CN102119240B - 用于铜或铜合金的表面处理剂及其应用 - Google Patents

用于铜或铜合金的表面处理剂及其应用 Download PDF

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Publication number
CN102119240B
CN102119240B CN200980131025.2A CN200980131025A CN102119240B CN 102119240 B CN102119240 B CN 102119240B CN 200980131025 A CN200980131025 A CN 200980131025A CN 102119240 B CN102119240 B CN 102119240B
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CN
China
Prior art keywords
methyl
imidazoles
phenyl
methylimidazole
dichlorophenyl
Prior art date
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Application number
CN200980131025.2A
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English (en)
Chinese (zh)
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CN102119240A (zh
Inventor
平尾浩彦
山地范明
村井孝行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shikoku Chemicals Corp
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Shikoku Chemicals Corp
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Publication of CN102119240A publication Critical patent/CN102119240A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/64—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with substituted hydrocarbon radicals attached to ring carbon atoms, e.g. histidine
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Chemical Treatment Of Metals (AREA)
CN200980131025.2A 2008-08-08 2009-08-07 用于铜或铜合金的表面处理剂及其应用 Active CN102119240B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2008-206119 2008-08-08
JP2008206119 2008-08-08
JP2008-295619 2008-11-19
JP2008295619 2008-11-19
JP2009124003A JP5313044B2 (ja) 2008-08-08 2009-05-22 銅または銅合金の表面処理剤及びその利用
JP2009-124003 2009-05-22
PCT/JP2009/064318 WO2010016620A1 (en) 2008-08-08 2009-08-07 Surface treating agent for copper or copper alloy and use thereof

Publications (2)

Publication Number Publication Date
CN102119240A CN102119240A (zh) 2011-07-06
CN102119240B true CN102119240B (zh) 2014-07-30

Family

ID=41259797

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980131025.2A Active CN102119240B (zh) 2008-08-08 2009-08-07 用于铜或铜合金的表面处理剂及其应用

Country Status (6)

Country Link
JP (1) JP5313044B2 (ko)
KR (1) KR101540143B1 (ko)
CN (1) CN102119240B (ko)
MY (1) MY162495A (ko)
TW (1) TWI464298B (ko)
WO (1) WO2010016620A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5301218B2 (ja) * 2008-08-25 2013-09-25 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
JP5260357B2 (ja) * 2008-09-17 2013-08-14 四国化成工業株式会社 ２−（２，４−ジクロロベンジル）−４−フェニル−５−アルキルイミダゾール化合物
JP5260208B2 (ja) * 2008-09-22 2013-08-14 四国化成工業株式会社 ２−（２，４−ジクロロベンジル）−４−（ハロゲン化フェニル）イミダゾール化合物
JP5260367B2 (ja) * 2008-09-26 2013-08-14 四国化成工業株式会社 ２−（クロロベンジル）−４−フェニルイミダゾール化合物
JP5615227B2 (ja) 2011-05-23 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
JP5615233B2 (ja) * 2011-06-20 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
KR101555753B1 (ko) 2013-11-18 2015-09-30 서울대학교산학협력단 단일 공정의 부식 방지된 구리 페이스트 제조와 다이폴 태그 안테나로의 응용
CN109048019B (zh) * 2018-09-13 2021-01-26 烟台孚信达双金属股份有限公司 一种用于铜铝复合排的焊接工艺
JP6681566B1 (ja) * 2019-05-27 2020-04-15 千住金属工業株式会社 はんだペースト及びフラックス
JP6681567B1 (ja) * 2019-05-27 2020-04-15 千住金属工業株式会社 はんだペースト及びフラックス

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0627499A1 (en) * 1993-05-10 1994-12-07 Shikoku Chemicals Corporation Agent for treating surfaces of copper and copper alloys
CN1391618A (zh) * 1999-08-26 2003-01-15 恩索恩－Omi公司 铜底基的选择性沉积方法
CN1761773A (zh) * 2003-03-19 2006-04-19 四国化成工业株式会社 新型咪唑化合物及其利用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3277025B2 (ja) * 1993-05-10 2002-04-22 四国化成工業株式会社 銅及び銅合金の表面処理剤
JPH06329635A (ja) * 1993-05-24 1994-11-29 Shikoku Chem Corp 新規イミダゾール化合物
JP3311858B2 (ja) * 1994-03-08 2002-08-05 四国化成工業株式会社 銅及び銅合金の表面処理剤
JPH08183776A (ja) * 1994-12-28 1996-07-16 Hideaki Yamaguchi 金属の表面保護剤ならびにそれを用いた製造方法
AR024077A1 (es) * 1999-05-25 2002-09-04 Smithkline Beecham Corp Compuestos antibacterianos
JP4181888B2 (ja) * 2003-02-04 2008-11-19 四国化成工業株式会社 銀及び銀合金の防食処理剤
JP2005068530A (ja) * 2003-08-28 2005-03-17 Tamura Kaken Co Ltd 表面処理剤、プリント回路基板およびプリント回路基板の金属の表面処理方法
JP4546163B2 (ja) * 2004-06-10 2010-09-15 四国化成工業株式会社 銅または銅合金の表面処理剤及び半田付け方法
JP2007297685A (ja) * 2006-05-01 2007-11-15 Shikoku Chem Corp 金属の表面処理剤およびその利用
JP5036216B2 (ja) * 2006-05-19 2012-09-26 四国化成工業株式会社 金属の表面処理剤およびその利用

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0627499A1 (en) * 1993-05-10 1994-12-07 Shikoku Chemicals Corporation Agent for treating surfaces of copper and copper alloys
US5498301A (en) * 1993-05-10 1996-03-12 Shikoku Chemicals Corporation Agent for treating surfaces of copper and copper alloys
CN1391618A (zh) * 1999-08-26 2003-01-15 恩索恩－Omi公司 铜底基的选择性沉积方法
CN1761773A (zh) * 2003-03-19 2006-04-19 四国化成工业株式会社 新型咪唑化合物及其利用

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平7-243054A 1995.09.19

Also Published As

Publication number Publication date
TW201009117A (en) 2010-03-01
KR101540143B1 (ko) 2015-07-28
TWI464298B (zh) 2014-12-11
CN102119240A (zh) 2011-07-06
WO2010016620A1 (en) 2010-02-11
JP5313044B2 (ja) 2013-10-09
KR20110073421A (ko) 2011-06-29
MY162495A (en) 2017-06-15
JP2010150651A (ja) 2010-07-08

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