CN102005432A - 四面无引脚封装结构及其封装方法 - Google Patents
四面无引脚封装结构及其封装方法 Download PDFInfo
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- CN102005432A CN102005432A CN2010105024216A CN201010502421A CN102005432A CN 102005432 A CN102005432 A CN 102005432A CN 2010105024216 A CN2010105024216 A CN 2010105024216A CN 201010502421 A CN201010502421 A CN 201010502421A CN 102005432 A CN102005432 A CN 102005432A
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Images
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010105024216A CN102005432B (zh) | 2010-09-30 | 2010-09-30 | 四面无引脚封装结构及其封装方法 |
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CN2010105024216A CN102005432B (zh) | 2010-09-30 | 2010-09-30 | 四面无引脚封装结构及其封装方法 |
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CN102005432A true CN102005432A (zh) | 2011-04-06 |
CN102005432B CN102005432B (zh) | 2012-03-28 |
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Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102403282A (zh) * | 2011-11-22 | 2012-04-04 | 江苏长电科技股份有限公司 | 有基岛四面无引脚封装结构及其制造方法 |
CN102683315A (zh) * | 2011-11-30 | 2012-09-19 | 江苏长电科技股份有限公司 | 滚镀四面无引脚封装结构及其制造方法 |
CN102723280A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 单面三维线路芯片倒装先蚀后封制造方法及其封装结构 |
CN102723290A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 单面三维线路芯片正装先封后蚀制造方法及其封装结构 |
CN102723288A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 芯片倒装单面三维线路先封后蚀制造方法及其封装结构 |
CN102723282A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 芯片正装双面三维线路先蚀后封制造方法及其封装结构 |
CN102723289A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 芯片正装单面三维线路先封后蚀制造方法及其封装结构 |
CN102723292A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 芯片倒装双面三维线路先蚀后封制造方法及其封装结构 |
CN102723284A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 芯片正装单面三维线路先蚀后封制造方法及其封装结构 |
CN102723283A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 双面三维线路芯片正装先蚀后封制造方法及其封装结构 |
CN102723291A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 双面三维线路芯片倒装先蚀后封制造方法及其封装结构 |
CN102723281A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 芯片倒装双面三维线路先封后蚀制造方法及其封装结构 |
CN102723286A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 芯片正装双面三维线路先封后蚀制造方法及其封装结构 |
CN102723293A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 芯片倒装单面三维线路先蚀后封制造方法及其封装结构 |
CN102760668A (zh) * | 2012-06-09 | 2012-10-31 | 江苏长电科技股份有限公司 | 单面三维线路芯片倒装先封后蚀制造方法及其封装结构 |
CN102856294A (zh) * | 2012-05-09 | 2013-01-02 | 江苏长电科技股份有限公司 | 单芯片正装先蚀刻后封装基岛埋入封装结构及其制造方法 |
CN102856212A (zh) * | 2012-06-09 | 2013-01-02 | 江苏长电科技股份有限公司 | 双面三维线路芯片倒装先封后蚀制造方法及其封装结构 |
CN102881671A (zh) * | 2012-05-09 | 2013-01-16 | 江苏长电科技股份有限公司 | 单芯片正装先蚀刻后封装基岛露出封装结构及其制造方法 |
CN103094241A (zh) * | 2012-12-15 | 2013-05-08 | 华天科技(西安)有限公司 | 一种引线框架再布线的fcaaqfn封装件及其制作工艺 |
CN103094239A (zh) * | 2012-12-14 | 2013-05-08 | 华天科技(西安)有限公司 | 一种引线框架增加辅助贴膜引脚的封装件及其制作工艺 |
WO2013078750A1 (en) * | 2011-11-30 | 2013-06-06 | Jiangsu Changjiang Electronics Technology Co. Ltd | First-plating-then-etching quad flat no-lead (qfn) packaging structures and method for manufacturing the same |
CN103390567A (zh) * | 2013-08-06 | 2013-11-13 | 江苏长电科技股份有限公司 | 先蚀后封三维系统级芯片正装凸点封装结构及工艺方法 |
CN104112674A (zh) * | 2013-04-18 | 2014-10-22 | 矽品精密工业股份有限公司 | 半导体封装件的制法 |
CN105448877A (zh) * | 2011-08-01 | 2016-03-30 | 日月光半导体制造股份有限公司 | 半导体封装 |
CN108389805A (zh) * | 2018-04-28 | 2018-08-10 | 长电科技(滁州)有限公司 | 一种高可靠性平面凸点式封装方法及封装结构 |
CN112652544A (zh) * | 2020-12-22 | 2021-04-13 | 长电科技(滁州)有限公司 | 一种封装结构及其成型方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1405881A (zh) * | 2001-09-11 | 2003-03-26 | 株式会社东芝 | 半导体装置 |
US6828688B2 (en) * | 2000-03-13 | 2004-12-07 | Dai Nippon Printing Co., Ltd. | Resin-sealed semiconductor device, circuit member used for the device, and method of manufacturing the circuit member |
CN1725460A (zh) * | 2005-05-27 | 2006-01-25 | 江苏长电科技股份有限公司 | 集成电路或分立元件平面凸点式封装工艺及其封装结构 |
CN101483168A (zh) * | 2009-01-21 | 2009-07-15 | 江苏长电科技股份有限公司 | 基于金属框架的模塑方式sim卡封装结构及其封装方法 |
CN101814481A (zh) * | 2010-04-30 | 2010-08-25 | 江苏长电科技股份有限公司 | 无基岛引线框结构及其生产方法 |
CN201838581U (zh) * | 2010-09-30 | 2011-05-18 | 江苏长电科技股份有限公司 | 四面无引脚封装结构 |
-
2010
- 2010-09-30 CN CN2010105024216A patent/CN102005432B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6828688B2 (en) * | 2000-03-13 | 2004-12-07 | Dai Nippon Printing Co., Ltd. | Resin-sealed semiconductor device, circuit member used for the device, and method of manufacturing the circuit member |
CN1405881A (zh) * | 2001-09-11 | 2003-03-26 | 株式会社东芝 | 半导体装置 |
CN1725460A (zh) * | 2005-05-27 | 2006-01-25 | 江苏长电科技股份有限公司 | 集成电路或分立元件平面凸点式封装工艺及其封装结构 |
CN101483168A (zh) * | 2009-01-21 | 2009-07-15 | 江苏长电科技股份有限公司 | 基于金属框架的模塑方式sim卡封装结构及其封装方法 |
CN101814481A (zh) * | 2010-04-30 | 2010-08-25 | 江苏长电科技股份有限公司 | 无基岛引线框结构及其生产方法 |
CN201838581U (zh) * | 2010-09-30 | 2011-05-18 | 江苏长电科技股份有限公司 | 四面无引脚封装结构 |
Cited By (46)
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CN105448877B (zh) * | 2011-08-01 | 2019-08-23 | 日月光半导体制造股份有限公司 | 半导体封装 |
CN105448877A (zh) * | 2011-08-01 | 2016-03-30 | 日月光半导体制造股份有限公司 | 半导体封装 |
CN102403282A (zh) * | 2011-11-22 | 2012-04-04 | 江苏长电科技股份有限公司 | 有基岛四面无引脚封装结构及其制造方法 |
CN102403282B (zh) * | 2011-11-22 | 2013-08-28 | 江苏长电科技股份有限公司 | 有基岛四面无引脚封装结构及其制造方法 |
CN102683315A (zh) * | 2011-11-30 | 2012-09-19 | 江苏长电科技股份有限公司 | 滚镀四面无引脚封装结构及其制造方法 |
CN102683315B (zh) * | 2011-11-30 | 2015-04-29 | 江苏长电科技股份有限公司 | 滚镀四面无引脚封装结构及其制造方法 |
WO2013078750A1 (en) * | 2011-11-30 | 2013-06-06 | Jiangsu Changjiang Electronics Technology Co. Ltd | First-plating-then-etching quad flat no-lead (qfn) packaging structures and method for manufacturing the same |
CN102856294A (zh) * | 2012-05-09 | 2013-01-02 | 江苏长电科技股份有限公司 | 单芯片正装先蚀刻后封装基岛埋入封装结构及其制造方法 |
CN102856294B (zh) * | 2012-05-09 | 2015-01-14 | 江苏长电科技股份有限公司 | 单芯片正装先蚀刻后封装基岛埋入封装结构及其制造方法 |
CN102881671B (zh) * | 2012-05-09 | 2014-10-29 | 江苏长电科技股份有限公司 | 单芯片正装先蚀刻后封装基岛露出封装结构及其制造方法 |
CN102881671A (zh) * | 2012-05-09 | 2013-01-16 | 江苏长电科技股份有限公司 | 单芯片正装先蚀刻后封装基岛露出封装结构及其制造方法 |
CN102723288B (zh) * | 2012-06-09 | 2013-09-04 | 江苏长电科技股份有限公司 | 芯片倒装单面三维线路先封后蚀制造方法及其封装结构 |
CN102723284B (zh) * | 2012-06-09 | 2014-02-26 | 江苏长电科技股份有限公司 | 芯片正装单面三维线路先蚀后封制造方法及其封装结构 |
CN102723293A (zh) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | 芯片倒装单面三维线路先蚀后封制造方法及其封装结构 |
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