CN101971310B - 形成内嵌热解石墨的散热器的方法 - Google Patents

形成内嵌热解石墨的散热器的方法 Download PDF

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Publication number
CN101971310B
CN101971310B CN200880124085.7A CN200880124085A CN101971310B CN 101971310 B CN101971310 B CN 101971310B CN 200880124085 A CN200880124085 A CN 200880124085A CN 101971310 B CN101971310 B CN 101971310B
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CN
China
Prior art keywords
tpg
embedded
metal
mould
metal material
Prior art date
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Expired - Fee Related
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CN200880124085.7A
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English (en)
Chinese (zh)
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CN101971310A (zh
Inventor
D·S·斯拉顿
D·L·麦唐纳
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Abaco Systems Inc
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GE Fanuc Embedded Systems Inc
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Application filed by GE Fanuc Embedded Systems Inc filed Critical GE Fanuc Embedded Systems Inc
Publication of CN101971310A publication Critical patent/CN101971310A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
CN200880124085.7A 2007-12-31 2008-11-15 形成内嵌热解石墨的散热器的方法 Expired - Fee Related CN101971310B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/967,307 2007-12-31
US11/967,307 US20090169410A1 (en) 2007-12-31 2007-12-31 Method of forming a thermo pyrolytic graphite-embedded heatsink
PCT/US2008/083709 WO2009088565A2 (en) 2007-12-31 2008-11-15 Method of forming a thermo pyrolytic graphite-embedded heatsink

Publications (2)

Publication Number Publication Date
CN101971310A CN101971310A (zh) 2011-02-09
CN101971310B true CN101971310B (zh) 2013-09-25

Family

ID=40328462

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880124085.7A Expired - Fee Related CN101971310B (zh) 2007-12-31 2008-11-15 形成内嵌热解石墨的散热器的方法

Country Status (6)

Country Link
US (1) US20090169410A1 (cg-RX-API-DMAC7.html)
EP (1) EP2232540A2 (cg-RX-API-DMAC7.html)
JP (1) JP2011508447A (cg-RX-API-DMAC7.html)
KR (1) KR20100105641A (cg-RX-API-DMAC7.html)
CN (1) CN101971310B (cg-RX-API-DMAC7.html)
WO (1) WO2009088565A2 (cg-RX-API-DMAC7.html)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2965401B1 (fr) * 2010-09-29 2012-09-14 Valeo Systemes Thermiques Dispositif thermo electrique, notamment destine a générer un courant électrique dans un véhicule automobile.
US9064852B1 (en) * 2011-12-05 2015-06-23 The Peregrine Falcon Corporation Thermal pyrolytic graphite enhanced components
US8663537B2 (en) * 2012-05-18 2014-03-04 3M Innovative Properties Company Injection molding apparatus and method
US10028418B2 (en) 2015-01-20 2018-07-17 Microsoft Technology Licensing, Llc Metal encased graphite layer heat pipe
US10108017B2 (en) 2015-01-20 2018-10-23 Microsoft Technology Licensing, Llc Carbon nanoparticle infused optical mount
US9791704B2 (en) 2015-01-20 2017-10-17 Microsoft Technology Licensing, Llc Bonded multi-layer graphite heat pipe
US10444515B2 (en) 2015-01-20 2019-10-15 Microsoft Technology Licensing, Llc Convective optical mount structure
US20180112938A1 (en) * 2016-10-26 2018-04-26 Goodrich Aerospace Services Private Limited Die-cast bodies with thermal conductive inserts
JP7119671B2 (ja) * 2017-11-20 2022-08-17 三菱マテリアル株式会社 複合伝熱部材、及び複合伝熱部材の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040141291A1 (en) * 2003-01-21 2004-07-22 Chen Chao Ming High-efficiency heat sink and method for manufacturing the same
CN101060974A (zh) * 2004-09-17 2007-10-24 先进能源科技公司 夹层散热鳍片

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JPS61207534A (ja) * 1985-03-11 1986-09-13 Honda Motor Co Ltd 繊維強化金属材料の製造方法
FR2654387B1 (fr) * 1989-11-16 1992-04-10 Lorraine Carbone Materiau multicouche comprenant du graphite souple renforce mecaniquement, electriquement et thermiquement par un metal et procede de fabrication.
JPH03207549A (ja) * 1990-01-11 1991-09-10 Mitsubishi Motors Corp 消失模型鋳造法
JPH079079A (ja) * 1993-06-28 1995-01-13 Tsuchiyoshi:Kk 消失模型鋳造方法
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6215661B1 (en) * 1999-08-11 2001-04-10 Motorola, Inc. Heat spreader
JP2001259822A (ja) * 2000-03-16 2001-09-25 Tokyo Tekko Co Ltd 複合摺動部材の消失鋳造法
EP1187199A2 (de) * 2000-08-28 2002-03-13 Alcan Technology & Management AG Kühlkörper für Halbleiterbauelemente, Verfahren zu seiner Herstellung sowie Formwerkzeug dafür
US6469381B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
JP2003183792A (ja) * 2001-12-20 2003-07-03 Mitsubishi Electric Corp 熱伝導基材、及びその製造方法、並びに該熱伝導基材を有する半導体装置
ATE353729T1 (de) * 2002-08-20 2007-03-15 Ex One Corp Giessverfahren
US6898084B2 (en) * 2003-07-17 2005-05-24 The Bergquist Company Thermal diffusion apparatus
US7220485B2 (en) * 2003-09-19 2007-05-22 Momentive Performance Materials Inc. Bulk high thermal conductivity feedstock and method of making thereof
JP2005272164A (ja) * 2004-03-23 2005-10-06 Matsushita Electric Ind Co Ltd 高熱伝導性部材及びその製造方法、並びにそれを用いた放熱システム
US7025109B1 (en) * 2005-04-06 2006-04-11 Gm Global Technology Operations, Inc. Method and apparatus for controlling dispersion of molten metal in a mold cavity
US20070204972A1 (en) * 2006-03-01 2007-09-06 Sensis Corporation Method and apparatus for dissipating heat

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040141291A1 (en) * 2003-01-21 2004-07-22 Chen Chao Ming High-efficiency heat sink and method for manufacturing the same
CN101060974A (zh) * 2004-09-17 2007-10-24 先进能源科技公司 夹层散热鳍片

Also Published As

Publication number Publication date
KR20100105641A (ko) 2010-09-29
WO2009088565A2 (en) 2009-07-16
US20090169410A1 (en) 2009-07-02
WO2009088565A3 (en) 2009-11-26
JP2011508447A (ja) 2011-03-10
EP2232540A2 (en) 2010-09-29
CN101971310A (zh) 2011-02-09

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