CN104342080B - Adhesive composite, circuit connection material, circuit connection structure and bonding agent sheet material - Google Patents
Adhesive composite, circuit connection material, circuit connection structure and bonding agent sheet material Download PDFInfo
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- CN104342080B CN104342080B CN201410363049.3A CN201410363049A CN104342080B CN 104342080 B CN104342080 B CN 104342080B CN 201410363049 A CN201410363049 A CN 201410363049A CN 104342080 B CN104342080 B CN 104342080B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Wire Bonding (AREA)
Abstract
The present invention provides a kind of adhesive composite, circuit connection material, circuit connection structure and bonding agent sheet material.Adhesive composite of the invention contains free-radical polymerised substance and radical polymerization initiator; as free-radical polymerised substance; the second free-radical polymerised substance with 2 or more (methyl) acryloyl groups other than the first free-radical polymerised substance and the first free-radical polymerised substance that are indicated containing the following general formula (1); as radical polymerization initiator, contain dilauroyl peroxide.In formula (1), X1And X2It can be the same or different, indicate acryloyl group, methylacryloyl or hydrogen atom, and at least one party is acryloyl group or methylacryloyl, n indicates 8~15 integer.
Description
Technical field
The present invention relates to a kind of adhesive composite, circuit connection material, circuit connection structure and bonding agent sheet materials.
Background technique
As semiconductor element, circuit connection material used for liquid crystal display element, it is therefore known to use high adhesiveness and table
Reveal the compositions of thermosetting resin of the epoxy resin of high reliability (for example, referring to patent document 1).As thermosetting resin group
The constituent of object is closed, generally there are using epoxy resin, with epoxy resin the curing agent such as reactive phenolic resin and is promoted
The potentiality curing agent reacted into epoxy resin with curing agent.In addition, making sometimes in order to ensure storage-stable at room temperature
With potentiality curing agent.Potentiality curing agent becomes an important factor for determining solidification temperature and curing rate, from room temperature
Storage-stable and curing rate when heating from the perspective of, use various compounds.
Recently, the free-radical polymerised substance such as and use acrylate derivative, methacrylate derivative and as from
It is of concern by the radical-curable bonding agent of the peroxide of base polymerization initiator.For radical-curable bonding agent
For, since the free radical as reactivity kind is rich in reactivity, can be solidified in low temperature and in the short time
(for example, referring to patent document 2,3).
In addition, being widely used with the multifunction of display device by the input unit of representative of touch screen.In the touching
It touches in the manufacture of screen, the sensor of touch screen and the connection of peripheral circuit component also use circuit connection material.
According to the display device, the composition of the touch screen of carrying is different, and diversification.In multifunctional portable phone (intelligence
Mobile phone), in the case where tablet PC, from the viewpoint of low price, lightweight, studying or be applicable in poly terephthalic acid second two
The basement membranes of the films as touch panel sensor such as alcohol ester (PET), polycarbonate (PC), polyethylene naphthalate (PEN).It is another
Aspect forms skill due to that can divert the circuit turned out in the manufacture of liquid crystal display in the case where liquid crystal display
Art, therefore have the example of touch screen of many liquid crystal display manufacturers productions on glass equipped with touch panel sensor.Having
In the liquid crystal display of the standby touch screen, in order to be thinned, the glass of touch panel sensor and the glass of liquid crystal display are set
It is common, therefore the low polarizer film of heat resistance is located near the interconnecting piece of circuit member.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 1-113480 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2002-203427 bulletin
Patent document 3: International Publication WO98/044067 bulletin
Summary of the invention
Problems to be solved by the invention
As described above, being when the substrate of touch panel sensor is resin film and when there are heat resistance low component
Carry out the connection of the sensor and circuit member of touch screen, even radical-curable bonding agent also requires it is further low
Wen Hua.
In order to improve the low temperature active of radical-curable bonding agent, it may be considered that increase matching for radical polymerization initiator
Resultant.But the research judgement of people etc. according to the present invention, the circuit connection structure of adhesive strength is ensured by this method
Body, interelectrode connection resistance value opposite under hot and humid environment can rise sometimes.
It is an object of that present invention to provide one kind even if 120 DEG C nearby in a low temperature of connection circuit member that at this point, can
It accesses with sufficient adhesive strength, and maintains under hot and humid environment between substantially low counter electrode
Circuit connection material, adhesive composite and the bonding agent piece of the excellent circuit connection structure of the connection reliability of connection resistance
Material.In addition, the object of the invention, which also resides in, provides one kind with sufficient adhesive strength, and even if under hot and humid environment
Maintain the excellent circuit connection structure of the connection reliability of the connection resistance between substantially low counter electrode.
Solution to the problem
The present invention provides a kind of adhesive composite, containing free-radical polymerised substance and radical polymerization initiator,
As free-radical polymerised substance, the first free-radical polymerised substance and the first radical polymerization indicated containing the following general formula (1)
The second free-radical polymerised substance with 2 or more (methyl) acryloyl groups other than conjunction property substance, as free radical polymerization
Initiator contains dilauroyl peroxide.
In formula (1), X1And X2It can be the same or different, indicate acryloyl group [CH2=CH-C (=O) -], methyl
Acryloyl group [CH2=C (CH3)-C (=O) -] or hydrogen atom [H-], and at least one party is acryloyl group or metering system
Acyl group, n indicate 8~15 integer.
According to the adhesive composite of aforementioned present invention, even if can also show adequately to be bonded between low-temperature short-time
Intensity.In addition, when adhesive composite of the invention is used for circuit connection material, even if in a low temperature of near 120 DEG C
Connect circuit member that at this point, can also obtain that there is sufficient adhesive strength, and tie up under hot and humid environment
The excellent circuit connection structure of the connection reliability of the connection resistance between substantially low counter electrode is held.
The reason of about said effect is generated when adhesive composite of the invention is used for circuit connection material, still not
It is clear, but the inventors of the present invention are presumed as follows.Firstly, the inventors of the present invention confirmed: using containing more dilauroyl peroxide
The circuit connection structure that circuit connection material is attached can generate after the reliability test under high temperature and humidity in interconnecting piece
More bubble, the connection reliability under especially narrow spacing are deteriorated.Therefore, as the electrode connected under hot and humid environment
Between connection resistance value rise the main reason for, it is believed that be the dilauroyl peroxide largely contained in circuit connection material
It crystallizes or is locally present on the surface of the material.The inventors of the present invention think, bonding of the invention is used in circuit connection material
When agent composition, pass through free-radical polymerised substance (the first free radical for indicating dilauroyl peroxide and above-mentioned general formula (1)
Polymeric agents) be used in combination, even if adhesive strength when in order to ensure law temperature joining and cooperated the feelings of dilauroyl peroxide
Under condition, also dilauroyl peroxide can be effectively inhibited by the first free-radical polymerised substance with specific structure
It crystallizes or is locally present, therefore adhesive strength can be taken into account and connect the stability of resistance.
The content of dilauroyl peroxide in adhesive composite of the invention, relative to what is contained in adhesive composite
100 mass parts of total amount of free-radical polymerised substance, preferably 10~40 mass parts.By the content for making dilauroyl peroxide
In the numberical range, even if can also show sufficient adhesive strength, while can sufficiently inhibit between low-temperature short-time
Aoxidize the crystallization of two lauroyl.
In addition, the content of the first free-radical polymerised substance, relative to 100 mass parts of content of dilauroyl peroxide,
Preferably 30~100 mass parts.By making the content of the first free-radical polymerised substance in the numberical range, even if being low temperature
Short time can also show sufficient adhesive strength, while can sufficiently inhibit the crystallization of dilauroyl peroxide.
Adhesive composite of the invention preferably further contains thermoplastic resin.At this moment, the operation of adhesive composite
Property improve, while stress when can be realized solidification mitigates excellent adhesive composite.
In addition, the present invention provides a kind of circuit connection material formed by the adhesive composite of aforementioned present invention, use
In by have it is opposite to the circuit member of circuit electrode be connected to each other.
According to the circuit connection material of aforementioned present invention, even if connection circuit member is each other in a low temperature of near 120 DEG C
When, it can also obtain that there is sufficient adhesive strength, and maintain substantially low opposite direction under hot and humid environment
The excellent circuit connection structure of the connection reliability of interelectrode connection resistance.
The content of dilauroyl peroxide in circuit connection material of the invention, relative to what is contained in circuit connection material
100 mass parts of total amount of free-radical polymerised substance, preferably 10~40 mass parts.By the content for making dilauroyl peroxide
In the numberical range, circuit member can be connected each other with sufficient adhesive strength, while can sufficiently inhibit in high temperature height
The rising of resistance value is connected under wet environment.
In addition, the content of the first free-radical polymerised substance, relative to 100 mass parts of content of dilauroyl peroxide,
Preferably 30~100 mass parts.It, can be with abundant by making the content of the first free-radical polymerised substance in the numberical range
Adhesive strength connection circuit member each other, while can sufficiently inhibit under hot and humid environment connect resistance value rising.
Circuit connection material of the invention preferably further contains thermoplastic resin.At this moment, the operation of circuit connection material
Property improve, while stress when can be realized solidification mitigates excellent circuit connection material.
In addition, the present invention provides a kind of circuit connection structure, have: there is first substrate and be formed in substrate master
First circuit member of the first circuit electrode on face；Second circuit component, the second circuit component have the second substrate and shape
At the second circuit electrode on the substrate interarea, second circuit electrode and the first circuit electrode are oppositely disposed, and the second electricity
Path electrode is electrically connected with the first circuit electrode；And the interconnecting piece between the first circuit member and second circuit component, even
Socket part is the solidfied material of the circuit connection material of aforementioned present invention.
Circuit connection structure of the invention, the solidification of the circuit connection material by making interconnecting piece aforementioned present invention
Object can have sufficient adhesive strength, and have and maintain substantially low opposite direction electricity under hot and humid environment
The excellent connection reliability of the connection resistance of interpolar.In addition, circuit connection structure of the invention, due to can be at low temperature
Interconnecting piece is formed, therefore the influence generated due to heat can be reduced with heat resistance low component.
In addition, the present invention provides a kind of bonding agent sheet material, have support membrane and be arranged on the support membrane by this hair
The film-like adhesive that bright adhesive composite is formed.
Bonding agent sheet material according to the present invention, by having the membranaceous bonding formed by adhesive composite of the invention
Agent can show sufficient adhesive strength between low-temperature short-time.
Invention effect
In accordance with the invention it is possible to provide it is a kind of even if 120 DEG C nearby in a low temperature of connection circuit member that at this point, can
It accesses with sufficient adhesive strength, and maintains under hot and humid environment between substantially low counter electrode
Circuit connection material, adhesive composite and the bonding agent piece of the excellent circuit connection structure of the connection reliability of connection resistance
Material.In addition, in accordance with the invention it is possible to provide it is a kind of there is sufficient adhesive strength, and even if under hot and humid environment
Maintain the excellent circuit connection structure of the connection reliability of the connection resistance between substantially low counter electrode.
Detailed description of the invention
Fig. 1 is the schematic section for indicating an embodiment of bonding agent sheet material.
Fig. 2 is the schematic section of an embodiment of indication circuit connection structural bodies.
Fig. 3 is the schematic section of an embodiment for illustrating the manufacturing method of circuit connection structure.
Specific embodiment
Hereinafter, the preferred embodiment of the present invention is described in detail on one side referring to attached drawing on one side as needed.But
It is that the present invention is not limited to the following embodiments and the accompanying drawings.It should be noted that the dimensional ratios of attached drawing are not limited to diagram
Ratio.In addition, " (methyl) acrylate " in this specification refers to " acrylate " and corresponding " methacrylic acid
Ester ", " (methyl) acryloyl group " refer to " acryloyl group " and corresponding " methylacryloyl ".
The adhesive composite of present embodiment contains free-radical polymerised substance and radical polymerization initiator, as certainly
By base polymeric agents, the first free-radical polymerised substance and the first free-radical polymerised object indicated containing the following general formula (1)
The second free-radical polymerised substance with 2 or more (methyl) acryloyl groups other than matter, as radical polymerization initiator,
Contain dilauroyl peroxide.
In formula (1), X1And X2It can be the same or different, indicate acryloyl group [CH2=CH-C (=O) -], methyl
Acryloyl group [CH2=C (CH3)-C (=O) -] or hydrogen atom [H-], and at least one party is acryloyl group or metering system
Acyl group, n indicate 8~15 integer.
Hereinafter, for the adhesive composite that is applicable in present embodiment as will have it is opposite to circuit electrode
The case where circuit connection material that circuit member is connected to each other, is illustrated.
First free-radical polymerised substance is the hydrocarbon skeleton (methylene as represented by above-mentioned general formula (1) with specific length
Chain) and with 1 or more (methyl) acryloyl group compound.Specifically, 1,10- decanediol, two propylene can be enumerated
Acid esters, 1,10- decanediol dimethylacrylate, 1,9- nonanediol diacrylate, 1,9- decanediol dimethacrylate
Ester, 1,8- ethohexadiol diacrylate, 1,8- ethohexadiol dimethylacrylate, 1,11- undecane diacrylate
Ester, 1,11- undecane dimethylacrylate, 1,12- dodecanediol diacrylate, 1,12- decanediol diformazan
Base acrylate, 1,13- tridecane diols diacrylate, 1,13- tridecane diols dimethylacrylate, 1,14- ten
Four alkane omega-diol diacrylates, 1,14- tetradecane diols dimethylacrylate, 1,15- pentadecane diols diacrylate,
1,15- pentadecane diols dimethylacrylate etc..
The compound that above-mentioned general formula (1) indicates can be used alone, or can be used in combination of two or more.
As the second free-radical polymerised substance, for example, carbamate (methyl) acrylate, ethylene glycol can be enumerated
Two (methyl) acrylate, diethylene glycol two (methyl) acrylate, trimethylolpropane tris (methyl) acrylate, four hydroxyl first
Methylmethane four (methyl) acrylate, two (methyl) acryloxy propane of 2- hydroxyl -1,3-, [the 4- ((first of 2,2- bis-
Base) acryloyl-oxy ylmethoxy) phenyl] propane, 2,2- bis- [4- ((methyl) acryloyl-oxy Quito ethyoxyl) phenyl] propane,
Dicyclopentenyl (methyl) acrylate, tricyclodecyl (methyl) acrylate, three ((methyl) acryloyl-oxyethyl) isocyanides
Urea acid esters etc..They can be used alone, or can be used in combination of two or more.
In addition, the second free-radical polymerised substance preferably has from the viewpoint of the heat resistance for improving circuit connection material
There are one or more of dicyclopentenyl, tricyclodecyl and triazine ring.
Second free-radical polymerised substance is not limited to monomer, and oligomer also can be used.As this free-radical polymerised
Substance, for example, carbamate (methyl) acrylate oligomer etc. can be enumerated.
From the viewpoint of the intermiscibility with resin, the molecular weight of above-mentioned oligomer is preferably 2000~20000.
Above-mentioned second free-radical polymerised substance can be used alone, or can be used in combination of two or more.
The circuit connection material of present embodiment can be further containing the third free radical polymerization with phosphate ester structure
Property substance.At this moment, it can be improved the adhesive strength to mineral surfaces such as metals.
As the free-radical polymerised substance of third, from the viewpoint of cementability, preferably the following general formula (2) indicate chemical combination
Object.As the compound that the following general formula (2) indicate, for example, list (2- (methyl) acryloyl-oxyethyl) acid phosphorus can be enumerated
Acid esters, two (2- (methyl) acryloyl-oxyethyl) phosphate ester acids etc..These compounds for example can be used as phosphoric anhydride with
The reactant of (methyl) acrylic acid 2- hydroxy methacrylate and obtain.
In formula (2), R indicates that methyl or hydrogen atom, n indicate 1~2 integer.
The free-radical polymerised substance of third can be used alone, or can be used in combination of two or more.
It, can also be free-radical polymerised containing above-mentioned first, second, and third in the circuit connection material of present embodiment
Free-radical polymerised substance other than substance.It as this free-radical polymerised substance, is not particularly limited, single official can be used
Energy (methyl) acrylate etc..As simple function (methyl) acrylate, for example, the simple function with ring structure can be enumerated
(methyl) acrylate, (methyl) acrylate with carbamate groups.
As simple function (methyl) acrylate with ring structure, acryloyl morpholine, methacryl can be used
Base morpholine, isobornyl acrylate, isobornyl methacrylate, tetrahydro -2H- pyrans -2- base-acrylate, four
Hydrogen -2H- pyrans -2- base-methacrylate, 1- (cyclohexyloxy) ethyl propylene acid esters, 1- (cyclohexyloxy) ethyl
Methacrylate, 1- (cyclohexyloxy) propyl acrylate, 1- (cyclohexyloxy) propyl methacrylate, 1- (hexamethylene
Oxygroup) ethylmethyl acrylate, 1- (cyclohexyloxy) butyl propyleneglycol acid esters, 1- (cyclohexyloxy) butyl methyl acrylic acid
Ester, 1- (cyclohexyloxy) acrylate, 1- (cyclohexyloxy) phenyl-methyl acrylate, cyclohexyl acrylate, methyl
Cyclohexyl acrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, acrylic acid phenoxy group methyl esters, methacrylic acid benzene
Oxygroup methyl esters, phenoxyethyl acrylate, phenoxyethyl methacrylate, acrylic acid phenoxy-propyl, methacrylic acid benzene
Oxygroup propyl ester, acrylic acid phenoxy group butyl ester, gamma-butyrolacton acrylate, δ-valerolactone acrylate etc..
As (methyl) acrylate with carbamate groups, for example, can enumerate as polytetramethylene glycol
Substance obtained from the reactant of equal polyalcohols and polyisocyanate and the acyclic compound containing hydroxyl.This compound
Due to excellent in adhesion, preferably.
From connection resistance with from the viewpoint of Nian Jie sexual balance, free radical polymerization in the circuit connection material of present embodiment
Property substance total content, with circuit connection material total amount be 100 mass parts when, preferably 25~55 mass parts, more preferably
For 30~50 mass parts, further preferably 35~45 mass parts.In addition, free radical in the circuit connection material of present embodiment
Total content of polymeric agents, with circuit connection material total amount be 100 mass parts when, or 20~70 mass parts or
30~65 mass parts.
The circuit connection material of present embodiment contains dilauroyl peroxide as radical polymerization initiator, and according to
The condition etc. of circuit is connected, it can also be suitably and with the radical polymerization initiator other than dilauroyl peroxide.
As the radical polymerization initiator other than dilauroyl peroxide, can be used usually makes in free radical polymerization
Radical polymerization initiator, it is, for example, possible to use peroxide compound, azos that free free radical is generated by heating
Based compound etc..Specifically, can be from diacyl peroxide class, peroxy dicarbonates, peroxyesters, peroxidating
It is selected in ketal class, dialkyl peroxide class, hydroperoxide type etc..
Above-mentioned radical polymerization initiator one kind can be used in combination with dilauroyl peroxide, can also by two kinds with
On combine and be used in combination with dilauroyl peroxide.
From the viewpoint of keeping quality raising, in the circuit connection material of present embodiment, preferably comprises and use polyurethane
The cladding radical polymerization initiator such as polymer substance of system or Polyester simultaneously carries out the resulting material of microencapsulation.
In addition, in the circuit connection material of present embodiment by radical polymerization initiator and promotion can also be decomposed
Agent or decomposing inhibitor are used in mixed way.
The content of dilauroyl peroxide in the circuit connection material of present embodiment, relative to containing in circuit connection material
100 mass parts of total amount for the free-radical polymerised substance having, preferably 10~40 mass parts, more preferably 15~35 mass parts,
Further preferably 20~30 mass parts.It, can be to fill by making the content of dilauroyl peroxide in above-mentioned numberical range
The adhesive strength connection circuit member divided each other, while can sufficiently inhibit to connect the upper of resistance value under hot and humid environment
It rises.
The content of first free-radical polymerised substance in the circuit connection material of present embodiment, relative to peroxidating February
100 mass parts of content of osmanthus acyl, preferably 30~100 mass parts, more preferably 50~80 mass parts.By making the first free radical
The content of polymeric agents can connect circuit member each other with sufficient adhesive strength in above-mentioned numberical range, while energy
Enough risings for sufficiently inhibiting to connect resistance value under hot and humid environment.
From the viewpoint of cementability, the second free-radical polymerised substance contains in the circuit connection material of present embodiment
Amount, relative to total 100 mass parts of free-radical polymerised substance, preferably 70~90 mass parts, more preferably 72~88 matter
Measure part, further preferably 75~90 mass parts.
From the viewpoint of cementability and corrosion sexual balance, third radical polymerization in the circuit connection material of present embodiment
The content of conjunction property substance, relative to total 100 mass parts of free-radical polymerised substance, preferably 3~10 mass parts, more preferably
For 4~8 mass parts, further preferably 5~6 mass parts.
The circuit connection material of present embodiment, the stress in the raising and solidification of operability mitigates excellent aspect, excellent
Choosing further contains thermoplastic resin.
As thermoplastic resin, phenoxy resin, polyurethane resin, polyester polyurethane resin, acrylic acid tree can be used
Rouge, polyvinyl butyral resin, vinyl-formal resin, polyimide resin, polyamide, polyester resin, phenol
Urea formaldehyde, polystyrene resin, polyvinyl resin, Corvic, polyphenylene oxide resin, xylene resin, polyisocyanate
Resin etc..
Phenoxy resin can be reacted with epihalohydrins by making two function phenols until high molecular weight, or makes two function rings
Oxygen resin carries out sudden reaction with two function phenols and obtains.
In addition, the copolymers such as vinyl-vinyl acetate copolymer can be used as thermoplastic resin.
Thermoplastic resin can be used alone, or can be used in combination of two or more.
In above-mentioned thermoplastic resin, from from the viewpoint of the intermiscibility of other resins, preferably phenoxy resin, poly- ammonia
Ester resin, polyester polyurethane resin, acrylic resin.Thermoplastic resin can be with free-radical polymerised functional group (for example, (first
Base) acryloyl group) it is modified.
The weight average molecular weight of thermoplastic resin is preferably greater than or equal to 10000, and more preferably 10000~1000000, into
One step is preferably 10000~150000.When the weight average molecular weight of thermoplastic resin is more than or equal to 10000, it is shaped to
The tendency that film formation property when membranaceous improves, on the other hand, when for less than or equal to 1000000, dissolubility in a solvent and
The intermiscibility of other ingredients improves, and has and is easy to modulate the tendency for being shaped to membranaceous coating fluid.
It should be noted that weight average molecular weight specified in this specification, which refers to, passes through gel infiltration color according to the following conditions
The value of spectrometry (GPC) and the calibrating curve determining using standard polystyren.
[GPC determination condition]
Use equipment: Hitachi's L-6000 type [(strain) Hitachi]
Column: Gelpack GL-R420+Gelpack GL-R430+Gelpack GL-R440 (3 total) [Hitachi
At Co. Ltd. system]
Eluent: tetrahydrofuran
Measuring temperature: 40 DEG C
Flow: 1.75mL/min
Detector: L-3300RI [(strain) Hitachi]
In addition, the glass transition temperature (Tg) of thermoplastic resin is preferably greater than or equal to 40 DEG C, more preferably 50~90 DEG C,
Further preferably 60~80 DEG C.
It should be noted that in the present specification, the glass transition temperature of thermoplastic resin refers to be filled using dynamic viscoelastic
The peak temperature of the tan δ obtained when setting the resin of measurement film film-like under conditions of 10 DEG C/min of heating rate, frequency 10Hz
Degree.
In the present embodiment, it is preferable to use polyester from the viewpoint of the intermiscibility from cementability and with other resins
Polyurethane resin is as thermoplastic resin.
Polyester polyurethane resin, for example, can react to obtain by polyester polyol and diisocyanate.Polyester is poly-
Urethane resin has carbamate groups and ester group preferably in its main chain.
Polyester polyol is the polymer with multiple ester groups and multiple hydroxyls.Polyester polyol, for example, two can be passed through
Carboxylic acid is obtained with reacting for dihydric alcohol.As dicarboxylic acids, preferably terephthalic acid (TPA), M-phthalic acid, adipic acid, decanedioic acid etc.
Aromatic series, aliphatic dicarboxylic acid etc..As dihydric alcohol, preferably ethylene glycol, propylene glycol, 1,4-butanediol, hexylene glycol, new penta 2
The glycols such as alcohol, diethylene glycol, triethylene glycol.
It can be suitable for using 2,4- toluene di-isocyanate(TDI) (TDI), 4,4 '-diphenyl methanes two as diisocyanate
The aromatic series such as isocyanates (MDI), 1,6- hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI),
Alicyclic or aliphatic diisocyanate.
Polyester polyurethane resin preferably has anionic property.Adhesive strength further increases as a result,.With anionic property
Polyester polyurethane resin, can be by having sulfonic group, carboxylic for side chain when polyester polyol is reacted with diisocyanate
The glycol of base, Diamines copolymerization obtain.That is, polyester polyurethane resin preferably has sulfonic group or carboxyl.
Polyester polyurethane resin preferably has the aromatic group including phenyl ring etc., the ring-shaped fat including cyclohexane ring etc.
Race's group etc..
Polyester polyurethane resin can be use mixing two or more.For example, aromatic polyester polyol can will be passed through
With the resin of aliphatic diisocyanate reacted and pass through aliphatic polyester polyols and aromatic diisocyanate
React obtained resin combination.
The weight average molecular weight of polyester polyurethane resin is preferably 5000~100000.When weight average molecular weight be more than or equal to
When 5000, film formation property when having the tendency that being shaped to membranaceous is improved, when weight average molecular weight is less than or equal to 100000, molten
Dissolubility, intermiscibility in agent improve, and have and are easy to modulate the tendency for being shaped to membranaceous coating fluid.
From connection resistance with from the viewpoint of Nian Jie sexual balance, thermoplastic resin in the circuit connection material of present embodiment
Content, with circuit connection material total amount be 100 mass parts when, preferably 10~50 mass parts, preferably 20~40 mass
Part, more preferably 25~35 mass parts.In addition, in the circuit connection material of present embodiment thermoplastic resin content, with
When circuit connection material total amount is 100 mass parts, or 30~80 mass parts or 35~70 mass parts.
The circuit connection material of present embodiment, can be further containing the compound with aminooxy group structure.At this moment, may be used
To further increase the storage stability of circuit connection material.
In order to improve storage stability, the circuit connection material of present embodiment can also contain quinhydrones, methylether hydroquinone
The polymerization inhibitors such as class.
The circuit connection material of present embodiment can contain electroconductive particle.As electroconductive particle, can enumerate Au,
The metallics such as Ag, Ni, Cu, solder, carbon etc..Further, it is also possible to be with transition metal-types tables such as the precious metals such as Au cladding Ni
Face and the particle formed.Sufficient working life in order to obtain, preferably surface layer are not the transition metal-types such as Ni, Cu but Au, Ag, platinum
The precious metal of race, more preferably Au.In addition, non-conductive by coating glass, ceramics, plastics etc. with said conductive substance
The methods of the surface of property particle forms conductting layer on non-conductive particles surface, and further constitutes outermost layer by precious metal
Particle or hot molten metal particle in the case where, due to have to heating pressurization morphotropism, connection when and electrode
Contact area increase, reliability improve, thus preferably.
The circuit connection material of present embodiment, even if being free of electroconductive particle, can also in connection by it is opposite to
Circuit electrode direct contact and connected, and if further containing electroconductive particle, can obtain more stable
Connection.
The content of electroconductive particle in the circuit connection material of present embodiment, can be according to the purposes of circuit connection material
And suitably set, for example, can be 0.1~30 volume relative to 100 parts by volume of circuit connection material containing electroconductive particle
The range of part.Lead to adjacent short circuit etc., the preferably content of electroconductive particle because of excessive electroconductive particle in order to prevent
For 0.1~10 parts by volume.
The circuit connection material of present embodiment can contain packing material, softening agent, promotor, anti-aging agent, coloring
Agent, fire retardant, thixotropic agent, coupling agent etc..
Circuit connection material according to the present embodiment, even if connection circuit member is each other in a low temperature of near 120 DEG C
When, it can also obtain that there is sufficient adhesive strength, and maintain substantially low opposite direction under hot and humid environment
The excellent circuit connection structure of the connection reliability of interelectrode connection resistance.
The reason of said effect can be generated for the circuit connection material of present embodiment, the inventors of the present invention speculate such as
Under.Firstly, the inventors of the present invention confirmed: the electricity being attached using the circuit connection material containing more dilauroyl peroxide
Road connection structural bodies can generate more bubble, especially narrow spacing in interconnecting piece after the reliability test under high temperature and humidity
Under connection reliability be deteriorated.Therefore, the master risen as the interelectrode connection resistance value connected under hot and humid environment
Want reason, it is believed that be that the dilauroyl peroxide largely contained in circuit connection material crystallizes or office on the surface of the material
Portion exists.The inventors of the present invention think, in the circuit connection material of present embodiment, by by dilauroyl peroxide with it is above-mentioned
The free-radical polymerised substance (the first free-radical polymerised substance) that general formula (1) indicates is used in combination, even if connecting in order to ensure low temperature
Adhesive strength when connecing and in the case where having cooperated dilauroyl peroxide, also by the first radical polymerization with specific structure
Conjunction property substance and restrained effectively the crystallization of dilauroyl peroxide or be locally present, therefore be able to take into account adhesive strength and
Connect the stability of resistance.
Then, bonding agent sheet material of the invention is directed at while referring to attached drawing to be illustrated.
Fig. 1 is the schematic section for indicating an embodiment of bonding agent sheet material of the invention.It is bonded shown in Fig. 1
Agent sheet material 4 have support membrane 1, the film-like adhesive 2 that is arranged on support membrane and film-like adhesive 2 is set with support membrane 1
Protective film 3 on the face of opposite side.
Film-like adhesive 2 by comprising with the circuit connection material of above-mentioned present embodiment with the of the invention bonding of sample ingredient
Agent composition is formed, and it includes bonding agent ingredients 5 and the electroconductive particle 7 being dispersed in bonding agent ingredient 5.Bonding agent herein
Ingredient refers to from the ingredient after adhesive composite removal electroconductive particle.
As support membrane 1, for example, be able to use polyethylene terephthalate film, poly (ethylene naphthalate) film,
Polyethylene glycol isophthalate film, polybutylene terephthalate (PBT) film, polyolefin mesentery, poly- acetate membrane, polycarbonate
Film, polyphenylene sulfide film, PA membrane, vinyl-vinyl acetate copolymer film, polychloroethylene film, polyvinylidene chlorida film, synthesis
The various films such as rubber mesentery, liquid crystalline polymer film.Above-mentioned film may be as needed to surface implement Corona discharge Treatment,
The film of primary coat processing, antistatic treatment etc..
In addition, can also be coated on the surface of support membrane 1 to easily remove film-like adhesive 2 from support membrane 1
There is stripping treatment agent.As stripping treatment agent, organic siliconresin, the copolymer of organosilicon and organic system resin, alcohol can be used
The various removings such as acid resin, amino-alkyd resin, the resin with chain alkyl, the resin with fluoro-alkyl, lac resin
Inorganic agent.
For the thickness of support membrane 1, it is contemplated that the keeping of the bonding agent sheet material 4 of production, convenience when using etc.,
Preferably 4~200 μm, it is contemplated that material cost, productivity etc., more preferably 15~75 μm.
Film-like adhesive 2 can be coated on support membrane 1 by using apparatus for coating to be combined containing bonding agent of the invention
The coating solution of object, heated-air drying that professional etiquette of going forward side by side is fixed time and make.In the present embodiment, bonding agent of the invention combination
Object preferably comprises above-mentioned thermoplastic resin as filmogen.
The thickness of film-like adhesive 2 is preferably 10~30 μm.If the thickness of film-like adhesive 2 is in the range, can
It is enough to be suitable for the most available circuit specification towards anisotropic conductive film.
Film-like adhesive 2 can also be constituted by 2 layers or more.For example, the layer containing electroconductive particle is being made and without leading
When this 2 layers structure of the layer of conductive particles, the raising of working life, the raising of particle capturing efficiency can be realized.
After bonding agent sheet material 4 can be by forming film-like adhesive 2 on support membrane 1, known laminating machine is used
It is made Deng protective film 3 is bonded above.
As protective film 3, can enumerate and the same film of support membrane 1.Wherein, preferably there is fissility higher than support membrane
Film as protective film.For the thickness of protective film, it is contemplated that the keeping of the bonding agent sheet material 4 of production, when using just
Benefit etc., preferably 4~200 μm, it is contemplated that material cost, productivity, more preferably 15~75 μm.
Then, circuit connection structure and its manufacturing method of the invention are illustrated.
Fig. 2 is the schematic section of an embodiment of indication circuit connection structural bodies.Circuit connection knot shown in Fig. 2
Structure body 100 has: with the first circuit substrate 21 and the first circuit electrode being formed on substrate interarea 21a (the first connection
Terminal) 22 the first circuit member 20, with second circuit substrate 31 and the second circuit being formed on the substrate interarea 31a electricity
The second circuit component 30 of pole (second connection end son) 32 and between the first circuit member 20 and second circuit component 30
The interconnecting piece 10 that they are bonded.Second circuit component 30 is in such a way that second circuit electrode 32 and the first circuit electrode 22 are opposite
It is oppositely disposed with the first circuit member 20.
Interconnecting piece 10 is to make the circuit connection material of present embodiment between the first circuit member 20 and second circuit component
It is this embodiment party between 30, and in this state to the first circuit member 20 and the pressurization of second circuit component 30 to formation
The solidfied material of the circuit connection material of formula.It should be noted that in the present embodiment, it is shown that using containing electroconductive particle
Circuit connection material and example when forming interconnecting piece 10, interconnecting piece 10 is by the ingredient other than electroconductive particle
Insulating layer 11 and the electroconductive particle 7 that is dispersed in insulating layer 11 constitute.
Opposite the first circuit electrode 22 and second circuit electrode 32 is electrically connected by electroconductive particle 7.Another party
Face is formed in the first circuit electrode 22 on same circuit substrate each other and second circuit electrode 32 is insulated from each other.
As the first circuit substrate 21 and second circuit substrate 31, semiconductor chip, resistance chip, capacitance core can be enumerated
Substrates such as the chip parts such as piece, printed base plate etc..In general, being equipped with multiple connection terminals on circuit member, but according to circumstances, even
Connecting terminal is also possible to individually.
As circuit substrate, more specifically, substrate, the modeling of the inorganic material such as semiconductor, glass and ceramics can be enumerated
Expect substrate, glass/epoxy substrate etc..Circuit substrate can also be by the resulting substrate of these combinations of materials.
As plastic base, polyimide film, polycarbonate (PC) film and polyester film can be enumerated.From low price, light weight
From the viewpoint of change, preferably polycarbonate (PC) film, polyethylene terephthalate (PET) or poly- naphthalenedicarboxylic acid ethylene glycol
Ester (PEN).
First circuit electrode and second circuit electrode are formed by metals such as copper.More good electrical connection in order to obtain, preferably
Make more than one gold of the surface of at least one party of the first circuit electrode and second circuit electrode selected from gold, silver, tin and platinum family
Belong to.For example, can combine various metals as copper/ni au and form multilayered structure.At this moment, layer gold most table can be made
Surface layer.
In addition, the side in the first circuit member 20 and second circuit component 30 can be with glass substrate or plastics base
Plate has as circuit substrate by the panel of LCD of the connection terminal of the formation such as ITO.In addition, the first circuit structure
A side in part 20 and second circuit component 30 is also possible to the flexible printing wiring for having polyimide film as circuit substrate
Plate (FPC), carrier package (TCP) or flip chip (COF) or the semiconductor silicon core with semiconductor substrate as circuit substrate
Piece.It can according to need and constitute connection structural bodies for these various circuit members are appropriately combined.
For example, when the first circuit member be the solar battery cell with electrodes such as finger electrode, bus electrodes, second
When circuit member is tab line, connecting their resulting connection structural bodies is to have solar battery cell, tab line and bonding
The solar cell module of their connecting elements (solidfied material of adhesive composite).
Circuit connection structure 100 for example by by the circuit connection material of the first circuit member 20, present embodiment and
Second circuit component 30 is overlapped in this order with the first connection terminal 22 and the sub 32 opposite modes of second connection end, and in the shape
It carries out pressurizeing under state or heats and formed in turn.
As long as pressure is not particularly limited in the range of will not generate damage to bonded object, but is preferably generally
0.1~10MPa.Heating temperature is not particularly limited, and preferably 100~200 DEG C.These pressurizations and heating are preferably at 0.5 second
Carried out in the range of~100 seconds, 120~180 DEG C or 130~180 DEG C, 3MPa, heating in 10 seconds be also able to carry out bonding.
Further, the manufacturing method of the circuit connection structure of present embodiment is said on one side referring to Fig. 3 on one side
It is bright.In the present embodiment, prepare above-mentioned first circuit member 20 first and form the circuit connection material of present embodiment
Be it is membranaceous made of film-like adhesive 40 (referring to Fig. 3 (a)).In the present embodiment, circuit connection material contains conductive grain
Son 7.Bonding agent ingredient 5 indicates the ingredient after removing electroconductive particle in circuit connection material.It should be noted that in circuit
When connecting material is free of electroconductive particle 7, which can also be used as insulating properties bonding agent and leads for anisotropy
Electrically bonding.
Then, the formation that film-like adhesive 40 is placed on the first circuit member 20 is had on the face of circuit electrode 22.Then,
It pressurizes on the arrow A and B direction of Fig. 3 (a) to film-like adhesive 40, film-like adhesive 40 is temporarily attached to the first electricity
(referring to Fig. 3 (b)) on road component 20.At this moment, it can pressurize while heating.Wherein, heating temperature is set below membranaceous viscous
Connect the temperature of the solidification temperature of the adhesive composite in agent 40.Heating temperature when interim connection is preferably 50~120 DEG C, more
Preferably 60~110 DEG C.In addition, pressure when interim connection is preferably 0.1~3MPa.
In the present embodiment, the bonding agent sheet material 4 that above-mentioned present embodiment can be used exists film-like adhesive configuration
On first circuit member.Specifically, protective film 3 will be removed from bonding agent sheet material 4 using laminating machine and exposed membranaceous viscous
Agent 2 is connect to be fitted on the first circuit member 20.When adherency condition for example can be set to 70 DEG C of heating temperature, pressure 1MPa, connection
Between 2 seconds.Support membrane 1 is removed after adherency.
Then, as shown in Fig. 3 (c), by second circuit in a manner of making second circuit electrode the first circuit member 20 of direction
Component 30 is placed on film-like adhesive 40.At this moment, after the first and second circuit electrodes are aligned in a manner of relatively, from
It heated, pressurizeed above second circuit component, so as to which second circuit component to be fixed temporarily.So operation, can
Electrode position when next formal connection is inhibited to deviate.Heating temperature when being fixed temporarily is set below in film-like adhesive 40
Adhesive composite solidification temperature temperature, in order to shorten the production time, the time of completion is excellent from aligning to being fixed temporarily
It is selected as being less than or equal to 5 seconds.In addition, heating temperature when being fixed temporarily is preferably 50~100 DEG C, more preferably 60~90
℃.In addition, heating temperature when being fixed temporarily may be 50~120 DEG C, 60~110 DEG C.In addition, pressure when being fixed temporarily
Preferably 0.1~3MPa.
Then, film-like adhesive 40 is heated on one side, on one side across first on the arrow A and B direction of Fig. 3 (c)
Circuit member 20 and second circuit component 30 pressurize.At this moment heating temperature is set as capableing of the temperature of initiated polymerization.
In the present embodiment, condition of contact as previously mentioned, can be set to 110~160 DEG C of heating temperature, preferably 115~150 DEG C,
It is more preferably 120~140 DEG C, 0.1~10MPa of pressure, preferably 0.5~5MPa, 0.5 second~120 seconds Connection Time, excellent
It is selected as 4 seconds~30 seconds.In addition, as needed, solidifying after can also carrying out.
In this way, film-like adhesive 40 solidifies, circuit connection structure as shown in Figure 2 is obtained.
The manufacturing method of circuit connection structure according to the present embodiment, by using the circuit company by present embodiment
The film-like adhesive 40 for connecing material formation, can obtain circuit connection structure, even if the circuit connection structure is above-mentioned
Cryogenic conditions under also can be bonded circuit member 20,30 each other with sufficient adhesive strength when being attached, while can fill
The connection resistance between the circuit electrode of electrical connection point is reduced, and then when placing for a long time under hot and humid environment is abundant
Inhibit the increase of connection resistance.
The adhesive composite and bonding agent sheet material of present embodiment are strong due to that can obtain adequately being bonded at low temperature
Degree, while the unfavorable condition caused by capable of being substantially reduced because of radical polymerization initiator, therefore be suitable for low containing heat resistance
The bonding of the component of material.
Embodiment
[production of bonding agent sheet material]
(embodiment 1)
Mix the polyester polyurethane resin (UR- of 40 mass parts in terms of nonvolatile component conversion as thermoplastic resin
8200, Japan spinning, 30% solution), by nonvolatile component conversion in terms of 10 mass parts vinyl-vinyl acetate copolymer
(EV40W, three well Du Pont polymerization lengths of schooling, 20% solution), as 5 mass parts 1 of the first free-radical polymerised substance, the 10- last of the ten Heavenly stems
Omega-diol diacrylate (village A-DOD-N, Xin Zhong chemical industry system), as the second free-radical polymerised substance with non-volatile
The toluene of the urethane acrylate oligomer (village UA5500, Xin Zhong chemical industry system) of ingredient conversion 33 mass parts of meter is molten
Solve 70 mass % solution of object, the 2 mass parts 2- methacryloxyethyl acid phosphorus as the free-radical polymerised substance of third
Acid esters (P-2M, common prosperity society chemistry system), the 10 mass parts dilauroyl peroxide (PEROYL as radical polymerization initiator
L, day oil system) and 10 μm of 5 mass parts average grain diameters electroconductive particle, the electroconductive particle is using polystyrene as the grain of core
Sublist face is equipped with 0.2 μm of thickness of nickel layer, and is equipped with 0.04 μm of thickness of layer gold (gold plate) in the outside of the nickel layer.It uses
The mixed solution is coated on the PET film as support membrane by applicator, by 70 DEG C, 10 minutes heated-air dryings, is formed thick
The film-like adhesive that degree is 20 μm, obtains bonding agent sheet material.It should be noted that in film-like adhesive electroconductive particle volume
Ratio is 2 volume %.
(embodiment 2)
Cooperating 5 mass parts 1,10- decanediol dimethylacrylate (village DOD-N, Xin Zhong chemical industry system) replaces 1,
10- decanediol diacrylate (A-DOD-N) equally carries out with embodiment 1 in addition to this, obtains bonding agent sheet material.
(embodiment 3)
Cooperating 5 mass parts 1,9- nonanediol diacrylate (village A-NOD-N, Xin Zhong chemical industry system) replaces 1,
10- decanediol diacrylate (A-DOD-N) equally carries out with embodiment 1 in addition to this, obtains bonding agent sheet material.
(embodiment 4)
Cooperating 5 mass parts 1,9- nonanediol dimethylacrylate (village NOD-N, Xin Zhong chemical industry system) replaces 1,
10- decanediol diacrylate (A-DOD-N) equally carries out with embodiment 1 in addition to this, obtains bonding agent sheet material.
(embodiment 5)
The use level of 1,10- decanediol diacrylate (A-DOD-N) is changed to 8 mass parts, by carbamate
The use level of acrylate oligomer (UA5500) is changed to 30 mass parts, equally carries out, obtains with embodiment 1 in addition to this
Bonding agent sheet material.
(embodiment 6)
The use level of urethane acrylate oligomer (UA5500) is changed to 27 mass parts, further cooperates 3
Mass parts isocyanuric acid EO modified diacrylate (M-215, East Asia synthesis system) is used as the second free-radical polymerised substance, will
The use level of dilauroyl peroxide is changed to 13 mass parts, equally carries out with embodiment 1 in addition to this, obtains bonding agent piece
Material.
(embodiment 7)
The use level of urethane acrylate oligomer (UA5500) is changed to 30 mass parts, further cooperates 3
Mass parts isocyanuric acid EO modified diacrylate (M-215, East Asia synthesis system) is used as the second free-radical polymerised substance, will
The use level of dilauroyl peroxide is changed to 7 mass parts, further two uncles of cooperation 3 mass parts in terms of nonvolatile component conversion
Butyl peroxy hexahydro terephthalic acid ester (HTP-65W, KAYAKU AKZO system, 20% solution) draws as free radical polymerization
Agent is sent out, is equally carried out with embodiment 1 in addition to this, obtains bonding agent sheet material.
(comparative example 1)
Mismatch 1,10- decanediol diacrylate (A-DOD-N), the modified dipropyl of 5 mass parts isocyanuric acid EO of cooperation
Olefin(e) acid ester (M-215, East Asia synthesis system), equally carries out with embodiment 1 in addition to this, obtains bonding agent sheet material.
(comparative example 2)
Mismatch 1,10- decanediol diacrylate (A-DOD-N), 5 mass parts isocyanuric acid EO of cooperation modified 3 third
Olefin(e) acid ester (M-315, East Asia synthesis system), equally carries out with embodiment 1 in addition to this, obtains bonding agent sheet material.
(comparative example 3)
1,10- decanediol diacrylate (A-DOD-N) is mismatched, 5 mass parts dicyclopentadiene-type, two propylene is cooperated
Acid esters (DCP-A, common prosperity society chemistry system) equally carries out with embodiment 1 in addition to this, obtains bonding agent sheet material.
Film-like adhesive composition in embodiment and comparative example is shown in table 1.Unit in table is mass parts.In addition, right
Dilauroyl peroxide and the first free-radical polymerised substance (compound that above-mentioned general formula (1) indicates) in film-like adhesive
For content, by dilauroyl peroxide relative to 100 mass parts of total amount of free-radical polymerised substance ratio (mass parts),
Ratio (mass parts) with the first free-radical polymerised substance relative to 100 mass parts of dilauroyl peroxide is shown in table 2.
[table 1]
[table 2]
[production of circuit connection structure]
Use the bonding agent sheet material of Examples 1 to 7 and comparative example 1~3 respectively, with 120 DEG C -2MPa-10 seconds, it is wide
2.0mm connection flexible circuit board (FPC) and PET film, the flexible circuit board are directly formed on 75 μm of thickness of polyimides
Have 50 μm of line width, 100 μm of spacing, 18 μm of thickness copper circuit, and implement 0.1 μm of thickness of tin coating on copper surfaces,
The PET film is to cover the PET film on surface using silica or cover the PET film on surface using silver paste.At this moment, in advance
The bonding plane of the film-like adhesive of bonding agent sheet material is adhered on above-mentioned PET film, then with 70 DEG C, 1MPa heating pressurization 2 seconds
It is temporarily connected, then PET film of the removing as support membrane from bonding agent sheet material, connect with FPC.
Evaluation for adhesive strength uses the PET film of silica surface and the circuit connection structure (FPC- of FPC
SiO2PET film), for connecting the evaluation of resistance, use the PET film on silver paste surface and the circuit connection structure (FPC- of FPC
Ag pastes PET film).
[measurement of adhesive strength]
Pass through the circuit connection structure (FPC-SiO of 90 degree of stripping methods measurement production based on JIS-Z02372PET
Film) adhesive strength.As the measurement device of adhesive strength, " Tensilon UTM-4 " is made using Japan BALDWIN (strain)
(trade name) (peeling rate 50mm/min, 25 DEG C).The obtained results are shown in tables 3.
[measurement of connection resistance]
After keeping 250 hours reliability tests after newly connection and in the environment of 85 DEG C/85%RH, make respectively
Resistance value between the counter electrode of the circuit connection structure (FPC-Ag pastes PET film) made of multitester measuring.For resistance
Value measures the average value and maximum value of 37 resistance values between opposite circuit electrode.The obtained results are shown in tables 3.
[table 3]
As shown in table 3, according to the bonding agent sheet material of Examples 1 to 7, obtained adhesive strength be more than or equal to 5N/cm,
The maximum value of the resistance value after reliability test is the circuit connection structure within 2 times of average value simultaneously.On the other hand, than
Compared with the bonding agent sheet material of example 1~3, although adhesive strength is good, connection electricity of the circuit connection structure after reliability test
The deviation of resistance becomes larger, and connection reliability is insufficient.In addition, the bonding agent sheet material of embodiment alleviates membranaceous compared with comparative example
The crystallization of the dilauroyl peroxide of adhesive surface.
Symbol description
1: support membrane, 2: film-like adhesive, 3: protective film, 4: bonding agent sheet material, 5: bonding agent ingredient, 7: electric conductivity grain
Son, 10: interconnecting piece, 11: (first connects for insulating layer, 20: the first circuit members, 21: the first circuit substrates, 22: the first circuit electrodes
Connecting terminal), 30: second circuit component, 31: second circuit substrate, 32: second circuit electrode (second connection end son), 40: membranaceous
Bonding agent, 100: circuit connection structure.
Claims (5)
1. a kind of adhesive composite, containing free-radical polymerised substance and radical polymerization initiator,
As the free-radical polymerised substance, the first free-radical polymerised substance for being indicated containing the following general formula (1) and described
The second free-radical polymerised substance with 2 or more (methyl) acryloyl groups other than first free-radical polymerised substance,
As the radical polymerization initiator, containing dilauroyl peroxide,
The content of the dilauroyl peroxide is relative to the free-radical polymerised substance contained in the adhesive composite
100 mass parts of total amount are 10~40 mass parts,
The content of the first free-radical polymerised substance is 30 relative to 100 mass parts of content of the dilauroyl peroxide
~100 mass parts,
In formula (1), X1And X2It can be the same or different, indicate acryloyl group, methylacryloyl or hydrogen atom, and extremely
A few side is acryloyl group or methylacryloyl, and n indicates 8~15 integer.
2. adhesive composite as described in claim 1, further contains thermoplastic resin.
3. a kind of circuit connection material, for for by have it is opposite to circuit electrode the circuit that is connected to each other of circuit member
Connecting material, the circuit connection material are formed by adhesive composite of any of claims 1 or 2.
4. a kind of circuit connection structure, has:
The first circuit member with first substrate and the first circuit electrode being formed on the substrate interarea；
Second circuit component, the second circuit component have the second substrate and the second circuit being formed on substrate interarea electricity
Pole, the second circuit electrode and first circuit electrode are oppositely disposed, and the second circuit electrode and first circuit
Electrode electrical connection；With
Interconnecting piece between first circuit member and the second circuit component,
The interconnecting piece is the solidfied material of circuit connection material as claimed in claim 3.
5. a kind of bonding agent sheet material has support membrane and being glued on the support membrane by of any of claims 1 or 2 is arranged in
Connect the film-like adhesive of agent composition formation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013155691A JP6123547B2 (en) | 2013-07-26 | 2013-07-26 | Circuit connection material, circuit connection structure, method for manufacturing circuit connection structure, adhesive composition, and adhesive sheet |
| JP2013-155691 | 2013-07-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104342080A CN104342080A (en) | 2015-02-11 |
| CN104342080B true CN104342080B (en) | 2019-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410363049.3A Active CN104342080B (en) | 2013-07-26 | 2014-07-28 | Adhesive composite, circuit connection material, circuit connection structure and bonding agent sheet material |
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| Country | Link |
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| JP (1) | JP6123547B2 (en) |
| KR (1) | KR102261617B1 (en) |
| CN (1) | CN104342080B (en) |
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| JP6864505B2 (en) * | 2016-06-24 | 2021-04-28 | 日東電工株式会社 | Heat-bonding sheet and heat-bonding sheet with dicing tape |
| KR102699213B1 (en) | 2018-06-06 | 2024-08-26 | 데쿠세리아루즈 가부시키가이샤 | Method for manufacturing a connector, method for connecting |
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| JP6123547B2 (en) | 2017-05-10 |
| CN104342080A (en) | 2015-02-11 |
| KR102261617B1 (en) | 2021-06-04 |
| JP2015025074A (en) | 2015-02-05 |
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