CN103589384B - The manufacture method of adhesive composite, connection structural bodies, connection structural bodies and the application of adhesive composite - Google Patents

The manufacture method of adhesive composite, connection structural bodies, connection structural bodies and the application of adhesive composite Download PDF

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Publication number
CN103589384B
CN103589384B CN201310462149.7A CN201310462149A CN103589384B CN 103589384 B CN103589384 B CN 103589384B CN 201310462149 A CN201310462149 A CN 201310462149A CN 103589384 B CN103589384 B CN 103589384B
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circuit block
methyl
circuit
adhesive composite
structural bodies
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CN103589384A (en
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伊泽弘行
加藤木茂树
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Lishennoco Co ltd
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Hitachi Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6603—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6607—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
    • C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
    • C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
    • C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
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    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/758—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing two or more cycloaliphatic rings
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
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    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • H01L24/92—Specific sequence of method steps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Abstract

The present invention relates to adhesive composite, connection structural bodies, the manufacture method of connection structural bodies and the application of adhesive composite.The adhesive composite that the present invention relates to is for connecting the adhesive composite first circuit block and interarea interarea with the first splicing ear with the second circuit parts of the second splicing ear, and described first circuit block and/or described second circuit parts are that the base material of the thermoplastic resin of less than 200 DEG C is formed by comprising second-order transition temperature.

Description

The manufacture method of adhesive composite, connection structural bodies, connection structural bodies and the application of adhesive composite
The present invention is application number be 2011800010169(international application no is PCT/JP2011/062417), the divisional application of the patent application of " manufacture method of adhesive composite, connection structural bodies, connection structural bodies and the application of adhesive composite " that the applying date, to be May 30, denomination of invention in 2011 be.
Technical field
Present embodiment relates to adhesive composite, connection structural bodies, the manufacture method of connection structural bodies and the application of adhesive composite.
Background technology
In semiconductor element and liquid crystal display device, in order to make the various parts in element combine, use various caking agent all the time.To the requirement of caking agent, take cementability as representative, relate to the reliability etc. under thermotolerance, humid tropical condition widely.In addition, about bonding used adherend, can use based on organic substrates such as printed-wiring board (PWB) or polyimide, polyethylene terephthalate (PET), polycarbonate (PC), PENs (PEN), the metal such as copper, aluminium or ITO (composite oxides of indium and tin), SiN, SiO 2etc. the base material with various condition of surface, therefore need the molecular designing meeting each adherend.
All the time, as above-mentioned semiconductor element, caking agent used for liquid crystal display element, can use and have employed display high adhesion and the thermosetting resin of the epoxy resin of high reliability (for example, referring to patent documentation 1).As the constituent of resin, generally use epoxy resin, there is the solidifying agent such as reactive resol with epoxy resin, promote the hot Latence catalyst that epoxy resin and solidifying agent react.Hot Latence catalyst does not react under the storing temps such as room temperature and shows the material of hyperergy when heating, it is the important factor determining solidification value and curing speed, from the view point of caking agent stability in storage at room temperature and curing speed when heating, various compound can be used.Condition of cure in actual operation is, by the temperature-curable 1 ~ 3 hour of 170 ~ 250 DEG C, obtains required bonding.
But, recently, sometimes on the organic substrate that the thermotolerances such as PET, PC, PEN are low, form semiconductor element, liquid crystal display device and circuit, but may bring detrimentally affect to organic substrate and circumferential component due to heating during solidification, what thus require under more low temperature curing conditions is bonding.Low-temperature fast-curing in order to adopt above-mentioned epoxy resin etc. to realize, need the hot Latence catalyst using activation energy low, but be difficult to the stability in storage having both near room temperature.
Wherein, radical-curable caking agent receives publicity, and its merging employs the free-radical polymerised compound such as acrylate derivative, methacrylate derivative and the superoxide as radical polymerization initiator.About radically curing, because the free radical as reactive behavior kind is rich reactive, therefore can solidify the short period of time (for example, referring to patent documentation 2).But the caking agent of radically curing system, because cure shrinkage during heating is large, therefore compared with using the situation of epoxy resin, bonding strength is poor.About the reduction of such bonding strength, propose and give flexibility by application urethane acrylate, make the improved method of bonding strength (for example, referring to patent documentation 3).In addition, propose by being ITO, SiN, SiO to adherend 2the bonding auxiliary agents such as silane coupling agent are added to improve the method (for example, referring to patent documentation 4) of bonding strength Deng inorganic substrate.
Patent documentation 1: Japanese Unexamined Patent Publication 1-113480 publication
Patent documentation 2: International Publication No. 98/44067 brochure
Patent documentation 3: Japanese Patent No. 3503740 publication
Patent documentation 4: Japanese Laid-Open Patent Publication 62-62874 publication
Summary of the invention
Invent problem to be solved
But, because the organic substrates such as PET, PC, the PEN as thermoplastic resin are straight-chain, and the interaction between the easy molecule by being caused by phenyl ring forms crystallising part, therefore forming covalent linkage with adhesive composite, silane coupling agent is extremely difficult.Therefore, in the method recorded in above-mentioned patent documentation 4, can not get sufficient bonding strength.In addition, because the surfaces such as PET, PC, PEN are level and smooth, the adhesive effect therefore caused by the Anchoring Effect (anchoringeffect) of physics is little.Therefore, need application can obtain the wettability to adherend, fully flexible adhesive composite, but in the method for above-mentioned patent documentation 3 record, can not get the sufficient wettability of adherend, flexibility.
Therefore, the object of this invention is to provide for organic substrates such as polyethylene terephthalate, polycarbonate, PENs, even if even if excellent bonding strength also can be obtained and also can keep the adhesive composite of stable performance (bonding strength, contact resistance) after long reliability test (high temperature and humidity test), employ the application of the connection structural bodies of the circuit block of this adhesive composite, the manufacture method of connection structural bodies and adhesive composite under the condition of cure of low temperature.
Solve the embodiment of problem
In order to achieve the above object, the invention provides a kind of adhesive composite, it is for connecting the adhesive composite first circuit block and interarea interarea with the first splicing ear with the second circuit parts of the second splicing ear, first circuit block and/or second circuit parts are that the base material of the thermoplastic resin of less than 200 DEG C is formed by comprising second-order transition temperature, adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, b () free-radical polymerised compound comprises urethane (methyl) acrylate of the critical surface tension with 25 ~ 40mN/m.
Above-mentioned adhesive composite contains (b) free-radical polymerised compound of urethane (methyl) acrylate comprising the critical surface tension with 25 ~ 40mN/m, therefore can improve and the wettability comprising the base material (such as PET, PC, PEN etc.) that Tg is the thermoplastic resin of less than 200 DEG C, what can realize under low temperature curing conditions is bonding, can improve the bonding strength between circuit block.In addition, even if also stable performance can be kept after long reliability test.
In addition, in adhesive composite of the present invention, the material shown in the preferred following general formula (A) of urethane (methyl) acrylate that (b) free-radical polymerised compound comprises.
[changing 1]
[in formula (A), R 1and R 2represent hydrogen atom or methyl independently of one another, R 3represent ethylidene, propylidene, the group derived by the opened loop compound of 6-caprolactone or the group shown in following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5represent the group shown in following general formula (B), a represents the integer of 1 ~ 40.]
[changing 2]
[in formula (B), R 6and R 7represent the alkylidene group of the straight or branched of carbonatoms 2 ~ 12 independently of one another, b represents the integer of 1 ~ 10, and c represents the integer of 1 ~ 25.In addition, in formula, R 6each other, R 7each other, b is identical or different each other with c each other.]
Owing to there is proportionlity between critical surface tension and cohesive energy density, therefore think by importing the high functional group of cohesive energy density to improve critical surface tension.Therefore, carbamate (methyl) acrylate comprised due to (b) free-radical polymerised compound is the structure shown in above-mentioned general formula (A), and cohesive energy density can be improved, improve adhesive composite and the wettability comprising the base material (such as PET, PC, PEN etc.) that Tg is the thermoplastic resin of less than 200 DEG C, bonding strength between the circuit block that raising is made up of the base material comprising the thermoplastic resins such as PET, PC, PEN, obtains excellent connection reliability.In addition, urethane (methyl) acrylate comprised due to (b) free-radical polymerised compound is the structure shown in above-mentioned general formula (A), and adhesive composite can be given with the flexibility of appropriateness, bonding strength between the circuit block that raising is made up of the base material comprising the thermoplastic resins such as PET, PC, PEN, obtains excellent connection reliability.
In addition, the invention provides a kind of adhesive composite, it is for connecting the adhesive composite first circuit block and interarea interarea with the first splicing ear with the second circuit parts of the second splicing ear, first circuit block and/or second circuit parts are that the base material of the thermoplastic resin of less than 200 DEG C is formed by comprising second-order transition temperature, adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, b () free-radical polymerised compound comprises urethane (methyl) acrylate shown in following general formula (A).
[changing 3]
[in formula (A), R 1and R 2represent hydrogen atom or methyl independently of one another, R 3represent ethylidene, propylidene, the group derived by the opened loop compound of 6-caprolactone or the group shown in following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5represent the group shown in following general formula (B), a represents the integer of 1 ~ 40.]
[changing 4]
[in formula (B), R 6and R 7represent the alkylidene group of the straight or branched of carbonatoms 2 ~ 12 independently of one another, b represents the integer of 1 ~ 10, and c represents the integer of 1 ~ 25.In addition, in formula, R 6each other, R 7each other, b is identical or different each other with c each other.]
This adhesive composite, carbamate (methyl) acrylate comprised due to (b) free-radical polymerised compound is the structure shown in above-mentioned general formula (A), and cohesive energy density can be improved, improve adhesive composite and the wettability comprising the base material (such as PET, PC, PEN etc.) that Tg is the thermoplastic resin of less than 200 DEG C, bonding strength between the circuit block that raising is made up of the base material comprising the thermoplastic resins such as PET, PC, PEN, obtains excellent connection reliability.In addition, urethane (methyl) acrylate comprised due to (b) free-radical polymerised compound is the structure shown in above-mentioned general formula (A), and adhesive composite can be given with the flexibility of appropriateness, bonding strength between the circuit block that raising is made up of the base material comprising the thermoplastic resins such as PET, PC, PEN, obtains excellent connection reliability.In addition, even if also stable performance can be kept after long reliability test.
In adhesive composite of the present invention, optimization polyurethane (methyl) acrylate uses aliphatic poly esterdiol and obtains.Obtain because urethane (methyl) acrylate uses aliphatic poly esterdiol, therefore the flexibility of adhesive composite can be improved, bonding strength between the circuit block that raising is made up of the base material comprising the thermoplastic resins such as PET, PC, PEN, obtains excellent connection reliability.
In addition, in adhesive composite of the present invention, the weight-average molecular weight of optimization polyurethane (methyl) acrylate is more than 8000 and is less than 25000.By making the weight-average molecular weight of urethane (methyl) acrylate in above-mentioned scope, the bonding strength with the organic substrate such as PET, PC, PEN can be improved further, obtaining excellent connection reliability.
In addition, in adhesive composite of the present invention, preferably (b) free-radical polymerised compound contains the vinyl compound with phosphate of more than a kind and the free-radical polymerised compound except the vinyl compound with phosphate of more than a kind.Because (b) free-radical polymerised compound possesses such formation, and improve the bonding strength with the metallic base material of bag further especially.
In addition, in adhesive composite of the present invention, preferably as (a) thermoplastic resin, containing at least a kind of resin be selected from phenoxy resin, urethane resin, polyester urethane resin, butyral resin, acrylic resin and polyimide resin.As (a) thermoplastic resin, by containing such resin, can further improve the thermotolerance of adhesive composite, cementability.
In addition, in adhesive composite of the present invention, preferably also containing (d) electroconductive particle.By containing (d) electroconductive particle, adhesive composite can being given with good electroconductibility or anisotropic conductive, therefore can being more suitable for the circuit block bonding purposes etc. each other for having splicing ear.In addition, the contact resistance of the circuit block be electrically connected via above-mentioned adhesive composite can be reduced more fully.
In addition, the invention provides a kind of connection structural bodies of circuit block, comprising: interarea has the second circuit parts and interconnecting piece the first circuit block of the first splicing ear, interarea with the second splicing ear; In the mode that the first splicing ear is relative with the second splicing ear, first circuit block and second circuit parts are configured via the interconnecting piece comprising above-mentioned adhesive composite, and the first splicing ear and the second splicing ear are electrically connected, the first circuit block and/or described second circuit parts are made up of the base material of the thermoplastic resin containing second-order transition temperature being less than 200 DEG C.
First circuit block and/or second circuit parts are the circuit blocks be made up of the base material of the thermoplastic resin being less than 200 DEG C containing second-order transition temperature, can improve with the wettability of adhesive composite thus, improve bonding strength further, obtain excellent connection reliability.
Preferred above-mentioned second-order transition temperature is the thermoplastic resin of less than 200 DEG C is be selected from least a kind of resin in the group of polyethylene terephthalate, polycarbonate and PEN composition.Owing to being the circuit block be made up of the base material containing polyethylene terephthalate etc., and can improving with the wettability of adhesive composite, improve bonding strength further, obtain excellent connection reliability.
In addition, in the connection structural bodies of circuit block of the present invention, a circuit block in first circuit block or second circuit parts is made up of the base material containing at least a kind of material be selected from group that polyethylene terephthalate, polycarbonate and PEN form, and another circuit block in the first circuit block or second circuit parts is preferably made up of the base material containing at least a kind of material be selected from polyimide resin and polyethylene terephthalate.First circuit block and the second circuit parts of this connection structural bodies are made up of base material as described above, can improve further and the wettability of adhesive composite and bonding strength thus, obtain excellent connection reliability.
The invention provides a kind of manufacture method of connection structural bodies of circuit block, comprise following operation: the operation that the second circuit parts that first circuit block interarea with the first splicing ear and interarea have the second splicing ear are configured in the mode that the first splicing ear is relative with the second splicing ear via above-mentioned adhesive composite; And heated, make it solidify by adhesive composite, thus connect the operation of the first circuit block and second circuit parts.According to this manufacture method, by being connected with the above-mentioned adhesive composite of second circuit parts by the first circuit block, the connection structural bodies of the circuit block with excellent connection reliability can be obtained.
In addition, the invention provides a kind of application of adhesive composite, for connecting the first circuit block and second circuit parts, described adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, b () free-radical polymerised compound comprises urethane (methyl) acrylate of the critical surface tension with 25 ~ 40mN/m, described first circuit block is first circuit block interarea with the first splicing ear, described second circuit parts are second circuit parts interarea with the second splicing ear, at least one circuit block is made up of the base material of the thermoplastic resin comprising second-order transition temperature less than 200 DEG C.Containing this adhesive composite of (b) free-radical polymerised compound of urethane (methyl) acrylate comprising the critical surface tension with 25 ~ 40mN/m, can improve and the wettability comprising the base material (such as PET, PC, PEN etc.) that Tg is the thermoplastic resin of less than 200 DEG C, can be bonding under low temperature curing conditions, therefore, the adhesive composite be suitable as junction circuit parts is applied.
In above-mentioned application, optimization polyurethane (methyl) acrylate is urethane (methyl) acrylate shown in following general formula (A).Because urethane (methyl) acrylate is the structure shown in following general formula (A), therefore can improve the bonding strength between circuit block, obtain excellent connection reliability.
[in formula (A), R 1and R 2represent hydrogen atom or methyl independently of one another, R 3the group represent ethylidene, propylidene, being derived by the opened loop compound of 6-caprolactone, or the group shown in following general formula (B), R 4represent the group saturated aliphatic groups shown in following general formula (B) or saturated fat ring type group, R 5represent the group shown in following general formula (B), a represents the integer of 1 ~ 40.]
[changing 6]
[in formula (B), R 6and R 7represent the alkylidene group of the straight or branched of carbonatoms 2 ~ 12 independently of one another, b represents the integer of 1 ~ 10, and c represents the integer of 1 ~ 25.In addition, in formula, R 6each other, R 7each other, b is identical or different each other with c each other.]
In addition, the invention provides a kind of application of adhesive composite, for connecting the first circuit block and second circuit parts, described adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, b () free-radical polymerised compound comprises urethane (methyl) acrylate shown in following general formula (A), described first circuit block is first circuit block interarea with the first splicing ear, described second circuit parts are second circuit parts interarea with the second splicing ear, at least one circuit block is made up of the base material of the thermoplastic resin comprising second-order transition temperature less than 200 DEG C.Urethane (methyl) acrylate is the structure shown in following general formula (A), can improve the bonding strength between circuit block thus, obtains excellent connection reliability.
[changing 7]
[in formula (A), R 1and R 2represent hydrogen atom or methyl independently of one another, R 3represent ethylidene, propylidene, the group derived by the opened loop compound of 6-caprolactone or the group shown in following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5represent the group shown in following general formula (B), a represents the integer of 1 ~ 40.]
[changing 8]
[in formula (B), R 6and R 7represent the alkylidene group of the straight or branched of carbonatoms 2 ~ 12 independently of one another, b represents the integer of 1 ~ 10, and c represents the integer of 1 ~ 25.In addition, in formula, R 6each other, R 7each other, b is identical or different each other with c each other.]
In above-mentioned application, optimization polyurethane (methyl) acrylate uses aliphatic poly esterdiol and obtains.Urethane (methyl) acrylate uses aliphatic poly esterdiol and obtains, the flexibility of adhesive composite can be improved thus, bonding strength between the circuit block that raising is made up of the base material comprising the thermoplastic resins such as PET, PC, PEN, obtains excellent connection reliability.
In above-mentioned application, the weight-average molecular weight of optimization polyurethane (methyl) acrylate is more than 8000 and is less than 25000.The weight-average molecular weight of urethane (methyl) acrylate, in above-mentioned scope, can improve the bonding strength with the organic substrate such as PET, PC, PEN thus further, obtains excellent connection reliability.
In above-mentioned application, preferably (b) free-radical polymerised compound contains the vinyl compound with phosphate of more than a kind and the free-radical polymerised compound except the vinyl compound with phosphate of more than a kind.B () free-radical polymerised compound possesses such formation, can improve the bonding strength with the metallic base material of bag thus especially further.
In above-mentioned application, as (a) thermoplastic resin, preferably containing at least a kind of resin be selected from the group of phenoxy resin, urethane resin, polyester urethane resin, butyral resin, acrylic resin and polyimide resin composition.Contain such resin as (a) thermoplastic resin, improve thermotolerance, cementability further thus.
In above-mentioned application, preferred adhesive composite is also containing (d) electroconductive particle.By containing (d) electroconductive particle, adhesive composite can be given with good electroconductibility or anisotropic conductive, in addition, the contact resistance of the circuit block of electrical connection can be reduced more fully.
Invention effect
According to the present invention, can provide for organic substrates such as polyethylene terephthalate, polycarbonate, PENs, even if even if excellent bonding strength also can be obtained and also can keep the adhesive composite of stable performance (bonding strength, contact resistance) after long reliability test (high temperature and humidity test), employ the connection structural bodies of the circuit block of this adhesive composite, the manufacture method of the connection structural bodies of circuit block and the application of adhesive composite under the condition of cure of low temperature.
Accompanying drawing explanation
Fig. 1 is the diagrammatic cross-section that display employs an embodiment of the connection structural bodies of the circuit block of the adhesive composite of present embodiment.
Fig. 2 is the diagrammatic cross-section of the first circuit block, second circuit parts and adhesive composite before the connection structural bodies being presented at the circuit block shown in construction drawing 1.
Fig. 3 is the diagrammatic cross-section that display employs an embodiment of the connection structural bodies of the circuit block of the adhesive composite (containing electroconductive particle) of present embodiment.
Fig. 4 is the diagrammatic cross-section of the first circuit block, second circuit parts and adhesive composite (containing electroconductive particle) before the connection structural bodies being presented at the circuit block shown in construction drawing 3.
Embodiment
Below, according to circumstances with reference to accompanying drawing, the preferred embodiment of the present invention is described in detail.In addition, in the accompanying drawings, to identical or corresponding section mark same-sign, the repetitive description thereof will be omitted.In addition; in the present embodiment; (methyl) vinylformic acid represents vinylformic acid or the methacrylic acid corresponding with it; (methyl) acrylate refers to acrylate or the methacrylic ester corresponding with it, and (methyl) acryl refers to acryl or methacryloyl.
" second-order transition temperature (Tg) " in present embodiment refers to and uses TA instrument company viscoelasticity analysis device " RSA-3 " (trade(brand)name), membranaceous organic substrate is measured to the value of that obtain, near Tg tan δ peak temperature under the condition of heat-up rate 5 DEG C/min, frequency 10Hz, mensuration temperature-150 ~ 300 DEG C.
In addition, " critical surface tension (γ c) " in present embodiment refers to, at once measure and angle (contact angle θ) formed by urethane (methyl) acrylate surface after urethane (methyl) acrylate of film-like drips pure water, wetting tension test mixing solutions No.50,60 (pharmaceutical worker's industry (strain) system pure with light) 1 μ l respectively at 23 DEG C, when the surface tension of each liquid being set to x-axis, COS θ is set to y-axis when drawing, through the surface tension of the straight lines of 3 when Y=1.In addition, through when measuring the straight line of 3 of gained at Y=1 by above-mentioned pure water, No.50,60, when X becomes negative value, also can use pure water, wetting tension test mixing solutions No.60,1-bromonaphthalene (with light pure pharmaceutical worker industry (strain) system) carries out mensuration similar to the above, use the capillary value of the straight line of 3 as Y=1 through gained.
In addition, in the present embodiment, " weight-average molecular weight " and " number-average molecular weight " refers to according to the condition shown in table 1, is used the value of the standard curve determination gained of polystyrene standard by gel permeation chromatography (GPC).
[table 1]
The adhesive composite of present embodiment is for connecting the adhesive composite first circuit block and interarea interarea with the first splicing ear with the second circuit parts of the second splicing ear, first circuit block and/or second circuit parts are that the base material of the thermoplastic resin of less than 200 DEG C is formed by comprising second-order transition temperature, adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, b () free-radical polymerised compound comprises urethane (methyl) acrylate of the critical surface tension with 25 ~ 40mN/m.
(a) contained by adhesive composite thermoplastic resin of present embodiment refers to the resin (polymer) with following character: become the liquid state that viscosity is high by heating, freely be out of shape by external force, if cool and remove external force, hardening and this process can be repeated under the state keeping its shape.In addition, the resin (polymer) containing the reactive functional groups with above-mentioned character is also comprised.A the Tg of () thermoplastic resin is preferably 0 ~ 190 DEG C, be more preferably 20 ~ 170 DEG C.
As such thermoplastic resin, polyimide resin, polyamide resin, phenoxy resin, (methyl) acrylic resin, urethane resin, polyester urethane resin, polyvinyl butyral resin etc. can be used.These resins can be used alone or two or more is used in combination.In addition, siloxane bond, fluoro substituents can be comprised in these thermoplastic resins.As long as mixed resin is fully compatible or produce the state of microphase-separated and gonorrhoea each other, use just can be applicable to.
When make adhesive composite formed membranaceous and utilize, the molecular weight of above-mentioned thermoplastic resin is larger, more easily obtains good film formative, in addition, can set in a wide range and affect as the melt viscosity of the mobility of film-like adhesive composition.As the weight-average molecular weight of (a) thermoplastic resin, be preferably 5000 ~ 150000, be more preferably 10000 ~ 80000.If this value is lower than 5000, then tend to not easily obtain good film formative, if be greater than 150000, then tend to not easily obtain the excellent compatibility with other composition.
In the adhesive composite of present embodiment, the content of (a) thermoplastic resin, with adhesive composite total amount for benchmark, is preferably 5 ~ 80 quality %, is more preferably 15 ~ 70 quality %.If its content is lower than 5 quality %, then when make adhesive composite formed membranaceous and utilize, tend to not easily obtain good film formative, if be greater than 80 quality %, then tend to the mobility not easily obtaining good adhesive composite.
(b) contained by adhesive composite free-radical polymerised compound of present embodiment, refer to the compound issuing raw radical polymerization in the effect of radical polymerization initiator, but also can be make itself to produce the compound of free radical by giving the activation energy such as light, heat.As (b) free-radical polymerised compound, the compound with the functional group that such as vinyl, (methyl) acryl, allyl group, dimaleoyl imino etc. are polymerized by living radical preferably can be used.
As (b) free-radical polymerised compound, specifically, the oligopolymer such as epoxy (methyl) origoester acrylate, carbamate (methyl) origoester acrylate, polyethers (methyl) origoester acrylate, polyester (methyl) origoester acrylate can be enumerated, trimethylolpropane tris (methyl) acrylate, polyoxyethylene glycol two (methyl) acrylate, polyalkylene glycol two (methyl) acrylate, dicyclopentenyl (methyl) acrylate, dicyclopentenyl oxygen base ethyl (methyl) acrylate, neopentyl glycol two (methyl) acrylate, Dipentaerythritol six (methyl) acrylate, isocyanuric acid modification 2 official energy (methyl) acrylate, isocyanuric acid modification 3 official energy (methyl) acrylate, two phenoxyethyl alcohol fluorenes acrylate, make the glycidyl of bisphenol fluorene diglycidyl ether and (methyl) vinylformic acid addition and epoxy (methyl) acrylate that obtains, two phenoxyethyl alcohol fluorenes acrylate, make the glycidyl of bisphenol fluorene diglycidyl ether and (methyl) vinylformic acid addition and epoxy (methyl) acrylate that obtains, the compound of (methyl) acryloxy gained is imported in the compound obtained making the glycidyl of bisphenol fluorene diglycidyl ether and ethylene glycol and/or propylene glycol addition, following general formula (C) and the compound etc. shown in (D).
[changing 9]
[in formula (C), R 8and R 9represent hydrogen atom or methyl independently of one another, d and e represents the integer of 1 ~ 8 independently of one another.]
[changing 10]
[in formula (D), R 10and R 11represent hydrogen atom or methyl independently of one another, f and g represents the integer of 0 ~ 8 independently of one another.]
In addition, as (b) free-radical polymerised compound, can be when leaving standstill at 30 DEG C separately for wax-like (ワ ッ Network ス shape), wax shape (ろ う shape), crystalloid, glassy, powdery etc. are without mobility, the compound showing solid state, can use without particular limitation.As such (b) free-radical polymerised compound, specifically, N can be enumerated, N '-methylene-bisacrylamide, diacetone-acryloamide(DAA), N-hydroxymethylacrylamide, N-phenyl methacrylamide, 2-acrylamide-2-methyl propane sulfonic acid, three (2-acryloyl-oxyethyl) isocyanuric acid ester, N-phenylmaleimide, N-(o-methyl-phenyl-) maleimide, N-(aminomethyl phenyl) maleimide, N-(p-methylphenyl)-maleimide, N-(o-methoxyphenyl) maleimide, N-(m-methoxyphenyl) maleimide, N-(p-methoxyphenyl)-maleimide, N-methylmaleimido, NEM, N-octyl group maleimide, 4,4 '-ditan bismaleimides, meta-phenylene bismaleimide, 3,3 '-dimethyl-5,5 '-diethyl-4,4 '-ditan bismaleimides, 4-methyl isophthalic acid, 3-phenylene bismaleimides, N-methacryloxy maleimide, N-acryloxy maleimide, 1,6-bismaleimides-(2,2,4-trimethylammonium) hexane, N-methacryloxy bromosuccinimide, N-acryloxy bromosuccinimide, 2-naphthyl methacrylate, 2-naphthyl acrylate, tetramethylol methane tetraacrylate, divinyl ethylidene-urea, divinyl propylidene urea, the polystyrene-based ethyl of 2-(methacrylic ester), N-phenyl-N '-(3-methacryloxy-2-hydroxypropyl)-Ursol D, N-phenyl-N '-(3-acryloxy-2-hydroxypropyl)-Ursol D, tetramethyl-piperidyl (methacrylic ester), tetramethyl-piperidyl acrylate, pentamethvl base (methacrylic ester), pentamethvl base acrylate, octadecyl acrylate, N tert butyl acrylamide, diacetone acrylamide, N-(hydroxymethyl) acrylamide, compound etc. shown in following general formula (E) ~ (N).
[changing 11]
[in formula (E), h represents the integer of 1 ~ 10.]
[changing 12]
[changing 13]
[in formula (G), R 12and R 13represent hydrogen atom or methyl independently of one another, i represents the integer of 15 ~ 30.]
[changing 14]
[in formula (H), R 14and R 15represent hydrogen atom or methyl independently of one another, j represents the integer of 15 ~ 30.]
[changing 15]
[in formula (I), R 16represent hydrogen atom or methyl.]
[changing 16]
[in formula (J), R 17represent hydrogen atom or methyl, k represents the integer of 1 ~ 10.]
[changing 17]
[in formula (K), R 18represent hydrogen atom or, following general formula (i) or the organic group shown in (ii), l represents the integer of 1 ~ 10.]
[changing 18]
[changing 19]
[changing 20]
[in formula (L), R 19represent hydrogen atom or, following general formula (iii) or the organic group shown in (iv), m represents the integer of 1 ~ 10.]
[changing 21]
[changing 22]
[changing 23]
[in formula (M), R 20represent hydrogen atom or methyl.]
[changing 24]
[in formula (N), R 21represent hydrogen atom or methyl.]
In addition, can using as belong to (b) free-radical polymerised compound compound the vinyl compound containing phosphate, be selected from N-vinyl compound in N-vinyl compound and N, N-dialkyl group vinyl compound and merge with (b) free-radical polymerised compound in addition and use.Used by the merging of the vinyl compound containing phosphate, the cementability of adhesive composite to metal base can be improved.In addition, used by the merging of N-vinyl compound, the crosslinking rate of adhesive composite can be improved.
As the vinyl compound containing phosphate, as long as have the compound of phosphate and vinyl, be not particularly limited, the compound shown in preferred following general formula (O) ~ (Q).
[changing 25]
[in formula (O), R 22represent (methyl) acryloxy, R 23represent hydrogen atom or methyl, n and o represents the integer of 1 ~ 8 independently of one another.In addition, in formula, R 22each other, R 23each other, n is identical or different each other with o each other.]
[changing 26]
[in formula (P), R 24represent (methyl) acryloxy, p and q represents the integer of 1 ~ 8 independently of one another.In addition, in formula, R 24each other, p is identical or different each other with q each other.]
[changing 27]
[in formula (Q), R 25represent (methyl) acryloxy, R 26represent hydrogen atom or methyl, r and s represents the integer of 1 ~ 8 independently of one another.In addition, in formula, R 26identical or different each other with r each other.]
As the vinyl compound containing phosphate, specifically, acid phosphate base oxygen base ethyl (methacrylic ester) (acidphosphoroxyethylmethacrylate) can be enumerated, acid phosphate base oxygen base ethyl propylene acid esters, acid phosphate base oxygen base propyl group (methacrylic ester), acid phosphate base oxygen base polyoxyethylene glycol monomethacrylates, acid phosphate base oxygen base polyoxypropylene glycol monomethacrylates, 2, 2 '-two (methyl) acryloxy diethylphosphate, EO modified phosphate two (methacrylic ester), phosphoric acid modification epoxy acrylate, phosphoric acid vinyl acetate etc.
The use level of the vinyl compound containing phosphate, with except the use level containing (b) free-radical polymerised compound except the vinyl compound of phosphate independently, relative to (a) thermoplastic resin 100 mass parts, be preferably 0.2 ~ 300 mass parts, be more preferably 1 ~ 200 mass parts, more preferably 1 ~ 50 mass parts, is particularly preferably 1 ~ 15 mass parts.If the use level of the vinyl compound containing phosphate is lower than 0.2 mass parts, then tend to not easily obtain high-adhesive-strength, if more than 300 mass parts, then the physical property of the adhesive composite after solidification tends to easy reduction, not easily guarantees reliability.
On the other hand, as N-vinyl compound, specifically, N-vinyl imidazole, N-vinyl pyridine, NVP, N-vinyl formamide, N-caprolactam, 4 can be enumerated, two (the N of 4 '-vinylidene, accelerine), N-vinyl acetamide, N,N-DMAA, N, N-acrylamide etc.
The use level of (b) free-radical polymerised compound except the compound that the vinyl compound containing phosphate with above-mentioned is corresponding, relative to (a) thermoplastic resin 100 mass parts, be preferably 50 ~ 250 mass parts, be more preferably 60 ~ 150 mass parts.If above-mentioned use level is lower than 50 mass parts, then not easily obtains sufficient thermotolerance after tending to solidification, in addition, if more than 250 mass parts, then when using as film, tending to not easily obtain good film formative.
The adhesive composite of present embodiment is using containing meeting urethane (methyl) acrylate of one or two condition following as essential component: as (b) free-radical polymerised compound, critical surface tension is urethane (methyl) acrylate of 25 ~ 40mN/m; With by urethane (methyl) acrylate shown in following general formula (A).Wherein, in the present embodiment, the urethane acrylate meeting above-mentioned condition is more preferably used.Here, urethane (methyl) acrylate shown in following general formula (A) can be obtained by the condensation reaction of fatty family vulcabond and polyester glycol.
[changing 28]
[in formula (A), R 1and R 2represent hydrogen atom or methyl independently of one another, R 3represent ethylidene, propylidene, the group derived by the opened loop compound of 6-caprolactone or the group shown in following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5represent the group shown in following general formula (B), a represents the integer of 1 ~ 40.]
[changing 29]
[in formula (B), R 6and R 7represent the alkylidene group of the straight or branched of carbonatoms 2 ~ 12 independently of one another, b represents the integer of 1 ~ 10, and c represents the integer of 1 ~ 25.In addition, in formula, R 6each other, R 7each other, b is identical or different each other with c each other.]
The fatty family vulcabond forming above-mentioned urethane (methyl) acrylate is selected from fourth vulcabond, hexamethylene diisocyanate, lysinediisocyanate, 2-methylpentane-1, 5-vulcabond, 3-methylpentane-1, 5-vulcabond, 2, 2, 4-tri-methyl hexamethylene-1, 6-vulcabond, 2, 4, 4-tri-methyl hexamethylene-1, 6-vulcabond, isophorone diisocyanate, cyclohexyl diisocyanate, hydrogenation of benzene dimethylene diisocyanate, hydrogenated diphenyl methane diisocyanate, hydrogenation Three methyl Benzene dimethylene diisocyanate etc.
In addition, as the polyester glycol forming above-mentioned urethane (methyl) acrylate, such as fatty family polyester glycol, fragrant family polyester glycol can be used, preferably use fatty family polyester glycol.Fat family polyester glycol is selected from ethylene glycol, propylene glycol, 1,2-PD, 1,3-PD, 1,3 butylene glycol, BDO, neopentyl glycol, 1,2-pentanediol, Isosorbide-5-Nitrae-pentanediol, 1,5-PD, 2,4-pentanediol, 2-methyl-2,4-pentanediol, 2,4-dimethyl-2,4-pentanediol, 2,2,4-trimethylammonium-1,3-pentanediol, 1,2-hexylene glycol, 1,5-hexylene glycol, 1,6-hexylene glycol, 2,5-hexylene glycol, 2-ethyl-1,3-hexylene glycol, 2,5-dimethyl-2,5-hexylene glycol, 1,2-ethohexadiol, 1,8-ethohexadiol, 1,7-heptanediol, 1,9-nonanediol, 1,2-decanediol, decamethylene-glycol, 1,12-decanediol, dodecanediol, tetramethyl ethylene ketone, Isosorbide-5-Nitrae-butynediol, triethylene glycol, glycol ether, dipropylene glycol, the low-molecular-weight diol class that cyclohexanedimethanol etc. are saturated, is reacted the polycarbonate diol class of gained by the above-mentioned glycols of more than at least a kind and carbonyl chloride, using the above-mentioned glycols of more than at least a kind as initiator by oxyethane, propylene oxide, the glycolss such as more than a kind of the monomers such as Epicholorohydrin or the a kind polyether glycol by known method addition polymerization gained, with hexanodioic acid, 3-methyl hexanodioic acid, 2,2,5,5-tetramethyl-hexanodioic acid, toxilic acid, fumaric acid, succsinic acid, 2,2-dimethyl succinate, 2-Ethyl-2-Methyl succsinic acid, 2,3-dimethyl succinate, oxalic acid, propanedioic acid, Methylpropanedioic acid, ethyl malonic acid, butyl malonic acid, dimethyl malonic acid, pentanedioic acid, 2-methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylated pentanedioic acid, 3,3-dimethylated pentanedioic acid, 2,4-dimethylated pentanedioic acid, pimelic acid, suberic acid, nonane diacid, the diprotic acid such as sebacic acid or the acid anhydrides corresponding with them carry out the fatty family polyester glycol class of dehydrating condensation gained, by the fatty family Polyester glycols of the cyclic ester compounds ring-opening polymerization gained such as 6-caprolactone.The polyester glycol class obtained by above-mentioned glycols and dicarboxylic acid both can be used alone, also can by used in combination for two or more polyester glycol class.
In addition, in the adhesive composite of present embodiment, from the view point of the bonding strength improved base materials such as PET, PC, PEN, the weight-average molecular weight of above-mentioned urethane (methyl) acrylate freely can to adjust, to be suitable for using in the scope being less than 25000 more than 8000.As long as the weight-average molecular weight of above-mentioned urethane (methyl) acrylate, in above-mentioned scope, just can obtain flexibility and cohesive force, and the bonding strength with the organic substrate such as PET, PC, PEN can be improved, obtain excellent connection reliability.In addition, from the view point of obtaining above-mentioned effect fully, the weight-average molecular weight of above-mentioned urethane (methyl) acrylate is more preferably more than 10000 and lower than 25000.In addition, if this weight-average molecular weight is lower than 8000, then tend to can not get sufficient flexibility, if be more than 25000, then the mobility of adhesive composite is tended to reduce.
The critical surface tension of above-mentioned urethane (methyl) acrylate is preferably 25 ~ 40mN/m, is more preferably 25 ~ 35mN/m.When the critical surface tension of urethane (methyl) acrylate is 25 ~ 40mN/m, due to close with the critical surface tension of PET, PC, the PEN as adherend, wettability improves, thus can improve bonding strength, obtains excellent connection reliability.In addition, if its critical surface tension is lower than 25mN/m or more than 40mN/m, then the wettability to PET, PC, PEN etc., compatibility poor may be reduced.Think that the critical surface tension of above-mentioned urethane (methyl) acrylate is relevant to ammonia ester bond equivalent, can be adjusted by the number-average molecular weight changing glycol.Such as, if make the number-average molecular weight of glycol increase, then ammonia ester bond equivalent reduces, and critical surface tension tends to reduce.
In addition, the use level of above-mentioned urethane (methyl) acrylate for benchmark with adhesive composite total amount, is preferably 5 ~ 95 quality %, is more preferably 10 ~ 80 quality %.When use level is lower than 5 quality %, thermotolerance is tended to be easy to reduce, if more than 95 quality %, then when using as film, film formative is tended to be easy to reduce.
As present embodiment adhesive composite contained by (c) radical polymerization initiator, all the time known organo-peroxide, azo-compound etc. can be used to produce the compound of free radical by providing energy from outside.As (c) radical polymerization initiator, from the view point of stability, reactivity, consistency, preferably 1 minute half life temperature be 90 ~ 175 DEG C and molecular weight be 180 ~ 1,000 organo-peroxide.Because 1 minute half life temperature is within the scope of this, therefore stability in storage is excellent, improves free-radical polymerised fully, can solidify at short notice.
As (c) radical polymerization initiator, specifically, 1,1,3,3-tetramethyl butyl new decanoate ester peroxide can be enumerated, two (4-tert-butylcyclohexyl) peroxy dicarbonate, two (2-ethylhexyl) peroxy dicarbonate, cumyl new decanoate ester peroxide, 1,1,3,3-tetramethyl butyl new decanoate ester peroxide, dilauroyl peroxide, 1-cyclohexyl-1-methylethyl new decanoate ester peroxide, tertiary hexyl new decanoate ester peroxide, tert-butyl hydroperoxide neodecanoic acid ester, t-butylperoxy pivarate, 1，1，3，3-tetra-methylbutyl peroxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis-(2-ethyihexanoylperoxy) hexane, tertiary hexyl peroxidation-2-ethylhexanoate, tert-butyl hydroperoxide-2-ethylhexanoate, the new heptanoate of tert-butyl hydroperoxide, t-amyl peroxy-2-ethylhexanoate, di-tert-butyl peroxide six hydrogen terephthalate, t-amyl peroxy-3,5,5 Trimethylhexanoic acid ester, 3-hydroxyl-1,1-dimethylbutyl new decanoate ester peroxide, 1，1，3，3-tetra-methylbutyl peroxy-2-ethylhexanoate, t-amyl peroxy neodecanoic acid ester, t-amyl peroxy-2-ethylhexanoate, peroxidation two (3-toluyl), dibenzoyl peroxide, peroxidation two (4-toluyl), tertiary hexyl isopropyl peroxide monocarbonate, tert-butyl hydroperoxide maleic acid ester, tert-butyl hydroperoxide-3,5,5 Trimethylhexanoic acid ester, tert-butyl hydroperoxide laurate, 2,5-dimethyl-2,5-bis-(peroxidation of 3-toluyl) hexane, tert-butyl hydroperoxide-2-ethylhexyl monocarbonate, tertiary hexyl peroxide benzoate, 2,5-dimethyl-2,5-bis-(benzoyl peroxidation) hexane, tert butyl peroxy benzoate, dibutyl peroxidation trimethyladipic acid ester, t-amyl peroxy n-caprylic acid ester, the different nonenoate of t-amyl peroxy, the organo-peroxides such as t-amyl peroxy benzoic ether, 2,2 '-azo two-2,4-methyl pentane nitrile, 1,1 '-azo two (1-acetoxyl group-1-diphenylphosphino ethane), 2,2 '-Diisopropyl azodicarboxylate, 2,2 '-azo two (2-methylbutyronitrile), dimethyl-2,2 '-Diisopropyl azodicarboxylate, 4,4 '-azo two (4-cyanopentanoic acid), 1, the azo-compounds etc. such as 1 '-azo two (1-cyclohexane carbonitrile).
These compounds both can be used alone, and also can two or more compound use.
In addition, as (c) radical polymerization initiator, the compound being produced free radical by the rayed of 150 ~ 750nm can be used.As such compound, such as, Photoinitiation, Photopolymerization, andPhotocuring(is light-initiated, photopolymerization and photocuring), J.-P.Fouassier, HanserPublishers (nineteen ninety-five, p17 ~ p35) in described α-acetparaminosalol amphyl, phosphinoxide to light-struck highly sensitive, therefore more preferably.
These compounds both can be used alone, also can be used in combination with above-mentioned organo-peroxide, azo-compound.
The use level of above-mentioned (c) radical polymerization initiator is preferably 0.1 ~ 500 mass parts relative to (a) thermoplastic resin 100 mass parts, be more preferably 1 ~ 300 mass parts, more preferably 5 ~ 50 mass parts, are particularly preferably 10 ~ 30 mass parts.If (c) use level of radical polymerization initiator is lower than 0.1 mass parts, then adhesive composite tends to not easily solidify fully, if more than 500 mass parts, then stability in storage is tended to be deteriorated.
As long as its entirety of (d) contained by adhesive composite electroconductive particle of present embodiment or surface have the particle of electroconductibility, but when using in the connection of circuit block with splicing ear, preferred median size is less than splicing ear spacing.
As (d) electroconductive particle, the metallicss such as Au, Ag, Ni, Cu, solder can be enumerated, carbon etc.In addition, also can be using dielectric glass, pottery, plastics etc. as core, coating above-mentioned metal, metallics, carbon and the material that obtains on this core.As core using plastics at (d) electroconductive particle, on this core coating above-mentioned metal, metallics, carbon and the material that obtains or hot molten metal particle, owing to there is deformability by heating and pressurizing, therefore when connecting and the contact area of electrode increase, reliability improves, because of but preferably.
In addition, the surface of these (d) electroconductive particle is coating with macromolecule resin etc. the further and particulate that obtains, can suppress to be contacted with each other caused short circuit the insulativity that can improve between telegraph circuit by particle when increasing the use level of electroconductive particle, therefore, can be suitably used alone by or used in combination with (d) electroconductive particle.
About the median size of this (d) electroconductive particle, from the view point of dispersed, electroconductibility, be preferably 1 ~ 18 μm.When containing such (d) electroconductive particle, adhesive composite can preferably use as anisotropic conductive adhesive.
The usage quantity of (d) electroconductive particle is not particularly limited, is preferably 0.1 ~ 30 volume % relative to adhesive composite cumulative volume, be more preferably 0.1 ~ 10 volume %.If its value is lower than 0.1 volume %, then electroconductibility is tended to reduce, if more than 30 volume %, then easy generation is tended in the short circuit of circuit.In addition, volume % depends on the volume of each composition before the solidification of 23 DEG C, but the volume of each composition can utilize proportion to be converted into volume by weight.In addition, also can by be added in graduated cylinder etc. do not make this component dissolves or swelling can make the appropriate solvent (water, alcohol etc.) of this composition good wet, add this composition wherein, the volume added is obtained as the volume of this composition.
In addition, about the adhesive composite of present embodiment, in order to control curing speed, give stability in storage, stablizer can be added.As such stablizer, be not particularly limited, known compound can be used, be preferably the quinone derivative such as benzoquinones, quinhydrones; The amphyls such as 4-methoxyphenol, 4-tert-butyl catechol; The aminoxy derivatives such as 2,2,6,6-tetramethyl piperidine-1-oxygen base, 4-hydroxyl-2,2,6,6-tetramethyl piperidine-1-oxygen base; The hindered amine derivative etc. such as tetramethyl piperidine methyl acrylate.
The use level of stablizer is preferably 0.01 ~ 30 mass parts relative to adhesive composite 100 mass parts, is more preferably 0.05 ~ 10 mass parts.When use level is lower than 0.01 mass parts, wayward curing speed, not easily give stability in storage, when more than 30 mass parts, easily detrimentally affect is brought to the consistency with other composition.
In addition, suitably can add in the adhesive composite of present embodiment with alkoxyl silicone alkane derivatives, the silazane derivatives bonding auxiliary agent such as coupling agent, closely sealed improving agent and flow agent that is representative.As coupling agent, specifically, the compound shown in preferred following general formula (R), it both can be used alone and also can two or more compound use.
[changing 30]
[in formula (R), R 27, R 28and R 29represent the alkoxyl group of the alkyl of hydrogen atom, carbonatoms 1 ~ 5, carbonatoms 1 ~ 5, the alkoxy carbonyl of carbonatoms 1 ~ 5 or aryl independently of one another, R 30represent (methyl) acryl, vinyl, isocyanate group, imidazolyl, sulfydryl, amino, methylamino, dimethylamino, benzylamino, phenyl amino, Cyclohexylamino, morpholinyl, piperazinyl, urea groups or glycidyl, t represents the integer of 1 ~ 10.]
The adhesive composite of present embodiment, in order to relax stress and improve cementability, can merge use rubber constituent.Rubber constituent refers to and shows the composition of caoutchouc elasticity (JISK6200) or show the composition of caoutchouc elasticity by reacting under state originally.Rubber constituent both can be solid in room temperature (25 DEG C) also can be liquid, from the viewpoint preferred liquid improving mobility.As rubber constituent, preferably there is the compound of polyhutadiene skeleton.Rubber constituent can have cyano group, carboxyl, hydroxyl, (methyl) acryl or morpholinyl.In addition, from the view point of raising cementability, preferred side chain or end comprise the rubber constituent of cyano group as high polar group, carboxyl.In addition, even if having polyhutadiene skeleton, in the thermoplastic situation of display, being classified into (a) thermoplastic resin, being classified into (b) free-radical polymerised compound when showing free-radical polymerised.
As rubber constituent, specifically, polyisoprene can be enumerated, polyhutadiene, carboxy terminated polybutadiene, hydroxy-terminated polybutadienes, 1, 2-polyhutadiene, end carboxyl 1, 2-polyhutadiene, terminal hydroxy group 1, 2-polyhutadiene, acrylic rubber, styrene-butadiene rubber(SBR), end hydroxy styrene-butadiene rubber, paracril, polymer ends contains carboxyl, hydroxyl, the paracril of (methyl) acryl or morpholinyl, carboxylated nitrile rubber, terminal hydroxy group gathers (oxypropylene), end alkoxysilyl poly-(oxypropylene), poly-(oxygen butylidene) glycol, polyolefin diols etc.
In addition; as above-mentioned there is high polar group, being at room temperature the rubber constituent of liquid; specifically; can enumerate liquid acrylonitrile butadiene rubber, contain the liquid acrylonitrile butadiene rubber, the carboxylated nitrile rubber of liquid etc. of carboxyl, hydroxyl, (methyl) acryl or morpholinyl in polymer ends, the acrylonitrile content as polar group is preferably 10 ~ 60 quality %.
These compounds both can be used alone and also can two or more compound use.
In addition, in order to relax stress and improve cementability, also organic fine particles can be added in the adhesive composite of present embodiment.The median size of organic fine particles is preferably 0.05 ~ 1.0 μm.In addition, when organic fine particles comprises above-mentioned rubber constituent, not being be categorized into organic fine particles but be categorized into rubber constituent, when organic fine particles comprises above-mentioned (a) thermoplastic resin, is not be categorized into organic fine particles but be categorized into (a) thermoplastic resin.
As organic fine particles, specifically, can enumerate by polyisoprene, polyhutadiene, carboxy terminated polybutadiene, hydroxy-terminated polybutadienes, 1, 2-polyhutadiene, end carboxyl 1, 2-polyhutadiene, acrylic rubber, styrene-butadiene rubber(SBR), paracril, polymer ends contains carboxyl, hydroxyl, the paracril of (methyl) acryl or morpholinyl, carboxylated nitrile rubber, terminal hydroxy group gathers (oxypropylene), end alkoxysilyl poly-(oxypropylene), poly-(oxygen butylidene) glycol, polyolefin diols (methyl) alkyl acrylate-butadiene-styrene copolymer, the organic fine particles of (methyl) alkyl acrylate-Organosiliconcopolymere or organosilicon (methyl)-acrylic copolymer or complex body formation.
These organic fine particles both can be used alone and also can merge use by two or more compound.
The adhesive composite of present embodiment, when being liquid at normal temperatures, can use with pasty state.When being at room temperature solid, both rear use can be heated, also solvent gelatinization can be used.As operable solvent, preferably do not have reactivity with adhesive composite and additive and show sufficient deliquescent solvent, preferably boiling point is at ambient pressure the solvent of 50 ~ 150 DEG C.When boiling point is lower than 50 DEG C, if at room temperature placed, then probably volatilize, tend to be difficult to use in open system.In addition, if boiling point is more than 150 DEG C, be then difficult to make solvent evaporates, often detrimentally affect brought to the reliability after bonding.
In addition, the adhesive composite of present embodiment also can form membranaceous use.Can by adhesive composite as required by adding solution coat that the modes such as solvent obtain on the separability base materials such as fluororesin film, polyethylene terephthalate film, release paper, or make the base materials such as above-mentioned solution impregnation non-woven fabrics and be positioned on separability base material, use as film except desolventizing etc.If used with the shape of film, then from the viewpoints such as operability be more convenient.
The adhesive composite of present embodiment can merge use heating and pressurization makes it bonding.Heating temperature is preferably the temperature of 100 ~ 200 DEG C.Pressure preferably not causing in the scope of damage to adherend, is generally preferably 0.1 ~ 10MPa.These heating and pressurization are preferably carried out in the scope of 0.5 second ~ 120 seconds, also can 120 ~ 190 DEG C, 3MPa, make it bonding under the heating of 10 seconds.
The adhesive composite of present embodiment can use as the caking agent of the different xenogenesis adherend of thermal expansivity.Specifically, can as the circuit connection material being representative with anisotropically conducting adhesive, silver-colored thickener, silverskin etc., CSP elastomerics, CSP underfill, LOC adhesive tape etc. for the semiconductor element adhesives of representative uses.
The adhesive composite of present embodiment uses as connecting the adhesive composite first circuit block and interarea interarea with the first splicing ear with the second circuit parts of the second splicing ear.Here, above-mentioned first circuit block and/or above-mentioned second circuit parts are that the base material of the thermoplastic resin of less than 200 DEG C is formed by comprising second-order transition temperature.As the thermoplastic resin that second-order transition temperature is less than 200 DEG C, be not particularly limited, can enumerate such as, polyethylene terephthalate, polycarbonate and PEN etc.
Next, the connection structural bodies of circuit block of the adhesive composite employing above-mentioned present embodiment is described.Fig. 1 be display employ the adhesive composite of present embodiment, the diagrammatic cross-section of an embodiment of the connection structural bodies of circuit block.Fig. 2 is the diagrammatic cross-section of the first circuit block, second circuit parts and adhesive composite before the connection structural bodies being presented at the circuit block shown in construction drawing 1.
The connection structural bodies 100 of the circuit block shown in Fig. 1 comprises: first circuit block 30 on the interarea 31a of the first circuit substrate 31 with the first splicing ear 32, the second circuit parts 40 that the interarea 41a of second circuit substrate 41 has the second splicing ear 42, connect the interconnecting piece 10C of the interarea 31a of the first circuit substrate 31 and the interarea 41a of second circuit substrate 41 in the mode that the first splicing ear 32 is relative with the second splicing ear 42.First splicing ear 32 is electrically connected each other by contacting with the second splicing ear 42.In addition, interconnecting piece 10C comprises the cured article of the adhesive composite 10 of present embodiment.
The connection structural bodies 100 of the circuit block shown in Fig. 1 such as can manufacture as follows.
First, as shown in Figure 2, prepare the first circuit block 30, second circuit parts 40 and be shaped to membranaceous adhesive composite 10.Next, adhesive composite 10 is placed on the interarea 41a being formed with the second splicing ear 42 in second circuit parts 40, then, adhesive composite 10 places the first circuit block 30 in the mode that the first splicing ear 32 is relative with the second splicing ear 42.Then, while carry out caking agent composition 10 while make it solidify across the first circuit block 30 and second circuit parts 40, pressurize in the direction vertical with interarea 31a, 41a simultaneously, between the first and second circuit blocks 30,40, form interconnecting piece 10C, thus obtain the connection structural bodies 100 of the circuit block of Fig. 1.
Fig. 3 is the diagrammatic cross-section that display employs an embodiment of the connection structural bodies of the circuit block of the adhesive composite of the present embodiment containing (d) electroconductive particle.Fig. 4 is the diagrammatic cross-section of the first circuit block, second circuit parts and adhesive composite (containing electroconductive particle) before the connection structural bodies being presented at the circuit block shown in construction drawing 3.
The connection structural bodies 200 of the circuit block shown in Fig. 3 comprises: the interarea 41a interarea 31a of the first circuit substrate 31 with the first circuit block 30 of the first splicing ear 32, second circuit substrate 41 has the second circuit parts 40 of the second splicing ear 42, connects the interconnecting piece 20C of the interarea 31a of the first circuit substrate 31 and the interarea 41a of second circuit substrate 41 in the mode that the first splicing ear 32 is relative with the second splicing ear 42.In addition, (namely interconnecting piece 20C is dispersed with the cured article of the adhesive composite 20 of electroconductive particle 22 in the composition 21 except electroconductive particle of adhesive composite, the material of electroconductive particle 22 is dispersed with) in the cured article 21C of the composition except electroconductive particle of adhesive composite, between the first relative splicing ear 32 and the second splicing ear 42, by electroconductive particle 22 is contacted with two splicing ears, thus via electroconductive particle 22, two splicing ears are electrically connected.
The connection structural bodies 200 of the circuit block shown in Fig. 3, such as shown in Figure 4, by preparation first circuit block 30, second circuit parts 40 and membranaceous adhesive composite 20 can be shaped to, utilize the method same with the connection structural bodies 100 obtaining above-mentioned circuit block to manufacture.
Here, at least one in the first circuit block 30 and second circuit parts 40 is made up of the base material of the thermoplastic resin containing second-order transition temperature being less than 200 DEG C.That is, at least one in the first circuit substrate 31 and second circuit substrate 41 contains the thermoplastic resin that second-order transition temperature is less than 200 DEG C.Here, be the thermoplastic resin of less than 200 DEG C as second-order transition temperature, be preferably selected from least a kind of resin in the group of polyethylene terephthalate, polycarbonate and PEN composition.If at least one in the first circuit block 30 and second circuit parts 40 is the circuit block be made up of the base material containing at least a kind of material be selected from polyethylene terephthalate, polycarbonate and PEN, then can improves with the wettability of adhesive composite, improve bonding strength further.Therefore, the connection structural bodies of such circuit block can obtain more excellent connection reliability.
In addition, one in the first circuit block 30 and second circuit parts 40 can be made up of the base material not containing at least a kind of material be selected from polyethylene terephthalate, polycarbonate and PEN.As the base material forming such circuit block, can use comprise the inorganicss such as semi-conductor, glass, pottery base material, comprise the organic base materials such as polyimide, make the inorganicss such as glass/epoxy and organism combine the base material etc. of gained.
In addition, at least one in the first splicing ear 32 and the second splicing ear 42 preferably formed by least a kind that is selected from ITO and IZO.ITO and IZO is owing to easily etching and pattern excellent in workability, therefore preferred as splicing ear.And, by using the adhesive composite of present embodiment, the corrosion of the splicing ear be made up of ITO and/or IZO can be suppressed fully.
In addition, one or two in the first splicing ear 32 and the second splicing ear 42 can be made up of the material except ITO and IZO.As such splicing ear, the splicing ear comprising the metals such as copper, silver, aluminium, gold, palladium, nickel and their alloy can be used.
In addition, as the adhesive composite of the present embodiment that interconnecting piece uses, not needing to solidify completely (solidification of the topnotch that can reach under regulation condition of cure), as long as produce above-mentioned characteristic, can be partially cured state.
Embodiment
Below, specifically describe present embodiment based on embodiment, but present embodiment is not limited to this.
< thermoplastic resin >
(modulation of phenoxy resin)
Phenoxy resin (Toto Kasei KK's system, YP-50 (trade(brand)name)) 40 mass parts are dissolved in the solution making solids component 40 quality % in methyl ethyl ketone 60 mass parts.
(preparation of polyester urethane resin)
The 1:1 mixed solvent of methyl ethyl ketone and toluene that polyester urethane resin (Co., Ltd.'s system is spun by Japan, UR-1400 (trade(brand)name)) employs resinous principle 30 quality % dissolves product.
(synthesis of urethane resin)
In the reaction vessel possessing stirrer, thermometer, the reflux cooling pipe possessing calcium chloride tube, nitrogen ingress pipe, by polybutylene glyool adipate 450 mass parts of weight-average molecular weight 2000, polyoxytetramethylene glycol 450 mass parts and 1 of weight-average molecular weight 2000,4-butyleneglycol 100 mass parts mixes equably in methyl ethyl ketone 4000 mass parts, add diphenylmethanediisocyanate 390 mass parts, react at 70 DEG C, obtain the urethane resin of weight-average molecular weight 350,000.
< free-radical polymerised compound >
(preparation of urethane acrylate (L-1600S))
Prepare the urethane acrylate (Mitsui urethane Co., Ltd. system, L-1600S (trade(brand)name)) that weight-average molecular weight is 15000, critical surface tension is 15mN/m.In addition, L-1600S uses ether system glycol and obtains, and does not meet above-mentioned general formula (A).
(synthesis of urethane acrylate (PE-UA1))
In the reaction vessel possessing stirrer, thermometer, the reflux cooling pipe possessing calcium chloride tube, nitrogen ingress pipe, add poly-(3-methylpentane adipic acid ester) glycol (aliphatic poly esterdiol of number-average molecular weight 2000, society of Kuraray Co., Ltd. system, POLYOLP-2010 (trade(brand)name)) 2000 mass parts (1.00 moles), dibutyltin dilaurate (Aldrich Co., Ltd. system) 5.53 mass parts.Import nitrogen fully, be then heated to 70 ~ 75 DEG C, drip dicyclohexyl methyl hydride 4 equably through 3 hours, 4 '-vulcabond (aliphatic diisocyanate, Evonik Degussa Corp.'s system, VESTANATH 12dMI (trade(brand)name)) 787 mass parts (3.00 moles), make it react.After dropping terminates, continue reaction about 10 hours.Add vinylformic acid 2-hydroxyl ethyl ester (Aldrich Co., Ltd. system) 238 mass parts (2.05 moles), Hydroquinone monomethylether (Aldrich Co., Ltd. system) 0.53 mass parts wherein, it is made to react 10 hours again, measured by IR and confirm that isocyanic ester disappears, terminate reaction, thus obtain urethane acrylate.The critical surface tension of the urethane acrylate (PE-UA1) of gained is 30mN/m, and weight-average molecular weight is 15300.In addition, PE-UA1 uses polyester glycol and obtains, and meets above-mentioned general formula (A).
(synthesis of urethane acrylate (PE-UA2))
In the reaction vessel possessing stirrer, thermometer, the reflux cooling pipe possessing calcium chloride tube, nitrogen ingress pipe, add polycaprolactone glycol (the aliphatic poly esterdiol of number-average molecular weight 2000, trade(brand)name: PLACCEL220EB, Daisel chemical industry Co., Ltd's system) 2000 mass parts (1.00 moles), dibutyltin dilaurate (Aldrich Co., Ltd. system) 5.53 mass parts.Import nitrogen fully, be then heated to 70 ~ 75 DEG C, dripped isophorone diisocyanate (aliphatic diisocyanate, Aldrich Co., Ltd. system) 666 mass parts (3.00 moles) through 3 hours equably, make it react.After dropping terminates, continue reaction about 10 hours.Add vinylformic acid 2-hydroxyl ethyl ester (Aldrich Co., Ltd. system) 238 mass parts (2.05 moles), Hydroquinone monomethylether (Aldrich Co., Ltd. system) 0.53 mass parts wherein, it is made to react 10 hours again, measured by IR and confirm that isocyanic ester disappears, terminate reaction, thus obtain urethane acrylate.The critical surface tension of the urethane acrylate (PE-UA2) of gained is 25mN/m, and weight-average molecular weight is 13500.In addition, PE-UA2 uses polyester glycol and obtains, and meets above-mentioned general formula (A).
(synthesis of urethane acrylate (PE-UA3))
Possessing stirrer, thermometer, possesses the reflux cooling pipe of calcium chloride tube, in the reaction vessel of nitrogen ingress pipe, add vinylformic acid 2-hydroxyl ethyl ester (Aldrich Co., Ltd. system) 238 mass parts (2.05 moles), Hydroquinone monomethylether (Aldrich Co., Ltd. system) 0.53 mass parts, polycaprolactone glycol (the aliphatic poly esterdiol of number-average molecular weight 1000, trade(brand)name: PLACCEL210N, Daisel chemical industry Co., Ltd's system) 2000 mass parts (2.00 moles), dibutyltin dilaurate (Aldrich Co., Ltd. system) 5.53 mass parts.Import nitrogen fully, be then heated to 70 ~ 75 DEG C, dripped isophorone diisocyanate (aliphatic diisocyanate, Aldrich Co., Ltd. system) 666 mass parts (3.00 moles) through 3 hours equably, make it react.After dropping terminates, continue reaction about 10 hours, measured by IR and confirm that isocyanic ester disappears, terminate reaction, thus obtain urethane acrylate.The critical surface tension of the urethane acrylate (PE-UA3) of gained is 28mN/m, and weight-average molecular weight is 14500.In addition, PE-UA3 uses polyester glycol and obtains, and meets above-mentioned general formula (A).
(synthesis of urethane acrylate (PE-UA4))
In the reaction vessel possessing stirrer, thermometer, the reflux cooling pipe possessing calcium chloride tube, nitrogen ingress pipe, add 3-methyl isophthalic acid, 5-pentanediol 1650 mass parts (14 moles) and m-phthalic acid 1660 mass parts (10 moles), import nitrogen fully at ambient pressure, then at about 170 DEG C, generated water is distilled removing while carry out esterification in system.When the acid number of polyester becomes below 0.3mgKOH/g, by vacuum pump little by little Raise vacuum degree, reaction is terminated.The aromatic polyester glycol (ED-1) of such acquisition has number-average molecular weight 2000.
Then, in the reaction vessel possessing stirrer, thermometer, the reflux cooling pipe possessing calcium chloride tube, nitrogen ingress pipe, add aromatic polyester glycol (ED-1) 2000 mass parts (1.00 moles), dibutyltin dilaurate (Aldrich Co., Ltd. system) 5.53 mass parts of gained.Import nitrogen fully, be then heated to 70 ~ 75 DEG C, dripped isophorone diisocyanate (aliphatic diisocyanate, Aldrich Co., Ltd. system) 666 mass parts (3.00 moles) through 3 hours equably, make it react.After dropping terminates, continue reaction about 15 hours.Add vinylformic acid 2-hydroxyl ethyl ester (Aldrich Co., Ltd. system) 238 mass parts (2.05 moles), Hydroquinone monomethylether (Aldrich Co., Ltd. system) 0.53 mass parts wherein, it is made to react 7 hours again, measured by IR and confirm that isocyanic ester disappears, terminate reaction, thus obtain urethane acrylate.The critical surface tension of the urethane acrylate (PE-UA4) of gained is 42mN/m, and weight-average molecular weight is 11500.In addition, PE-UA4 uses polyester glycol and obtains, and meets above-mentioned general formula (A).
(synthesis of urethane acrylate (PE-UA5))
In the reaction vessel possessing stirrer, thermometer, the reflux cooling pipe possessing calcium chloride tube, nitrogen ingress pipe, add poly-(1 of number-average molecular weight 2000,6-hexylene glycol carbonic ether) glycol (Aliphatic Polycarbonatediols, Asahi Chemical Corp's system, PCDLT5652 (trade(brand)name)) 4000 mass parts (2.00 moles), dibutyltin dilaurate (Aldrich Co., Ltd. system) 5.53 mass parts.Import nitrogen fully, be then heated to 70 ~ 75 DEG C, dripped isophorone diisocyanate (aliphatic diisocyanate, Aldrich Co., Ltd. system) 666 mass parts (3.00 moles) through 3 hours equably, make it react.After dropping terminates, continue reaction about 15 hours.Add vinylformic acid 2-hydroxyl ethyl ester (Aldrich Co., Ltd. system) 238 mass parts (2.05 moles), Hydroquinone monomethylether (Aldrich Co., Ltd. system) 0.53 mass parts wherein, it is made to react 10 hours again, measured by IR and confirm that isocyanic ester disappears, terminate reaction, thus obtain urethane acrylate.The critical surface tension of the urethane acrylate (PE-UA5) of gained is 21mN/m, and weight-average molecular weight is 30000.In addition, PE-UA5 uses polycarbonate diol and obtains, and does not meet above-mentioned general formula (A).
(preparation of isocyanuric acid modification 2 functional acrylate (M-215))
Prepare isocyanuric acid modification 2 functional acrylate (Toagosei Co., Ltd's system, M-215 (trade(brand)name)).
(there is the preparation of the vinyl compound (P-2M) of phosphate)
Prepare 2-(methyl) acryloyl-oxyethyl phosphoric acid ester (trade(brand)name: lightesterP-2M, Kyoeisha Chemical Co., Ltd.'s system).
< radical polymerization initiator >
Prepare the dibenzoyl peroxide (trade(brand)name: NiparBW, Japan Oil Co's system) as radical polymerization initiator.
< electroconductive particle >
(making of electroconductive particle)
Using the nickel dam of polystyrene as the surperficial thickness setting 0.2 μm of the particle of core, in the layer gold of the arranged outside thickness 0.02 μm of this nickel dam, thus make the electroconductive particle of median size 10 μm, proportion 2.5.
[embodiment 1 ~ 7, reference example 8 ~ 10 and comparative example 1 ~ 5]
According to the solid masses shown in table 2 than coordinating thermoplastic resin, free-radical polymerised compound and radical polymerization initiator, then making electroconductive particle 1.5 volume % coordinate dispersion, thus obtaining adhesive composite.Use coating unit to be coated on by the adhesive composite of gained on the fluororesin film of thickness 80 μm, the thickness obtaining bond layer by the warm air dryings of 70 DEG C, 10 minutes is the film-like adhesive composition of 20 μm.
[table 2]
(mensuration of contact resistance, bonding strength)
Make the film-like adhesive composition of embodiment 1 ~ 7, reference example 8 ~ 10 and comparative example 1 ~ 5 have on polyimide film (Tg350 DEG C) 80 live widths 150 μm, spacing 300 μm, thickness 8 μm copper circuit flexible electric circuit board (FPC) and be formed thickness 5 μm Ag thickener thin layer pet substrate (thickness 0.1mm) between.In addition, make the film-like adhesive composition of embodiment 1 ~ 7, reference example 8 ~ 10 and comparative example 1 ~ 5 have on polyimide film 80 live widths 150 μm, spacing 300 μm, thickness 18 μm copper circuit FPC and be formed on PET (thickness 0.1mm) film live width 150 μm, spacing 300 μm, thickness 10 μm Ag thickener circuit substrate between.They are used respectively thermo-compression bonding device (type of heating: permanent pattern of fever, Dong Li engineering society system), 150 DEG C, heating and pressurizing 10 seconds under the condition of 2MPa, connect and relate to wide 2mm, thus make linker.Firm bonding after and 85 DEG C, keep 240 hours in the hot and humid groove of 85%RH after (after test) by the resistance value between the adjacent circuit of these linkers of multitester measuring.Resistance value represents with the mean value of the resistance between 37 place's adjacent circuits.
In addition, measured the bonding strength of each linker according to JIS-Z0237 by 90 degree of stripping methods, evaluate.Here, the determinator of bonding strength uses Baldwin Co., Ltd. of Japan TENSILONUTM-4 (peeling rate 50mm/ minute, 25 DEG C).Contact resistance and the determining bonding strength result of the film-like adhesive composition as above carried out are shown in following table 3.
[table 3]
The adhesive composite of embodiment 1 ~ 7, Heating temperature 150 DEG C, firm bonding after and 85 DEG C, keep 240 hours in the hot and humid groove of 85%RH after (after test), the display good contact resistance of about 1.2 below Ω and the good bonding strength of more than 600N/m.
On the other hand, although the adhesive composite of comparative example 1 and 3 firm bonding after and 85 DEG C, keep 240 hours in the hot and humid groove of 85%RH after (after test), show good contact resistance, bonding strength step-down.In addition, the adhesive composite of comparative example 2,4 and 5 firm bonding after and 85 DEG C, keep 240 hours in the hot and humid groove of 85%RH after the contact resistance of (after test) high, bonding strength is also low than embodiment 1 ~ 7.
On the other hand, the adhesive composite of reference example 8 ~ 10 firm bonding after and 85 DEG C, keep 240 hours in the hot and humid groove of 85%RH after (after test), the good contact resistance of display about 1.2 below Ω, and, compare with 3 with comparative example 1, bonding strength is excellent.
[embodiment 11 ~ 13 and comparative example 6 and 7]
In addition, the film-like adhesive composition of embodiment 3,4 and 7 and comparative example 3 and 4 had respectively on polyimide film 80 live widths 150 μm, spacing 300 μm, the flexible electric circuit board (FPC) of copper circuit of thickness 8 μm and PET film (thickness 0.1mm, Tg120 DEG C), between PC film (thickness 0.1mm, Tg150 DEG C) and pen film (thickness 0.1mm, Tg160 DEG C).They are used respectively thermo-compression bonding device (type of heating: permanent pattern of fever, Dong Li engineering society system), 150 DEG C, heating and pressurizing 10 seconds under the condition of 2MPa, crimping relates to wide 2mm, thus makes linker.
In addition, the bonding strength of each linker is measured in the same manner as aforesaid method.The measurement result of the bonding strength of the film-like adhesive composition as above carried out is shown in following table 4.
[table 4]
The adhesive composite that embodiment 11 ~ 13 uses, to any base material, Heating temperature 150 DEG C, firm bonding after and 85 DEG C, keep 240 hours in the hot and humid groove of 85%RH after (after test), all show the good bonding strength of more than 600N/m.On the other hand, use the adhesive composite of comparative example 6 and 7 gained, firm bonding after and 85 DEG C, keep 240 hours in the hot and humid groove of 85%RH after (after test), bonding strength step-down.
[reference example 1 ~ 6]
As a reference example, the film-like adhesive composition of embodiment 3,4,6 and 7 and comparative example 1 and 3 is had between 500 live widths 25 μm, spacing 50 μm, the flexible electric circuit board (FPC) of copper circuit of thickness 8 μm and the glass (thickness 1.1mm, surface resistivity 20 Ω/) of ITO thin layer being formed with 0.2 μm on polyimide film.Used thermo-compression bonding device (type of heating: permanent pattern of fever, Dong Li engineering society system), 150 DEG C, heating and pressurizing 10 seconds under the condition of 2MPa, connect and relate to wide 2mm, thus make linker.Firm bonding after and 85 DEG C, keep 240 hours in the hot and humid groove of 85%RH after (after test) by the resistance value between the adjacent circuit of this linker of multitester measuring.Resistance value represents with the mean value of the resistance between 37 place's adjacent circuits.
In addition, measured the bonding strength of each linker according to JIS-Z0237 by 90 degree of stripping methods, evaluate.Here, the determinator of bonding strength uses Baldwin Co., Ltd. of Japan TENSILONUTM-4 (peeling rate 50mm/ minute, 25 DEG C).As above the contact resistance of film-like adhesive composition carried out and the measurement result of bonding strength are shown in following table 5.
[table 5]
As implied above, the adhesive composite of comparative example contact resistance, bonding strength when adherend is PET film, PC film and pen film is poor.But, as shown in table 5, when adherend is the glass with ITO, in the whole reference examples 1 ~ 6 comprising the adhesive composite using comparative example, confirm firm bonding after and 85 DEG C, keep 240 hours in the hot and humid groove of 85%RH after (after test), all can obtain the good contact resistance of 2.5 below Ω and the good bonding strength of more than 680N/m.
Industry utilizability
According to the present embodiment, can provide for organic substrates such as polyethylene terephthalate, polycarbonate, PENs, even if the adhesive composite of stable performance (bonding strength, contact resistance) also can be kept even if excellent bonding strength also can be obtained under the condition of cure of low temperature, employ the application of the connection structural bodies of the circuit block of this adhesive composite, the manufacture method of connection structural bodies and adhesive composite after long reliability test (high temperature and humidity test).
Nomenclature
10,20 is adhesive composite;
10C, 20C are interconnecting piece;
21 for not comprising the adhesive composite of electroconductive particle;
22 is electroconductive particle;
21C is the cured article of the adhesive composite not comprising electroconductive particle;
30 is the first circuit block;
31 is the first circuit substrate;
31a is interarea;
32 is the first splicing ear;
40 is second circuit parts;
41 is second circuit substrate;
41a is interarea;
42 is the second splicing ear;
100,200 is the connection structural bodies of circuit block.

Claims (24)

1. a connection structural bodies for circuit block, it possesses first circuit block interarea with the first splicing ear, second circuit parts and the interconnecting piece interarea with the second splicing ear,
Described first circuit block and described second circuit parts configure in the described first splicing ear mode relative with described second splicing ear via described interconnecting piece, and described first splicing ear and described second splicing ear are electrically connected,
Described interconnecting piece is the cured article of adhesive composite, described adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, described (b) free-radical polymerised compound comprises by urethane (methyl) acrylate shown in following general formula (A)
A circuit block in described first circuit block or described second circuit parts is made up of the base material containing at least a kind of material be selected from the group that is made up of polyethylene terephthalate, polycarbonate and PEN,
Another circuit block in described first circuit block or second circuit parts is made up of the base material containing at least a kind of material be selected from the group that is made up of polyimide resin and polyethylene terephthalate,
In formula (A), R 1and R 2represent hydrogen atom or methyl independently of one another, R 3represent ethylidene, propylidene, by the derivative group of the opened loop compound of 6-caprolactone or by the group shown in following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5represent by the group shown in following general formula (B), a represents the integer of 1 ~ 40,
In formula (B), R 6and R 7represent the alkylidene group of the straight or branched of carbonatoms 2 ~ 12 independently of one another, b represents the integer of 1 ~ 10, and c represents the integer of 1 ~ 25, in addition, in formula, and R 6each other, R 7each other, b can be the same or different each other with c each other.
2. require the connection structural bodies of the circuit block described in 1 according to profit, wherein, described urethane (methyl) acrylate is obtained by the condensation reaction of fatty family vulcabond and polyester glycol.
3. the connection structural bodies of the circuit block described in 2 is required according to profit, wherein, described fatty family vulcabond is fourth vulcabond, hexamethylene diisocyanate, lysinediisocyanate, 2-methylpentane-1, 5-vulcabond, 3-methylpentane-1, 5-vulcabond, 2, 2, 4-tri-methyl hexamethylene-1, 6-vulcabond, 2, 4, 4-tri-methyl hexamethylene-1, 6-vulcabond, isophorone diisocyanate, cyclohexyl diisocyanate, hydrogenation of benzene dimethylene diisocyanate, hydrogenated diphenyl methane diisocyanate or hydrogenation Three methyl Benzene dimethylene diisocyanate.
4. require the connection structural bodies of the circuit block described in 2 or 3 according to profit, wherein, described polyester glycol is fatty family polyester glycol or fragrant family polyester glycol.
5. require the connection structural bodies of the circuit block described in 4 according to profit, wherein, described fatty family polyester glycol is: by ethylene glycol, propylene glycol, 1,3 butylene glycol, BDO, neopentyl glycol, 1,2-pentanediol, Isosorbide-5-Nitrae-pentanediol, 1,5-PD, 2,4-pentanediol, 2-methyl-2,4-pentanediol, 2,4-dimethyl-2,4-pentanediol, 2,2,4-trimethylammonium-1,3-pentanediol, 1,2-hexylene glycol, 1,5-hexylene glycol, 1,6-hexylene glycol, 2,5-hexylene glycol, 2-ethyl-1,3-hexylene glycol, 2,5-dimethyl-2,5-hexylene glycol, 1,2-ethohexadiol, 1,8-ethohexadiol, 1,7-heptanediol, 1,9-nonanediol, 1,2-decanediol, decamethylene-glycol, dodecanediol, tetramethyl ethylene ketone, triethylene glycol, glycol ether, dipropylene glycol or cyclohexanedimethanol and saturated low-molecular-weight diol class, reacted the polycarbonate diol class of gained by the described low-molecular-weight diol class of more than at least a kind and carbonyl chloride, or the described low-molecular-weight diol class of more than at least a kind will be selected from oxyethane as initiator, propylene oxide, the polyether glycol of at least a kind of addition polymerization gained of Epicholorohydrin and glycols, with hexanodioic acid, 3-methyl hexanodioic acid, 2,2,5,5-tetramethyl-hexanodioic acid, toxilic acid, fumaric acid, succsinic acid, 2,2-dimethyl succinate, 2-Ethyl-2-Methyl succsinic acid, 2,3-dimethyl succinate, oxalic acid, propanedioic acid, Methylpropanedioic acid, ethyl malonic acid, butyl malonic acid, dimethyl malonic acid, pentanedioic acid, 2-methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylated pentanedioic acid, 3,3-dimethylated pentanedioic acid, 2,4-dimethylated pentanedioic acid, pimelic acid, suberic acid, the diprotic acid of nonane diacid or sebacic acid or dibasic acid anhydride carry out dehydrating condensation and obtain.
6. require the connection structural bodies of the circuit block described in 4 according to profit, wherein, cyclic ester compounds ring-opening polymerization obtains by described fatty family polyester glycol.
7. the connection structural bodies of circuit block according to claim 1 and 2, wherein, the weight-average molecular weight of described urethane (methyl) acrylate is more than 8000 and is less than 25000.
8. the connection structural bodies of circuit block according to claim 1 and 2, wherein, the weight-average molecular weight of described urethane (methyl) acrylate is more than 10000 and is less than 25000.
9. the connection structural bodies of circuit block according to claim 1 and 2, wherein, the use level of described urethane (methyl) acrylate for benchmark, is 5 ~ 95 quality % with described adhesive composite total amount.
10. the connection structural bodies of circuit block according to claim 1 and 2, wherein, described (b) free-radical polymerised compound contains the vinyl compound with phosphate of more than a kind and the free-radical polymerised compound except the described vinyl compound with phosphate of more than a kind.
11. require the connection structural bodies of the circuit block described in 10 according to profit, and wherein, the described vinyl compound containing phosphate is the compound shown in following general formula (O) ~ (Q),
In formula (O), R 22represent (methyl) acryloxy, R 23represent hydrogen atom or methyl, n and o represents the integer of 1 ~ 8 independently of one another; In addition, in formula, R 22each other, R 23each other, n is identical or different each other with o each other,
In formula (P), R 24represent (methyl) acryloxy, p and q represents the integer of 1 ~ 8 independently of one another; In addition, in formula, R 24each other, p is identical or different each other with q each other,
In formula (Q), R 25represent (methyl) acryloxy, R 26represent hydrogen atom or methyl, r and s represents the integer of 1 ~ 8 independently of one another; In addition, in formula, R 26identical or different each other with r each other.
12. require the connection structural bodies of the circuit block described in 10 according to profit, and wherein, the use level of the described vinyl compound containing phosphate is 0.2 ~ 300 mass parts relative to described (a) thermoplastic resin 100 mass parts.
The connection structural bodies of 13. circuit blocks according to claim 10, wherein, except the described use level containing the free-radical polymerised compound except the vinyl compound of phosphate, be 50 ~ 250 mass parts relative to described (a) thermoplastic resin 100 mass parts.
The connection structural bodies of 14. circuit blocks according to claim 1 and 2, wherein, described (a) thermoplastic resin contains at least a kind of resin in the group being selected from and being made up of phenoxy resin, urethane resin, butyral resin, acrylic resin and polyimide resin.
The connection structural bodies of 15. circuit blocks according to claim 1 and 2, wherein, the weight-average molecular weight of described (a) thermoplastic resin is 5000 ~ 150000.
16. the connection structural bodies of circuit block according to claim 1 and 2, wherein, the content of described (a) thermoplastic resin for benchmark, is 5 ~ 80 quality % with described adhesive composite total amount.
The connection structural bodies of 17. circuit blocks according to claim 1 and 2, wherein, described (c) radical polymerization initiator is organo-peroxide or azo-compound.
The connection structural bodies of 18. circuit blocks according to claim 1 and 2, wherein, the use level of described (c) radical polymerization initiator is 0.1 ~ 500 mass parts relative to described (a) thermoplastic resin 100 mass parts.
The connection structural bodies of 19. circuit blocks according to claim 1 and 2, wherein, described adhesive composite is also containing (d) electroconductive particle.
The connection structural bodies of 20. circuit blocks according to claim 19, wherein, the usage quantity of described (d) electroconductive particle is 0.1 ~ 30 volume % relative to adhesive composite cumulative volume.
The connection structural bodies of 21. circuit blocks according to claim 1 and 2, wherein, described interconnecting piece is the cured article of the anisotropic conductive adhesive containing described adhesive composite.
The manufacture method of the connection structural bodies of 22. 1 kinds of circuit blocks, comprises following operation:
By the operation that the second circuit parts that first circuit block interarea with the first splicing ear and interarea have the second splicing ear configure in the mode that described first splicing ear is relative with described second splicing ear via adhesive composite,
Described adhesive composite is heated, makes it solidify, connect the operation of described first circuit block and described second circuit parts,
Described adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, described (b) free-radical polymerised compound comprises by urethane (methyl) acrylate shown in following general formula (A)
A circuit block in described first circuit block or described second circuit parts is made up of the base material containing at least a kind of material be selected from the group that is made up of polyethylene terephthalate, polycarbonate and PEN,
Another circuit block in described first circuit block or second circuit parts is made up of the base material containing at least a kind of material be selected from the group that is made up of polyimide resin and polyethylene terephthalate,
In formula (A), R 1and R 2represent hydrogen atom or methyl independently of one another, R 3represent ethylidene, propylidene, by the derivative group of the opened loop compound of 6-caprolactone or by the group shown in following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5represent by the group shown in following general formula (B), a represents the integer of 1 ~ 40,
In formula (B), R 6and R 7represent the alkylidene group of the straight or branched of carbonatoms 2 ~ 12 independently of one another, b represents the integer of 1 ~ 10, and c represents the integer of 1 ~ 25, in addition, in formula, and R 6each other, R 7each other, b can be the same or different each other with c each other.
23. 1 kinds of adhesive composites as the application of circuit connection material, described circuit connection material for connecting the first circuit block and second circuit parts,
Described adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, described (b) free-radical polymerised compound comprises by urethane (methyl) acrylate shown in following general formula (A)
A circuit block in described first circuit block or described second circuit parts is made up of the base material containing at least a kind of material be selected from the group that is made up of polyethylene terephthalate, polycarbonate and PEN,
Another circuit block in described first circuit block or second circuit parts is made up of the base material containing at least a kind of material be selected from the group that is made up of polyimide resin and polyethylene terephthalate,
In formula (A), R 1and R 2represent hydrogen atom or methyl independently of one another, R 3represent ethylidene, propylidene, by the derivative group of the opened loop compound of 6-caprolactone or by the group shown in following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5represent by the group shown in following general formula (B), a represents the integer of 1 ~ 40,
In formula (B), R 6and R 7represent the alkylidene group of the straight or branched of carbonatoms 2 ~ 12 independently of one another, b represents the integer of 1 ~ 10, and c represents the integer of 1 ~ 25, in addition, in formula, and R 6each other, R 7each other, b can be the same or different each other with c each other.
24. 1 kinds of adhesive composite application in the manufacture of circuit connection material, described circuit connection material for connecting the first circuit block and second circuit parts,
Described adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound and (c) radical polymerization initiator, described (b) free-radical polymerised compound comprises by urethane (methyl) acrylate shown in following general formula (A)
A circuit block in described first circuit block or described second circuit parts is made up of the base material containing at least a kind of material be selected from the group that is made up of polyethylene terephthalate, polycarbonate and PEN,
Another circuit block in described first circuit block or second circuit parts is made up of the base material containing at least a kind of material be selected from the group that is made up of polyimide resin and polyethylene terephthalate,
In formula (A), R 1and R 2represent hydrogen atom or methyl independently of one another, R 3represent ethylidene, propylidene, by the derivative group of the opened loop compound of 6-caprolactone or by the group shown in following general formula (B), R 4represent saturated aliphatic groups or saturated fat ring type group, R 5represent by the group shown in following general formula (B), a represents the integer of 1 ~ 40,
In formula (B), R 6and R 7represent the alkylidene group of the straight or branched of carbonatoms 2 ~ 12 independently of one another, b represents the integer of 1 ~ 10, and c represents the integer of 1 ~ 25, in addition, in formula, and R 6each other, R 7each other, b can be the same or different each other with c each other.
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