KR20110019699A - 프린트 배선판용 동박 및 그 제조방법 - Google Patents

프린트 배선판용 동박 및 그 제조방법 Download PDF

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Publication number
KR20110019699A
KR20110019699A KR1020100066092A KR20100066092A KR20110019699A KR 20110019699 A KR20110019699 A KR 20110019699A KR 1020100066092 A KR1020100066092 A KR 1020100066092A KR 20100066092 A KR20100066092 A KR 20100066092A KR 20110019699 A KR20110019699 A KR 20110019699A
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KR
South Korea
Prior art keywords
copper foil
printed wiring
plating layer
wiring boards
cobalt
Prior art date
Application number
KR1020100066092A
Other languages
English (en)
Korean (ko)
Inventor
야스유키 이토
고지 누카가
Original Assignee
히타치 덴센 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 히타치 덴센 가부시키가이샤 filed Critical 히타치 덴센 가부시키가이샤
Publication of KR20110019699A publication Critical patent/KR20110019699A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
KR1020100066092A 2009-08-20 2010-07-09 프린트 배선판용 동박 및 그 제조방법 KR20110019699A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-191169 2009-08-20
JP2009191169A JP5115527B2 (ja) 2009-08-20 2009-08-20 プリント配線板用銅箔およびその製造方法

Publications (1)

Publication Number Publication Date
KR20110019699A true KR20110019699A (ko) 2011-02-28

Family

ID=43776961

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100066092A KR20110019699A (ko) 2009-08-20 2010-07-09 프린트 배선판용 동박 및 그 제조방법

Country Status (4)

Country Link
JP (1) JP5115527B2 (zh)
KR (1) KR20110019699A (zh)
CN (1) CN101998776B (zh)
TW (1) TWI428065B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013065727A1 (ja) * 2011-11-02 2013-05-10 Jx日鉱日石金属株式会社 印刷回路用銅箔
TWI497051B (zh) * 2012-09-14 2015-08-21 Jx Nippon Mining & Metals Corp An evaluation apparatus for a surface condition of a metallic material, a visibility evaluation apparatus for a transparent substrate, an evaluation program thereof, and a computer-readable recording medium on which a recording medium is recorded, and a method of detecting the same
JP5362924B1 (ja) 2012-11-09 2013-12-11 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板
JP5706026B1 (ja) * 2013-07-30 2015-04-22 古河電気工業株式会社 配線板用銅箔及び配線板
JP6393126B2 (ja) * 2013-10-04 2018-09-19 Ｊｘ金属株式会社 表面処理圧延銅箔、積層板、プリント配線板、電子機器及びプリント配線板の製造方法
JP6323261B2 (ja) * 2014-08-29 2018-05-16 住友金属鉱山株式会社 フレキシブル銅配線板の製造方法、及び、それに用いる支持フィルム付フレキシブル銅張積層板
KR101895256B1 (ko) * 2014-09-02 2018-09-05 미쓰이금속광업주식회사 흑색화 표면 처리 동박 및 캐리어박 부착 동박
CN106795644B (zh) * 2014-09-09 2019-10-01 古河电气工业株式会社 印刷配线板用铜箔及覆铜层压板
JP5877282B1 (ja) * 2014-09-09 2016-03-02 古河電気工業株式会社 プリント配線板用銅箔及び銅張積層板
CN109839347A (zh) * 2019-04-10 2019-06-04 珠海市永刚塑料制品有限公司 一种汽车饰件产品处理用的耐腐蚀测试工艺
CN111129194A (zh) * 2019-12-23 2020-05-08 浙江正泰太阳能科技有限公司 一种黑色汇流条及其制作方法、全黑光伏组件
CN113438805A (zh) * 2021-07-06 2021-09-24 昆山联滔电子有限公司 用于柔性天线的铜箔基板及其制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2608014B2 (ja) * 1992-11-17 1997-05-07 悦 ▲柳▼平 塗装方法
JP2002341783A (ja) * 2001-05-18 2002-11-29 Shuho:Kk 電子画像表示装置におけるディスプレーフィルタ
TW583688B (en) * 2002-02-21 2004-04-11 Dainippon Printing Co Ltd Electromagnetic shielding sheet and method of producing the same
JP4311991B2 (ja) * 2003-06-30 2009-08-12 長島鋳物株式会社 地下構造物用カラー鉄蓋
US7341796B2 (en) * 2004-02-17 2008-03-11 Nippon Mining & Metals Co., Ltd Copper foil having blackened surface or layer
JP2009004423A (ja) * 2007-06-19 2009-01-08 Hitachi Cable Ltd キャリア箔付き銅箔
JP4941204B2 (ja) * 2007-09-27 2012-05-30 日立電線株式会社 プリント配線板用銅箔及びその表面処理方法
JP4978456B2 (ja) * 2007-12-19 2012-07-18 日立電線株式会社 印刷回路用銅箔

Also Published As

Publication number Publication date
TW201108883A (en) 2011-03-01
TWI428065B (zh) 2014-02-21
JP5115527B2 (ja) 2013-01-09
JP2011044550A (ja) 2011-03-03
CN101998776B (zh) 2014-07-16
CN101998776A (zh) 2011-03-30

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