WO2008139996A1 - フィルム状回路接続材料及び回路部材の接続構造 - Google Patents

フィルム状回路接続材料及び回路部材の接続構造 Download PDF

Info

Publication number
WO2008139996A1
WO2008139996A1 PCT/JP2008/058489 JP2008058489W WO2008139996A1 WO 2008139996 A1 WO2008139996 A1 WO 2008139996A1 JP 2008058489 W JP2008058489 W JP 2008058489W WO 2008139996 A1 WO2008139996 A1 WO 2008139996A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
film
connecting material
connection structure
circuit connecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/058489
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Nichiomi Mochizuki
Motohiro Arifuku
Kazuyoshi Kojima
Kouji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN2008800141483A priority Critical patent/CN101675715B/zh
Priority to JP2009514131A priority patent/JP4941554B2/ja
Priority to KR1020097013931A priority patent/KR101100507B1/ko
Publication of WO2008139996A1 publication Critical patent/WO2008139996A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4205—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups
    • C08G18/4208—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups
    • C08G18/4211—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols
    • C08G18/4213—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols from terephthalic acid and dialcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4266—Polycondensates having carboxylic or carbonic ester groups in the main chain prepared from hydroxycarboxylic acids and/or lactones
    • C08G18/4269—Lactones
    • C08G18/4277—Caprolactone and/or substituted caprolactone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/71—Monoisocyanates or monoisothiocyanates
    • C08G18/711—Monoisocyanates or monoisothiocyanates containing oxygen in addition to isocyanate oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/71—Monoisocyanates or monoisothiocyanates
    • C08G18/718—Monoisocyanates or monoisothiocyanates containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
    • C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
    • C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
    • C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/355—Materials of die-attach connectors of outermost layers of multilayered die-attach connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
PCT/JP2008/058489 2007-05-09 2008-05-07 フィルム状回路接続材料及び回路部材の接続構造 Ceased WO2008139996A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800141483A CN101675715B (zh) 2007-05-09 2008-05-07 膜状电路连接材料及电路部件的连接结构
JP2009514131A JP4941554B2 (ja) 2007-05-09 2008-05-07 フィルム状回路接続材料及び回路部材の接続構造
KR1020097013931A KR101100507B1 (ko) 2007-05-09 2008-05-07 필름상 회로 접속 재료 및 회로 부재의 접속 구조

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-124436 2007-05-09
JP2007124436 2007-05-09

Publications (1)

Publication Number Publication Date
WO2008139996A1 true WO2008139996A1 (ja) 2008-11-20

Family

ID=40002196

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058489 Ceased WO2008139996A1 (ja) 2007-05-09 2008-05-07 フィルム状回路接続材料及び回路部材の接続構造

Country Status (5)

Country Link
JP (1) JP4941554B2 (https=)
KR (1) KR101100507B1 (https=)
CN (3) CN102199404B (https=)
TW (2) TW201130940A (https=)
WO (1) WO2008139996A1 (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012014563A1 (ja) * 2010-07-26 2012-02-02 日立化成工業株式会社 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用
WO2012014562A1 (ja) * 2010-07-26 2012-02-02 日立化成工業株式会社 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用
CN104559902A (zh) * 2013-10-09 2015-04-29 日立化成株式会社 电路连接材料、电路构件的连接结构体、和电路构件的连接结构体的制造方法
CN104559898A (zh) * 2013-10-16 2015-04-29 日立化成株式会社 粘接剂组合物和连接体
JP2015166406A (ja) * 2014-03-03 2015-09-24 日立化成株式会社 接着剤組成物及び接続体
JPWO2016199252A1 (ja) * 2015-06-10 2018-03-29 日立化成株式会社 接着剤組成物及び接続体
JP2018184607A (ja) * 2018-06-27 2018-11-22 日立化成株式会社 接着剤組成物及び接続体
JP2020521852A (ja) * 2017-05-31 2020-07-27 ダウ グローバル テクノロジーズ エルエルシー 溶剤系接着剤組成物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9412717B2 (en) * 2011-11-04 2016-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for molded underfills in flip chip packaging
JP6915544B2 (ja) * 2015-11-04 2021-08-04 昭和電工マテリアルズ株式会社 接着剤組成物及び構造体
CN107613675A (zh) * 2017-08-10 2018-01-19 维沃移动通信有限公司 一种柔性电路板的压合方法、集成电路板及移动终端
CN107946677A (zh) * 2017-12-15 2018-04-20 安徽中科中涣防务装备技术有限公司 一种安全锂电池芯阻燃结构
DE102018206632A1 (de) 2018-04-27 2019-10-31 Tesa Se Latent reaktiver Klebefilm

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01103678A (ja) * 1987-10-15 1989-04-20 Sunstar Giken Kk ポリウレタン接着剤
JPH0790236A (ja) * 1993-09-24 1995-04-04 Soken Kagaku Kk 異方導電性接着剤
WO2007046190A1 (ja) * 2005-10-18 2007-04-26 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH674518A5 (https=) * 1987-09-09 1990-06-15 Inventa Ag
JP2002204052A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路端子の接続方法、接続構造
JP2003064331A (ja) * 2001-08-30 2003-03-05 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法
JP3858740B2 (ja) * 2002-03-27 2006-12-20 日立化成工業株式会社 回路接続用接着剤組成物及びそれを用いた回路接続構造体
JP4649815B2 (ja) * 2002-03-27 2011-03-16 日立化成工業株式会社 回路接続用接着剤組成物及びそれを用いた回路接続構造体
TWI276117B (en) * 2003-07-04 2007-03-11 Natoco Co Ltd Coated conductive particle, conductive material, anisotropic conductive adhesive and anisotropic conductive junction structure
JP2005255706A (ja) * 2004-03-09 2005-09-22 Lintec Corp 粘接着剤組成物、光ディスク製造用シートおよび光ディスク
JP2005347273A (ja) * 2005-06-06 2005-12-15 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01103678A (ja) * 1987-10-15 1989-04-20 Sunstar Giken Kk ポリウレタン接着剤
JPH0790236A (ja) * 1993-09-24 1995-04-04 Soken Kagaku Kk 異方導電性接着剤
WO2007046190A1 (ja) * 2005-10-18 2007-04-26 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102449095B (zh) * 2010-07-26 2016-06-01 日立化成株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用
JP5855459B2 (ja) * 2010-07-26 2016-02-09 日立化成株式会社 回路部材の接続構造体
CN102449096A (zh) * 2010-07-26 2012-05-09 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
CN105176471A (zh) * 2010-07-26 2015-12-23 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
CN103589384A (zh) * 2010-07-26 2014-02-19 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
JP5454578B2 (ja) * 2010-07-26 2014-03-26 日立化成株式会社 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用
CN105860910A (zh) * 2010-07-26 2016-08-17 日立化成株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用
WO2012014563A1 (ja) * 2010-07-26 2012-02-02 日立化成工業株式会社 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用
WO2012014562A1 (ja) * 2010-07-26 2012-02-02 日立化成工業株式会社 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用
CN103589384B (zh) * 2010-07-26 2016-03-02 日立化成株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
CN102449095A (zh) * 2010-07-26 2012-05-09 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用
CN104559902A (zh) * 2013-10-09 2015-04-29 日立化成株式会社 电路连接材料、电路构件的连接结构体、和电路构件的连接结构体的制造方法
CN104559898A (zh) * 2013-10-16 2015-04-29 日立化成株式会社 粘接剂组合物和连接体
JP2015166406A (ja) * 2014-03-03 2015-09-24 日立化成株式会社 接着剤組成物及び接続体
JPWO2016199252A1 (ja) * 2015-06-10 2018-03-29 日立化成株式会社 接着剤組成物及び接続体
JP2020521852A (ja) * 2017-05-31 2020-07-27 ダウ グローバル テクノロジーズ エルエルシー 溶剤系接着剤組成物
JP7149292B2 (ja) 2017-05-31 2022-10-06 ダウ グローバル テクノロジーズ エルエルシー 溶剤系接着剤組成物
US11773303B2 (en) 2017-05-31 2023-10-03 Dow Global Technologies Llc Solvent-based adhesive compositions
JP2018184607A (ja) * 2018-06-27 2018-11-22 日立化成株式会社 接着剤組成物及び接続体

Also Published As

Publication number Publication date
JPWO2008139996A1 (ja) 2010-08-05
CN101675715A (zh) 2010-03-17
TW201130940A (en) 2011-09-16
KR20090086465A (ko) 2009-08-12
TW200913808A (en) 2009-03-16
JP4941554B2 (ja) 2012-05-30
CN101982515A (zh) 2011-03-02
CN101982515B (zh) 2013-07-03
KR101100507B1 (ko) 2011-12-29
TWI378751B (https=) 2012-12-01
TWI378745B (https=) 2012-12-01
CN101675715B (zh) 2011-06-08
CN102199404A (zh) 2011-09-28
CN102199404B (zh) 2013-12-04

Similar Documents

Publication Publication Date Title
WO2008139996A1 (ja) フィルム状回路接続材料及び回路部材の接続構造
TWI265966B (en) Adhesive film for circuit connection, and circuit connection structure
WO2009044732A1 (ja) 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
WO2009031472A1 (ja) 接着剤及びそれを用いた接続構造体
WO2009057376A1 (ja) 回路接続材料、接続構造体及びその製造方法
WO2006074462A3 (en) Electrostatic discharge protection for embedded components
WO2009051067A1 (ja) 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
WO2009028241A1 (ja) 異方性導電フィルム及びそれを用いた接続構造体の製造方法
WO2010036713A3 (en) Capacitive sensor having electrodes arranged on the substrate and the flex circuit
WO2010017167A3 (en) Insulation element for an electrical appliance such as a dishwasher
WO2012058123A3 (en) Electro-optic device with gap-coupled electrode
WO2009038342A3 (en) Optical film and method of manufacturing the same
WO2008052017A3 (en) Flexible fingerprint sensor
WO2005104226A3 (de) Verfahren zur herstellung von durchkontaktierungen durch eine kunststoffmasse und halbleiterbauteil mit derartigen durchkontaktierungen
TW200621896A (en) Anisotropic conductive film forming composition
WO2008033419A3 (en) Electrochemical sensor with interdigitated microelectrodes and conducted polymer
WO2008152934A1 (ja) 金属一体導電ゴム部品
JP2009277769A5 (ja) 回路部材の接続構造
WO2010020242A3 (de) Aktorelement sowie seine verwendung
HK1080426A1 (zh) 消除静电荷的硬的层压面
WO2011002930A3 (en) Hydroxyaryl functionalized polymers
TW200739612A (en) Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure
WO2005117030A3 (en) Electrically conductive elastomers, methods for making the same and articles incorporating the same
EP2528066A4 (en) ELECTRON BEAM CURABLE ELECTROCONDUCTIVE PASTE AND METHOD FOR MANUFACTURING CIRCUIT BOARD USING THE SAME
WO2009038082A1 (ja) 感光性樹脂組成物及びその積層体

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880014148.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08752381

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009514131

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020097013931

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08752381

Country of ref document: EP

Kind code of ref document: A1