CN101998776B - 印刷电路板用铜箔及其制造方法 - Google Patents
印刷电路板用铜箔及其制造方法 Download PDFInfo
- Publication number
- CN101998776B CN101998776B CN201010258177.3A CN201010258177A CN101998776B CN 101998776 B CN101998776 B CN 101998776B CN 201010258177 A CN201010258177 A CN 201010258177A CN 101998776 B CN101998776 B CN 101998776B
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- copper foil
- nickel
- cobalt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009191169A JP5115527B2 (ja) | 2009-08-20 | 2009-08-20 | プリント配線板用銅箔およびその製造方法 |
JP2009-191169 | 2009-08-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101998776A CN101998776A (zh) | 2011-03-30 |
CN101998776B true CN101998776B (zh) | 2014-07-16 |
Family
ID=43776961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010258177.3A Active CN101998776B (zh) | 2009-08-20 | 2010-08-18 | 印刷电路板用铜箔及其制造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5115527B2 (zh) |
KR (1) | KR20110019699A (zh) |
CN (1) | CN101998776B (zh) |
TW (1) | TWI428065B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5913356B2 (ja) * | 2011-11-02 | 2016-04-27 | Jx金属株式会社 | 印刷回路用銅箔 |
TWI497051B (zh) * | 2012-09-14 | 2015-08-21 | Jx Nippon Mining & Metals Corp | An evaluation apparatus for a surface condition of a metallic material, a visibility evaluation apparatus for a transparent substrate, an evaluation program thereof, and a computer-readable recording medium on which a recording medium is recorded, and a method of detecting the same |
JP5362924B1 (ja) * | 2012-11-09 | 2013-12-11 | Jx日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた積層板 |
JP5706026B1 (ja) * | 2013-07-30 | 2015-04-22 | 古河電気工業株式会社 | 配線板用銅箔及び配線板 |
JP6393126B2 (ja) * | 2013-10-04 | 2018-09-19 | Jx金属株式会社 | 表面処理圧延銅箔、積層板、プリント配線板、電子機器及びプリント配線板の製造方法 |
JP6323261B2 (ja) * | 2014-08-29 | 2018-05-16 | 住友金属鉱山株式会社 | フレキシブル銅配線板の製造方法、及び、それに用いる支持フィルム付フレキシブル銅張積層板 |
JP6539281B2 (ja) * | 2014-09-02 | 2019-07-03 | 三井金属鉱業株式会社 | 黒色化表面処理銅箔及びキャリア箔付銅箔 |
JP5877282B1 (ja) * | 2014-09-09 | 2016-03-02 | 古河電気工業株式会社 | プリント配線板用銅箔及び銅張積層板 |
WO2016038923A1 (ja) * | 2014-09-09 | 2016-03-17 | 古河電気工業株式会社 | プリント配線板用銅箔及び銅張積層板 |
CN109839347A (zh) * | 2019-04-10 | 2019-06-04 | 珠海市永刚塑料制品有限公司 | 一种汽车饰件产品处理用的耐腐蚀测试工艺 |
CN111129194A (zh) * | 2019-12-23 | 2020-05-08 | 浙江正泰太阳能科技有限公司 | 一种黑色汇流条及其制作方法、全黑光伏组件 |
CN113438805A (zh) * | 2021-07-06 | 2021-09-24 | 昆山联滔电子有限公司 | 用于柔性天线的铜箔基板及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1440234A (zh) * | 2002-02-21 | 2003-09-03 | 大日本印刷株式会社 | 电磁波屏蔽片及其制造方法 |
CN1922947A (zh) * | 2004-02-17 | 2007-02-28 | 日矿金属株式会社 | 具有黑化处理表面或层的铜箔 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2608014B2 (ja) * | 1992-11-17 | 1997-05-07 | 悦 ▲柳▼平 | 塗装方法 |
JP2002341783A (ja) * | 2001-05-18 | 2002-11-29 | Shuho:Kk | 電子画像表示装置におけるディスプレーフィルタ |
JP4311991B2 (ja) * | 2003-06-30 | 2009-08-12 | 長島鋳物株式会社 | 地下構造物用カラー鉄蓋 |
JP2009004423A (ja) * | 2007-06-19 | 2009-01-08 | Hitachi Cable Ltd | キャリア箔付き銅箔 |
JP4941204B2 (ja) * | 2007-09-27 | 2012-05-30 | 日立電線株式会社 | プリント配線板用銅箔及びその表面処理方法 |
JP4978456B2 (ja) * | 2007-12-19 | 2012-07-18 | 日立電線株式会社 | 印刷回路用銅箔 |
-
2009
- 2009-08-20 JP JP2009191169A patent/JP5115527B2/ja active Active
-
2010
- 2010-07-09 KR KR1020100066092A patent/KR20110019699A/ko not_active Application Discontinuation
- 2010-08-12 TW TW099126930A patent/TWI428065B/zh active
- 2010-08-18 CN CN201010258177.3A patent/CN101998776B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1440234A (zh) * | 2002-02-21 | 2003-09-03 | 大日本印刷株式会社 | 电磁波屏蔽片及其制造方法 |
CN1922947A (zh) * | 2004-02-17 | 2007-02-28 | 日矿金属株式会社 | 具有黑化处理表面或层的铜箔 |
Non-Patent Citations (1)
Title |
---|
JP特开2002-341783A 2002.11.29 |
Also Published As
Publication number | Publication date |
---|---|
JP5115527B2 (ja) | 2013-01-09 |
JP2011044550A (ja) | 2011-03-03 |
TW201108883A (en) | 2011-03-01 |
TWI428065B (zh) | 2014-02-21 |
KR20110019699A (ko) | 2011-02-28 |
CN101998776A (zh) | 2011-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SH COPPER INDUSTRY CO., LTD. Free format text: FORMER OWNER: HITACHI CABLE CO., LTD. Effective date: 20130731 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20130731 Address after: Ibaraki Applicant after: Sh Copper Products Co Ltd Address before: Tokyo, Japan, Japan Applicant before: Hitachi Cable Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20151228 Address after: Taipei City, Taiwan, China Patentee after: Changchun Petrochemical Co., Ltd. Address before: Ibaraki Patentee before: Sh Copper Products Co Ltd |