CN102007080B - 使用含铜玻璃料的电阻器组合物 - Google Patents

使用含铜玻璃料的电阻器组合物 Download PDF

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Publication number
CN102007080B
CN102007080B CN200980113820.9A CN200980113820A CN102007080B CN 102007080 B CN102007080 B CN 102007080B CN 200980113820 A CN200980113820 A CN 200980113820A CN 102007080 B CN102007080 B CN 102007080B
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CN
China
Prior art keywords
weight
frit
oxide
thick
compound
Prior art date
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Active
Application number
CN200980113820.9A
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English (en)
Chinese (zh)
Other versions
CN102007080A (zh
Inventor
早川佳一郎
J·D·史密斯
緖方裕子
M·H·拉布兰切
K·W·杭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celanese Mercury Holdings Inc
Original Assignee
EI Du Pont de Nemours and Co
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Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN102007080A publication Critical patent/CN102007080A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • H01C17/0654—Oxides of the platinum group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Adjustable Resistors (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)
CN200980113820.9A 2008-04-18 2009-04-17 使用含铜玻璃料的电阻器组合物 Active CN102007080B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4626808P 2008-04-18 2008-04-18
US61/046,268 2008-04-18
PCT/US2009/040967 WO2009129468A1 (en) 2008-04-18 2009-04-17 Resistor compositions using a cu-containing glass frit

Publications (2)

Publication Number Publication Date
CN102007080A CN102007080A (zh) 2011-04-06
CN102007080B true CN102007080B (zh) 2014-05-07

Family

ID=40823082

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980113820.9A Active CN102007080B (zh) 2008-04-18 2009-04-17 使用含铜玻璃料的电阻器组合物

Country Status (7)

Country Link
US (1) US8133413B2 (enExample)
EP (1) EP2274250A1 (enExample)
JP (1) JP5406277B2 (enExample)
KR (1) KR101258329B1 (enExample)
CN (1) CN102007080B (enExample)
TW (1) TW201004890A (enExample)
WO (1) WO2009129468A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8257619B2 (en) * 2008-04-18 2012-09-04 E I Du Pont De Nemours And Company Lead-free resistive composition
WO2016039108A1 (ja) * 2014-09-12 2016-03-17 昭栄化学工業株式会社 厚膜抵抗体及びその製造方法
KR101739744B1 (ko) * 2015-08-13 2017-05-25 대주전자재료 주식회사 무연 후막 저항 조성물, 무연 후막 저항체 및 이의 제조방법
JP6558253B2 (ja) * 2016-01-15 2019-08-14 住友金属鉱山株式会社 厚膜抵抗体組成物および抵抗体ペースト
RU2658644C2 (ru) * 2016-03-16 2018-06-22 Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Уральский федеральный университет имени первого Президента России Б.Н. Ельцина" Способ изготовления и состав пасты для толстопленочного резистора
KR102745341B1 (ko) 2016-10-06 2024-12-20 삼성전자주식회사 복합물질과 그 형성방법 및 복합물질을 포함하는 장치
CN109790061B (zh) 2016-11-10 2022-06-28 日本板硝子株式会社 玻璃填料及其制造方法
US10115505B2 (en) 2017-02-23 2018-10-30 E I Du Pont De Nemours And Company Chip resistor
CN108053960B (zh) * 2017-10-23 2019-10-15 潮州三环（集团）股份有限公司 一种厚膜电阻浆料
GB201806411D0 (en) * 2018-04-19 2018-06-06 Johnson Matthey Plc Kit, particle mixture, paste and methods
CN113314284B (zh) * 2021-03-10 2022-10-11 三之星机带株式会社 电阻体糊及其用途以及电阻体的制造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4362656A (en) * 1981-07-24 1982-12-07 E. I. Du Pont De Nemours And Company Thick film resistor compositions
EP0132810A1 (en) * 1983-07-25 1985-02-13 E.I. Du Pont De Nemours And Company Borosilicate glass composition
EP0548865A2 (en) * 1991-12-25 1993-06-30 E.I. Du Pont De Nemours And Company Thick film resistor composition
US5474711A (en) * 1993-05-07 1995-12-12 E. I. Du Pont De Nemours And Company Thick film resistor compositions
US5534194A (en) * 1993-03-30 1996-07-09 E. I. Du Pont De Nemours And Company Thick film resistor composition containing pyrochlore and silver-containing binder
CN1130795A (zh) * 1994-12-20 1996-09-11 纳幕尔杜邦公司 无镉无铅的厚膜糊状组合物
WO1999063553A1 (en) * 1998-05-29 1999-12-09 E.I. Du Pont De Nemours And Company Thick film resistor compositions for making heat-transfer tapes and use thereof
JP2005244114A (ja) * 2004-02-27 2005-09-08 Tdk Corp 抵抗体用導電材及び抵抗体ペースト、抵抗体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3583931A (en) 1969-11-26 1971-06-08 Du Pont Oxides of cubic crystal structure containing bismuth and at least one of ruthenium and iridium
US5753432A (en) * 1990-10-19 1998-05-19 Board Of Trustees Of The University Of Illinois Genes and genetic elements associated with control of neoplastic transformation in mammalian cells
JPH05335110A (ja) 1992-05-11 1993-12-17 Du Pont Japan Ltd 厚膜抵抗体組成物
EP0628974A2 (en) 1993-06-07 1994-12-14 E.I. Du Pont De Nemours & Company Incorporated Thick film resistor composition
JP4159056B2 (ja) * 1995-01-05 2008-10-01 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 水性現像可能なフォトリソグラフィー用感光性抵抗体組成物及び厚膜抵抗体の形成方法
JPH113801A (ja) 1997-06-11 1999-01-06 Sumitomo Metal Mining Co Ltd 厚膜抵抗ペーストおよびその製造方法
JP2001185409A (ja) 1999-12-22 2001-07-06 Koa Corp 厚膜抵抗体、厚膜抵抗器および厚膜抵抗器の製造方法
TW200419593A (en) * 2002-11-21 2004-10-01 Tdk Corp Resistive paste, resistor body and electronic device
US20050062585A1 (en) * 2003-09-22 2005-03-24 Tdk Corporation Resistor and electronic device
JP2005244115A (ja) 2004-02-27 2005-09-08 Tdk Corp 抵抗体ペースト、抵抗体及び電子部品
JP2006073718A (ja) * 2004-09-01 2006-03-16 Tdk Corp 厚膜抵抗体ペースト及び厚膜抵抗体、電子部品
TW200639880A (en) * 2005-02-21 2006-11-16 Tdk Corp Thick-film resistor and its production process

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4362656A (en) * 1981-07-24 1982-12-07 E. I. Du Pont De Nemours And Company Thick film resistor compositions
EP0132810A1 (en) * 1983-07-25 1985-02-13 E.I. Du Pont De Nemours And Company Borosilicate glass composition
EP0548865A2 (en) * 1991-12-25 1993-06-30 E.I. Du Pont De Nemours And Company Thick film resistor composition
US5534194A (en) * 1993-03-30 1996-07-09 E. I. Du Pont De Nemours And Company Thick film resistor composition containing pyrochlore and silver-containing binder
US5474711A (en) * 1993-05-07 1995-12-12 E. I. Du Pont De Nemours And Company Thick film resistor compositions
CN1130795A (zh) * 1994-12-20 1996-09-11 纳幕尔杜邦公司 无镉无铅的厚膜糊状组合物
WO1999063553A1 (en) * 1998-05-29 1999-12-09 E.I. Du Pont De Nemours And Company Thick film resistor compositions for making heat-transfer tapes and use thereof
JP2005244114A (ja) * 2004-02-27 2005-09-08 Tdk Corp 抵抗体用導電材及び抵抗体ペースト、抵抗体

Also Published As

Publication number Publication date
CN102007080A (zh) 2011-04-06
KR20100134768A (ko) 2010-12-23
EP2274250A1 (en) 2011-01-19
JP5406277B2 (ja) 2014-02-05
WO2009129468A1 (en) 2009-10-22
US20090261307A1 (en) 2009-10-22
KR101258329B1 (ko) 2013-04-25
TW201004890A (en) 2010-02-01
JP2011521869A (ja) 2011-07-28
US8133413B2 (en) 2012-03-13

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SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20221123

Address after: Delaware

Patentee after: DuPont Electronics

Address before: Delaware

Patentee before: E.I. Nemours DuPont

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20250508

Address after: Delaware, USA

Patentee after: dupont china Ltd.

Country or region after: U.S.A.

Address before: Delaware, USA

Patentee before: DuPont Electronics

Country or region before: U.S.A.