CN102077343A - 引线架及其制造方法 - Google Patents
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Abstract
提供一种在树脂密封型半导体装置的制造中可省略树脂密封后的堤坝切断去除工序的引线架。加工金属薄板而形成无堤坝引线架,该无堤坝引线架具有多个外部引线及多个内部引线且不具有堤坝,在内部引线区域的引线架表面或背面涂布绝缘性的热硬化性树脂或紫外线硬化树脂的树脂液,通过表面张力作用而使流进引线间的间隙的涂布树脂液沿着引线侧壁而移动至外部引线与内部引线的边界,在上述边界处使涂布树脂液硬化而形成树脂制堤坝,由此制造引线架。利用该制造方法,得到树脂制堤坝,并可得在堤坝位置处的引线架表面、背面没有树脂残渣的引线架。
Description
技术领域
本发明涉及作为树脂密封型半导体装置的装配构件的引线(lead)架及其制造方法以及使用它的半导体装置。
背景技术
例如,如图7所示地,在树脂密封型半导体装置中,在引线架的压模垫(ダイパツト)1上装载半导体元件11,对施以镀银等表面处理的内部引线2前端部与半导体元件11的端子12用导线(wire)13进行接线并以密封用树脂14进行密封,然后,将外部引线4成形为鸥形翼(ガルウイング)状。如图8所示地,上述密封用树脂14的密封,是通过以金属模(上)21与金属模(下)22夹住装载了半导体元件的引线架、并在两金属模间的空隙中注入密封用树脂而进行的。这时候,为了使树脂不会从引线间的间隙漏出,如图9所示地,在引线架中,对外部引线部设有填补引线间的间隙的堤坝(dam bar)3。
以往,通过冲压加工(プレス加工)或蚀刻加工金属薄板而同时地形成外部引线、内部引线及堤坝,堤坝是利用与引线架相同的金属材料所形成的。所以,树脂密封之后,需要以冲压等处理来切断分离堤坝、解除电短路状态的工序。
近年来,引线架有多引脚化及狭间距化的趋势,用于冲压堤坝的冲压金属模的加工及维修的经费有增加的趋势。所以,在日本专利第2970066号(专利文献1)、日本特开平9-283691号(专利文献2)、日本特开平11-233704号(专利文献3)中提出了可省略树脂密封后的堤坝切断分离工序地通过绝缘性树脂材料形成堤坝的方法。
现有技术文献
专利文献
专利文献1:日本专利第2970066号公报
专利文献2:日本特开平9-283691号公报
专利文献3:日本特开平11-233704号公报
发明概要
发明要解决的技术问题
然而,上述专利文献所提案的树脂制堤坝的形成方法,是压入于引线间的方法(专利文献1),是以跨越外部引线的方式涂布热硬化性树脂后加热加压而填充于引线间的方法(专利文献2),是利用掩模(mask)等以印刷方式进行涂抹的方法(专利文献3),然而,由于多引脚化,所以压入于引线间的方法(专利文献1)及使用掩模的方法(专利文献3)由于成本过高而不实用。此外,以跨越外部引线的方式将树脂涂布于引线架表面的情况下(专利文献2),在引线架表面、背面留下树脂,为了用密封用树脂进行密封而以金属模夹住并闭合时,引线架变形,或是在金属模与引线架之间产生间隙而产生树脂泄漏。
发明内容
本发明是鉴于这种情况而做出的,其目的在于,低成本地提供一种引线架及半导体装置,在利用密封用树脂密封半导体装置时,不会产生引线架、半导体装置的变形及树脂泄漏,且密封后可省略堤坝切断去除工序。
本发明的第一项发明是一种引线架,具有多个外部引线及多个内部引线,在上述外部引线与上述内部引线的边界处具有绝缘性树脂制的堤坝,其特征为:
上述绝缘性树脂,是在硬化完成前能够在内部引线间沿着引线侧壁移动的热硬化树脂或紫外线硬化树脂,
在堤坝附近,内部引线间隔随着接近堤坝而变得狭窄,
而且,在堤坝附近,外部引线间隔比位于堤坝处的引线间隔宽。
本发明的第二项发明是一种半导体装置,是在上述第1项发明的引线架上装载半导体元件、对上述内部引线与半导体元件的端子进行接线并以密封用树脂进行密封而成的半导体装置,其特征为:上述绝缘树脂制堤坝位于形成密封用树脂的部分与未形成密封性树脂的部分的边界线(模塑(mold)密封线)上。
本发明的第三项发明是一种引线架的制造方法,其特征为:
加工金属薄板来成形具有多个外部引线及多个内部引线、不具有堤坝的无堤坝引线架,
在内部引线区域的引线架表面或背面涂布绝缘性的热硬化性树脂或紫外线硬化树脂的树脂液,
使流进引线间的间隙的涂布树脂液沿着引线侧壁而向外部引线与内部引线的边界方向移动,
然后,使涂布树脂硬化而在模塑密封线上形成树脂制堤坝。
在上述本发明的第三发明中,涂布树脂液的移动方法优选为,内部引线间隔随着接近外部引线与内部引线的边界方向而变得狭窄,使得树脂液沿着引线侧壁向上述边界方向移动,通过使外部引线间隔在涂布树脂液移动停止位置的外侧较宽,从而上述涂布树脂液的移动停止。
发明效果
在本发明中,堤坝由绝缘性树脂制造,因而以密封用树脂密封半导体装置之后不需要切断去除堤坝。此外,树脂制堤坝是利用涂布法形成的,因而低成本。此外,将树脂液涂布于内部引线区域,沿着引线间的侧壁移动至内部引线与外部引线的边界之后进行硬化从而形成堤坝,因而在堤坝附近树脂不会残留于引线架的表面、背面,并且为了密封而由金属模进行闭合时,不会有引线架变形或产生间隔而发生树脂泄漏的情况。
此外,在本发明中,内部引线间隔随着接近堤坝位置、即内部引线与外部引线的边界位置而变狭窄,从引线架表面观看,内部引线间隔的形状为梯形。所以,堤坝的树脂形状为梯形,即使在硬化时堤坝的树脂稍微收缩,由于压入密封用树脂时的压力,也可防止树脂制堤坝脱落。
此外,利用形成堤坝的树脂硬化时所产生的收缩,使树脂制堤坝的中央位置比引线架表面、背面的高度位置稍低,并在密封时的金属模与堤坝之间稍微留有间隙,也可使得树脂制堤坝兼具从密封用树脂发生的气体的泄气口(排气口)的作用。
此外,在本发明的第二发明中,堤坝上的一部分被密封用树脂所覆盖,因而可防止树脂制堤坝的剥离或脱落。
附图说明
图1是本发明的引线架的整体概观图。
图2是本发明采用的无堤坝引线架的局部扩大图。
图3是本发明的制造方法的说明图。
图4是表示涂布的树脂液的移动量与锥度之间的关系的一例的图表。
图5是用于说明角部与中心部的树脂液的移动量差异的说明图。
图6是用于说明角部与中心部的树脂液的移动量差异的局部图。
图7是树脂密封型半导体装置的概略图。
图8是半导体装置的树脂密封方法的说明图。
图9表示现有的引线架。
图10是半导体装置的树脂密封方法的说明图。
具体实施方式
以下,针对于本发明的实施形态,使用附图加以说明。
在本发明中,首先,将铜合金、铁-镍合金等的金属薄板施以冲压加工或蚀刻加工,形成不具有堤坝的无堤坝引线架图案。图1表示本发明的引线架的概观图。在本发明中,在内部引线2与外部引线4之间的模塑密封线34的位置,设有绝缘性树脂制堤坝33。
图2表示本发明所使用的无堤坝引线架的外部引线与内部引线的边界附近的扩大图。在上述边界附近,内部引线间隔W1朝向上述边界而变狭窄,当超过上述边界而进入到外部引线区域时,外部引线间隔W2变宽。引线架的板厚是0.1~0.2mm,较佳为0.1~0.15mm。外部引线间距(pitch)一般是0.5mm,外部引线间隔一般为0.2~0.3mm。此外,引线间隔变狭窄的比率(锥度(taper))为,每1000μm(1mm)长度为5~60μm较佳,更佳为10~50μm,进一步更佳为10~40μm。若锥度过小,则堤坝形成用树脂的涂布液的移动量变小而不理想。此外,外部引线的间隔比上述边界处的引线间隔宽。
在引线架的内部引线的前端部分的引线表面,通过点镀或环镀等手段施以镀银或镀金等处理,使得能够容易地进行引线键合。
以下说明堤坝的形成方法。在内部引线区域,当将堤坝形成用的树脂液涂布于涂布线31(图3a)时,所涂布的树脂液32由于表面张力而进入引线间(图3b),并且,树脂液32由于表面张力而沿着引线侧壁向引线间隔狭窄方向、即上述边界方向移动(图3c),在引线间隔变宽的部位停止移动(图3d)。在该停止位置使树脂硬化完成从而形成树脂制堤坝。此外,所涂布的树脂液能够通过提升温度而降低黏度,能够容易地移动到停止位置。
堤坝形成用的树脂采用热硬化性树脂或紫外线硬化性树脂,较佳是使用热硬化性树脂。作为热硬化性树脂,列举有丙烯酸系热硬化性树脂、聚酰亚胺系热硬化性树脂、聚酰胺酰亚胺系热硬化性树脂、环氧系热硬化性树脂,其中,以环氧树脂系热硬化性树脂较佳,尤其是由环氧树脂与潜在性硬化剂构成的一液型环氧树脂系热硬化性树脂较佳。树脂液的涂布时黏度是4Pa·s以上60Pa·s以下较佳。若树脂液的黏度过高,则涂布速度变慢,或树脂液的移动变难而不理想。若树脂黏度过低,则在涂布时会产生液体滴落等而不容易处理,因而不理想。涂布方法优选分配器法(デイスペンサ法),尤其是使用螺旋式分配器的分配器法由于容易调整涂布液量而较佳。
树脂的硬化方法采用对应于该树脂的通常的方法。使用一液型环氧树脂系热硬化性树脂时,在170~200℃下加热15秒钟至两分钟从而能够进行硬化固定。此外,使用热硬化性树脂时,可兼得用于使到停止位置的移动容易进行的加热、及用于升温至硬化反应温度的加热。具体而言,在移动至停止移动位置之前(图3c)开始加热,促进移动且正当到达停止位置(图3d)的时候能够达到硬化反应温度是较有效率的。
堤坝形成用树脂的涂布液的移动量根据所涂布的树脂液的黏度及内部引线间隔、内部引线侧面的表面状态等而有所不同,然而在引线间隔的变狭窄比率(锥度)与树脂移动距离之间存在大约正的相关关系。图4是表示对引线的间距间隔为120μm的引线架涂布了所涂布的树脂液的黏度大约为20Pa·s的堤坝形成用树脂液的情况下的、锥度与树脂移动量的关系的一例的图表。在图4的图表中,纵轴表示树脂液的移动量,横轴表示每1000μm长度的引线间隔的变狭窄比率(锥度)。由图4可知,树脂涂布液的移动距离与锥度具有正的相关关系,因而通过控制引线间隔的锥度,能够控制树脂涂布液的移动量,而能够在所期望的位置形成树脂制堤坝。
此外,如图5、图6所示地,将引线配置成放射状、且使模塑密封线为方形状时,树脂涂布线到堤坝形成位置的距离在中心部与角部不同。即,为了以使堤坝的位置整齐的方式移动树脂涂布液,需要使角部的树脂移动量(Lco)比中心部的树脂移动量(Lce)大。在这种情况下,通过使角部的锥度(Tco)比中心部的锥度(Tce)大,来控制树脂涂布液的移动量即可。
半导体装置通过如下方式制造:在按如上方式制造的引线架的规定位置装载半导体元件,对内部引线的镀处理部与半导体元件的端子进行接线,然后,如图7所示地以密封用金属模(上模具)21与密封用金属模(下模具)22夹住引线架,向金属模内部注入密封用树脂并使之固化。作为密封用树脂,作为半导体装置的密封用树脂而采用的密封用树脂均可使用。例如可列举出由环氧树脂与氧化铝或二氧化硅等无机填充剂所构成的树脂组成物。在本发明中,不必在密封后将堤坝切断去除,因而优选为,使模塑密封线34位于堤坝33之上,使通过密封用树脂来覆盖堤坝的一部分。通过以密封用树脂覆盖堤坝的一部分,可防止堤坝的剥离、脱落。
在本发明中,可省略树脂密封后的堤坝切断去除工序,因而能够低成本地制造多引脚化且窄间距化的树脂密封型半导体装置。
符号说明
1:压模垫
2:内部引线
3:堤坝
4:外部引线
11:半导体元件
12:端子
13:引线
14:密封用树脂
21:金属模(上模具)
22:金属模(下模具)
31:涂布线
32:涂布树脂
33:树脂制堤坝
34:模塑密封线
Claims (5)
1.一种引线架,具有多个外部引线及多个内部引线,在上述外部引线与上述内部引线的边界处具有绝缘性树脂制的堤坝,其特征为:
上述绝缘性树脂,是在硬化完成前能沿着引线侧壁在上述内部引线间移动的热硬化树脂或紫外线硬化树脂,
内部引线间隔在堤坝附近随着接近堤坝而变窄,
外部引线间隔在堤坝附近比堤坝位置处的引线间隔宽。
2.一种半导体装置,是通过在权利要求1所述的引线架上装载半导体元件、对上述内部引线与半导体元件的端子进行接线、以密封用树脂进行密封所形成的半导体装置,其特征为:
上述绝缘树脂制堤坝位于形成有密封用树脂的部分与未形成有密封用树脂的部分的边界线、即模塑密封线上。
3.一种引线架的制造方法,其特征为:
加工金属薄板而形成无堤坝引线架,该无堤坝引线架具有多个外部引线及多个内部引线,且不具有堤坝,
在内部引线区域的引线架表面或背面涂布绝缘性的热硬化性树脂或紫外线硬化树脂的树脂液,
使流进引线间的间隙的涂布树脂液沿着引线侧壁而向外部引线与内部引线的边界方向移动,
然后,使涂布树脂硬化而在模塑密封线上形成树脂制堤坝。
4.如权利要求3所述的引线架的制造方法,其特征为,
使内部引线间隔随着接近外部引线与内部引线的边界而变窄,因此树脂液向上述边界方向移动,
使外部引线间隔在涂布树脂液移动停止位置的外侧间隔变宽,因此上述涂布树脂液的移动停止。
5.如权利要求4所述的引线架的制造方法,其特征为,
使内部引线间隔随着接近外部引线与内部引线的边界而变窄的比率、即锥度在引线架的角附近比引线架的各边中心附近大。
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CN109119395A (zh) * | 2017-06-22 | 2019-01-01 | 大口电材株式会社 | 引线框架及其制造方法 |
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