CN102062788B - Picking and placing device - Google Patents
Picking and placing device Download PDFInfo
- Publication number
- CN102062788B CN102062788B CN201010286630.1A CN201010286630A CN102062788B CN 102062788 B CN102062788 B CN 102062788B CN 201010286630 A CN201010286630 A CN 201010286630A CN 102062788 B CN102062788 B CN 102062788B
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- CN
- China
- Prior art keywords
- spacing
- pick
- block
- pickup
- picking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Abstract
The invention relates to a picking and placing device. The picking and placing device comprises a plurality of picking modules each provided with at least one picker and applied for holding or releasing electronic parts, a spacing adjusting device for adjusting the spacing among the picking modules, a guide plate provided with a guide part for guiding the picking modules to horizontally move when the spacing adjusting device is operated to adjust the spacing among the picking modules and combining blocks movably combined on the guide part so as to make the picking modules capable of movably combining on the guide part. The guide plate is integrally formed with the guide part. Each combining block respectively combines with one of the picking modules. According to the invention, the guide rail for guiding the picking modules to move horizontally is integrally processed with the guide plate, which makes the picking and placing device firmer. Furthermore, the picking and placing device has a simpler structure and a simpler assembly. Therefore, the productivity is made improved.
Description
Technical field
The present invention relates to a kind of pick and place device, particularly relating to a kind of in order to guide the guided plate moved horizontally of the pickup model being applicable to Test handler.
Background technology
In order to testing electronic parts (particularly semiconductor element), need the electronic unit using test electrical connection test machine (tester) and as the Test handler (test handler) of equipment electronic unit being electrically connected to test machine.
Test handler in order to increase process capacity, the support plate (carrier board) of the multiple semiconductor elements using disposable transport to load with ranks form.
Because semiconductor element is electrically connected, so the spacing be loaded between the spacing of the semiconductor element of support plate and the test jack of test machine is identical with the test jack (test socket) of test machine under the state being loaded into support plate.
In addition, the semiconductor element that will test towards Test handler supply is provided by the semiconductor element being loaded into user tray (user tray).The fundamental purpose of this user tray is loading and the keeping of semiconductor element, and in order to increase struck capacity, the spacing between the semiconductor element that the gap ratio between the semiconductor element being loaded into user tray is loaded into support plate is short a little.
Therefore, Test handler needs to possess pick and place device (pick and place apparatus), the semiconductor element do not tested being loaded into user tray is moved to support plate or the semiconductor element completing test being loaded into support plate is moved to user tray, but also the mechanism of spacing between the spacing needing to possess between the semiconductor element that can regulate and move to support plate from user tray or the semiconductor element moving to user tray from support plate.
Usually, the mechanism of the spacing between semiconductor is regulated to be incorporated into pick and place device.
As everyone knows, pick and place device possesses multiple pick-up (picker) arranged with ranks form that can adsorb or discharge semiconductor element, and the spacing of semiconductor element regulates by regulating the spacing between the pick-up holding semiconductor element and realizes.
The mode of the spacing between pick-up is regulated to have cam (cam) mode (with reference to No. 10-0796196th, Korean granted patent, hereinafter referred to as " prior art ") and connecting rod mode (with reference to Korean granted patent 10-0628553), but which kind of mode all needs the structure moved horizontally that possesses for guiding pick-up.
According to the pick and place device (being defined as in prior art " semiconductor element transfer device ") of prior art on the lifter plate for being elevated pick-up in conjunction with four horizontal LM guide rails, and make each horizontal LM guide rail to combine the LM block be combined with pick-up, to possess the structure of the horizontal direction movement that can guide pick-up.
But prior art can produce following problem.
The first, need in conjunction with four horizontal LM guide rails on different lifter plates, but need LM guide rail levelness in certain margin tolerance identical, so its assembling operation requires exquisite, make operation very thorny.
The second, in order to prevent pick-up rock or ensure to move horizontally smooth and easy, pick-up needs by two fulcrum supports with upper-lower height difference, therefore each pick-up is in conjunction with two LM blocks, but the adjacent LM block spacing contacted between Shi Qi center is greater than the minimum spacing (being loaded into the spacing between the adjacent semiconductor on user tray) between pick-up, two LM guide rails are therefore only used to be difficult to form complete pick and place device.So, need, in conjunction with four LM guide rails (with reference to the detailed description of prior art, odd column and even column are used alternatingly), which increase the weight of pick and place device, cause the waste of maneuverability decline and resource.
Three, LM block is assembled in LM guide rail with the form of overlap, and because this increasing the thickness of device, this finally plays the negative interaction preventing from the interference of other devices designing.
Summary of the invention
The object of the present invention is to provide one can reduce the technology of the quantity of guiding rail (rail comprises LM guide rail).
Further, the object of the present invention is to provide a kind of technology that can minimize the thickness of pick and place device.
To achieve these goals, pick and place device according to the present invention is characterized in that comprising: multiple pickup model, and for holding or release electronic unit, and described multiple pickup model possesses at least one pick-up respectively; Spacing adjusting device, for regulating the spacing between described multiple pickup model; Guided plate, have for guide to be regulated the spacing between described multiple pickup model by the action of described spacing adjusting device time adjoint described multiple pickup model the guide portion of horizontal direction movement, and be processed into one with this guide portion; And combined block, be incorporated into described guide portion movably, enable described multiple pickup model be incorporated into described guide portion movably, the pickup model of combined block described in each respectively in described multiple pickup model is combined.
Described spacing adjusting device comprises: lobe plate, be formed with the multiple cam paths for inserting the insertion projection that described multiple pickup model possesses respectively, and can be elevated, the multiple cam paths wherein formed are shapes of the length of above-below direction, spacing between the lower end of the spacing between the upper end of described cam path and described cam path is different mutually, to make the lifting according to described lobe plate, shorten or expand the horizontal-direction pitch between described multiple pickup model; And lobe plate drive division, to provide the driving force being elevated described lobe plate, and the guide portion of described guided plate has at least two guiding rails of the long shape of horizontal direction, and form guiding groove between at least two guiding rails described in making, and described combined block is incorporated into described guided plate, can move along horizontal direction when being inserted in described guiding groove.
The quantity being inserted in the combined block of guiding groove described in each is identical with the quantity of described pickup model.
When described guiding rail is more than three, at least one guiding rail guides the combined block of the upper side and lower side simultaneously, to make few one of the quantity of the relatively described guiding rail of the quantity of the combined block being incorporated into a described pickup model.
In addition, to achieve these goals, pick and place device according to the present invention comprises: at least three pickup models, and for holding or release electronic unit, wherein said at least three pickup models have at least one pick-up respectively, spacing adjusting device, for being adjusted to identical by the spacing between the pick-up of described at least three pickup models, guided plate, possess for guide by the action of described spacing adjusting device, the spacing between the pick-up of described at least three pickup models is adjusted to identical time adjoint described in the guide portion of horizontal direction movement of at least three pickup models, and combined block, be incorporated into described guide portion movably, described in enabling, at least three pickup models are incorporated into described guide portion movably, and described spacing adjusting device comprises: lobe plate, be formed with at least three cam paths of the insertion projection possessed respectively at least three pickup models described in inserting, and can be elevated, wherein, at least three cam paths are shapes of above-below direction length, spacing between the lower end of the spacing between the upper end of described at least three cam paths and described cam path is mutually different, horizontal-direction pitch described in shortening to make the lifting according to described lobe plate or expand between at least three pickup models, and lobe plate drive division, to provide the driving force being elevated described lobe plate, and the spacing in the spacing between the upper end of described at least three cam paths or lower end between at least one spacing and pick-up of pickup model is different.
And, to achieve these goals, it is characterized in that comprising according to the method for making of pick and place device of the present invention: guided plate making step, processing metallic, manufacture at least two guiding rail shape all-in-one-piece guided plates; Combined block integrating step, inserts multiple combined block in the guiding groove between the guiding rail of the guided plate made in described guided plate making step, makes it be combined with guided plate; Pickup model integrating step, described multiple combined block is combined with the pickup model possessing at least one pick-up respectively; And spacing adjusting device number of assembling steps, assembling spacing adjusting device, for regulating the spacing between described pickup model.
Pick and place device according to the present invention has following effect.
The first, guiding rail and guided plate are processed into one, and therefore structure is simple, and assembleability is excellent, and improves productivity.
The second, the width of combined block can not limit the minimum spacing between pick-up, and the quantity that therefore can reduce guiding rail, to reduce the weight of pick and place device, can guarantee maneuverability thus.
Three, combined block is with the combination of shape and state inserted in being formed in the guiding groove between guiding rail, therefore can reduce the thickness of device compared to existing technology, in this considerably, prevents from designing etc. becoming simple with the interference of other devices.
Accompanying drawing explanation
Fig. 1 is the stereographic map of the pick and place device according to the embodiment of the present invention;
Fig. 2 is the exploded perspective view of the critical piece to pick and place device in Fig. 1;
Fig. 3 a and Fig. 3 b is that the spacing in the pick and place device of Fig. 1 between pickup model maintains front view (FV) that is minimum or maximum rating;
Fig. 4 is the front view (FV) of the lobe plate for the pick and place device being applicable to Fig. 1;
Fig. 5 to Fig. 8 is the reference figure of the method for making for illustration of the pick and place device in Fig. 1.
Symbol description to accompanying drawing critical piece: 100 is pick and place device, 111 to 114 is pickup model, 120 is spacing adjusting device, 121 is lobe plate, and 121a to 121d is cam path, and 122 is cylinder, 130 is guided plate, 131a to 131c is guiding rail, 132a and 132b is guiding groove, and 141a to 141d, 142a to 142d are combined block.
Embodiment
Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, succinct in order to what illustrate, and the explanation for the explanation repeated or well-known technology is omitted as much as possible or compresses.
Fig. 1 is the stereographic map of the pick and place device 100 according to the embodiment of the present invention, and Fig. 2 is the exploded perspective view of the critical piece to pick and place device in Fig. 1 100.
According to the pick and place device 100 of the present embodiment comprise four pickup models 111,112,113,114, spacing adjusting device 120, guided plate 130,8 combined blocks (141a to 141d, 142a to 142d).
Four pickup models 111,112,113,114 possess eight pick-up P that can adsorb or discharge semiconductor element respectively, and possess insertion projection 111a, 112a, 113a, 114a.Certainly, pickup model just possesses more than one pick-up enough.
And four pickup models 111,112,113,114 comprise the bootstrap block GB possessing the longer LM guide rail G of above-below direction and described insertion projection 111a, 112a, 113a, 114a respectively; Be incorporated into the following side of described bootstrap block GB and guide lifting by LM guide rail G, and can be elevated microspur along the vertical direction, and lower end possesses the pickup block PB of described pick-up P and relative bootstrap module GB, applies the spring S of elastic force in downward direction to pickup block PB.
Spring S is being loaded in the semiconductor element on user tray or support plate, under part semiconductor element is in the state that cannot form balance with other semiconductor elements remaining, when pickup model 111,112,113,114 adsorb simultaneously comprise multiple semiconductor element of this part of semiconductor element time, prevent the damage because applying more pressure and contingent semiconductor element to this part of semiconductor element.Namely, in the case at absorption time point, pickup block PB rises to reduce the pressure putting on this part of semiconductor element relative to bootstrap block GB, and then prevent the damage of semiconductor element, when pickup model 111,112,113,114 rises after adsorbing semiconductor element, because of the effect of spring S, pickup block PB is relative, and bootstrap block GB declines, and returns to the state can implementing next operation rightly.
Spacing adjusting device 120 comprises lobe plate 121 and cylinder 122 etc., for regulating the spacing of the horizontal direction between pickup model 111,112,113,114.Lobe plate 121 is formed and can insert the insertion projection 111a of pickup model 111,112,113,114, four cam paths (121a to 121d) of 112a, 113a, 114a respectively, and be arranged to be elevated.At this, cam path (121a to 121d) is substantially along the more microscler shape that above-below direction tilts, and the spacing between the upper end comparing cam path (121a to 121d), spacing between the lower end of cam path (121a to 121d) is wider, make the lifting according to lobe plate 121, the horizontal-direction pitch between pickup model 111,112,113,114 narrows or broadens.
Cylinder 122 is the drive divisions as the driving force providing lifter cam groove 121.
The movement in the horizontal direction of pickup model 111,112,113,114 adjoint when guided plate 130 is for guiding the spacing between the pickup model 111,112,113,114 that causes because of the action of spacing adjusting device 120 to be conditioned, guide portion is processed into one with it.
Guide portion possesses three longer guiding rails (131a to 131c) of horizontal direction side by side up and down, to make to form guiding groove 132a, 132b between adjacent guiding rail (131a, 131b/131b, 131c).Certainly, according to concrete enforcement, it is just enough that guiding rail arranges two or more.
The guiding groove 132a of combined block (141a to 141d, 142a to 142d) between upside guiding rail 131a and medial side guiding rail 131b and the guiding groove 132b between medial side guiding rail 131b and downside guiding rail 131c respectively inserts four, and each combined block (141a to 141d, 142a to 142d) is combined with a pickup model (111/112/113/114).
In addition, combined block (141a to 141d) on the upside of the upper end guide support of medial side guide rail 131b, combined block (142a to 142d) on the downside of the guide support of lower end, two basic change block (the 141a of the upper side and lower side can be guided thus by three guiding rails (131a to 131c) simultaneously, 142a/141b, 142b/141c, 142c/141d, 142d), to make the combined block (141a being incorporated into a pickup model (111/112/113/114), 142a/141b, 142b/141c, 142c/141d, few one of the quantity of the relative guiding rail (131a to 131c) of quantity 142d).
And, when narrowing between combined block (141a to 141d, 142a to 142d) and form minimum spacing, maintain minimum spacing between the pick-up P being incorporated into each pickup model 111,112,113,114 of combined block (141a to 141d, 142a to 142d), make the spacing between the adjacent semiconductor element of the spacing between this pick-up P and user tray identical thus.Therefore, guiding groove 132a, 132b is upper can insert the four combinations block (141a to 141d, 142a to 142d) identical with the quantity of pickup model 111,112,113,114.Certainly, according to concrete enforcement, when removing lobe plate 121, the spacing between the adjacent semiconductor element that the spacing between this pick-up P is less than user tray is also harmless.
Possess the action of pick and place device 100 because of spacing adjusting device 120 of as above structure, moved by upper and lower guiding rail (131a, 131b/131b, 131c) supporting guide with the combined block (141a to 141d, 142a to 142d) being inserted in the combinations of states of guiding groove 132a, 132b, regulate the spacing between each pickup model 111,112,113,114 being incorporated into combined block (141a, 142a/141b, 142b/141c, 142c/141d, 142d) thus.
In addition, Fig. 3 a illustrates the spacing farthest shortened between pickup model 111,112,113,114, to make the front view (FV) of state that the spacing a between pick-up P is identical with the spacing between the semiconductor element being loaded into user tray, Fig. 3 b illustrates the spacing farthest expanded between pickup model 111,112,113,114, to make the front view (FV) of state that the spacing b between pick-up P is identical with the spacing between the semiconductor element being loaded into support plate.
Usually, the spacing between cam path is in the past identical with the spacing between pick-up.Such as, the spacing between the pick-up when spacing between the upper end of cam path and the spacing shortened between pick-up is identical, and the spacing between the pick-up when spacing between cam path lower end and the spacing expanded between pick-up is identical.
But known with reference to Fig. 4, the upper end spacing of cam path 121a, 121b, 121c, 121d of lobe plate 121 is s, t, s, and lower end spacing is S, T, S.It can thus be appreciated that the insertion projection 111a of each pickup model, the spacing between 112a, 113a, 114a can maintain s, t, s, or S, T, S.Namely, spacing a (spacing between this and the semiconductor element being loaded into user tray is identical) between pick-up P when the distance s between the upper end of cam path 121a, 121b, 121c, 121d, spacing between t, s from shortening pick-up P is different, and spacing b (spacing between this and the semiconductor element being loaded into support plate is identical) between pick-up P when the interval S between the lower end of cam path 121a, 121b, 121c, 121d, the spacing between T, S from expansion pick-up P is different.And the distance s between the upper end of cam path and t are also mutually different, the interval S between lower end and T are also mutually different.But, because mechanism design becomes symbol to be that the pick-up P of the pickup model of 111 and 112 to turn right from the center of bootstrap block GB and departs from, symbol be 113 and the pick-up P of pickup model of symbol 114 turn left from the center of bootstrap block GB and depart from, even if therefore insert projection 111a, spacing between 112a, 113a, 114a be s, t, s, spacing between pick-up P also can be unified into a, even if insert projection 111a, spacing between 112a, 113a, 114a is S, T, S, the spacing between pick-up P also can be unified into b.That is, according to some spacing t or T and remaining distance s in the spacing between the upper end of cam path 111a, 112a, 113a, 114a of the present invention or lower end or S different, also can make to maintain identical spacing between pick-up P.
The method for making of described pick and place device 100 is then described.
First, as shown in Figure 5, processing metallic, manufactures three guiding rail (131a to 131c) shape all-in-one-piece guided plates 130.
Then, as shown in Figure 6, insert four combinations block (141a to 141d, 142a to 142d) towards each guiding groove 132a, 132b of being positioned between guiding rail (131a to 131c) and combine.
Then, as shown in Figure 7, combined block (141a, 142a/141b, 142b/141c, 142c/141d, 142d) is combined respectively, as shown in Figure 8, according to the sequentially built pick and place device 100 of assembling spacing adjusting device 120 with pick-up 111,112,113,114.
As mentioned above, the present invention has been described in detail by referring to the embodiment of accompanying drawing, but above-described embodiment is only preferred exemplary of the present invention, and the present invention is not limited to above-described embodiment, and interest field of the present invention should be understood to aforesaid claim and equivalent concepts thereof.
Claims (1)
1. a pick and place device, is characterized in that comprising:
Multiple pickup model, for holding or release electronic unit, described multiple pickup model possesses at least one pick-up respectively;
Spacing adjusting device, for regulating the spacing between described multiple pickup model;
Guided plate, has been processed to form upside guiding groove and downside guiding groove integratedly, and the horizontal direction of described multiple pickup model adjoint when to be regulated the spacing between described multiple pickup model by the action of described spacing adjusting device for guiding moves,
Each pickup model in described multiple pickup model is combined with respectively upside combined block and downside combined block, described upside combined block and described downside combined block are incorporated into described upside guiding groove and described downside guiding groove respectively movably,
Described multiple pickup model comprises bootstrap block, pickup block and spring respectively, described bootstrap block possesses the longer LM guide rail of above-below direction and inserts projection, described pickup block is incorporated into the following side of described bootstrap block and is elevated by LM rail guidance, and microspur can be elevated along the vertical direction, and described pickup block lower end possesses at least one pick-up described, described spring is used for relatively described bootstrap block to described pickup block applying elastic force in downward direction
Described spacing adjusting device comprises the multiple cam paths corresponding to described insertion projection.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2009-0108863 | 2009-11-12 | ||
| KR1020090108863A KR101361494B1 (en) | 2009-11-12 | 2009-11-12 | Pick and place apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102062788A CN102062788A (en) | 2011-05-18 |
| CN102062788B true CN102062788B (en) | 2014-12-17 |
Family
ID=43998153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010286630.1A Active CN102062788B (en) | 2009-11-12 | 2010-09-17 | Picking and placing device |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101361494B1 (en) |
| CN (1) | CN102062788B (en) |
| TW (1) | TWI413612B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103187345A (en) * | 2011-12-28 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Taking and placing device |
| KR101811646B1 (en) * | 2012-05-17 | 2017-12-26 | (주)테크윙 | Pick and place apparatus for test handler |
| KR200474199Y1 (en) * | 2012-09-25 | 2014-08-28 | 세메스 주식회사 | Apparatus for picking up semiconductor devices |
| KR20160110083A (en) * | 2015-03-11 | 2016-09-21 | (주)제이티 | Picker |
| KR102369467B1 (en) * | 2017-06-14 | 2022-03-04 | (주)테크윙 | Socket opening apparatus for handling electronic devices |
| CN108326842A (en) * | 2017-12-30 | 2018-07-27 | 广东埃华路机器人工程有限公司 | A kind of adjustable precise go-no-go fixture |
| CN109308019B (en) * | 2018-08-10 | 2021-08-20 | 江苏信息职业技术学院 | Contact force control method of motor-driven cylindrical cam pressing mechanism |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5031957B2 (en) * | 2001-08-30 | 2012-09-26 | Ｔｈｋ株式会社 | Linear actuator |
| KR100628553B1 (en) * | 2005-11-23 | 2006-09-26 | (주)테크윙 | Pick and place apparatus |
| KR100737400B1 (en) * | 2006-05-12 | 2007-07-09 | 미래산업 주식회사 | Device transfer for semiconductor device test handler |
| KR100792485B1 (en) * | 2006-07-01 | 2008-01-10 | (주)테크윙 | Pick-and-place apparatus |
| KR100796196B1 (en) * | 2007-03-13 | 2008-01-21 | 미래산업 주식회사 | Transfer apparatus for test handler transferring semiconductor device and test handler having the same |
| KR100908496B1 (en) * | 2007-04-02 | 2009-08-04 | 이건소 | Vacuum adsorption picker apparatus of handler |
| KR100820328B1 (en) * | 2007-05-23 | 2008-04-08 | (주)아이콘 | Pick and place apparatus |
| TWM328336U (en) * | 2007-07-27 | 2008-03-11 | Nat Chin Yi Inst Technology | Linear guide device |
| KR100920968B1 (en) * | 2007-11-23 | 2009-10-09 | (주)테크윙 | Pick-and-place module for test handler |
| KR100938172B1 (en) * | 2007-12-28 | 2010-01-21 | 미래산업 주식회사 | Handler, Method of Transferring Test-tray, and Method of Manufacturing Semiconductor |
-
2009
- 2009-11-12 KR KR1020090108863A patent/KR101361494B1/en active IP Right Grant
-
2010
- 2010-09-17 CN CN201010286630.1A patent/CN102062788B/en active Active
- 2010-11-08 TW TW099138376A patent/TWI413612B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102062788A (en) | 2011-05-18 |
| TW201119926A (en) | 2011-06-16 |
| KR20110052008A (en) | 2011-05-18 |
| KR101361494B1 (en) | 2014-02-14 |
| TWI413612B (en) | 2013-11-01 |
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