2represent independently of one another hydrogen atom or methyl, R 3represent ethylidene, propylidene, by the group shown in the derivative group of the opened loop compound of 6-caprolactone or following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5represent the group shown in following general formula (B), a represents 1～40 integer.]
[changing 8]
Figure BDA0000391300420000082
[in formula (B), R 6and R 7the alkylidene group that represents independently of one another the straight or branched of carbonatoms 2～12, b represents 1～10 integer, c represents 1～25 integer.In addition, in formula, R 6r each other, 7each other, b is identical or different each other with c each other.]
In above-mentioned application, optimization polyurethane (methyl) acrylate is used aliphatic poly esterdiol and obtains.Urethane (methyl) acrylate is used aliphatic poly esterdiol and obtains, can improve the flexible of adhesive composite thus, bonding strength between the circuit block that raising consists of the base material that comprises the thermoplastic resins such as PET, PC, PEN, obtains excellent connection reliability.
In above-mentioned application, the weight-average molecular weight of optimization polyurethane (methyl) acrylate is more than 8000 and is less than 25000.The weight-average molecular weight of urethane (methyl) acrylate is in above-mentioned scope, and the further bonding strength of the organic substrate such as raising and PET, PC, PEN, obtains excellent connection reliability thus.
In above-mentioned application, preferably (b) free-radical polymerised compound contains a kind of above vinyl compound with phosphate and a kind of above free-radical polymerised compound except having the vinyl compound of phosphate.(b) free-radical polymerised compound possesses such formation, can further improve especially thus the bonding strength with the metallic base material of bag.
In above-mentioned application, as (a) thermoplastic resin, preferably contain at least a kind of resin in the group that is selected from phenoxy resin, urethane resin, polyester urethane resin, butyral resin, acrylic resin and polyimide resin composition.As (a) thermoplastic resin, contain such resin, further improve thus thermotolerance, cementability.
In above-mentioned application, preferably adhesive composite also contains (d) electroconductive particle.By containing (d) electroconductive particle, can give adhesive composite with good electroconductibility or anisotropic conductive, in addition, can reduce more fully the contact resistance of the circuit block of electrical connection.
Invention effect
According to the present invention, can provide for organic substrates such as polyethylene terephthalate, polycarbonate, PENs, even even under the condition of cure of low temperature, also can obtain excellent bonding strength, and long reliability test (high temperature and humidity test) also can keep afterwards stable performance (bonding strength, contact resistance) adhesive composite, used the syndeton body of the circuit block of this adhesive composite, the manufacture method of syndeton body of circuit block and the application of adhesive composite.
Accompanying drawing explanation
Fig. 1 is the diagrammatic cross-section of an embodiment of syndeton body that shows the circuit block of the adhesive composite used present embodiment.
Fig. 2 is the diagrammatic cross-section that is presented at the first circuit block, second circuit parts and adhesive composite before the syndeton body of the circuit block shown in construction drawing 1.
Fig. 3 is the diagrammatic cross-section of an embodiment of syndeton body that shows the circuit block of the adhesive composite (containing electroconductive particle) used present embodiment.
Fig. 4 is the diagrammatic cross-section that is presented at the first circuit block, second circuit parts and adhesive composite (containing electroconductive particle) before the syndeton body of the circuit block shown in construction drawing 3.
Embodiment
Below, according to circumstances with reference to accompanying drawing, the preferred embodiment of the present invention is elaborated.In addition, in the accompanying drawings, to identical or corresponding section mark same-sign, the repetitive description thereof will be omitted.In addition; in the present embodiment; (methyl) vinylformic acid represents vinylformic acid or the methacrylic acid corresponding with it, and (methyl) acrylate refers to acrylate or the methacrylic ester corresponding with it, and (methyl) acryl refers to acryl or methacryloyl.
" second-order transition temperature (Tg) " in present embodiment refer to and use TA instrument company viscoelasticity analysis device processed " RSA-3 " (trade(brand)name), at 5 ℃/min of heat-up rates, frequency 10Hz, measure near the value of tan δ peak temperature that under the condition of temperature-150～300 ℃, membranaceous organic substrate mensuration is obtained, Tg.
In addition, " critical surface tension (γ c) " in present embodiment refers to, to becoming membranaceous urethane (methyl) acrylate to drip respectively pure water, the wetting tension angle (contact angle θ) that for test, after mixing solutions No.50,60 (with the pure pharmaceutical worker's industry of light (strain) system) 1 μ l, mensuration becomes with urethane (methyl) acrylate surface at once at 23 ℃, when the surface tension of each liquid being made as to x axle, when COS θ is made as to y axle and draws, the surface tension through the straight lines of 3 when Y=1.In addition, at the straight line of 3 through measured gained by above-mentioned pure water, No.50,60 during at Y=1, in the situation that X becomes negative value, also can use pure water, wetting tension for test mixing solutions No.60,1-bromonaphthalene (with the pure pharmaceutical worker's industry of light (strain) system) carry out and above-mentioned same mensuration, use is the capillary value when the Y=1 through the straight line of 3 of gained.
In addition, in the present embodiment, " weight-average molecular weight " and " number-average molecular weight " refers to according to the condition shown in table 1, uses the value of the standard curve determination gained of polystyrene standard by gel permeation chromatography (GPC).
[table 1]
Figure BDA0000391300420000101
The adhesive composite of present embodiment is on interarea, to have the adhesive composite on the first circuit block of the first splicing ear and interarea with the second circuit parts of the second splicing ear for connecting, the first circuit block and/or second circuit parts are that the base material of 200 ℃ of following thermoplastic resins forms by comprising second-order transition temperature, adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, (b) urethane (methyl) acrylate that free-radical polymerised compound comprises the critical surface tension with 25～40mN/m.
Contained (a) thermoplastic resin of adhesive composite of present embodiment refers to the resin (polymer) with following character: by heating, become the liquid state that viscosity is high, the freely distortion by external force, if cooling and remove external force, hardening can repeat this process under the state that keeps its shape.In addition, also comprise the resin (polymer) that contains the reactive functional groups with above-mentioned character.(a) Tg of thermoplastic resin is preferably 0～190 ℃, more preferably 20～170 ℃.
As such thermoplastic resin, can use polyimide resin, polyamide resin, phenoxy resin, (methyl) acrylic resin, urethane resin, polyester urethane resin, polyvinyl butyral resin etc.These resins can be used separately or two or more mixes use.In addition, in these thermoplastic resins, can comprise siloxane bond, fluoro substituents.So long as the resin mixing is fully compatible or produce microphase-separated and the state of gonorrhoea each other, just can be applicable to use.
Making adhesive composite form membranaceous, utilize in the situation that, the molecular weight of above-mentioned thermoplastic resin is larger, more easily obtains good film formative, in addition, can set in a wide range impact as the melt viscosity of the mobility of film-like adhesive composition.As the weight-average molecular weight of (a) thermoplastic resin, be preferably 5000～150000, more preferably 10000～80000.If this is worth lower than 5000, tend to be difficult for obtaining good film formative, if be greater than 150000, tend to be difficult for the excellent compatibility of acquisition and other composition.
In the adhesive composite of present embodiment, (a) content of thermoplastic resin, take adhesive composite total amount as benchmark, is preferably 5～80 quality %, more preferably 15～70 quality %.If its content is lower than 5 quality %, making adhesive composite form membranaceous, utilize in the situation that, tend to be difficult for obtaining good film formative, if be greater than 80 quality %, tend to be difficult for obtaining the mobility of good adhesive composite.
Contained (b) free-radical polymerised compound of adhesive composite of present embodiment, the effect at radical polymerization initiator that refers to issues the compound of raw radical polymerization, but can be also to make itself to produce the compound of free radical by giving the activation energy such as light, heat.As (b) free-radical polymerised compound, can preferably use to have and such as vinyl, (methyl) acryl, allyl group, dimaleoyl imino etc., by living radical, carry out the compound of the functional group of polymerization.
As (b) free-radical polymerised compound, particularly, can enumerate the oligopolymer such as epoxy (methyl) origoester acrylate, carbamate (methyl) origoester acrylate, polyethers (methyl) origoester acrylate, polyester (methyl) origoester acrylate, trimethylolpropane tris (methyl) acrylate, polyoxyethylene glycol two (methyl) acrylate, polyalkylene glycol two (methyl) acrylate, dicyclopentenyl (methyl) acrylate, dicyclopentenyl oxygen base ethyl (methyl) acrylate, neopentyl glycol two (methyl) acrylate, Dipentaerythritol six (methyl) acrylate, isocyanuric acid modification 2 officials' energy (methyl) acrylate, isocyanuric acid modification 3 officials' energy (methyl) acrylate, two phenoxyethyl alcohol fluorenes acrylate, the glycidyl that makes bisphenol fluorene diglycidyl ether with (methyl) vinylformic acid addition and epoxy (methyl) acrylate, two phenoxyethyl alcohol fluorenes acrylate, the glycidyl that makes bisphenol fluorene diglycidyl ether with (methyl) vinylformic acid addition and epoxy (methyl) acrylate, making the glycidyl of bisphenol fluorene diglycidyl ether and ethylene glycol and/or propylene glycol addition compound in import the compound of (methyl) acryloxy gained, following general formula (C) and (D) shown in compound etc.
[changing 9]
[in formula (C), R 8and R 9represent independently of one another hydrogen atom or methyl, d and e represent 1～8 integer independently of one another.]
[changing 10]
Figure BDA0000391300420000122
[in formula (D), R 10and R 11represent independently of one another hydrogen atom or methyl, f and g represent 0～8 integer independently of one another.]
In addition, as (b) free-radical polymerised compound, the in the situation that of can being separately standing at 30 ℃ for wax-like (ワ ッ Network ス shape), wax shape (ろ う shape), crystalloid, glassy, powdery etc. without mobility, show and can use the compound of solid state without particular limitation.As such (b) free-radical polymerised compound, particularly, can enumerate N, N '-methylene-bisacrylamide, diacetone-acryloamide(DAA), N-hydroxymethyl acrylamide, N-phenyl methyl acrylamide, 2-acrylamide-2-methyl propane sulfonic acid, three (2-acryloxy ethyl) isocyanuric acid ester, N-phenylmaleimide, N-(o-methyl-phenyl-) maleimide, N-(aminomethyl phenyl) maleimide, N-(p-methylphenyl)-maleimide, N-(o-methoxyphenyl) maleimide, N-(m-methoxyphenyl) maleimide, N-(p-methoxyphenyl)-maleimide, N-methyl maleimide, NEM, N-octyl group maleimide, 4,4 '-ditan bismaleimides, meta-phenylene bismaleimide, 3,3 '-dimethyl-5,5 '-diethyl-4,4 '-ditan bismaleimides, 4-methyl isophthalic acid, 3-phenylene bismaleimides, N-methacryloxy maleimide, N-acryloxy maleimide, 1,6-bismaleimides-(2,2,4-trimethylammonium) hexane, N-methacryloxy succsinic acid imide, N-acryloxy succsinic acid imide, 2-naphthyl methyl acrylate, 2-naphthyl acrylate, tetramethylol methane tetraacrylate, divinyl ethylidene-urea, divinyl propylidene urea, the polystyrene-based ethyl of 2-(methacrylic ester), N-phenyl-N '-(3-methacryloxy-2-hydroxypropyl)-Ursol D, N-phenyl-N '-(3-acryloxy-2-hydroxypropyl)-Ursol D, tetramethyl-piperidyl (methacrylic ester), tetramethyl-piperidyl acrylate, pentamethyl-piperidyl (methacrylic ester), pentamethyl-piperidyl acrylate, octadecyl acrylate, N tert butyl acrylamide, diacetone acrylamide, N-(hydroxymethyl) acrylamide, compound shown in following general formula (E)～(N) etc.
[changing 11]
Figure BDA0000391300420000131
[in formula (E), h represents 1～10 integer.]
[changing 12]
Figure BDA0000391300420000141
[changing 13]
Figure BDA0000391300420000142
[in formula (G), R 12and R 13represent independently of one another hydrogen atom or methyl, i represents 15～30 integer.]
[changing 14]
Figure BDA0000391300420000143
[in formula (H), R 14and R 15represent independently of one another hydrogen atom or methyl, j represents 15～30 integer.]
[changing 15]
Figure BDA0000391300420000144
[in formula (I), R 16represent hydrogen atom or methyl.]
[changing 16]
Figure BDA0000391300420000145
[in formula (J), R 17represent hydrogen atom or methyl, k represents 1～10 integer.]
[changing 17]
Figure BDA0000391300420000151
[in formula (K), R 18represent hydrogen atom or, following general formula (i) or (ii) shown in organic group, l represents 1～10 integer.]
[changing 18]
Figure BDA0000391300420000152
[changing 19]
Figure BDA0000391300420000153
[changing 20]
[in formula (L), R 19represent hydrogen atom or, following general formula (iii) or (iv) shown in organic group, m represents 1～10 integer.]
[changing 21]
[changing 22]
[changing 23]
Figure BDA0000391300420000163
[in formula (M), R 20represent hydrogen atom or methyl.]
[changing 24]
Figure BDA0000391300420000164
[in formula (N), R 21represent hydrogen atom or methyl.]
In addition, can using as belong to the compound of (b) free-radical polymerised compound the vinyl compound that contains phosphate, be selected from N-vinyl compound and N, the N-vinyl compound in N-dialkyl group vinyl compound merges and uses with (b) free-radical polymerised compound in addition.The merging of the vinyl compound by containing phosphate is used, and can improve the cementability of adhesive composite to metal base.In addition, by the merging of N-vinyl compound, use, can improve the crosslinking rate of adhesive composite.
As the vinyl compound that contains phosphate, so long as there is the compound of phosphate and vinyl, be not particularly limited the compound shown in preferred following general formula (O)～(Q).
[changing 25]
Figure BDA0000391300420000171
[in formula (O), R 22represent (methyl) acryloxy, R 23represent hydrogen atom or methyl, n and o represent 1～8 integer independently of one another.In addition, in formula, R 22r each other, 23each other, n is identical or different each other with o each other.]
[changing 26]
Figure BDA0000391300420000172
[in formula (P), R 24represent (methyl) acryloxy, p and q represent 1～8 integer independently of one another.In addition, in formula, R 24each other, p is identical or different each other with q each other.]
[changing 27]
Figure BDA0000391300420000173
[in formula (Q), R 25represent (methyl) acryloxy, R 26represent hydrogen atom or methyl, r and s represent 1～8 integer independently of one another.In addition, in formula, R 26identical or different each other with r each other.]
As the vinyl compound that contains phosphate, particularly, can enumerate acid phosphate oxygen base ethyl (methacrylic ester) (acid phosphor oxy ethyl methacrylate), acid phosphate oxygen base ethyl propylene acid esters, acid phosphate oxygen base propyl group (methacrylic ester), acid phosphate oxygen base polyoxyethylene glycol monomethacrylates, acid phosphate oxygen base polyoxy propylene glycol monomethyl acrylate, 2, 2 '-bis-(methyl) acryloxy diethyl phosphoric acid ester, EO modified phosphate two (methacrylic ester), phosphoric acid modification epoxy acrylate, phosphoric acid vinyl acetate etc.
The use level of the vinyl compound that contains phosphate, with the use level of (b) free-radical polymerised compound vinyl compound except containing phosphate independently, with respect to (a) thermoplastic resin 100 mass parts, be preferably 0.2～300 mass parts, 1～200 mass parts more preferably, more preferably 1～50 mass parts, is particularly preferably 1～15 mass parts.If the use level of the vinyl compound that contains phosphate lower than 0.2 mass parts, is tended to be difficult for obtaining high-adhesive-strength, if surpass 300 mass parts, the physical property of the adhesive composite after solidifying is tended to easy reduction, is difficult for guaranteeing reliability.
On the other hand, as N-vinyl compound, particularly, can enumerate N-vinyl imidazole, N-vinyl pyridine, NVP, N-vinyl formamide, N-caprolactam, 4, two (the N of 4 '-vinylidene, accelerine), N-vinyl acetamide, N,N-DMAA, N, N-diethyl acrylamide etc.
The use level of (b) free-radical polymerised compound except the compound corresponding with the above-mentioned vinyl compound that contains phosphate, with respect to (a) thermoplastic resin 100 mass parts, be preferably 50～250 mass parts, more preferably 60～150 mass parts.If above-mentioned use level is difficult for obtaining sufficient thermotolerance after lower than 50 mass parts, tending to solidify, in addition, if surpass 250 mass parts,, in the situation that using as film, tend to be difficult for obtaining good film formative.
The adhesive composite of present embodiment is usingd and is contained urethane (methyl) acrylate that meets following one or two condition as essential component: as (b) free-radical polymerised compound, and the urethane that critical surface tension is 25～40mN/m (methyl) acrylate; With urethane (methyl) acrylate by shown in following general formula (A).Wherein, in the present embodiment, more preferably use the urethane acrylate that meets above-mentioned condition.Here, urethane (methyl) acrylate shown in following general formula (A) can obtain by the condensation reaction of fatty family vulcabond and polyester glycol.
[changing 28]
Figure BDA0000391300420000191
[in formula (A), R 1and R 2represent independently of one another hydrogen atom or methyl, R 3represent ethylidene, propylidene, by the group shown in the derivative group of the opened loop compound of 6-caprolactone or following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5represent the group shown in following general formula (B), a represents 1～40 integer.]
[changing 29]
Figure BDA0000391300420000192
[in formula (B), R 6and R 7the alkylidene group that represents independently of one another the straight or branched of carbonatoms 2～12, b represents 1～10 integer, c represents 1～25 integer.In addition, in formula, R 6r each other, 7each other, b is identical or different each other with c each other.]
The fatty family vulcabond that forms above-mentioned urethane (methyl) acrylate is selected from fourth vulcabond, hexamethylene diisocyanate, lysinediisocyanate, 2-methylpentane-1, 5-vulcabond, 3-methylpentane-1, 5-vulcabond, 2, 2, 4-tri-methyl hexamethylene-1, 6-vulcabond, 2, 4, 4-tri-methyl hexamethylene-1, 6-vulcabond, isophorone diisocyanate, cyclohexyl diisocyanate, hydrogenation of benzene dimethylene diisocyanate, hydrogenated diphenyl methane diisocyanate, hydrogenation Three methyl Benzene dimethylene diisocyanate etc.
In addition, the polyester glycol as forming above-mentioned urethane (methyl) acrylate, can be used for example fatty family polyester glycol, fragrant family polyester glycol, preferably uses fatty family polyester glycol.Fat family polyester glycol is selected from ethylene glycol, propylene glycol, 1,2-PD, 1,3-PD, 1,3 butylene glycol, BDO, neopentyl glycol, 1,2-pentanediol, Isosorbide-5-Nitrae-pentanediol, 1,5-PD, 2,4-pentanediol, 2-methyl-2,4-pentanediol, 2,4-dimethyl-2,4-pentanediol, 2,2,4-trimethylammonium-1,3-pentanediol, 1,2-hexylene glycol, 1,5-hexylene glycol, 1,6-hexylene glycol, 2,5-hexylene glycol, 2-ethyl-1,3-hexylene glycol, 2,5-dimethyl-2,5-hexylene glycol, 1,2-ethohexadiol, 1,8-ethohexadiol, 1,7-heptanediol, 1,9-nonanediol, 1,2-decanediol, decamethylene-glycol, 1,12-decanediol, dodecanediol, tetramethyl ethylene ketone, Isosorbide-5-Nitrae-butynediol, triethylene glycol, glycol ether, dipropylene glycol, the low-molecular-weight diol class that cyclohexanedimethanol etc. are saturated, is reacted the polycarbonate diol class of gained with carbonyl chloride by least a kind of above above-mentioned glycols, using at least a kind of above-mentioned glycols above as initiator by oxyethane, propylene oxide, 1 kind of the monomers such as Epicholorohydrin or a kind above by the glycolss such as polyether glycol of known method addition polymerization gained, with hexanodioic acid, 3-methyl hexanodioic acid, 2,2,5,5-tetramethyl-hexanodioic acid, toxilic acid, fumaric acid, succsinic acid, 2,2-dimethyl succinate, 2-Ethyl-2-Methyl succsinic acid, 2,3-dimethyl succinate, oxalic acid, propanedioic acid, Methylpropanedioic acid, ethyl malonic acid, butyl malonic acid, dimethyl malonic acid, pentanedioic acid, 2-methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylated pentanedioic acid, 3,3-dimethylated pentanedioic acid, 2,4-dimethylated pentanedioic acid, pimelic acid, suberic acid, nonane diacid, the diprotic acid such as sebacic acid or the acid anhydrides corresponding with them carry out the fatty family polyester glycol class of dehydrating condensation gained, by the fatty family polyester of the cyclic ester compound ring-opening polymerization gained such as 6-caprolactone, it is glycols.The polyester glycol class being obtained by above-mentioned glycols and dicarboxylic acid both can be used separately, also two or more polyester glycol class can be mixed and was used.
In addition, in the adhesive composite of present embodiment, from improving the viewpoint to the bonding strength of the base materials such as PET, PC, PEN, the weight-average molecular weight of above-mentioned urethane (methyl) acrylate can be more than 8000 and be less than in 25000 scope and freely adjust, to be suitable for use.As long as the weight-average molecular weight of above-mentioned urethane (methyl) acrylate, in above-mentioned scope, just can obtain flexibility and cohesive force, and can raising and the bonding strength of the organic substrate such as PET, PC, PEN, excellent connection reliability obtained.In addition,, from obtaining fully the viewpoint of above-mentioned effect, the weight-average molecular weight of above-mentioned urethane (methyl) acrylate is more preferably more than 10000 and lower than 25000.In addition, flexible fully if this weight-average molecular weight lower than 8000, is tended to can not get, more than 25000, the mobility of adhesive composite is tended to reduce if.
The critical surface tension of above-mentioned urethane (methyl) acrylate is preferably 25～40mN/m, more preferably 25～35mN/m.In the situation that the critical surface tension of urethane (methyl) acrylate is 25～40mN/m, because the critical surface tension of the PET with as adherend, PC, PEN is approaching, wettability improves, thereby can improve bonding strength, obtains excellent connection reliability.In addition,, if its critical surface tension is lower than 25mN/m or over 40mN/m, may reduce wettability, the consistency variation to PET, PC, PEN etc.Think that the critical surface tension of above-mentioned urethane (methyl) acrylate is relevant to ammonia ester bond equivalent, can adjust by changing the number-average molecular weight of glycol.For example, if the number-average molecular weight of glycol is increased, ammonia ester bond equivalent reduces, and critical surface tension tends to reduce.
In addition, the use level of above-mentioned urethane (methyl) acrylate be take adhesive composite total amount as benchmark, is preferably 5～95 quality %, more preferably 10～80 quality %.In use level, lower than 5 quality % in the situation that, thermotolerance is tended to be easy to reduce, if surpass 95 quality %,, in the situation that using as film, film formative tends to be easy to reduction.
As contained (c) radical polymerization initiator of the adhesive composite of present embodiment, can use all the time known organo-peroxide, azo-compound etc. by provide energy to produce the compound of free radical from outside.As (c) radical polymerization initiator, from the viewpoint of stability, reactivity, consistency, preferably 1 minute half life temperature is that 90～175 ℃ and molecular weight are 180～1,000 organo-peroxide.Because 1 minute half life temperature is within the scope of this, so stability in storage is excellent, improves fully free-radical polymerisedly, can solidify at short notice.
As (c) radical polymerization initiator, particularly, can enumerate 1,1,3,3-tetramethyl butyl new decanoate ester peroxide, two (4-tert-butylcyclohexyl) peroxy dicarbonate, two (2-ethylhexyl) peroxy dicarbonate, cumyl new decanoate ester peroxide, 1,1,3,3-tetramethyl butyl new decanoate ester peroxide, dilauroyl peroxide, 1-cyclohexyl-1-methylethyl new decanoate ester peroxide, tertiary hexyl new decanoate ester peroxide, tert-butyl hydroperoxide neodecanoic acid ester, t-butylperoxy pivarate, 1，1，3，3-tetra-methylbutyl peroxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis-(peroxidation of 2-ethyl hexanoyl) hexane, tertiary hexyl peroxidation-2-ethylhexanoate, tert-butyl hydroperoxide-2-ethylhexanoate, the new heptanoate of tert-butyl hydroperoxide, t-amyl peroxy-2-ethylhexanoate, di-tert-butyl peroxide six hydrogen terephthalate, t-amyl peroxy-3,5,5 Trimethylhexanoic acid ester, 3-hydroxyl-1,1-dimethylbutyl new decanoate ester peroxide, 1，1，3，3-tetra-methylbutyl peroxy-2-ethylhexanoate, t-amyl peroxy neodecanoic acid ester, t-amyl peroxy-2-ethylhexanoate, peroxidation two (3-toluyl), dibenzoyl peroxide, peroxidation two (4-toluyl), tertiary hexyl peroxidation sec.-propyl monocarbonate, tert-butyl hydroperoxide maleic acid ester, tert-butyl hydroperoxide-3,5,5 Trimethylhexanoic acid ester, tert-butyl hydroperoxide laurate, 2,5-dimethyl-2,5-bis-(peroxidation of 3-toluyl) hexane, tert-butyl hydroperoxide-2-ethylhexyl monocarbonate, tertiary hexyl peroxide benzoate, 2,5-dimethyl-2,5-bis-(benzoyl peroxidation) hexane, tert butyl peroxy benzoate, dibutyl peroxidation trimethyladipic acid ester, t-amyl peroxy n-caprylic acid ester, the different nonenoate of t-amyl peroxy, the organo-peroxides such as t-amyl peroxy benzoic ether, 2,2 '-azo two-2,4-methyl pentane nitrile, 1,1 '-azo two (1-acetoxyl group-1-diphenylphosphino ethane), 2,2 '-Diisopropyl azodicarboxylate, 2,2 '-azo two (2-methylbutyronitrile), dimethyl-2,2 '-Diisopropyl azodicarboxylate, 4,4 '-azo two (4-cyanopentanoic acid), 1, the azo-compounds such as 1 '-azo two (1-hexanaphthene formonitrile HCN) etc.
These compounds both can be used separately, also can two or more compound use.
In addition,, as (c) radical polymerization initiator, can use the compound that produces free radical by the rayed of 150～750nm.As such compound, for example, Photoinitiation, Photopolymerization, and Photocuring(is light-initiated, photopolymerization and photocuring), J.-P.Fouassier, Hanser Publishers (nineteen ninety-five, p17～p35) α-acetparaminosalol amphyl of recording in, phosphinoxide is to light-struck highly sensitive, therefore more preferably.
These compounds both can be used separately, also can mix use with above-mentioned organo-peroxide, azo-compound.
The use level of above-mentioned (c) radical polymerization initiator is preferably 0.1～500 mass parts with respect to (a) thermoplastic resin 100 mass parts, 1～300 mass parts more preferably, and more preferably 5～50 mass parts, are particularly preferably 10～30 mass parts.If (c) use level of radical polymerization initiator is lower than 0.1 mass parts, adhesive composite tends to be difficult for solidifying fully, if surpass 500 mass parts, stability in storage is tended to variation.
Contained (d) electroconductive particle of adhesive composite of present embodiment is so long as its whole or surperficial particle with electroconductibility, but in the situation that use in having the connection of circuit block of splicing ear, preferably median size is less than splicing ear spacing.
As (d) electroconductive particle, can enumerate the metallicss such as Au, Ag, Ni, Cu, scolder, carbon etc.In addition, can be also using dielectric glass, pottery, plastics etc. as core, the above-mentioned metal of coating, metallics, carbon on this core and material.At (d) electroconductive particle, be using plastics as core, in the situation that the above-mentioned metal of coating on this core, metallics, carbon and material or hot molten metal particle, owing to thering is deformability by heating and pressurizing, therefore when connecting with the contact area increase of electrode, reliability improves, because of but preferably.
In addition, the particulate that the surface of these (d) electroconductive particles is further obtained with coatings such as macromolecule resins, can suppress when increasing the use level of electroconductive particle by particle contact with each other caused short circuit, and can improve the insulativity between telegraph circuit, therefore, can suitably it be used by separately or mix use with (d) electroconductive particle.
About the median size of this (d) electroconductive particle, from viewpoint dispersed, electroconductibility, be preferably 1～18 μ m.In the situation that contain such (d) electroconductive particle, adhesive composite can preferably be used as anisotropic conductive adhesive.
Usage quantity to (d) electroconductive particle is not particularly limited, and with respect to adhesive composite cumulative volume, is preferably 0.1～30 volume %, more preferably 0.1～10 volume %.If its value is lower than 0.1 volume %, electroconductibility is tended to reduce, if surpass 30 volume %, easy generation is tended in the short circuit of circuit.In addition, volume % depends on the volume of each composition before 23 ℃ solidifying, but the volume of each composition can utilize proportion to be converted into volume by weight.In addition, also can add therein this composition by be added in the appropriate solvent (water, alcohol etc.) that this composition is dissolved or can make this composition good wet swelling in the situation that in graduated cylinder etc., the volume using the volume having increased as this composition and obtaining.
In addition,, about the adhesive composite of present embodiment, in order to control curing speed, to give stability in storage, can add stablizer.Stablizer as such, is not particularly limited, and can use known compound, is preferably the quinone derivatives such as benzoquinones, quinhydrones; The amphyls such as 4-methoxyphenol, 4-tert-butyl catechol; 2,2,6,6-tetramethyl piperidine-1-oxygen base, 4-hydroxyl-2, the amino oxygen radical derivatives such as 2,6,6-tetramethyl piperidine-1-oxygen base; The hindered amine derivatives such as tetramethyl-piperidyl methacrylic ester etc.
The use level of stablizer is preferably 0.01～30 mass parts with respect to adhesive composite 100 mass parts, more preferably 0.05～10 mass parts.In use level lower than 0.01 mass parts in the situation that, wayward curing speed, be difficult for giving stability in storage, in the situation that surpassing 30 mass parts, easily to bringing detrimentally affect with the consistency of other composition.
In addition, can in the adhesive composite of present embodiment, suitably add and take the bonding auxiliary agents such as coupling agent, closely sealed improving agent and flow agent that alkoxyl silicone alkane derivatives, silazane derivative be representative.As coupling agent, particularly, the compound shown in preferred following general formula (R), it both can use separately also and can two or more compound use.
[changing 30]
Figure BDA0000391300420000231
[in formula (R), R 27, R 28and R 29represent independently of one another the alkyl of hydrogen atom, carbonatoms 1～5, alkoxy carbonyl or the aryl of the alkoxyl group of carbonatoms 1～5, carbonatoms 1～5, R 30represent (methyl) acryl, vinyl, isocyanate group, imidazolyl, sulfydryl, amino, methylamino, dimethylamino, benzylamino, phenyl amino, cyclohexyl amino, morpholinyl, piperazinyl, urea groups or glycidyl, t represents 1～10 integer.]
The adhesive composite of present embodiment, in order to relax stress and to improve cementability, can merge use rubber constituent.Rubber constituent refers to and under state originally, shows the composition of caoutchouc elasticity (JIS K6200) or by reacting the composition that shows caoutchouc elasticity.Rubber constituent can be both that solid can be also liquid in room temperature (25 ℃), from improving the viewpoint preferred liquid of mobility.As rubber constituent, preferably there is the compound of polyhutadiene skeleton.Rubber constituent can have cyano group, carboxyl, hydroxyl, (methyl) acryl or morpholinyl.In addition,, from improving the viewpoint of cementability, preferably side chain or end comprise the cyano group as high polar group, the rubber constituent of carboxyl.In addition, even if there is polyhutadiene skeleton, in the thermoplastic situation of demonstration, be classified into (a) thermoplastic resin, in the situation that demonstration is free-radical polymerised, be classified into (b) free-radical polymerised compound.
As rubber constituent; particularly; can enumerate polyisoprene, polyhutadiene, carboxy terminated polybutadiene, hydroxy-terminated polybutadienes, 1; 2-polyhutadiene, end carboxyl 1; 2-polyhutadiene, terminal hydroxy group 1, the paracril that 2-polyhutadiene, acrylic rubber, styrene-butadiene rubber(SBR), end hydroxy styrene-butadiene rubber, paracril, polymer ends contain carboxyl, hydroxyl, (methyl) acryl or morpholinyl, carboxylated nitrile rubber, terminal hydroxy group poly-(oxypropylene), end alkoxysilyl poly-(oxypropylene), poly-(oxygen butylidene) glycol, polyolefin diols etc.
In addition; as above-mentionedly thering is high polar group, being at room temperature the rubber constituent of liquid; particularly; can enumerate liquid acrylonitrile butadiene rubber, the liquid acrylonitrile butadiene rubber that contains carboxyl, hydroxyl, (methyl) acryl or morpholinyl in polymer ends, the carboxylated nitrile rubber of liquid etc., as the acrylonitrile content of polar group, be preferably 10～60 quality %.
These compounds both can have been used separately also and can two or more compound use.
In addition,, in order to relax stress and to improve cementability, also can in the adhesive composite of present embodiment, add organic fine particles.The median size of organic fine particles is preferably 0.05～1.0 μ m.In addition, in the situation that organic fine particles comprises above-mentioned rubber constituent, not being to be categorized into organic fine particles but to be categorized into rubber constituent, in the situation that organic fine particles comprises above-mentioned (a) thermoplastic resin, is not to be categorized into organic fine particles but to be categorized into (a) thermoplastic resin.
As organic fine particles, particularly, can enumerate by polyisoprene, polyhutadiene, carboxy terminated polybutadiene, hydroxy-terminated polybutadienes, 1, 2-polyhutadiene, end carboxyl 1, 2-polyhutadiene, acrylic rubber, styrene-butadiene rubber(SBR), paracril, polymer ends contains carboxyl, hydroxyl, the paracril of (methyl) acryl or morpholinyl, carboxylated nitrile rubber, terminal hydroxy group gathers (oxypropylene), end alkoxysilyl poly-(oxypropylene), poly-(oxygen butylidene) glycol, polyolefin diols (methyl) alkyl acrylate-butadiene-styrene copolymer, the organic fine particles that (methyl) alkyl acrylate-Organosiliconcopolymere or organosilicon (methyl)-acrylic copolymer or complex body form.
These organic fine particles both can have been used separately also can merge use by two or more compound.
The adhesive composite of present embodiment is, in the situation of liquid, can use with pasty state at normal temperatures.Be at room temperature, in the situation of solid, both can heat rear use, also can use solvent gelatinization.As operable solvent, preferably there is no reactivity with adhesive composite and additive and show sufficient deliquescent solvent, preferably the boiling point under normal pressure is the solvent of 50～150 ℃.At boiling point, lower than 50 ℃ in the situation that, if at room temperature placed, probably volatilization, tends to be difficult to use in open system.In addition, if boiling point surpasses 150 ℃, be difficult to make solvent evaporates, often the reliability after bonding brought to detrimentally affect.
In addition, the adhesive composite of present embodiment also can form membranaceous use.Can by adhesive composite as required by adding solution coat that the modes such as solvent obtain on the separability base materials such as fluororesin film, polyethylene terephthalate film, release paper, or make the base materials such as above-mentioned solution impregnation non-woven fabrics and be positioned on separability base material, except desolventizing etc., as film, use.If the shape with film is used, and is more convenient from viewpoints such as operability.
The adhesive composite of present embodiment can merge use heating and pressurization makes it bonding.Heating temperature is preferably the temperature of 100～200 ℃.Pressure preferably, adherend not being caused in the scope of damage, is generally preferably 0.1～10MPa.These heating and pressurization are preferably carried out in the scope of 0.5 second～120 seconds, also can under 120～190 ℃, 3MPa, the heating of 10 seconds, make it bonding.
The caking agent that the adhesive composite of present embodiment can be used as the different xenogenesis adherend of thermal expansivity is used.Particularly, can be used as and take anisotropically conducting adhesive, silver-colored thickener, silverskin etc. and use as the circuit connection material of representative, elastomerics for CSP, semiconductor element adhesives that for CSP, underfill, LOC adhesive tape etc. are representative.
The adhesive composite of present embodiment is used as the adhesive composite on interarea for connecting with the second circuit parts on the first circuit block of the first splicing ear and interarea with the second splicing ear.Here, above-mentioned the first circuit block and/or above-mentioned second circuit parts are that the base material of 200 ℃ of following thermoplastic resins forms by comprising second-order transition temperature.As second-order transition temperature, be 200 ℃ of following thermoplastic resins, be not particularly limited, for example can enumerate polyethylene terephthalate, polycarbonate and PEN etc.
Next, to having used the syndeton body of circuit block of the adhesive composite of above-mentioned present embodiment to describe.Fig. 1 is the diagrammatic cross-section that shows an embodiment of syndeton body adhesive composite, circuit block that has used present embodiment.Fig. 2 is the diagrammatic cross-section that is presented at the first circuit block, second circuit parts and adhesive composite before the syndeton body of the circuit block shown in construction drawing 1.
The syndeton body 100 of the circuit block shown in Fig. 1 comprises: on the interarea 31a of the first circuit substrate 31, have the first splicing ear 32 the first circuit block 30, on the interarea 41a of second circuit substrate 41, have the second splicing ear 42 second circuit parts 40, in the first splicing ear 32 mode relative with the second splicing ear 42, connect the interconnecting piece 10C of the interarea 31a of the first circuit substrate 31 and the interarea 41a of second circuit substrate 41.The first splicing ear 32 is electrically connected by contacting each other with the second splicing ear 42.The cured article of the adhesive composite 10 that in addition, interconnecting piece 10C comprises present embodiment.
The syndeton body 100 of the circuit block shown in Fig. 1 for example can be manufactured as follows.
First, as shown in Figure 2, prepare the first circuit block 30, second circuit parts 40 and be shaped to membranaceous adhesive composite 10.Next, adhesive composite 10 is placed on the interarea 41a that is formed with the second splicing ear 42 in second circuit parts 40, then, on adhesive composite 10, in the first splicing ear 32 mode relative with the second splicing ear 42, place the first circuit block 30.Then, across the first circuit block 30 and second circuit parts 40, come caking agent composition 10 to make it solidify on one side on one side, simultaneously in the direction pressurization vertical with interarea 31a, 41a, between the first and second circuit blocks 30,40, form interconnecting piece 10C, thereby obtain the syndeton body 100 of the circuit block of Fig. 1.
Fig. 3 is the diagrammatic cross-section of an embodiment of syndeton body that shows the circuit block of the adhesive composite used the present embodiment that contains (d) electroconductive particle.Fig. 4 is the diagrammatic cross-section that is presented at the first circuit block, second circuit parts and adhesive composite (containing electroconductive particle) before the syndeton body of the circuit block shown in construction drawing 3.
The syndeton body 200 of the circuit block shown in Fig. 3 comprises: on the interarea 31a of the first circuit substrate 31, there is the first circuit block 30 of the first splicing ear 32, on the interarea 41a of second circuit substrate 41, have the second splicing ear 42 second circuit parts 40, in the first splicing ear 32 mode relative with the second splicing ear 42, connect the interconnecting piece 20C of the interarea 31a of the first circuit substrate 31 and the interarea 41a of second circuit substrate 41.In addition, interconnecting piece 20C be in the composition except electroconductive particle 21 of adhesive composite, be dispersed with electroconductive particle 22 adhesive composite 20 cured article (, in the cured article 21C of the composition except electroconductive particle of adhesive composite, be dispersed with the material of electroconductive particle 22), between relative the first splicing ear 32 and the second splicing ear 42, by electroconductive particle 22 is contacted with two splicing ears, thereby be situated between, by electroconductive particle 22, two splicing ears are electrically connected to.
The syndeton body 200 of the circuit block shown in Fig. 3, for example as shown in Figure 4, can, by preparing the first circuit block 30, second circuit parts 40 and being shaped to membranaceous adhesive composite 20, utilize the method same with the syndeton body 100 that obtains above-mentioned circuit block to manufacture.
Here, at least one in the first circuit block 30 and second circuit parts 40 is that the base material of 200 ℃ of following thermoplastic resins forms by containing second-order transition temperature.That is, to contain second-order transition temperature be 200 ℃ of following thermoplastic resins at least one in the first circuit substrate 31 and second circuit substrate 41.Here, as second-order transition temperature, be 200 ℃ of following thermoplastic resins, be preferably at least a kind of resin in the group that is selected from polyethylene terephthalate, polycarbonate and PEN composition.If at least one in the first circuit block 30 and second circuit parts 40 is to be selected from by containing the circuit block that the base material of at least a kind of material in polyethylene terephthalate, polycarbonate and PEN forms, can improve with the wettability of adhesive composite, further improve bonding strength.Therefore, the syndeton body of such circuit block can obtain more excellent connection reliability.
In addition, in the first circuit block 30 and second circuit parts 40 can form by not containing the base material that is selected from least a kind of material in polyethylene terephthalate, polycarbonate and PEN.As the base material that forms such circuit block, can use inorganicss such as comprising semi-conductor, glass, pottery base material, comprise the organic base materials such as polyimide, make the inorganicss such as glass/epoxy and organism combine the base material etc. of gained.
In addition, at least one in the first splicing ear 32 and the second splicing ear 42 preferably consists of at least a kind of institute being selected from ITO and IZO.ITO and IZO are due to easy etching and pattern excellent in workability, therefore preferably as splicing ear.And, by using the adhesive composite of present embodiment, can suppress fully the corrosion of the splicing ear that formed by ITO and/or IZO.
In addition, one or two in the first splicing ear 32 and the second splicing ear 42 can be consisted of the material except ITO and IZO.As such splicing ear, can use the splicing ear that comprises copper, silver, aluminium, gold, palladium, nickel and their metals such as alloy.
In addition, the adhesive composite of the present embodiment of using as interconnecting piece, does not need to solidify completely (solidifying of the topnotch that can reach under regulation condition of cure), as long as produce above-mentioned characteristic, can be partly solidified state.
Embodiment
Below, based on embodiment, specifically describe present embodiment, but present embodiment is not limited to this.
< thermoplastic resin >
(modulation of phenoxy resin)
Phenoxy resin (Toto Kasei KK's system, YP-50 (trade(brand)name)) 40 mass parts are dissolved in to the solution of making solids component 40 quality % in methyl ethyl ketone 60 mass parts.
(preparation of polyester urethane resin)
Polyester urethane resin (Co., Ltd.'s system is spun by Japan, UR-1400 (trade(brand)name)) has been used the methyl ethyl ketone of resinous principle 30 quality % and the 1:1 mixed solvent of toluene to dissolve product.
(synthesizing of urethane resin)
Possessing stirrer, thermometer, possessing the reflux cooling pipe of calcium chloride tube, in the reaction vessel of nitrogen ingress pipe, by polyoxy tetramethylene glycol 450 mass parts and 1 of the polybutylene glyool adipate of weight-average molecular weight 2,000 450 mass parts, weight-average molecular weight 2000,4-butyleneglycol 100 mass parts are mixed equably in methyl ethyl ketone 4000 mass parts, add diphenylmethanediisocyanate 390 mass parts, at 70 ℃, react, obtained the urethane resin of weight-average molecular weight 350,000.
< free-radical polymerised compound >
(preparation of urethane acrylate (L-1600S))
The urethane acrylate (Mitsui urethane Co., Ltd. system, L-1600S (trade(brand)name)) that prepared weight-average molecular weight and be 15000, critical surface tension is 15mN/m.In addition, L-1600S be use ether be glycol and, do not meet above-mentioned general formula (A).
(synthesizing of urethane acrylate (PE-UA1))
Possessing stirrer, thermometer, possessing the reflux cooling pipe of calcium chloride tube, in the reaction vessel of nitrogen ingress pipe, add poly-(3-methylpentane adipic acid ester) glycol (aliphatic poly esterdiol of number-average molecular weight 2000, society of Kuraray Co., Ltd. system, POLYOL P-2010 (trade(brand)name)) 2000 mass parts (1.00 moles), dibutyltin dilaurate (Aldrich Co., Ltd. system) 5.53 mass parts.Import fully nitrogen, be then heated to 70～75 ℃, through 3 hours, drip equably dicyclohexyl methyl hydride 4,4 '-vulcabond (aliphatic diisocyanate, Evonik Degussa Corp.'s system, VESTANAT H 12dMI (trade(brand)name)) 787 mass parts (3.00 moles), make its reaction.After dropping finishes, continue reaction approximately 10 hours.Add therein vinylformic acid 2-hydroxyl ethyl ester (Aldrich Co., Ltd. system) 238 mass parts (2.05 moles), Hydroquinone monomethylether (Aldrich Co., Ltd. system) 0.53 mass parts, it is reacted 10 hours again, by IR, measure and confirm that isocyanic ester disappears, finish reaction, thereby obtained urethane acrylate.The critical surface tension of the urethane acrylate of gained (PE-UA1) is 30mN/m, and weight-average molecular weight is 15300.In addition, PE-UA1 be use polyester glycol and, meet above-mentioned general formula (A).
(synthesizing of urethane acrylate (PE-UA2))
Possessing stirrer, thermometer, possessing the reflux cooling pipe of calcium chloride tube, in the reaction vessel of nitrogen ingress pipe, add polycaprolactone glycol (the aliphatic poly esterdiol of number-average molecular weight 2000, trade(brand)name: PLACCEL220EB, Daisel chemical industry Co., Ltd's system) 2000 mass parts (1.00 moles), dibutyltin dilaurate (Aldrich Co., Ltd. system) 5.53 mass parts.Import fully nitrogen, be then heated to 70～75 ℃, through 3 hours, drip equably isophorone diisocyanate (aliphatic diisocyanate, Aldrich Co., Ltd. system) 666 mass parts (3.00 moles), make its reaction.After dropping finishes, continue reaction approximately 10 hours.Add therein vinylformic acid 2-hydroxyl ethyl ester (Aldrich Co., Ltd. system) 238 mass parts (2.05 moles), Hydroquinone monomethylether (Aldrich Co., Ltd. system) 0.53 mass parts, it is reacted 10 hours again, by IR, measure and confirm that isocyanic ester disappears, finish reaction, thereby obtained urethane acrylate.The critical surface tension of the urethane acrylate of gained (PE-UA2) is 25mN/m, and weight-average molecular weight is 13500.In addition, PE-UA2 be use polyester glycol and, meet above-mentioned general formula (A).
(synthesizing of urethane acrylate (PE-UA3))
Possessing stirrer, thermometer, possessing the reflux cooling pipe of calcium chloride tube, in the reaction vessel of nitrogen ingress pipe, add polycaprolactone glycol (the aliphatic poly esterdiol of vinylformic acid 2-hydroxyl ethyl ester (Aldrich Co., Ltd. system) 238 mass parts (2.05 moles), Hydroquinone monomethylether (Aldrich Co., Ltd. system) 0.53 mass parts, number-average molecular weight 1000, trade(brand)name: PLACCEL210N, Daisel chemical industry Co., Ltd's system) 2000 mass parts (2.00 moles), dibutyltin dilaurate (Aldrich Co., Ltd. system) 5.53 mass parts.Import fully nitrogen, be then heated to 70～75 ℃, through 3 hours, drip equably isophorone diisocyanate (aliphatic diisocyanate, Aldrich Co., Ltd. system) 666 mass parts (3.00 moles), make its reaction.After dropping finishes, continue reaction approximately 10 hours, by IR, measure and confirm that isocyanic ester disappears, finish reaction, thereby obtain urethane acrylate.The critical surface tension of the urethane acrylate of gained (PE-UA3) is 28mN/m, and weight-average molecular weight is 14500.In addition, PE-UA3 be use polyester glycol and, meet above-mentioned general formula (A).
(synthesizing of urethane acrylate (PE-UA4))
Possessing stirrer, thermometer, possessing the reflux cooling pipe of calcium chloride tube, in the reaction vessel of nitrogen ingress pipe, add 3-methyl isophthalic acid, 5-pentanediol 1650 mass parts (14 moles) and m-phthalic acid 1660 mass parts (10 moles), under normal pressure, import fully nitrogen, Yi Bian then on one side generated water is removed and carried out esterification from distillation in system at approximately 170 ℃.Acid number at polyester becomes the moment below 0.3mgKOH/g, by the vacuum pump vacuum tightness that little by little raises, reaction is finished.The aromatic polyester glycol (ED-1) obtaining like this has number-average molecular weight 2000.
Then, possessing stirrer, thermometer, possessing the reflux cooling pipe of calcium chloride tube, in the reaction vessel of nitrogen ingress pipe, adding aromatic polyester glycol (ED-1) 2000 mass parts (1.00 moles), dibutyltin dilaurate (Aldrich Co., Ltd. system) 5.53 mass parts of gained.Import fully nitrogen, be then heated to 70～75 ℃, through 3 hours, drip equably isophorone diisocyanate (aliphatic diisocyanate, Aldrich Co., Ltd. system) 666 mass parts (3.00 moles), make its reaction.After dropping finishes, continue reaction approximately 15 hours.Add therein vinylformic acid 2-hydroxyl ethyl ester (Aldrich Co., Ltd. system) 238 mass parts (2.05 moles), Hydroquinone monomethylether (Aldrich Co., Ltd. system) 0.53 mass parts, it is reacted 7 hours again, by IR, measure and confirm that isocyanic ester disappears, finish reaction, thereby obtain urethane acrylate.The critical surface tension of the urethane acrylate of gained (PE-UA4) is 42mN/m, and weight-average molecular weight is 11500.In addition, PE-UA4 be use polyester glycol and, meet above-mentioned general formula (A).
(synthesizing of urethane acrylate (PE-UA5))
Possessing stirrer, thermometer, possessing the reflux cooling pipe of calcium chloride tube, in the reaction vessel of nitrogen ingress pipe, add poly-(1 of number-average molecular weight 2000,6-hexylene glycol carbonic ether) glycol (Aliphatic Polycarbonatediols, Asahi Chemical Corp's system, PCDL T5652 (trade(brand)name)) 4000 mass parts (2.00 moles), dibutyltin dilaurate (Aldrich Co., Ltd. system) 5.53 mass parts.Import fully nitrogen, be then heated to 70～75 ℃, through 3 hours, drip equably isophorone diisocyanate (aliphatic diisocyanate, Aldrich Co., Ltd. system) 666 mass parts (3.00 moles), make its reaction.After dropping finishes, continue reaction approximately 15 hours.Add therein vinylformic acid 2-hydroxyl ethyl ester (Aldrich Co., Ltd. system) 238 mass parts (2.05 moles), Hydroquinone monomethylether (Aldrich Co., Ltd. system) 0.53 mass parts, it is reacted 10 hours again, by IR, measure and confirm that isocyanic ester disappears, finish reaction, thereby obtained urethane acrylate.The critical surface tension of the urethane acrylate of gained (PE-UA5) is 21mN/m, and weight-average molecular weight is 30000.In addition, PE-UA5 be use polycarbonate diol and, do not meet above-mentioned general formula (A).
(isocyanuric acid modification 2 functional acrylates' (M-215) preparations)
Prepare isocyanuric acid modification 2 functional acrylates (Toagosei Co., Ltd's system, M-215 (trade(brand)name)).
(thering is the preparation of the vinyl compound (P-2M) of phosphate)
Prepare 2-(methyl) acryloxy ethyl phosphonic acid ester (trade(brand)name: lightester P-2M, Kyoeisha Chemical Co., Ltd.'s system).
< radical polymerization initiator >
Preparation is as the dibenzoyl peroxide (trade(brand)name: Nipar BW， Japan Oil Co system) of radical polymerization initiator.
< electroconductive particle >
(making of electroconductive particle)
The nickel dam of thickness 0.2 μ m is set on the surface of the particle using polystyrene as core, at the gold layer of the arranged outside thickness 0.02 μ m of this nickel dam, thereby makes the electroconductive particle of median size 10 μ m, proportion 2.5.
[embodiment 1～7, reference example 8～10 and comparative example 1～5]
According to the solid masses shown in table 2, than coordinating thermoplastic resin, free-radical polymerised compound and radical polymerization initiator, then make electroconductive particle 1.5 volume % coordinate and disperse, thereby obtained adhesive composite.Use coating unit the adhesive composite of gained to be coated on the fluororesin film of thickness 80 μ m, the thickness that obtains bond layer by the warm air dryings of 70 ℃, 10 minutes is the film-like adhesive composition of 20 μ m.
[table 2]
Figure BDA0000391300420000321
(mensuration of contact resistance, bonding strength)
Make the film-like adhesive composition of embodiment 1～7, reference example 8～10 and comparative example 1～5 on polyimide film (Tg350 ℃), have 80 live widths, 150 μ m, spacing 300 μ m, thickness 8 μ m copper circuit flexible electric circuit board (FPC) and be formed with between the pet substrate (thickness 0.1mm) of thin layer of Ag thickener of thickness 5 μ m.In addition, make the film-like adhesive composition of embodiment 1～7, reference example 8～10 and comparative example 1～5 on polyimide film, have 80 live widths, 150 μ m, spacing 300 μ m, thickness 18 μ m copper circuit FPC and on PET (thickness 0.1mm) film, be formed with between the substrate of Ag thickener circuit of live width 150 μ m, spacing 300 μ m, thickness 10 μ m.They are used respectively to thermo-compression bonding device (type of heating: permanent pattern of fever ，Dong Li engineering society system), heating and pressurizing is 10 seconds under 150 ℃, the condition of 2MPa, connects and relates to wide 2mm, thereby make linker.After just bonding and in 85 ℃, the hot and humid groove of 85%RH, keep after 240 hours (after test) by the resistance value between the adjacent circuit of these linkers of multitester measuring.Resistance value represents with the mean value of the resistance between 37 place's adjacent circuits.
In addition, according to JIS-Z0237, by 90 degree stripping methods, measure the bonding strength of each linker, evaluate.Here, the determinator of bonding strength is used the TENSILON UTM-4 processed of Japan Baldwin Co., Ltd. (peeling rate 50mm/ minute, 25 ℃).Contact resistance and the determining bonding strength of the film-like adhesive composition as above carrying out the results are shown in following table 3.
[table 3]
Figure BDA0000391300420000331
The adhesive composite of embodiment 1～7,150 ℃ of Heating temperatures, after just bonding and in 85 ℃, the hot and humid groove of 85%RH, keep (after test) after 240 hours, show good contact resistance below approximately 1.2 Ω and good bonding strength more than 600N/m.
On the other hand, although the adhesive composite of comparative example 1 and 3 keeps (after test) after 240 hours after just bonding and in 85 ℃, the hot and humid groove of 85%RH, show good contact resistance, bonding strength step-down.In addition, comparative example 2,4 and 5 adhesive composite keep the contact resistance of (after test) after 240 hours high after just bonding and in 85 ℃, the hot and humid groove of 85%RH, and bonding strength is also low than embodiment 1～7.
On the other hand, the adhesive composite of reference example 8～10 keeps (after test) after 240 hours after just bonding and in 85 ℃, the hot and humid groove of 85%RH, shows the good contact resistance below approximately 1.2 Ω, and, compare with 3 with comparative example 1, bonding strength is excellent.
[embodiment 11～13 and comparative example 6 and 7]
In addition, by embodiment 3,4 and 7 and the film-like adhesive composition of comparative example 3 and 4 on polyimide film, have respectively between the flexible electric circuit board (FPC) and PET film (thickness 0.1mm, Tg120 ℃), PC film (thickness 0.1mm, Tg150 ℃) and pen film (thickness 0.1mm, Tg160 ℃) of copper circuit of 80 live widths, 150 μ m, spacing 300 μ m, thickness 8 μ m.They are used respectively to thermo-compression bonding device (type of heating: permanent pattern of fever ，Dong Li engineering society system), heating and pressurizing is 10 seconds under 150 ℃, the condition of 2MPa, and crimping relates to wide 2mm, thereby makes linker.
In addition, the bonding strength of each linker and aforesaid method are similarly measured.The measurement result of the bonding strength of the film-like adhesive composition as above carrying out is shown in following table 4.
[table 4]
The adhesive composite that embodiment 11～13 is used, to any base material, 150 ℃ of Heating temperatures, after just bonding and in 85 ℃, the hot and humid groove of 85%RH, keep (after test) after 240 hours, all show good bonding strength more than 600N/m.On the other hand, use the adhesive composite of comparative example 6 and 7 gained, after just bonding and in 85 ℃, the hot and humid groove of 85%RH, keep (after test) after 240 hours, bonding strength step-down.
[reference example 1～6]
As a reference example, make embodiment 3,4,6 and 7 and the film-like adhesive composition of comparative example 1 and 3 on polyimide film, have 500 live widths, 25 μ m, spacing 50 μ m, thickness 8 μ m copper circuit flexible electric circuit board (FPC) be formed with between the glass (thickness 1.1mm, surface resistivity 20 Ω/) of the ITO thin layer of 0.2 μ m.Used thermo-compression bonding device (type of heating: permanent pattern of fever ，Dong Li engineering society system), heating and pressurizing is 10 seconds under 150 ℃, the condition of 2MPa, connects and relates to wide 2mm, thereby make linker.After just bonding and in 85 ℃, the hot and humid groove of 85%RH, keep after 240 hours (after test) by the resistance value between the adjacent circuit of this linker of multitester measuring.Resistance value represents with the mean value of the resistance between 37 place's adjacent circuits.
In addition, according to JIS-Z0237, by 90 degree stripping methods, measure the bonding strength of each linker, evaluate.Here, the determinator of bonding strength is used the TENSILON UTM-4 processed of Japan Baldwin Co., Ltd. (peeling rate 50mm/ minute, 25 ℃).The contact resistance of film-like adhesive composition and the measurement result of bonding strength of as above carrying out are shown in following table 5.
[table 5]
Figure BDA0000391300420000351
As implied above, the adhesive composite of comparative example contact resistance, bonding strength in the situation that adherend is PET film, PC film and pen film is poor.Yet, as shown in table 5, in the situation that adherend is the glass with ITO, in comprising whole reference examples 1～6 of the adhesive composite that uses comparative example, confirmed after just bonding and kept (after test) after 240 hours in 85 ℃, the hot and humid groove of 85%RH, all can obtain good contact resistance below 2.5 Ω and good bonding strength more than 680N/m.
Industry utilizability
According to present embodiment, can provide for organic substrates such as polyethylene terephthalate, polycarbonate, PENs, even also can keep afterwards adhesive composite, the syndeton body that has used the circuit block of this adhesive composite, the manufacture method of syndeton body and the application of adhesive composite of stable performance (bonding strength, contact resistance) in long reliability test (high temperature and humidity test) even if also can obtain excellent bonding strength under the condition of cure of low temperature.
Nomenclature
10,20 is adhesive composite;
10C, 20C are interconnecting piece;
21 for not comprising the adhesive composite of electroconductive particle;
22 is electroconductive particle;
21C is not for comprising the cured article of the adhesive composite of electroconductive particle;
30 is the first circuit block;
31 is the first circuit substrate;
31a is interarea;
32 is the first splicing ear;
40 is second circuit parts;
41 is second circuit substrate;
41a is interarea;
42 is the second splicing ear;
100, the 200 syndeton bodies that are circuit block.

Claims (29)

1. an adhesive composite, it is on interarea, to have the adhesive composite on the first circuit block of the first splicing ear and interarea with the second circuit parts of the second splicing ear for connecting,
Described the first circuit block and/or described second circuit parts are that the base material of 200 ℃ of following thermoplastic resins forms by comprising second-order transition temperature,
Described adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, described (b) free-radical polymerised compound comprises by urethane (methyl) acrylate shown in following general formula (A)
Figure FDA0000391300410000011
In formula (A), R 1and R 2represent independently of one another hydrogen atom or methyl, R 3represent ethylidene, propylidene, by the derivative group of the opened loop compound of 6-caprolactone or by the group shown in following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5expression is by the group shown in following general formula (B), and a represents 1～40 integer,
Figure FDA0000391300410000012
In formula (B), R 6and R 7the alkylidene group that represents independently of one another the straight or branched of carbonatoms 2～12, b represents 1～10 integer, c represents 1～25 integer, in addition, and in formula, R 6r each other, 7each other, b can be the same or different each other with c each other.
2. an adhesive composite, it is on interarea, to have the adhesive composite on the first circuit block of the first splicing ear and interarea with the second circuit parts of the second splicing ear for connecting,
Described the first circuit block and/or described second circuit parts form by comprising the base material that is selected from least a kind of material in the group that polyethylene terephthalate, polycarbonate and PEN form,
Described adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, described (b) free-radical polymerised compound comprises by urethane (methyl) acrylate shown in following general formula (A)
Figure FDA0000391300410000021
In formula (A), R 1and R 2represent independently of one another hydrogen atom or methyl, R 3represent ethylidene, propylidene, by the derivative group of the opened loop compound of 6-caprolactone or by the group shown in following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5expression is by the group shown in following general formula (B), and a represents 1～40 integer,
Figure FDA0000391300410000022
In formula (B), R 6and R 7the alkylidene group that represents independently of one another the straight or branched of carbonatoms 2～12, b represents 1～10 integer, c represents 1～25 integer, in addition, and in formula, R 6r each other, 7each other, b can be the same or different each other with c each other.
3. according to profit, require the adhesive composite described in 1 or 2, wherein, described urethane (methyl) acrylate is that the condensation reaction by fatty family vulcabond and polyester glycol obtains.
4. according to profit, require the adhesive composite described in 3, wherein, described fatty family vulcabond is fourth vulcabond, hexamethylene diisocyanate, lysinediisocyanate, 2-methylpentane-1, 5-vulcabond, 3-methylpentane-1, 5-vulcabond, 2, 2, 4-tri-methyl hexamethylene-1, 6-vulcabond, 2, 4, 4-tri-methyl hexamethylene-1, 6-vulcabond, isophorone diisocyanate, cyclohexyl diisocyanate, hydrogenation of benzene dimethylene diisocyanate, hydrogenated diphenyl methane diisocyanate or hydrogenation Three methyl Benzene dimethylene diisocyanate.
5. according to profit, require the adhesive composite described in 3 or 4, wherein, described polyester glycol is fatty family polyester glycol or fragrant family polyester glycol.
6. according to profit, require the adhesive composite described in 5, wherein, described fatty family polyester glycol is: by ethylene glycol, propylene glycol, 1,2-PD, 1,3-PD, 1,3 butylene glycol, BDO, neopentyl glycol, 1,2-pentanediol, Isosorbide-5-Nitrae-pentanediol, 1,5-PD, 2,4-pentanediol, 2-methyl-2,4-pentanediol, 2,4-dimethyl-2,4-pentanediol, 2,2,4-trimethylammonium-1,3-pentanediol, 1,2-hexylene glycol, 1,5-hexylene glycol, 1,6-hexylene glycol, 2,5-hexylene glycol, 2-ethyl-1,3-hexylene glycol, 2,5-dimethyl-2,5-hexylene glycol, 1,2-ethohexadiol, 1,8-ethohexadiol, 1,7-heptanediol, 1,9-nonanediol, 1,2-decanediol, decamethylene-glycol, 1,12-decanediol, dodecanediol, tetramethyl ethylene ketone, Isosorbide-5-Nitrae-butynediol, triethylene glycol, glycol ether, dipropylene glycol or cyclohexanedimethanol are saturated low-molecular-weight diol class, by at least a kind of above described low-molecular-weight diol class, reacted the polycarbonate diol class of gained with carbonyl chloride, or at least a kind of above described low-molecular-weight diol class will be selected to oxyethane as initiator, propylene oxide, the polyether glycol of at least a kind of addition polymerization gained of Epicholorohydrin is glycols, with hexanodioic acid, 3-methyl hexanodioic acid, 2,2,5,5-tetramethyl-hexanodioic acid, toxilic acid, fumaric acid, succsinic acid, 2,2-dimethyl succinate, 2-Ethyl-2-Methyl succsinic acid, 2,3-dimethyl succinate, oxalic acid, propanedioic acid, Methylpropanedioic acid, ethyl malonic acid, butyl malonic acid, dimethyl malonic acid, pentanedioic acid, 2-methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylated pentanedioic acid, 3,3-dimethylated pentanedioic acid, 2,4-dimethylated pentanedioic acid, pimelic acid, suberic acid, the diprotic acid of nonane diacid or sebacic acid or dibasic acid anhydride carry out dehydrating condensation and obtain.
7. according to profit, require the adhesive composite described in 5, wherein, described fatty family polyester glycol obtains the ring-opening polymerization of cyclic ester compound.
8. adhesive composite according to claim 1 and 2, wherein, the weight-average molecular weight of described urethane (methyl) acrylate is more than 8000 and is less than 25000.
9. adhesive composite according to claim 1 and 2, wherein, the weight-average molecular weight of described urethane (methyl) acrylate is more than 10000 and is less than 25000.
10. adhesive composite according to claim 1 and 2, wherein, it is benchmark that the use level of described urethane (methyl) acrylate be take described adhesive composite total amount, is 5～95 quality %.
11. adhesive composites according to claim 1 and 2, wherein, described (b) free-radical polymerised compound contains a kind of above vinyl compound with phosphate and a kind of above free-radical polymerised compound except the described vinyl compound with phosphate.
12. require the adhesive composite described in 11 according to profit, wherein, described in contain phosphate vinyl compound be the compound shown in following general formula (O)～(Q),
Figure FDA0000391300410000041
In formula (O), R 22represent (methyl) acryloxy, R 23represent hydrogen atom or methyl, n and o represent 1～8 integer independently of one another; In addition, in formula, R 22r each other, 23each other, n is identical or different each other with o each other,
Figure FDA0000391300410000042
In formula (P), R 24represent (methyl) acryloxy, p and q represent 1～8 integer independently of one another; In addition, in formula, R 24each other, p is identical or different each other with q each other,
Figure FDA0000391300410000043
In formula (Q), R 25represent (methyl) acryloxy, R 26represent hydrogen atom or methyl, r and s represent 1～8 integer independently of one another; In addition, in formula, R 26identical or different each other with r each other.
13. require the adhesive composite described in 11 or 12 according to profit, wherein, described in contain phosphate the use level of vinyl compound, with respect to described (a) thermoplastic resin 100 mass parts, be 0.2～300 mass parts.
14. according to the adhesive composite described in claim 11 or 12, wherein, the use level of the free-radical polymerised compound except the described vinyl compound that contains phosphate is 50～250 mass parts with respect to described (a) thermoplastic resin 100 mass parts.
15. adhesive composites according to claim 1 and 2, wherein, described (a) thermoplastic resin contains at least a kind of resin in the group of selecting free phenoxy resin, urethane resin, polyester urethane resin, butyral resin, acrylic resin and polyimide resin composition.
16. adhesive composites according to claim 1 and 2, wherein, the weight-average molecular weight of described (a) thermoplastic resin is 5000～150000.
17. adhesive composites according to claim 1 and 2, wherein, it is benchmark that the content of described (a) thermoplastic resin be take described adhesive composite total amount, is 5～80 quality %.
18. adhesive composites according to claim 1 and 2, wherein, described (c) radical polymerization initiator is organo-peroxide or azo-compound.
19. adhesive composites according to claim 1 and 2, wherein, the use level of described (c) radical polymerization initiator, is 0.1～500 mass parts with respect to described (a) thermoplastic resin 100 mass parts.
20. adhesive composites according to claim 1 and 2, wherein, also contain (d) electroconductive particle.
21. adhesive composites according to claim 20, wherein, the usage quantity of described (d) electroconductive particle is 0.1～30 volume % with respect to adhesive composite cumulative volume.
22. 1 kinds of anisotropic conductive adhesives, it contains the adhesive composite described in any one in claim 1～21.
The syndeton body of 23. 1 kinds of circuit blocks, comprising: on interarea, there is second circuit parts and the interconnecting piece on first circuit block, interarea of the first splicing ear with the second splicing ear,
Described the first circuit block is situated between and is configured in described the first splicing ear mode relative with described the second splicing ear by described interconnecting piece with described second circuit parts, and described the first splicing ear and described the second splicing ear be electrically connected,
Described interconnecting piece is the cured article of the adhesive composite described in claim 1 or 2.
The syndeton body of 24. circuit blocks according to claim 23, wherein,
A circuit block in described the first circuit block or described second circuit parts selects the base material of at least a kind of material in the group that free polyethylene terephthalate, polycarbonate and PEN form to form by containing,
Another circuit block in described the first circuit block or second circuit parts selects the base material of at least a kind of material in the group that free polyimide resin and polyethylene terephthalate form to form by containing.
The manufacture method of the syndeton body of 25. 1 kinds of circuit blocks, comprises following operation:
The operation that first circuit block on interarea with the first splicing ear is situated between and is configured in described the first splicing ear mode relative with described the second splicing ear by the adhesive composite described in claim 1 or 2 with the second circuit parts on interarea with the second splicing ear
By described adhesive composite heating, it is solidified, connect the operation of described the first circuit block and described second circuit parts.
Adhesive composite described in 26. claims 1 or 2 is as the application of circuit connection material, and described circuit connection material is used for connecting the first circuit block and second circuit parts.
Adhesive composite described in 27. claims 1 or 2 is as the application of circuit connection material, described circuit connection material is used for connecting the first circuit block and second circuit parts, wherein, a circuit block in described the first circuit block or described second circuit parts forms by containing the base material that is selected from least a kind of material in the group that polyethylene terephthalate, polycarbonate and PEN form
Another circuit block in described the first circuit block or described second circuit parts forms by containing the base material that is selected from least a kind of material in the group that polyimide resin and polyethylene terephthalate form.
The application of adhesive composite described in 28. claims 1 or 2 in the manufacture of circuit connection material, described circuit connection material is used for connecting the first circuit block and second circuit parts.
29. application according to claim 28, wherein, a circuit block in described the first circuit block or described second circuit parts forms by containing the base material that is selected from least a kind of material in the group that polyethylene terephthalate, polycarbonate and PEN form
Another circuit block in described the first circuit block or described second circuit parts forms by containing the base material that is selected from least a kind of material in the group that polyimide resin and polyethylene terephthalate form.
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