CN103418551B - Test handler pick and place device - Google Patents
Test handler pick and place device Download PDFInfo
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- CN103418551B CN103418551B CN201310142289.6A CN201310142289A CN103418551B CN 103418551 B CN103418551 B CN 103418551B CN 201310142289 A CN201310142289 A CN 201310142289A CN 103418551 B CN103418551 B CN 103418551B
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- pick
- cam
- support frame
- lifting
- cam part
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to Test handler pick and place device. According to the present invention, the cam part that is arranged at pick and place device is divided into support frame and lobe plate, thus can be by the mode of only lobe plate being loaded and unloaded on support frame, realize the substantial replacing to cam, therefore, there is it and change effect easily.
Description
Technical field
The present invention relates to a kind of in Test handler, pick up be transplanted on after semiconductor element requirementThe pick and place device of position.
Background technology
Test handler is so a kind of equipment: by the semiconductor element of manufacturing through predetermined manufacturing processPart is from client's tray loading after test pallet, and supporting to be loaded into the semiconductor element of test pallet canThe test of tested device, and according to test result, semiconductor element is pressed to grade separation and again from test palletBe unloaded to client's pallet. This equipment is disclosed by multiple open files.
Test handler not only possesses client's pallet, test pallet as mentioned above, also possesses such as establishingBe placed in the calibrator (aligner) of loading part or take care of and load the buffering area of unnecessary semiconductor element(buffer), motor driven type loading stage, pigeonholes (sortingtable) etc. for loading and arrangingMultiple mountings unit or the arrangement units of semiconductor element.
The present invention relates to a kind of for (client's pallet, test holder in mutually different unit as aboveDish, calibrator, buffering area, motor driven type loading stage, pigeonholes) in any two unit between transferSemiconductor element is transplanted on another by this semiconductor element after the unit of a side picks up semiconductor elementThe pick and place device (pickandplaceapparatus) of the unit of side. Under normal circumstances, pick and place deviceWhile being arranged at loading part, it is also referred to as loader or load hand, and in the time being arranged at unloading portion, also referred to asEmptier or unloading hand.
So far disclosed pick and place device have in order to pick up semiconductor element with 2 × 4,1 × 8,8,16 or 32 pick-ups (picker) that 2 × 8 or 4 × 8 ranks forms are arranged. At this,The reason that possesses the pick-up of multiple row in pick and place device is, for by be increased in once transfer in instituteThe quantity of the semiconductor element that can transfer shortens the required time of loading or unloading. Under normal circumstances,Consider lightweight and the miniaturization of once transferring processing capacity and pick-up, mainly adopt 2 × 8 ranksStructure. For example, and now, two pick-ups form groups and (, form a pick-up moduleFor the situation of 4 × 8 ranks forms, four pick-ups form groups and form a pick-up mouldPiece).
Conventionally, the object of client's pallet is to take care of semiconductor element by loading, therefore in order to the greatest extent canCan how to pick up semiconductor element, be configured such that spacing between picked semiconductor element is forLittle, and test pallet is configured to compare the pallet client, the spacing between semiconductor element has widerSpacing, to there is the required spacing of test between the semiconductor element of guaranteeing to be loaded. , thanSpacing between semiconductor element in client's pallet, the spacing between the semiconductor element in test palletBe set to wider. Therefore, by semiconductor element during from client's tray loading to test pallet, or from surveyingWhen examination pallet is unloaded to client's pallet, need to adjust the spacing between semiconductor element. Further,Not only at client's pallet or test pallet, and in calibrator or buffering area, motor driven type loading stage, sortingWhile there is semiconductor element mobile between multiple mountings unit of platform etc., be also necessary to adjust as requestedSpacing between whole semiconductor.
The adjustment of the spacing of this semiconductor element is undertaken by pick and place device. , specific implementation is, complies withBy after pick and place device picks up semiconductor element in the mounting unit of a side, by between semiconductor elementSpacing is adjusted into desired spacing, then semiconductor element is transplanted in the mounting unit of opposite side andLoad.
Therefore, pick and place device has the formation for adjusting the spacing between pick-up module.
The mode of adjusting the spacing between semiconductor element in pick and place device has the protruding of the tabular cam of employingWheel mode (with reference to No. 10-1999-0038981, Korea S's publication) and pick-up module is entered with connecting rodThe connecting rod mode (with reference to No. 10-0648919, Korean granted patent) that row connects, and the present invention has about protrudingWheel mode.
For cam mode, due in the time that the size of semiconductor element to be tested changes, halfMaximum spacing between conductor or minimum spacing also can change, thereby follow and need to change cam notJust part. But, in the time will changing cam, because pick and place device is arranged at the inside of Test handler,Therefore it is changed operation and has inconvenience. And, when the linear movement of the left and right from being incorporated into camWhen (LinearMotion, LM) piece is isolated cam, linear movement piece is because deadweight is towards linear guidesBelow is mobile, thereby likely departs from, and now, the steel ball that forms linear block comes off and likely fallsLow its function. And, for example, if the cam being again replaced can not (, be attached to linear movement piece rightlyBe attached to linear movement piece unbalancely), when linear movement piece moves on linear moving guide rail, occurredCarry phenomenon and can not move swimmingly, or easily causing fault.
Therefore, follow cam as above to change operation and the problem of generation in order to solve, proposing has such as Korea SproNo. 10-0622415 (denomination of invention: " element of semiconductor element test separator is transferred of state's granted patentDevice ", hereinafter referred to as " prior art ") technology.
In the prior art, be arranged to utilize servomotor at random to adjust pick and place device (existingHave in technology and be named as " element transfer device ") minimum spacing between the semiconductor element that picks up andMaximum spacing, even if the size of semiconductor element to be tested changes accordingly, also without changing cam.
But, when loading in the spacing homogeneous phase as between the semiconductor element of the mounting unit of test pallet etc.Meanwhile, can effectively use prior art, but when loading between the semiconductor element of mounting unitSpacing different (with reference to Figure 12 of No. 10-2008-0003145, Korea S's publication) or becomeDifferent or while becoming in contrast to this identical, can not effectively use prior art. And, in mountingMinimum spacing between the semiconductor element of new mounting unit or maximum spacing exceed and at present useIn the situation of the spacing adjusting range of cam, can not effectively use prior art. In this case,Its result can only be changed cam, so or can there is the above-mentioned problem causing because changing cam. AndAnd because formation has servomotor, therefore device becomes complicated, has the problem of price increase.
Summary of the invention
The present invention proposes in order to improve the problems referred to above, its object be to provide one can with lineProperty moving mass maintains the technology of substantially changing cam under the state of combination.
To achieve these goals, Test handler provided by the present invention comprises by pick and place device: multiplePick-up module, can move horizontally, and possesses respectively for picking up at least one that semiconductor element arrangesIndividual pick-up; The first guide member, for guiding moving horizontally of described multiple pick-up modules; ProtrudingWheel component, can carry out lifting, and corresponds respectively to described multiple pick-up module and be formed with multiple protrudingRace, the level that described multiple cam paths according to lifting, described multiple pick-up module occur is separately movedMoving, to adjust the spacing between described multiple pick-up module; The second guide member, for guiding instituteState the lifting of cam part; And drive source, the required driving force of lifting of described cam part is provided.Described cam part comprises: support frame, is liftably incorporated into described the second guide member; And protrudingWheel plate, is releasably incorporated into described support frame, is formed with described multiple cam path. Many described in eachIndividual pick-up module has insertion portion, and this insertion portion is by being inserted into respectively described multiple cam pathWith the lifting interlock of described cam part, to provide along continuous straight runs to multiple pick-up modules described in eachLocomotivity, described multiple cam paths spacing is each other according to the lifting of described cam part and at warpCross on the horizontal line of insertion portion of described multiple pick-up modules and narrow or broaden, so that described multiple picking upThe spacing of getting between device module is adjusted according to the jacking condition of described cam part.
Described multiple cam path top and bottom are separately closed.
The position corresponding with the lower end of described multiple cam paths of described support frame is formed with multiple arrangementsGroove, for settling respectively the insertion portion of described multiple pick-up modules.
Have for guiding inserting of described insertion portion in multiple cam paths of described lobe plate lower end separatelyThe leader entering.
Described leader is by making the lower end part court and described multiple pick-up module faces of described cam pathRight face side is expanded and is formed.
A side at described support frame is formed with projecting slot, and described lobe plate is corresponding with described projecting slotPosition be formed with the combination projection for being inserted into described projecting slot, described cam part also comprises and maintainingPart, for being inserted under the state of described projecting slot in described combination projection, is maintained described lobe plateBe incorporated into the state of described support frame.
Described cam part also comprises elastomeric element, maintains part described in this elastomeric element resiliency supported, so thatThe described part that maintains can be exerted pressure to the described lobe plate that is incorporated into described support frame towards a side direction.
Described cam part also comprises elastomeric element, and this elastomeric element is set to can be towards a side direction pairThe described lobe plate that is incorporated into described support frame is exerted pressure.
According to the present invention, be incorporated under the state of linear movement piece at the support frame that forms cam part,Only need on support frame, load and unload lobe plate, therefore have and be convenient to substantially to change camEffect.
Brief description of the drawings
Fig. 1 is vertical with the summary of pick and place device of the Test handler that provides about embodiments of the inventionBody figure.
Fig. 2 illustrates the state of isolating lobe plate pick and place device for Test handler from Fig. 1.
Fig. 3 is illustrated in the state of further isolating support frame under the state of Fig. 2.
Fig. 4 is illustrated under the state of Fig. 3 and further isolates for guiding moving horizontally of pick-up moduleThe state of rail supported plate of the first guide member.
Fig. 5 for about at the Test handler of Fig. 1 with the first guide member using in pick and place deviceBack view.
Fig. 6 illustrate spacing between pick-up module along with the lifting of cam part controlled state.
Fig. 7 is the stereogram that can observe the summary at the back side of lobe plate.
Fig. 8 a and Fig. 8 b are for the duty about the Test handler pick and place device of Fig. 1 is describedWith reference to figure.
Fig. 9 and Figure 10 change lobe plate for illustrating in the Test handler pick and place device of Fig. 1Technology with reference to figure.
Symbol description
100: pick and place device
111 to 118: pick-up module
P: pick-up
111a to 118a: insertion portion
120: the first guide members
130: cam part
131: support frame
131b: engagement groove
131c-1 to 131c-8: resettlement groove
132: lobe plate
132a to 132h: cam path
132i: in conjunction with projection
G: leader
133: maintain part
134: spring
141,142: the second guide members
151,152: cylinder
Detailed description of the invention
Below, with reference to the accompanying drawings of preferred embodiment provided by the present invention as above, in this caseMake interest of clarity, omit as far as possible or the simple explanation repeating.
Fig. 1 for the pick and place device for Test handler that provides about embodiments of the invention (100, belowReferred to as " pick and place device ") the stereogram of summary, Fig. 2 separates from the pick and place device 100 of Fig. 1Go out to form the stereogram of the summary of the state of the lobe plate 132 of cam part 130, Fig. 3 is Fig. 2'sUnder state, further isolate the solid of the summary of the state of the support frame 131 that forms cam part 130Figure. And, Fig. 4 be under the state of Fig. 3, further isolate for guide pick-up module 111 toThe solid of the summary of the state of the rail supported plate 123 of 118 the first guide member 120 moving horizontallyFigure.
As shown in Figures 1 to 4, the pick and place device 100 that the present embodiment provides comprises eight pick-up mouldsPiece 111 to 118, the first guide member 120, cam part 130, a pair of the second guide member 141,142, a pair of cylinder 151,152 etc. and forming.
Eight pick-up modules 111 to 118 can move horizontally respectively, possess respectively for picking up simultaneouslyGet at least one pick-up P of semiconductor element. As a reference, showing one at Fig. 1 to Fig. 4 picks upGet device module 111,112..., 118 and possess the situation of two pick-up P, but can be according to enforcementAnd making a pick-up module 111,112..., 118 possess three above pick-up P, this is aobviousAnd easily see. And each the pick-up module in eight pick-up modules 111 to 118 possesses courtThe insertion portion 111a to 118a that front is outstanding, and each insertion portion 111a to 118a has bearing B.
The first guide member 120 is in order to guide moving horizontally of eight pick-up modules 111 to 118Arrange, and as shown in the back view of Fig. 5, by the first guide rail 121a, the 121b that possess in pairs and eightThe first rail block 122a to 122h and rail supported plate 123 form.
Two the first guide rail 121a, 121b are the form of extending along left and right directions, and mutually along the vertical directionSeparately arrange.
Eight the first rail block 122a to 122h are for by 111 to 118 selections of eight pick-up modulesBe incorporated into two the first guide rail 121a, 121b to property, so that each pick-up module 111 to 118 canAlong continuous straight runs moves and arranges. , eight the first rail block 122a to 122h are alternately incorporated intoThe first guide rail 121a of upside or the first guide rail 121b of downside. And, eight pick-up modules 111Be incorporated into respectively eight the first rail block 122a to 122h to 118. Accordingly, eight pick-up modules 111Edge when can being guided by the first guide rail 121a, 121b by the first rail block 122a to 122h to 118Horizontal direction moves.
Rail supported plate 123 arranges in order to support the first guide rail 121a, 121b. , first leadRail 121a, 121b are to be incorporated into the state setting of rail supported plate 123. And, rail supported plate 123Between the first guide rail 121a, the 121b of upper and lower both sides, be formed with the via hole 123a that along continuous straight runs extends,So that the insertion portion 111a to 118a of pick-up module 111 to 118 can be through to front.
Cam part 130 is set to, and can carry out lifting, and according to this lifting, eight pick-up modules111 to 118 generations moving horizontally separately, to adjust thus eight pick-up modules 111 to 118Between spacing. For this reason, cam part 130 comprises support frame 131, lobe plate 132, maintains part133 and spring etc. and forming.
Support frame 131 is arranged at the front of the first guide member 120, and two ends are incorporated into liftableThe second rail block 141b, the 142b of the second guide member 141,142. This support frame 131 inCentre place is formed with the open bore 131a of broad quadrangle form, to avoid cam part 130 risingWhile falling and the insertion portion 111a to 118a of pick-up module 111 to 118 interfere, and oneSide is formed with for the engagement groove 131b in conjunction with lobe plate 132. And supporting surface SF is formed as from propping upThe positive FF of support frame frame 131 is with the stepped form falling in, so that the back side of lobe plate 132 is supportedFramework 131 supports. , in the present invention, supporting surface SF is formed as the gabarit table of supporting cam wheel plate 132Face and mid portion, but can make shape be designed to difference according to the formation of equipment. And, supportLadder extent between positive FF and the supporting surface SF of framework 131 is preferably with lobe plate 132Thickness is identical, and this is when lobe plate 132 is attached to support frame 131, forms and maintains part 133And in conjunction with the marriage relation smoothly of protruding 132i.
Lobe plate 132 is to adjust pick-up module 111 in order to play according to the lifting of cam part 130Effect to the spacing between 118 arranges, and this lobe plate 132 is releasably arranged at carriageFrame 131. In this lobe plate 132, corresponding to each in eight pick-up modules 111 to 118Individual pick-up module and be formed with along the vertical direction eight elongated cam path 132a to 132h. At this,Eight cam path 132a to 132h are formed obliquely so that spacing each other from upper portion toSide part is wider gradually, and top and bottom are separately closed. , complete in lobe plate 132Ground is formed with eight cam path 132a to 132h, thereby can guide aptly insertion portion 111a extremely118a. And the insertion portion 111a to 118a of above-mentioned eight pick-up modules 111 to 118 dividesBe not inserted into eight cam path 132a to 132h of lobe plate 132. Therefore, as Fig. 6 (a) and (b)Shown in, on the horizontal line H of the insertion portion 111a to 118a through pick-up module 111 to 118,Along with the lifting of lobe plate 132, insertion portion 111a to 118a is upper according to cam path 132a to 132hAnd the locomotivity of generation along continuous straight runs, pick-up module 111 to 118 along continuous straight runs move accordinglyMeanwhile, spacing each other narrows or broadens. Now, the axle that insertion portion 111a to 118 possessesHolding B makes pick-up module 111 to 118 respectively along the cam path 132a to 132h tilting and submissive groundMobile. And a side of lobe plate 132 is formed with the combination for being inserted into above-mentioned engagement groove 131bProjection 132i.
In addition, aforesaid support frame 131 is at the cam path 132a to 132h corresponding to lobe plate 132The position of lower end be formed with can settle respectively pick-up module 111 to 118 insertion portion 111a extremelyEight resettlement groove 131c-1 to 131c-8 of 118a, can limit while therefore changing lobe plate 132 afterwardsMoving horizontally of pick-up module 111 to 118 processed. And, as shown in Figure 7, for cam is being setWhen plate 132, guide insertion portion 111a to 118a to insert rightly, at lobe plate 132The back side is formed with leader G, and this leader G is by making the bottom of cam path 312a to 132hPosition court expands and forms with the face side that pick-up module 111 to 118 is faced.
Maintaining part 133 functions as follows: be inserted in support by the combination projection 132i in a sideThe opposite side of the lobe plate 132 of the state of the engagement groove 131b of framework 131 carries out clamping, remains thus protrudingWheel plate 132 is incorporated into the state of support frame 131. This maintain that part 133 is set to can be along lobe plate132 sides advance and retreat are mobile, and possess can be to being incorporated into the opposite side of support frame 131 of lobe plate 132Carry out the joint end 133a of clamping.
Spring 134 maintains the elastomeric element of part 133 and is equipped with as being used for resiliency supported, further,Spring 134 is pushed lobe plate 132 by maintaining part 133 to a side direction, thus in connection with in carriageThe lobe plate 132 of frame 131 is arranged into suitable position. Although spring 134 is by dimension in the present embodimentGripping member 133 provides elastic force so that lobe plate 132 is arranged into a side to lobe plate 132, but is implementingTime also can specific implementation provide elastic force in other mode to lobe plate for spring.
In addition, a pair of the second guide member the 141, the 142nd, for the lifting moving of drive cam parts 130And arrange, it is made up of the second guide rail 141a, 142a and the second rail block 141b, 142b respectively.
The second guide rail 141a, 142a extend along the vertical direction and arrange, for drive cam parts 130Lifting moving, and the second rail block 141b, 142b are attached to second by the two ends of cam part 130Guide rail 141a, 142a, so that cam part 130 can carry out lifting moving.
Cylinder 151,152 provides driving of required driving force as being used to the lifting of cam part 130Moving source and arranging.
Then, the action of pick and place device 100 is as above described.
First, to load in the semiconductor element of for example client's pallet and need to make pick-up module in order to pick upWhen spacing between 111 to 118 narrows, as shown in Figure 8 a, utilize cylinder 151,152 to make the second railRoad piece 141b, 142b decline towards below, make to be thus incorporated into the cam of the second rail block 141b, 142bParts 130 move towards below. Accordingly, the insertion portion 111a to 118a of pick-up module 111 to 118By the cam path 132a to 132h of the inclination of cam part 130 and the level that is subject to moves horizontally power,Eventually, pick-up module 111 to 118 moves horizontally the distance of regulation by cam path 132a to 132hTime, as shown in Figure 8 b, spacing each other narrows. And, for by pick-up module 111Be placed on such as test pallet etc. and need to make pick-up module 111 to 118 semiconductor elements that pick upWhile broadening to the spacing between 118, utilize cylinder 151,152 mention towards top the second rail block 141b,142b, so that cam part 130 moves towards top, turns back to the shape of Fig. 8 a thus from the state of Fig. 8 bState.
In addition, because changing, the size of semiconductor element to be tested loads partly leading in test pallet(semiconductor element is electrically connected by socket for inspection for spacing between body member or the socket for inspection of testerReceive tester) between spacing while changing, manager only need to change cam part 130 simplyLobe plate 132 just can obtain fast and easily special for new semiconductor element to be testedProperty.
That is, above cam part 130 moves to as the state of Fig. 8 a under, manager is by towards camThe opposition side of plate 132 is pushed and is maintained part 133, and the other end of removing thus lobe plate 132 is connected in and maintainsThe state of the joint end 133a of part 133. Now, as shown in Figure 9, pick-up module 111 to 118Insertion portion 111a to 111h is placed in the resettlement groove 131c-1 to 131c-8 of support frame 131, because ofAnd the moving freely of the along continuous straight runs of the insertion portion 111a to 111h of pick-up module 111 to 118Be limited, thereby new lobe plate 132(can be easily installed afterwards for asking convenient, symbol is with existingThe symbol of some lobe plates is identical). The state separating from support frame 131 at existing lobe plate 132(as shown in Figure 9), the combination projection 132i of a side of new lobe plate to be replaced 132 will be formed atBe inserted into the engagement groove 131b(of support frame 131 as shown in figure 10). Then, towards support frame 131The opposite side of new lobe plate 132 is squeezed in thruster. Now, the other end of lobe plate 132 maintains part with being positioned atThe sloping portion S contact of 133 joint end 133a, under this state by gerentocratic towards support frameThe direction of 131 sides is pushed the power of lobe plate 132, maintains part 133 and will temporarily retreat into lobe plate 132Opposition side, in the time that lobe plate 132 is positioned at the state that is incorporated into support frame 131, maintain part 133 byThe elastic force of spring 134 and towards lobe plate 132 side shiftings, thus the joint end 133a card of part 133 maintainedThe other end of living lobe plate 132, completes the setting of new lobe plate 132 thus. Now, spring 134Provide elastic force to lobe plate 132 constantly by maintaining part 133, thereby make the lobe plate 132 canBe arranged into the engagement groove 131b side of support frame. At this, due to the cam path 132a of lobe plate 132 extremelyThe lower end part of 132h is formed as court and expands with the face side that pick-up module 111 to 118 is faced, thereforeEven if adopt the engagement groove 13b court afterwards that first a side of lobe plate 132 is inserted into support frame 131Support frame 131 thrusters squeeze lobe plate 132 opposite side and the mode of combination also can guide aptlyThe insertion portion 111a to 118a of pick-up module 111 to 118 is inserted into cam path 132a to 132h.
In the present invention, utilize cylinder 151,152 as the required drive source of the lifting of cam part 130,But can utilize motor according to different situations.
And, in the present invention, be incorporated into the state of support frame 131 and profit in order to maintain lobe plate 132With engagement groove 131b and maintain part 133, but can only utilize according to the associated methods of lobe plate dimensionGripping member, and the combination projection 132i and the guide member G that are arranged at lobe plate also can select as requiredProperty ground uses.
As mentioned above, by the embodiment with reference to accompanying drawing, the present invention is illustrated, however above-mentionedEmbodiment only enumerate preferred exemplary of the present invention and be illustrated, therefore the present invention can not be interpreted as only officeBe limited to the above embodiments, protection scope of the present invention should be with the scope of being asked in claims andIts equivalents is understood.
Claims (7)
1. a Test handler pick and place device, is characterized in that, comprising:
Multiple pick-up modules, can move horizontally, and possess respectively for picking up semiconductor element settingAt least one pick-up;
The first guide member, for guiding moving horizontally of described multiple pick-up modules;
Cam part, can carry out lifting, and corresponds respectively to described multiple pick-up module and be formed withMultiple cam paths, there is separately described multiple pick-up module according to lifting in described multiple cam pathsMove horizontally, to adjust the spacing between described multiple pick-up module;
The second guide member, for guiding the lifting of described cam part; And
Drive source, for the lifting of described cam part provides required driving force,
Described cam part comprises:
Support frame, is liftably incorporated into described the second guide member; And
Lobe plate, is releasably incorporated into described support frame, is formed with described multiple cam path,
Described in each, multiple pick-up modules have insertion portion, and this insertion portion is by being inserted into respectively instituteState multiple cam paths and with the lifting interlock of described cam part, with to multiple pick-up modules described in eachThe locomotivity of along continuous straight runs is provided,
Described multiple cam path spacing is each other according to the lifting of described cam part and described in processOn the horizontal line of the insertion portion of multiple pick-up modules, narrow or broaden, so that described multiple pick-up mouldSpacing between piece is adjusted according to the jacking condition of described cam part, described support frame with institutePosition corresponding to lower end of stating multiple cam paths is formed with multiple resettlement grooves, described many for settling respectivelyThe insertion portion of individual pick-up module,
Wherein, be formed with projecting slot in a side of described support frame,
Described lobe plate is formed with in the position corresponding with described projecting slot for being inserted into described projecting slotIn conjunction with projection,
Described cam part also comprises and maintains part, for being inserted into described projecting slot in described combination projectionState under, be maintained described lobe plate and be incorporated into the state of described support frame.
2. Test handler pick and place device according to claim 1, is characterized in that, described manyIndividual cam path top and bottom are separately closed.
3. Test handler pick and place device according to claim 1, is characterized in that, describedThe lower end separately of multiple cam paths of lobe plate has the guiding of the insertion for guiding described insertion portionPart.
4. Test handler pick and place device according to claim 3, is characterized in that, described in drawLead part by making the lower end part of described cam path towards the face side right with described multiple pick-up module facesExpand and form.
5. a Test handler pick and place device, is characterized in that, comprising:
Multiple pick-up modules, can move horizontally, and possess respectively for picking up semiconductor element settingAt least one pick-up;
The first guide member, for guiding moving horizontally of described multiple pick-up modules;
Cam part, can carry out lifting, and corresponds respectively to described multiple pick-up module and be formed withMultiple cam paths, there is separately described multiple pick-up module according to lifting in described multiple cam pathsMove horizontally, to adjust the spacing between described multiple pick-up module;
The second guide member, for guiding the lifting of described cam part; And
Drive source, for the lifting of described cam part provides required driving force,
Described cam part comprises:
Support frame, is liftably incorporated into described the second guide member; And
Lobe plate, is releasably incorporated into described support frame, is formed with described multiple cam path,
Described in each, multiple pick-up modules have insertion portion, and this insertion portion is by being inserted into respectively instituteState multiple cam paths and with the lifting interlock of described cam part, with to multiple pick-up modules described in eachThe locomotivity of along continuous straight runs is provided,
Described multiple cam path spacing is each other according to the lifting of described cam part and described in processOn the horizontal line of the insertion portion of multiple pick-up modules, narrow or broaden, so that described multiple pick-up mouldSpacing between piece is adjusted according to the jacking condition of described cam part,
Wherein, be formed with projecting slot in a side of described support frame, described lobe plate with described projectionThe position that groove is corresponding is formed with the combination projection for being inserted into described projecting slot, and described cam part also wrapsDraw together and maintain part, for being inserted under the state of described projecting slot in described combination projection, described in being maintainedLobe plate is incorporated into the state of described support frame.
6. Test handler pick and place device according to claim 5, is characterized in that, described protrudingWheel component also comprises elastomeric element, maintains part described in this elastomeric element resiliency supported so that described in maintain partCan exert pressure to the described lobe plate that is incorporated into described support frame towards a side direction.
7. Test handler pick and place device according to claim 1 or 5, is characterized in that instituteState cam part and also comprise elastomeric element, this elastomeric element is set to can be towards a side direction to being incorporated intoThe described lobe plate of described support frame is exerted pressure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0052240 | 2012-05-17 | ||
| KR1020120052240A KR101811646B1 (en) | 2012-05-17 | 2012-05-17 | Pick and place apparatus for test handler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103418551A CN103418551A (en) | 2013-12-04 |
| CN103418551B true CN103418551B (en) | 2016-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310142289.6A Active CN103418551B (en) | 2012-05-17 | 2013-04-23 | Test handler pick and place device |
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| Country | Link |
|---|---|
| KR (1) | KR101811646B1 (en) |
| CN (1) | CN103418551B (en) |
| TW (1) | TWI497085B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102149767B1 (en) * | 2014-08-07 | 2020-09-01 | (주)테크윙 | Contact apparatus |
| KR102187839B1 (en) * | 2014-11-28 | 2020-12-08 | (주)테크윙 | Test handler |
| KR102326005B1 (en) * | 2015-05-18 | 2021-11-12 | 세메스 주식회사 | Apparatus for picking up a semiconductor device |
| KR101870394B1 (en) * | 2017-03-24 | 2018-06-22 | ㈜토니텍 | Picker device for semiconductor package |
| KR102369467B1 (en) * | 2017-06-14 | 2022-03-04 | (주)테크윙 | Socket opening apparatus for handling electronic devices |
| CN107214920A (en) * | 2017-07-21 | 2017-09-29 | 昆山艾博机器人股份有限公司 | One kind automation variable pitch device |
| CN107398427B (en) * | 2017-07-27 | 2019-05-07 | 安徽江淮汽车集团股份有限公司 | Components sorting equipment |
| CN109516187B (en) * | 2018-10-15 | 2020-08-11 | 惠州市隆合科技有限公司 | Device of interval between adjustable adjacent slip table anchor clamps |
| CN110197813B (en) * | 2019-04-18 | 2021-11-05 | 广州市加简派电子科技有限公司 | Dust removal type chip picking equipment with suction nozzle replacing function |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002164413A (en) * | 2000-11-24 | 2002-06-07 | Toshiba Ceramics Co Ltd | Apparatus for changing pitch |
| KR100428432B1 (en) * | 2001-01-15 | 2004-05-03 | 아주시스템 주식회사 | Pick and place of test device for semiconductor element |
| KR100411297B1 (en) | 2002-01-17 | 2003-12-24 | 미래산업 주식회사 | Picker for semiconductor test handler |
| KR100536474B1 (en) * | 2004-06-15 | 2005-12-14 | 미래산업 주식회사 | Picker for transferring devices in semiconductor test handler |
| KR100622415B1 (en) * | 2004-12-06 | 2006-09-19 | 미래산업 주식회사 | Device Transfer for Semiconductor Test Handler |
| KR100792485B1 (en) * | 2006-07-01 | 2008-01-10 | (주)테크윙 | Pick-and-place apparatus |
| KR20080103344A (en) * | 2007-05-23 | 2008-11-27 | 세크론 주식회사 | Pick-up apparatus for semiconductor device |
| KR101304274B1 (en) * | 2008-12-31 | 2013-09-26 | (주)테크윙 | Pick-and-place apparatus of test handler |
| KR101361494B1 (en) * | 2009-11-12 | 2014-02-14 | (주)테크윙 | Pick and place apparatus |
-
2012
- 2012-05-17 KR KR1020120052240A patent/KR101811646B1/en active IP Right Review Request
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2013
- 2013-04-23 CN CN201310142289.6A patent/CN103418551B/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103418551A (en) | 2013-12-04 |
| KR20130128500A (en) | 2013-11-27 |
| TW201348721A (en) | 2013-12-01 |
| TWI497085B (en) | 2015-08-21 |
| KR101811646B1 (en) | 2017-12-26 |
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