KR102261617B1 - Adhesive composition, circuit connecting material, circuit connection structrue, and adhesive sheet - Google Patents

Abstract

화학식 (1) 중, X₁ 및 X₂는 동일하거나 상이할 수도 있고, 아크릴로일기, 메타크릴로일기 또는 수소 원자를 나타내며, 적어도 한쪽은 아크릴로일기 또는 메타크릴로일기이고, n은 8 내지 15의 정수를 나타낸다.The adhesive composition of the present invention contains a radically polymerizable substance and a radical polymerization initiator, and as a radically polymerizable substance, a first radically polymerizable substance represented by the following general formula (1) and two or more (meth)acryloyl groups It contains 2nd radically polymerizable substances other than the 1st radically polymerizable substance which has, and contains dilauroyl peroxide as a radical polymerization initiator.

In the formula (1), X ₁ and X ₂ may be the same or different, and represent an acryloyl group, a methacryloyl group or a hydrogen atom, at least one of which is an acryloyl group or a methacryloyl group, and n is 8 to Represents an integer of 15.

Description

Adhesive composition, circuit connection material, circuit connection structure, and adhesive sheet {ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CIRCUIT CONNECTION STRUCTRUE, AND ADHESIVE SHEET}

The present invention relates to an adhesive composition, a circuit connection material, a circuit connection structure, and an adhesive sheet.

As a circuit connection material for a semiconductor element or a liquid crystal display element, the thermosetting resin composition using the epoxy resin which is highly adhesive and shows high reliability is known (for example, refer patent document 1). As the constituent components of the thermosetting resin composition, a curing agent such as an epoxy resin, a phenol resin having reactivity with the epoxy resin, and a latent curing agent that promotes the reaction between the epoxy resin and the curing agent are generally used. In addition, for the purpose of ensuring storage stability at room temperature, a latent curing agent may be used. The latent curing agent is an important factor determining the curing temperature and curing rate, and various compounds are used from the viewpoint of storage stability at room temperature and curing rate upon heating.

In recent years, the radically curable adhesive which used together radical polymerizable substances, such as an acrylate derivative and a methacrylate derivative, and the peroxide which is a radical polymerization initiator, attracts attention. Since radical curing adhesives are highly reactive with radicals as reactive active species, they can be cured at low temperature and in a short time (for example, refer to Patent Documents 2 and 3).

However, with the multifunctionalization of the display device, an input device represented by a touch panel is widely used. Also in manufacture of this touchscreen, the circuit connection material is used for the connection of the sensor of a touchscreen, and peripheral circuit member.

Depending on the display device, the configuration of the mounted touch panel is different and diversified. In the case of multifunctional mobile phones (smartphones) and tablet PCs, from the viewpoint of low price and weight reduction, films such as polyethylene terephthalate (PET), polycarbonate (PC), and polyethylene naphthalate (PEN) are the base of the touch panel sensor. It is being studied or applied as a film. On the other hand, in the case of liquid crystal displays, since the circuit formation technology cultivated in the production of liquid crystal displays can be diverted, there are many examples in which liquid crystal display manufacturers produce touch panels in which touch panel sensors are installed on glass. In the liquid crystal display provided with this touch panel, since the glass which installs a touch panel sensor and the glass of a liquid crystal display are common for thickness reduction, a polarizing plate film with low heat resistance is located near the connection part of a circuit member.

Japanese Patent Laid-Open No. Hei1-113480 Japanese Patent Laid-Open No. 2002-203427 International Publication No. WO98/044067

As described above, when the base of the touch panel sensor is a resin film or when a member with low heat resistance exists, further lowering of the temperature is required for the connection between the sensor of the touch panel and the circuit member even with a radical curing adhesive.

It is considered to increase the compounding quantity of a radical polymerization initiator in order to improve the low-temperature activity of a radical-curable adhesive agent. However, it became clear by the examination of the present inventors that the connection resistance value between electrodes opposing in a high-temperature, high-humidity environment may rise in the circuit connection structure which ensured adhesive strength by such a method.

The present invention provides a circuit connection structure excellent in connection reliability that has sufficient adhesive strength even when circuit members are connected at a low temperature around 120° C., and the connection resistance between opposing electrodes is kept sufficiently low even in a high temperature and high humidity environment. An object of the present invention is to provide a circuit connection material, an adhesive composition, and an adhesive sheet that can be used. Moreover, an object of this invention is to provide the circuit connection structure excellent in the connection reliability which has sufficient adhesive strength and the connection resistance between opposing electrodes is kept sufficiently low also in a high-temperature, high-humidity environment.

The present invention is an adhesive composition containing a radical polymerizable substance and a radical polymerization initiator, a radical polymerizable substance having a first radical polymerizable substance represented by the following formula (1) and two or more (meth)acryloyl groups An adhesive composition containing a second radically polymerizable substance other than one radically polymerizable substance and containing dilauroyl peroxide as a radical polymerization initiator is provided.

In formula (1), X ₁ and X ₂ may be the same or different, and may be an acryloyl group [CH ₂ =CH-C(=O)-], a methacryloyl group [CH ₂ =C(CH ₃ )- C(=O)-] or a hydrogen atom [H-], at least one is an acryloyl group or a methacryloyl group, and n represents an integer of 8 to 15.

According to the adhesive composition according to the present invention, sufficient adhesive strength can be expressed even at low temperature and for a short time. In addition, when the adhesive composition according to the present invention is used for a circuit connection material, even when the circuit members are connected at a low temperature of around 120°C, the adhesive composition has sufficient adhesive strength, and the connection resistance between opposing electrodes is high even in a high temperature and high humidity environment. A circuit connection structure excellent in connection reliability maintained sufficiently low can be obtained.

The reason why the above effects are exhibited when the adhesive composition according to the present invention is used for a circuit connection material is not clear, but the present inventors presume as follows. First, in a circuit connection structure connected using a circuit connection material containing a large amount of dilauroyl peroxide, after a reliability test at high temperature and high humidity, bubbles frequently occur in the connection portion, and in particular, connection reliability at a narrow pitch is deteriorated. It has been confirmed by the present inventors. Therefore, it is considered that the dilauroyl peroxide contained in a large amount in a circuit connection material crystallizes or localizes on the material surface as a factor which raises the connection resistance value between the electrodes connected in a high-temperature, high-humidity environment. When the adhesive composition according to the present invention is used in the circuit connection material, dilauroyl peroxide and the radically polymerizable substance (first radically polymerizable substance) represented by the above formula (1) are used in combination, so that at the time of low-temperature connection Even when dilauroyl peroxide is compounded so as to ensure the adhesive strength of , since crystallization or localization of dilauroyl peroxide is effectively suppressed by the first radically polymerizable substance having a specific structure, the adhesive strength The present inventors think that stability of connection resistance can be compatible with and.

It is preferable that content of the dilauroyl peroxide in the adhesive composition which concerns on this invention is 10-40 mass parts with respect to 100 mass parts of total amounts of the radically polymerizable substance contained in an adhesive composition. When the content of dilauroyl peroxide falls within such a numerical range, sufficient adhesive strength can be exhibited even at low temperature and for a short time, and crystallization of dilauroyl peroxide can be sufficiently suppressed.

Moreover, it is preferable that content of a 1st radically polymerizable substance is 30-100 mass parts with respect to content of 100 mass parts of dilauroyl peroxide. By making content of a 1st radically polymerizable substance into this numerical range, while being able to express sufficient adhesive strength even at low temperature for a short time, crystallization of dilauroyl peroxide can fully be suppressed.

The adhesive composition according to the present invention preferably further comprises a thermoplastic resin. In this case, while improving the handleability of an adhesive composition, the adhesive composition excellent in stress relaxation at the time of hardening can be implement|achieved.

Moreover, this invention is a circuit connection material for connecting circuit members which have mutually opposing circuit electrodes, Comprising: The circuit connection material containing the adhesive composition concerning this invention is provided.

According to the circuit connection material according to the present invention, even when circuit members are connected at a low temperature around 120° C., they have sufficient adhesive strength, and the connection resistance between opposing electrodes is maintained sufficiently low even in a high-temperature, high-humidity environment. A circuit connection structure excellent in reliability can be obtained.

It is preferable that content of the dilauroyl peroxide in the circuit connection material which concerns on this invention is 10-40 mass parts with respect to 100 mass parts of total amounts of the radically polymerizable substance contained in a circuit connection material. By carrying out content of dilauroyl peroxide in such a numerical range, while being able to connect circuit members with sufficient adhesive strength, the raise of the connection resistance value in a high-temperature, high-humidity environment can fully be suppressed.

Moreover, it is preferable that content of a 1st radically polymerizable substance is 30-100 mass parts with respect to content of 100 mass parts of dilauroyl peroxide. By carrying out content of a 1st radically polymerizable substance in such a numerical range, while being able to connect circuit members with sufficient adhesive strength, the raise of the connection resistance value in high-temperature, high-humidity environment can fully be suppressed.

It is preferable that the circuit connection material according to the present invention further contains a thermoplastic resin. In this case, while the handleability of the circuit connection material is improved, it is possible to realize a circuit connection material excellent in stress relaxation at the time of curing.

Further, the present invention has a first circuit member having a first substrate and a first circuit electrode formed on a main surface of the substrate, a second circuit member having a second substrate and a second circuit electrode formed on a main surface of the substrate, and a second circuit electrode and a second circuit member disposed so as to face the first circuit electrode, the second circuit electrode being electrically connected to the first circuit electrode, and a connecting portion interposed between the first circuit member and the second circuit member; , The connection part provides a circuit connection structure that is a cured product of the circuit connection material according to the present invention.

In the circuit connection structure of the present invention, when the connection portion is a cured product of the circuit connection material according to the present invention, it has sufficient adhesive strength and excellent connection reliability in which the connection resistance between opposing electrodes is kept sufficiently low even in a high temperature and high humidity environment. can have Moreover, since the circuit connection structure of this invention can form a connection part at low temperature, even if it has a member with low heat resistance, the influence by a heat can be made small.

Further, the present invention provides an adhesive sheet comprising a support film and a film adhesive comprising the adhesive composition according to the present invention provided on the support film.

According to the adhesive sheet which concerns on this invention, sufficient adhesive strength can be expressed even if it is low temperature and a short time by having the film adhesive containing the adhesive composition which concerns on this invention.

ADVANTAGE OF THE INVENTION According to this invention, even when circuit members are connected at the low temperature of 120 degreeC vicinity, it has sufficient adhesive strength and the connection resistance between opposing electrodes is kept sufficiently low even in a high-temperature, high-humidity environment. Circuit connection structure excellent in connection reliability It is possible to provide a circuit connection material, an adhesive composition, and an adhesive sheet that can be obtained. Moreover, according to this invention, it has sufficient adhesive strength, and the circuit connection structure excellent in the connection reliability by which the connection resistance between opposing electrodes is kept sufficiently low even in a high-temperature, high-humidity environment can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows one Embodiment of an adhesive agent sheet.
It is a schematic sectional drawing which shows one Embodiment of a circuit connection structure.
It is a schematic sectional drawing for demonstrating one Embodiment of the manufacturing method of a circuit connection structure.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described in detail, referring drawings as needed. However, this invention is not limited to the following embodiment. In addition, the dimensional ratios in the drawings are not limited to the illustrated ratios. In addition, "(meth)acrylate" in this specification means "acrylate" and "methacrylate" corresponding thereto, and "(meth)acryloyl group" means "acryloyl group" and it A corresponding "methacryloyl group" is meant.

The adhesive composition according to the present embodiment contains a radically polymerizable substance and a radical polymerization initiator, and as a radically polymerizable substance, a first radically polymerizable substance represented by the following formula (1) and a (meth)acryloyl group 2 2nd radically polymerizable substances other than the 1st radically polymerizable substance which has above is contained, and dilauroyl peroxide is contained as a radical polymerization initiator.

In formula (1), X ₁ and X ₂ may be the same or different, and may be an acryloyl group [CH ₂ =CH-C(=O)-], a methacryloyl group [CH ₂ =C(CH ₃ )- C(=O)-] or a hydrogen atom [H-], at least one is an acryloyl group or a methacryloyl group, and n represents an integer of 8 to 15.

Hereinafter, the case where the adhesive composition which concerns on this embodiment is applied as a circuit connection material for connecting the circuit members which have mutually opposing circuit electrodes is demonstrated.

A 1st radically polymerizable substance is a compound which is equipped with the hydrocarbon backbone (methylene chain) of a specific length, and has one or more (meth)acryloyl groups as represented by the said general formula (1). Specifically, 1,10-decanediol diacrylate, 1,10-decanediol dimethacrylate, 1,9-nonanediol diacrylate, 1,9-decanediol dimethacrylate, 1,8-octane diol diacrylate, 1,8-octanediol dimethacrylate, 1,11-undecanediol dimethacrylate, 1,11-undecanediol dimethacrylate, 1,12-dodecanediol diacrylate, 1, 12-decanediol dimethacrylate, 1,13-tridecanediol diacrylate, 1,13-tridecanediol dimethacrylate, 1,14-tetradecanediol diacrylate, 1,14-tetradecanediol Dimethacrylate, 1,15-pentadecanediol diacrylate, 1,15-pentadecanediol dimethacrylate, etc. are mentioned.

The compound represented by the above formula (1) may be used alone or in combination of two or more.

As the second radical polymerizable substance, for example, urethane (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylol Methanetetra(meth)acrylate, 2-hydroxy-1,3-di(meth)acryloxypropane, 2,2-bis[4-((meth)acryloxymethoxy)phenyl]propane, 2,2- Bis[4-((meth)acryloxypolyethoxy)phenyl]propane, dicyclopentenyl(meth)acrylate, tricyclodecanyl(meth)acrylate, tris((meth)acryloxyethyl)isocyanu rate etc. are mentioned. These can be used individually by 1 type or in combination of 2 or more type.

Moreover, it is preferable that the 2nd radically polymerizable substance has 1 or more types of a dicyclopentenyl group, a tricyclodecanyl group, and a triazine ring from a viewpoint of improving the heat resistance of a circuit connection material.

The 2nd radically polymerizable substance is not limited to a monomer, An oligomer can also be used. As such a radically polymerizable substance, a urethane (meth)acrylate oligomer etc. are mentioned, for example.

As for the molecular weight of said oligomer, 2000-20000 are preferable from a compatible viewpoint with resin.

The above-mentioned 2nd radically polymerizable substance can be used individually by 1 type or in combination of 2 or more types.

The circuit connection material according to the present embodiment may further contain a third radically polymerizable substance having a phosphoric acid ester structure. In this case, the adhesive strength to the surface of an inorganic material such as metal can be improved.

As a 3rd radically polymerizable substance, the compound represented by following formula (2) from an adhesive viewpoint is preferable. Examples of the compound represented by the following formula (2) include mono(2-(meth)acryloyloxyethyl)acid phosphate and di(2-(meth)acryloyloxyethyl)acid phosphate. . These compounds can be obtained, for example, as a reaction product of phosphoric anhydride and 2-hydroxyethyl (meth)acrylate.

In formula (2), R represents a methyl group or a hydrogen atom, and n represents the integer of 1-2.

The 3rd radically polymerizable substance can be used individually by 1 type or in combination of 2 or more type.

The circuit connection material of this embodiment can also be made to contain radically polymerizable substances other than the 1st, 2nd, and 3rd radically polymerizable substance mentioned above. Although it does not specifically limit as such a radically polymerizable substance, Monofunctional (meth)acrylate etc. can be used. As monofunctional (meth)acrylate, the monofunctional (meth)acrylate which has a ring structure, and (meth)acrylate which has a urethane group are mentioned, for example.

Examples of the monofunctional (meth)acrylate having a ring structure include acroylmorpholine, methcroylmorpholine, isobornyl acrylate, isobornyl methacrylate, tetrahydro-2H-pyran-2-yl-acrylate, Tetrahydro-2H-pyran-2-yl-methacrylate, 1-(cyclohexyoxy)ethyl acrylate, 1-(cyclohexyoxy)ethyl methacrylate, 1-(cyclohexyoxy)propylacryl rate, 1-(cyclohexyoxy)propyl methacrylate, 1-(cyclohexyoxy)ethyl methacrylate, 1-(cyclohexyoxy)butyl acrylate, 1-(cyclohexyoxy)butyl methacrylate Acrylate, 1-(cyclohexyloxy) pentyl acrylate, 1-(cyclohexyloxy) pentyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl Methacrylate, phenoxymethyl acrylate, phenoxymethyl methacrylate, phenoxyethyl acrylate, phenoxyethyl methacrylate, phenoxypropyl acrylate, phenoxypropyl methacrylate, phenoxybutyl acrylate, γ -Butyrolactone acrylate, δ-valerolactone acrylate, etc. can be used.

Examples of the (meth)acrylate having a urethane group include those obtained as a reaction product of a polyol such as polytetramethylene glycol and a polyisocyanate and a hydroxyl group-containing acrylic compound. Such a compound is preferable because it is excellent in adhesiveness.

The total content of the radically polymerizable substance in the circuit connection material according to the present embodiment is preferably 25 to 55 parts by mass, when the total amount of the circuit connection material is 100 parts by mass, from the viewpoint of the balance between connection resistance and adhesiveness, 30 -50 mass parts is more preferable, and 35-45 mass parts is still more preferable. Moreover, when the total content of the radically polymerizable substance in the circuit connection material which concerns on this embodiment makes 100 mass parts, 20-70 mass parts or 30-65 mass parts may be sufficient.

The circuit connection material according to the present embodiment contains dilauroyl peroxide as a radical polymerization initiator, however, a radical polymerization initiator other than dilauroyl peroxide may be appropriately used in combination depending on conditions for connecting circuits and the like.

As the radical polymerization initiator other than dilauroyl peroxide, a radical polymerization initiator generally used in radical polymerization can be used. For example, a peroxide compound that generates free radicals by heating, an azo compound, etc. can be used. have. Specifically, it can be selected from diacyl peroxides, peroxydicarbonates, peroxyesters, peroxyketals, dialkyl peroxides, hydroperoxides, and the like.

Said radical polymerization initiator may use together 1 type with dilauroyl peroxide, and may use it together with dilauroyl peroxide in combination of 2 or more type.

The circuit connection material according to the present embodiment preferably contains a radical polymerization initiator coated with a polyurethane-based or polyester-based polymer material or the like and microencapsulated from the viewpoint of improving the storage property.

Moreover, in the circuit connection material which concerns on this embodiment, a radical polymerization initiator and a decomposition accelerator or decomposition inhibitor can also be mixed and used.

As for content of the dilauroyl peroxide in the circuit connection material which concerns on this embodiment, 10-40 mass parts is preferable with respect to 100 mass parts of total amounts of the radically polymerizable substance contained in a circuit connection material, 15-35 mass Addition is more preferable, and 20-30 mass parts is still more preferable. By carrying out content of dilauroyl peroxide in said numerical range, a raise of the connection resistance value in a high-temperature, high-humidity environment can fully be suppressed, connecting circuit members with sufficient adhesive strength.

30-100 mass parts is preferable with respect to content of 100 mass parts of dilauroyl peroxide, and, as for content of the 1st radically polymerizable substance in the circuit connection material which concerns on this embodiment, 50-80 mass parts is more preferable . By carrying out content of a 1st radically polymerizable substance in said numerical range, a raise of the connection resistance value in a high-temperature, high-humidity environment can fully be suppressed, connecting circuit members with sufficient adhesive strength.

As for content of the 2nd radically polymerizable substance in the circuit connection material which concerns on this embodiment, 70-90 mass parts is preferable with respect to a total of 100 mass parts of a radically polymerizable substance from an adhesive viewpoint, 72-88 mass parts It is more preferable, and 75-90 mass parts is still more preferable.

The content of the third radically polymerizable substance in the circuit connection material according to the present embodiment is preferably 3 to 10 parts by mass with respect to a total of 100 parts by mass of the radically polymerizable substance from the viewpoint of the balance between adhesiveness and corrosive properties, 4-8 mass parts is more preferable, and 5-6 mass parts is still more preferable.

The circuit connection material according to the present embodiment preferably further contains a thermoplastic resin from the viewpoint of improving handleability and relieving stress during curing.

As the thermoplastic resin, phenoxy resin, polyurethane resin, polyester urethane resin, acrylic resin, polyvinyl butyral resin, polyvinyl formal resin, polyimide resin, polyamide resin, polyester resin, phenol resin, polystyrene resin, polyethylene Resin, polyvinyl chloride resin, polyphenylene oxide resin, xylene resin, polyisocyanate resin, etc. can be used.

A phenoxy resin can be obtained by making bifunctional phenols and epihalohydrin react to high molecular weight, or by polyaddition reaction of a bifunctional epoxy resin and bifunctional phenols.

Moreover, as a thermoplastic resin, copolymers, such as an ethylene-vinyl acetate copolymer, can be used.

A thermoplastic resin can be used individually by 1 type or in combination of 2 or more type.

Among the above thermoplastic resins, phenoxy resins, polyurethane resins, polyester urethane resins, and acrylic resins are preferable from the viewpoint of compatibility with other resins. The thermoplastic resin may be modified|denatured with a radically polymerizable functional group (for example, (meth)acryloyl group).

It is preferable that it is 10000 or more, as for the weight average molecular weight of a thermoplastic resin, it is more preferable that it is 10000-1000000, It is still more preferable that it is 10000-150000. When the weight average molecular weight of the thermoplastic resin is 10000 or more, the film formability at the time of molding into a film tends to be improved, and on the other hand, when it is 100000 or less, solubility in a solvent and compatibility with other components are improved, and the film is formed into a film. It tends to become easy to manufacture the coating liquid for shaping|molding.

In addition, the weight average molecular weight prescribed|regulated in this specification means the value measured using the analytical curve by standard polystyrene by the gel permeation chromatography method (GPC) according to the following conditions.

[GPC measurement conditions]

Equipment used: Hitachi L-6000 type [Hitachi Seisakusho Co., Ltd.]

Column: Gel pack GL-R420 + Gel pack GL-R430 + Gel pack GL-R440 (3 in total) [manufactured by Hitachi Chemical Co., Ltd.]

Eluent: tetrahydrofuran

Measuring temperature: 40℃

Flow: 1.75 mL/min

Detector: L-3300RI [Hitachi Seisakusho]

Moreover, 40 degreeC or more is preferable, as for the glass transition temperature (Tg) of a thermoplastic resin, 50-90 degreeC is more preferable, and its 60-80 degreeC is still more preferable.

In addition, in this specification, the glass transition temperature of a thermoplastic resin refers to the peak temperature of tanδ obtained when the resin formed into a film on a film is measured under the conditions of the temperature increase rate of 10 degreeC/min, and a frequency of 10 Hz with a dynamic viscoelastic apparatus.

In this embodiment, it is preferable to use a polyester urethane resin as a thermoplastic resin from the point of adhesiveness and compatibility with other resin.

Polyester urethane resin can be obtained by reaction of polyester polyol and diisocyanate, for example. It is preferable that a polyester urethane resin has a urethane group and an ester group in its main chain.

A polyester polyol is a polymer which has a some ester group and a some hydroxyl group. Polyester polyol is obtained by reaction of dicarboxylic acid and diol, for example. As dicarboxylic acid, aromatic, aliphatic dicarboxylic acids, such as terephthalic acid, isophthalic acid, adipic acid, and sebacic acid, etc. are preferable. As diol, glycols like ethylene glycol, propylene glycol, 1, 4- butanediol, hexanediol, neopentyl glycol, diethylene glycol, and triethylene glycol are preferable.

Examples of diisocyanate include aromatics such as 2,4-tolylene diisocyanate (TDI), 4,4'-diphenylmethane diisocyanate (MDI), 1,6-hexamethylene diisocyanate (HDI), and isophorone diisocyanate (IPDI). , alicyclic or aliphatic diisocyanates are suitably used.

It is preferable that polyester urethane resin has anionicity. Thereby, adhesive strength improves further. Polyester urethane resin which has anionic property is obtained by copolymerizing the diol and diamine which have a sulfonic acid group or a carboxyl group in a side chain at the time of reaction of polyester polyol and diisocyanate. That is, the polyester urethane resin preferably has a sulfonic acid group or a carboxyl group.

It is preferable that the polyester urethane resin has an aromatic group containing a benzene ring, etc., a cyclic aliphatic group containing a cyclohexane ring, etc.

A polyester urethane resin can be used in mixture of 2 or more types. For example, what is obtained by reaction of an aromatic polyester polyol and aliphatic diisocyanate, and what is obtained by reaction of an aliphatic polyester polyol and aromatic diisocyanate can be combined.

It is preferable that the weight average molecular weights of polyester urethane resin are 5000-100000. When the weight average molecular weight is 5000 or more, the film forming property at the time of molding into a film tends to be improved, and when the weight average molecular weight is 100000 or less, the solubility and compatibility in a solvent are improved, and coating for molding into a film shape It tends to become easy to prepare a liquid.

The content of the thermoplastic resin in the circuit connection material according to the present embodiment is preferably 10 to 50 parts by mass, and 20 to 40 parts by mass when the total amount of the circuit connection material is 100 parts by mass from the viewpoint of the balance between connection resistance and adhesiveness. addition is preferable, and 25-35 mass parts is more preferable. Moreover, when content of the thermoplastic resin in the circuit connection material which concerns on this embodiment makes 100 mass parts of circuit connection materials, 30-80 mass parts or 35-70 mass parts may be sufficient.

The circuit connection material according to the present embodiment may further contain a compound having an aminooxyl structure. In this case, the storage stability of a circuit connection material can be improved more.

The circuit connection material according to the present embodiment may contain polymerization inhibitors such as hydroquinone and methyl ether hydroquinones to improve storage stability.

The circuit connection material which concerns on this embodiment may contain electroconductive particle. As electroconductive particle, metal particles, such as Au, Ag, Ni, Cu, and solder, carbon, etc. are mentioned. Moreover, the surface of transition metals, such as Ni, may be coat|covered with noble metals, such as Au. In order to obtain sufficient pot life, the surface layer is preferably made of noble metals of Au, Ag, and platinum group rather than transition metals such as Ni and Cu, and more preferably Au. In addition, a conductive layer is formed on the surface of the non-conductive particle by a method such as coating the surface of the non-conductive particle such as glass, ceramic, or plastic with the above-described conductive material, and the outermost layer is composed of noble metals, In the case of molten metal particles, since they have deformability by heating and pressing, the contact area with the electrode increases during connection, and reliability is improved, so it is preferable.

Although the circuit connection material according to the present embodiment does not contain conductive particles, connection can be obtained by direct contact of circuit electrodes opposing each other at the time of connection. However, when conductive particles are additionally included, more stable connection can be obtained. have.

Although content of the electroconductive particle in the circuit connection material which concerns on this embodiment is suitably set according to the use of a circuit connection material, For example, 0.1-30 parts with respect to 100 parts of circuit connection material containing electroconductive particle. range can be In order to prevent the short circuit etc. of the adjacent circuit by excessive electroconductive particle, it is preferable that content of electroconductive particle is 0.1-10 parts by volume.

The circuit connection material according to the present embodiment may contain a filler, a softener, an accelerator, an anti-aging agent, a colorant, a flame retardant, a thixotropic agent, a coupling agent, and the like.

According to the circuit connection material according to the present embodiment, even when circuit members are connected at a low temperature of around 120° C., the connection has sufficient adhesive strength and the connection resistance between opposing electrodes is maintained sufficiently low even in a high temperature and high humidity environment. A circuit connection structure excellent in reliability can be obtained.

The present inventors estimate as follows about the reason that the circuit connection material which concerns on this embodiment can exhibit said effect. First, in a circuit connection structure connected using a circuit connection material containing a large amount of dilauroyl peroxide, after a reliability test at high temperature and high humidity, bubbles frequently occur in the connection portion, and in particular, connection reliability at a narrow pitch is deteriorated. It has been confirmed by the present inventors. Therefore, it is considered that the dilauroyl peroxide contained in a large amount in a circuit connection material crystallizes or localizes on the material surface as a factor which raises the connection resistance value between the electrodes connected in a high-temperature, high-humidity environment. In the circuit connection material according to the present embodiment, by using in combination dilauroyl peroxide and the radically polymerizable substance (first radically polymerizable substance) represented by the above formula (1), adhesive strength during low-temperature connection is ensured Even when dilauroyl peroxide is blended as much as possible, since crystallization or localization of dilauroyl peroxide is effectively suppressed by the first radically polymerizable substance having a specific structure, adhesive strength and stability of connection resistance The present inventors think that it was possible to make it compatible.

Next, the adhesive sheet which concerns on this invention is demonstrated, referring drawings.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows one Embodiment of the adhesive agent sheet which concerns on this invention. The adhesive sheet 4 shown in FIG. 1 is provided on the surface opposite to the support film 1 of the support film 1, the film adhesive 2 provided on the support film, and the support film 1 of the film adhesive 2. A protective film 3 is provided.

The film adhesive 2 contains the adhesive composition according to the present invention containing the same components as the circuit connection material according to the present embodiment described above, and is dispersed in the adhesive component 5 and the adhesive component 5 . particles (7). Here, an adhesive agent component means the component remove|excluding electroconductive particle from the adhesive composition.

As the support film 1, for example, a polyethylene terephthalate film, a polyethylene naphthalate film, a polyethylene isophthalate film, a polybutylene terephthalate film, a polyolefin type film, a polyacetate film, a polycarbonate film, polyphenylene sulfide. It is possible to use various films such as a film, a polyamide film, an ethylene-vinyl acetate copolymer film, a polyvinyl chloride film, a polyvinylidene chloride film, a synthetic rubber film, and a liquid crystal polymer film. As for the said film, the corona discharge treatment, anchor coating treatment, antistatic treatment, etc. may be given to the surface as needed.

Moreover, the peeling agent may be coated on the surface of the support film 1 so that the film adhesive 2 may peel from the support film 1 easily. As the release treatment agent, various release treatment agents such as silicone resins, copolymers of silicone and organic resins, alkyd resins, aminoalkyd resins, resins having a long-chain alkyl group, resins having a fluoroalkyl group, and shellac resins can be used.

The thickness of the support film 1 is preferably 4 to 200 µm in consideration of storage and use convenience of the produced adhesive sheet 4, and 15 to 75 µm in consideration of material cost, productivity, etc. It is more preferable to set it as micrometer.

The film adhesive 2 can be produced by applying a coating solution containing the adhesive composition according to the present invention on the support film 1 using a coating apparatus, and drying it with hot air for a predetermined period of time. In this embodiment, it is preferable that the adhesive composition which concerns on this invention contains the above-mentioned thermoplastic resin as a film forming material.

It is preferable that the thickness of the film adhesive 2 is 10-30 micrometers. If the thickness of the film adhesive 2 is within this range, it can be applied to most of the existing circuit specifications suitable for the anisotropic conductive film.

The film adhesive 2 may be composed of two or more layers. For example, when it is set as the two-layer structure of the layer containing electroconductive particle, and the layer which does not contain electroconductive particle, the improvement of pot life and the improvement of particle|grain capture|acquisition efficiency can be aimed at.

The adhesive sheet 4 can be produced by forming the film adhesive 2 on the support film 1, and bonding the protective film 3 thereon using a conventionally well-known laminator etc.

As the protective film 3, the same film as the support film 1 is mentioned. Especially, the film which has peelability higher than a support film is preferable as a protective film. The thickness of the protective film is preferably 4 to 200 µm in consideration of the storage and use of the produced adhesive sheet 4, and 15 to 75 µm in consideration of material cost and productivity. more preferably.

Next, the circuit connection structure which concerns on this invention and its manufacturing method are demonstrated.

2 : is a schematic sectional drawing which shows one Embodiment of a circuit connection structure. The circuit connection structure 100 shown in Fig. 2 includes a first circuit member (21) having a first circuit board (21) and a first circuit electrode (first connection terminal) (22) formed on a main surface (21a) of the board. 20), a second circuit member 30 having a second circuit board 31 and a second circuit electrode (second connection terminal) 32 formed on a main surface 31a of the board, and a first circuit member A connecting portion (10) interposed between the (20) and the second circuit member (30) and bonding them is provided. The second circuit member 30 is disposed to face the first circuit member 20 such that the second circuit electrode 32 faces the first circuit electrode 22 .

The connection part 10 interposes the circuit connection material which concerns on this embodiment between the 1st circuit member 20 and the 2nd circuit member 30, and the 1st circuit member 20 and the 2nd circuit in the state. It is formed by pressing the member 30, and is the hardened|cured material of the circuit connection material which concerns on this embodiment. In addition, in this embodiment, the example at the time of forming the connection part 10 using the circuit connection material containing electroconductive particle is shown, and the connection part 10 is the insulating layer 11 derived from components other than electroconductive particle. And it is comprised with the electroconductive particle 7 disperse|distributed in the insulating layer 11.

The opposing 1st circuit electrode 22 and the 2nd circuit electrode 32 are electrically connected via the electroconductive particle 7 . On the other hand, the first circuit electrodes 22 and the second circuit electrodes 32 formed on the same circuit board are insulated from each other.

As the 1st circuit board 21 and the 2nd circuit board 31, chip components, such as a semiconductor chip, a resistor chip, and a capacitor chip, board|substrates, such as a printed circuit board, etc. are mentioned. Usually, a plurality of connection terminals are provided in the circuit member, but in some cases, the number of connection terminals may be singular.

As a circuit board, the board|substrate of inorganic materials, such as a semiconductor, glass and ceramics, a plastic board, glass/epoxy board|substrate, etc. are specifically mentioned more specifically. The circuit board may be a combination of these materials.

Examples of the plastic substrate include a polyimide film, a polycarbonate (PC) film, and a polyester film. From a viewpoint of low cost and weight reduction, a polycarbonate (PC) film, a polyethylene terephthalate (PET), or a polyethylene naphthalate (PEN) is preferable.

The first circuit electrode and the second circuit electrode are formed of a metal such as copper. In order to obtain a better electrical connection, it is preferable that the surface of at least one of the first circuit electrode and the second circuit electrode be made of one or more metals selected from the group consisting of gold, silver, tin and platinum. For example, a multilayer structure may be obtained by combining a plurality of metals such as copper/nickel/gold. In this case, the gold layer can be used as the outermost layer.

Further, one of the first circuit member 20 and the second circuit member 30 may be a liquid crystal display panel having a glass substrate or a plastic substrate as a circuit board and having connection terminals made of ITO or the like. In addition, one of the first circuit member 20 and the second circuit member 30 is a flexible printed wiring board (FPC) having a polyimide film as a circuit board, a tape carrier package (TCP), or a chip-on film (COF); Or it may be a semiconductor silicon chip which has a semiconductor substrate as a circuit board. A connection structure is comprised by combining these various circuit members suitably as needed.

For example, when the first circuit member is a solar cell having an electrode such as a finger electrode, a bus bar electrode, and the second circuit member is a tab wire, a connection structure obtained by connecting them is a solar cell, a tab wire, and a method for bonding them. It is a solar cell module provided with the connection member (hardened|cured material of adhesive composition).

The circuit connection structure 100 includes, for example, the first circuit member 20 , the circuit connection material according to the present embodiment, and the second circuit member 30 , in this order, the first connection terminal 22 and the second It is formed by superimposing the connection terminals 32 to face each other, and pressing or further heating in that state.

The pressure is not particularly limited as long as it does not damage the adherend, but is generally preferably 0.1 to 10 MPa. Although the heating temperature in particular is not restrict|limited, 100-200 degreeC is preferable. It is preferable to carry out this pressurization and heating in the range of 0.5 second - 100 second, and it is possible to adhere|attach also by heating at 120-180 degreeC or 130-180 degreeC, 3 MPa, and 10 second.

Moreover, the manufacturing method of the circuit connection structure which concerns on this embodiment is demonstrated, referring FIG. In the present embodiment, first, the first circuit member 20 and the film adhesive 40 formed by molding the circuit connecting material according to the present embodiment into a film form are prepared (see Fig. 3(a)). ). In this embodiment, the circuit connection material contains the electroconductive particle 7 . The adhesive component (5) represents the component which removed the electroconductive particle from the circuit connection material. Further, even when the circuit connection material does not contain the conductive particles 7, the circuit connection material can be used for anisotropically conductive bonding as an insulating adhesive.

Next, the film adhesive 40 is mounted on the surface in which the circuit electrode 22 of the 1st circuit member 20 is formed. Next, the film adhesive 40 is pressed in the direction of the arrows A and B in Fig. 3A, and the film adhesive 40 is temporarily connected to the first circuit member 20 (Fig. 3A). see (b)). At this time, you may pressurize while heating. However, the heating temperature is set to be lower than the curing temperature of the adhesive composition in the film adhesive 40 . The heating temperature at the time of temporary connection becomes like this. Preferably it is 50-120 degreeC, More preferably, it is 60-110 degreeC. Moreover, it is preferable that the pressure at the time of a temporary connection is 0.1-3 MPa.

In this embodiment, a film adhesive can be arrange|positioned on the 1st circuit member using the adhesive agent sheet 4 which concerns on this embodiment mentioned above. Specifically, the film adhesive 2 exposed by peeling the protective film 3 from the adhesive sheet 4 is bonded to the first circuit member 20 using a laminator. The adhesion conditions can be, for example, a heating temperature of 70°C, a pressure of 1 MPa, and a connection time of 2 seconds. After attachment, the support film 1 is peeled off.

Then, as shown to FIG.3(c), the 2nd circuit member 30 is mounted on the film adhesive 40 with a 2nd circuit electrode facing the 1st circuit member 20. As shown in FIG. At this time, after aligning the positions so that the first and second circuit electrodes face each other, the second circuit member can be temporarily fixed by heating and pressing from above the second circuit member. By doing in this way, it is possible to suppress the displacement of the electrode during the subsequent main connection. The heating temperature at the time of temporary fixing is set to a temperature lower than the curing temperature of the adhesive composition in the film adhesive 40, and it is preferable that the time from alignment to completion of temporary fixing is 5 seconds or less in order to shorten the throughput. Moreover, the heating temperature at the time of temporary fixing becomes like this. Preferably it is 50-100 degreeC, More preferably, it is 60-90 degreeC. In addition, the heating temperature at the time of temporary fixing is 50-120 degreeC, and may be 60-110 degreeC. Moreover, it is preferable that the pressure at the time of temporary fixing is 0.1-3 MPa.

And while heating the film adhesive 40, it presses through the 1st circuit member 20 and the 2nd circuit member 30 in the arrow (A and B) directions of FIG.3(c). The heating temperature at this time is set as the temperature at which the polymerization reaction can be started. In the present embodiment, the connection conditions are, as described earlier, a heating temperature of 110 to 160° C., preferably 115 to 150° C., more preferably 120 to 140° C., a pressure of 0.1 to 10 MPa, preferably 0.5 to 5 MPa, and a connection time. It is 0.5 second - 120 second, Preferably it can be set as 4 second - 30 second. Moreover, you may perform post-curing as needed.

In this way, the film adhesive 40 hardens|cures, and a circuit connection structure as shown in FIG. 2 is obtained.

According to the manufacturing method of the circuit connection structure which concerns on this embodiment, by using the film adhesive 40 containing the circuit connection material which concerns on this embodiment, even when connected under the said low-temperature conditions, the circuit member 20, 30) can be adhered to each other with sufficient adhesive strength, and the connection resistance between the electrically connected circuit electrodes can be sufficiently reduced, and furthermore, circuit connection in which the increase in connection resistance is sufficiently suppressed even when placed in a high-temperature, high-humidity environment for a long period of time struct can be obtained.

The adhesive composition and adhesive sheet according to the present embodiment are suitable for bonding a member made of a material having low heat resistance in that sufficient adhesive strength can be obtained at a low temperature and problems caused by a radical polymerization initiator can be sufficiently reduced. Do.

[Example]

[Production of adhesive sheet]

(Example 1)

As a thermoplastic resin, 40 parts by mass of polyester urethane resin (UR-8200, manufactured by Toyobo, 30% solution) in terms of non-volatile content, and an ethylene vinyl acetate copolymer (EV40W, manufactured by Mitsui DuPont Polychemical, 20% solution) as a non-volatile matter In terms of conversion, 10 parts by mass of 1,10-decanediol diacrylate (A-DOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.) as a first radically polymerizable substance is 5 parts by mass, as a second radically polymerizable substance, urethane 33 parts by mass of a 70 mass % solution of an acrylate oligomer (UA5500, manufactured by Shin-Nakamura Chemical Co., Ltd.) dissolved in toluene in terms of non-volatile content, 2-methacryloxyethyl acid phosphate (P-2M, 2 parts by mass (manufactured by Kyoesha Chemical), 10 parts by mass of dilauroyl peroxide (Peroyl L, manufactured by Nichiyu) as a radical polymerization initiator, and polystyrene as the nucleus on the surface of the particles having a thickness of 0.2 µm The nickel layer was provided and 5 mass parts of electroconductive particles of 10 micrometers in average particle diameter which provided the gold layer (gold plating) with a thickness of 0.04 micrometers were mixed in the outer side of this nickel layer. This mixed solution was apply|coated on the PET film as a support film with an applicator, and the film adhesive with a thickness of 20 micrometers was formed by hot air drying at 70 degreeC for 10 minutes, and the adhesive agent sheet was obtained. In addition, the volume ratio of the electroconductive particle in a film adhesive was 2 volume%.

(Example 2)

Implemented except that 5 parts by mass of 1,10-decanediol dimethacrylate (DOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.) was blended in place of 1,10-decanediol diacrylate (A-DOD-N). It carried out similarly to Example 1, and obtained the adhesive agent sheet.

(Example 3)

Except for blending 5 parts by mass of 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.) instead of 1,10-decanediol diacrylate (A-DOD-N), It carried out similarly to Example 1, and obtained the adhesive agent sheet.

(Example 4)

Implemented except that 5 parts by mass of 1,9-nonanediol dimethacrylate (NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.) was blended in place of 1,10-decanediol diacrylate (A-DOD-N). It carried out similarly to Example 1, and obtained the adhesive agent sheet.

(Example 5)

In the same manner as in Example 1, except that the blending amount of 1,10-decanediol diacrylate (A-DOD-N) was changed to 8 parts by mass and the blending amount of the urethane acrylate oligomer (UA5500) was changed to 30 parts by mass, An adhesive sheet was obtained.

(Example 6)

The compounding amount of the urethane acrylate oligomer (UA5500) is changed to 27 parts by mass, and 3 parts by mass of isocyanuric acid EO-modified diacrylate (M-215, manufactured by Toagosei) is further blended as a second radically polymerizable substance, Except having changed the compounding quantity of dilauroyl peroxide into 13 mass parts, it carried out similarly to Example 1, and obtained the adhesive agent sheet.

(Example 7)

Change the blending amount of the urethane acrylate oligomer (UA5500) to 30 parts by mass, and further 3 parts by mass of isocyanuric acid EO-modified diacrylate (M-215, manufactured by Toagosei) as a second radically polymerizable substance, The compounding amount of dilauroyl peroxide was changed to 7 parts by mass, and di-t-butylperoxyhexahydroterephthalate (HTP-65W, manufactured by Kayaku Akujo, 20% solution) was further added as a radical polymerization initiator as a nonvolatile matter. In terms of conversion, an adhesive sheet was obtained in the same manner as in Example 1 except that 3 parts by mass was blended.

(Comparative Example 1)

Examples except that 1,10-decanediol diacrylate (A-DOD-N) was not blended, and 5 parts by mass of isocyanuric acid EO modified diacrylate (M-215, manufactured by Toagosei) was blended. It carried out similarly to 1, and obtained the adhesive agent sheet.

(Comparative Example 2)

Examples except that 1,10-decanediol diacrylate (A-DOD-N) was not blended, and 5 parts by mass of isocyanuric acid EO-modified triacrylate (M-315, manufactured by Toagosei) was blended. It carried out similarly to 1, and obtained the adhesive agent sheet.

(Comparative Example 3)

Except that 1,10-decanediol diacrylate (A-DOD-N) was not blended, and 5 parts by mass of dicyclopentadiene-type diacrylate (DCP-A, manufactured by Kyoesa Chemicals) was blended, It carried out similarly to Example 1, and obtained the adhesive agent sheet.

The composition of the film adhesive in an Example and a comparative example is shown in Table 1. Units in the table are parts by mass. In addition, with respect to content of the dilauroyl peroxide and the 1st radically polymerizable substance (compound represented by said general formula (1)) in a film adhesive, dilau with respect to 100 mass parts of total amounts of a radically polymerizable substance Table 2 shows the ratio (parts by mass) of royl peroxide and the ratio (parts by mass) of the first radically polymerizable substance with respect to 100 parts by mass of dilauroyl peroxide (parts by mass), respectively.

[Production of circuit connection structure]

Using the adhesive sheets of Examples 1 to 7 and Comparative Examples 1 to 3, respectively, a copper circuit having a line width of 50 μm, a pitch of 100 μm and a thickness of 18 μm formed directly on a polyimide having a thickness of 75 μm, and a thickness of 0.1 on the copper surface A flexible circuit board (FPC) plated with mu m and a PET film having a surface covered with silicon dioxide or a PET film having a surface covered with a silver paste were connected at 120° C.-2 MPa-10 seconds and a width of 2.0 mm. At this time, after attaching the adhesive side of the film adhesive of the adhesive sheet on the PET film in advance, and heating and pressing at 70 ° C., 1 MPa, for 2 seconds to temporarily connect, after that, the PET film as a support film from the adhesive sheet It peeled and connected with FPC.

For evaluation of adhesive strength, a circuit connection structure (FPC-SiO ₂ PET film) between a PET film on the surface of silicon dioxide and FPC was used, and a circuit connection structure between a PET film on a silver paste surface and FPC (FPC-Ag paste PET) for evaluation of connection resistance. film) was used.

[Measurement of adhesive strength]

Fabricated circuit connection structure (FPC-SiO ₂ PET film) was measured by the 90 degree peeling method according to JIS-Z0237. As a measuring apparatus of adhesive strength, the Toyo Baldwin Co., Ltd. product "Tensilon UTM-4" (brand name) (peel rate 50 mm/min, 25 degreeC) was used. The obtained results are shown in Table 3.

[Measurement of connection resistance]

The resistance value between the opposing electrodes of the produced circuit connection structure (FPC-Ag paste PET film) was measured with a multimeter immediately after connection and after a reliability test held in an environment of 85°C/85% RH for 250 hours, respectively. The resistance value measured the average value and the maximum value of 37 resistance values between the circuit electrodes which oppose. The obtained results are shown in Table 3.

As shown in Table 3, according to the adhesive sheet of Examples 1-7, while the adhesive strength is 5 N/cm or more, the maximum value of the resistance value after a reliability test is less than twice the average value circuit connection structure was obtained. On the other hand, although the adhesive strength of the adhesive agent sheets of Comparative Examples 1-3 was favorable, the dispersion|variation in the connection resistance after the reliability test of a circuit connection structure became large, and connection reliability was inadequate. Further, in the adhesive sheet of Examples, crystallization of dilauroyl peroxide on the surface of the film adhesive was reduced as compared with Comparative Examples.

One… support film, 2... Film adhesive, 3... protective film, 4... adhesive sheet, 5... Adhesive component, 7... Electroconductive particles, 10... connection, 11... insulating layer, 20... A first circuit member, 21 ... A first circuit board, 22... 1st circuit electrode (1st connection terminal), 30... a second circuit member, 31 ... a second circuit board, 32... 2nd circuit electrode (2nd connection terminal), 40... Film adhesive, 100... circuit connection structure.

Claims (7)

An adhesive composition comprising a radical polymerizable material and a radical polymerization initiator, comprising:
As the radical polymerizable substance, a first radical polymerizable substance represented by the following formula (1) and a second radical polymerizable substance other than the first radical polymerizable substance having two or more (meth)acryloyl groups are contained. and,
As the radical polymerization initiator, containing dilauroyl peroxide,
The content of the dilauroyl peroxide is 15 to 35 parts by mass based on 100 parts by mass of the total amount of the radically polymerizable substance contained in the adhesive composition,
The adhesive composition, wherein the content of the first radically polymerizable substance is 30 to 100 parts by mass with respect to 100 parts by mass of the dilauroyl peroxide.

[In formula (1), X ₁ and X ₂ may be the same or different, and represent an acryloyl group, a methacryloyl group or a hydrogen atom, at least one of which is an acryloyl group or a methacryloyl group, and n is 8 represents an integer of to 15] The adhesive composition of claim 1 , further comprising a thermoplastic resin. It is a circuit connection material for connecting circuit members which have mutually opposing circuit electrodes, Comprising: The circuit connection material containing the adhesive composition of Claim 1 or 2nd. a first circuit member having a first substrate and a first circuit electrode formed on a main surface of the substrate;
It has a second substrate and a second circuit electrode formed on a main surface of the substrate, wherein the second circuit electrode and the first circuit electrode are disposed to face each other, and the second circuit electrode is electrically connected to the first circuit electrode a second circuit member comprising:
a connection portion interposed between the first circuit member and the second circuit member
to provide
The said connection part is a hardened|cured material of the circuit connection material of Claim 3, A circuit connection structure. An adhesive sheet comprising a support film and a film adhesive comprising the adhesive composition according to claim 1 or 2 provided on the support film. delete delete

Images