CN102015286B - 用于印刷电路基板的穿孔加工用薄板 - Google Patents

用于印刷电路基板的穿孔加工用薄板 Download PDF

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Publication number
CN102015286B
CN102015286B CN200980113891.9A CN200980113891A CN102015286B CN 102015286 B CN102015286 B CN 102015286B CN 200980113891 A CN200980113891 A CN 200980113891A CN 102015286 B CN102015286 B CN 102015286B
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CN
China
Prior art keywords
ethylene
sheet
organic resin
resin layer
punching according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200980113891.9A
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English (en)
Chinese (zh)
Other versions
CN102015286A (zh
Inventor
洪富镇
蔡承奉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
I S TECH Co Ltd
Original Assignee
I S TECH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Publication of CN102015286A publication Critical patent/CN102015286A/zh
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Publication of CN102015286B publication Critical patent/CN102015286B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/56—Damping, energy absorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
CN200980113891.9A 2008-06-06 2009-05-07 用于印刷电路基板的穿孔加工用薄板 Expired - Fee Related CN102015286B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2008-0053408 2008-06-06
KR1020080053408A KR100889702B1 (ko) 2008-06-06 2008-06-06 진동흡수용 천공 가공 시트
PCT/KR2009/002411 WO2009148222A2 (ko) 2008-06-06 2009-05-07 인쇄 회로 기판용 천공 가공 시트

Publications (2)

Publication Number Publication Date
CN102015286A CN102015286A (zh) 2011-04-13
CN102015286B true CN102015286B (zh) 2014-08-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980113891.9A Expired - Fee Related CN102015286B (zh) 2008-06-06 2009-05-07 用于印刷电路基板的穿孔加工用薄板

Country Status (5)

Country Link
JP (1) JP5543431B2 (enExample)
KR (1) KR100889702B1 (enExample)
CN (1) CN102015286B (enExample)
TW (1) TW201000307A (enExample)
WO (1) WO2009148222A2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102573306A (zh) * 2012-01-09 2012-07-11 苏州艾迪亚电子科技有限公司 一种用于生产外层半压合板的方法
JP6131977B2 (ja) * 2015-03-24 2017-05-24 マツダ株式会社 金属製基材上に樹脂含有皮膜を有するワークの加工方法
KR20160139574A (ko) 2015-05-28 2016-12-07 창조산업 주식회사 인쇄회로기판 천공용 엔트리 시트 및 그 제조방법
WO2017038867A1 (ja) * 2015-09-02 2017-03-09 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
JP6351865B1 (ja) * 2016-12-09 2018-07-04 日本メクトロン株式会社 エントリーシート、エントリーシートの製造方法及びフレキシブル基板の製造方法
JP2019042870A (ja) * 2017-09-01 2019-03-22 三菱瓦斯化学株式会社 切削加工用エントリーシート及び切削加工方法
CN112265339B (zh) * 2020-10-28 2022-12-02 深圳市柳鑫实业股份有限公司 一种pcb背钻用盖板及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1299318A (zh) * 1997-12-01 2001-06-13 波雷坦合成物有限公司 印制电路板和天线的基材用超高分子量聚乙烯复合材料
CN1333920A (zh) * 1999-03-12 2002-01-30 Ga－Tek公司(商业活动中称哥德电子公司) 多层印刷电路中的层压品
TWI244361B (en) * 2003-12-09 2005-11-21 Kobe Steel Ltd Resin-coated metal plate for use in perforating printed-wiring board
KR100657427B1 (ko) * 2006-04-19 2006-12-14 주식회사 제알코 코팅용 조성물 및 이를 이용한 피씨비 홀가공용 시트
JP2007100961A (ja) * 2006-10-17 2007-04-19 Nippon Unicar Co Ltd 発泡ポリエチレン被覆金属管

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001150215A (ja) * 1999-11-24 2001-06-05 Hitachi Chem Co Ltd プリント配線板穴明け加工用シート
JP4249370B2 (ja) * 2000-04-19 2009-04-02 大日本印刷株式会社 ラミネ−トチュ−ブ容器
JP2003080498A (ja) * 2000-06-28 2003-03-18 Hitachi Chem Co Ltd プリント配線板穴あけ加工用シート
JP5041621B2 (ja) 2000-10-11 2012-10-03 三菱瓦斯化学株式会社 孔明け用金属箔複合シート及びドリル孔明け加工法
JP2002292599A (ja) * 2001-01-29 2002-10-08 Hitachi Chem Co Ltd 積層体穴あけ加工用シート
JP2004009270A (ja) * 2002-06-11 2004-01-15 Hitachi Chem Co Ltd フレキシブルプリント配線板穴あけ加工用シートおよびフレキシブルプリント配線板の製造方法
JP2008045019A (ja) * 2006-08-14 2008-02-28 Asahi Kasei Chemicals Corp ドリル穴開け加工用シート
KR20080055627A (ko) * 2007-11-19 2008-06-19 홍부진 천공 가공용 쉬트

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1299318A (zh) * 1997-12-01 2001-06-13 波雷坦合成物有限公司 印制电路板和天线的基材用超高分子量聚乙烯复合材料
CN1333920A (zh) * 1999-03-12 2002-01-30 Ga－Tek公司(商业活动中称哥德电子公司) 多层印刷电路中的层压品
TWI244361B (en) * 2003-12-09 2005-11-21 Kobe Steel Ltd Resin-coated metal plate for use in perforating printed-wiring board
KR100657427B1 (ko) * 2006-04-19 2006-12-14 주식회사 제알코 코팅용 조성물 및 이를 이용한 피씨비 홀가공용 시트
JP2007100961A (ja) * 2006-10-17 2007-04-19 Nippon Unicar Co Ltd 発泡ポリエチレン被覆金属管

Also Published As

Publication number Publication date
JP2011518059A (ja) 2011-06-23
JP5543431B2 (ja) 2014-07-09
CN102015286A (zh) 2011-04-13
KR100889702B1 (ko) 2009-03-20
TW201000307A (en) 2010-01-01
WO2009148222A3 (ko) 2010-01-28
WO2009148222A2 (ko) 2009-12-10

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Granted publication date: 20140813

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CF01 Termination of patent right due to non-payment of annual fee