CN101060974A - 夹层散热鳍片 - Google Patents
夹层散热鳍片 Download PDFInfo
- Publication number
- CN101060974A CN101060974A CNA2005800392609A CN200580039260A CN101060974A CN 101060974 A CN101060974 A CN 101060974A CN A2005800392609 A CNA2005800392609 A CN A2005800392609A CN 200580039260 A CN200580039260 A CN 200580039260A CN 101060974 A CN101060974 A CN 101060974A
- Authority
- CN
- China
- Prior art keywords
- graphite
- radiating fin
- acid
- goods
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D39/00—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12007—Component of composite having metal continuous phase interengaged with nonmetal continuous phase
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/943,791 US7393587B2 (en) | 2004-09-17 | 2004-09-17 | Sandwiched finstock |
US10/943,791 | 2004-09-17 | ||
PCT/US2005/031302 WO2006033808A2 (en) | 2004-09-17 | 2005-09-01 | Sandwiched finstock |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101060974A true CN101060974A (zh) | 2007-10-24 |
CN101060974B CN101060974B (zh) | 2012-01-25 |
Family
ID=36074409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800392609A Expired - Fee Related CN101060974B (zh) | 2004-09-17 | 2005-09-01 | 夹层散热鳍片 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7393587B2 (zh) |
EP (1) | EP1789217A4 (zh) |
KR (1) | KR101061262B1 (zh) |
CN (1) | CN101060974B (zh) |
CA (1) | CA2580625C (zh) |
WO (1) | WO2006033808A2 (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101971310A (zh) * | 2007-12-31 | 2011-02-09 | 通用电气智能平台嵌入系统公司 | 形成内嵌热解石墨的散热器的方法 |
CN103568389A (zh) * | 2012-07-26 | 2014-02-12 | 苏州沛德导热材料有限公司 | 一种石墨复合非金属材料 |
CN105120634A (zh) * | 2015-09-06 | 2015-12-02 | 张永锋 | 一种高导散热器 |
CN105882041A (zh) * | 2015-03-27 | 2016-08-24 | 东莞市闻誉实业有限公司 | 用于led散热器的复合材料 |
CN110213944A (zh) * | 2019-06-05 | 2019-09-06 | 湖南同能机电科技有限公司 | 一种吸水性金属片、散热方法及散热器 |
CN115682810A (zh) * | 2022-10-27 | 2023-02-03 | 常州富烯科技股份有限公司 | 石墨烯金属复合散热翅片、散热器、制备方法 |
CN115682810B (zh) * | 2022-10-27 | 2024-07-26 | 常州富烯科技股份有限公司 | 石墨烯金属复合散热翅片、散热器、制备方法 |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070053168A1 (en) * | 2004-01-21 | 2007-03-08 | General Electric Company | Advanced heat sinks and thermal spreaders |
US20060068205A1 (en) * | 2004-09-24 | 2006-03-30 | Carbone Lorraine Composants | Composite material used for manufacturing heat exchanger fins with high thermal conductivity |
WO2010096503A1 (en) * | 2009-02-17 | 2010-08-26 | Mcalister Technologies, Llc | Electrolytic cell and method of use thereof |
US20090101632A1 (en) * | 2005-02-17 | 2009-04-23 | David Naylor | Heating unit for direct current applications |
US20090302023A1 (en) * | 2008-05-12 | 2009-12-10 | Thomas Caterina | Heating unit for warming pallets of materials |
US10920379B2 (en) | 2005-02-17 | 2021-02-16 | Greenheat Ip Holdings Llc | Grounded modular heated cover |
US9392646B2 (en) | 2005-02-17 | 2016-07-12 | 417 And 7/8, Llc | Pallet warmer heating unit |
US20090107972A1 (en) * | 2005-02-17 | 2009-04-30 | David Naylor | Heating unit for warming propane tanks |
US20090107986A1 (en) * | 2005-02-17 | 2009-04-30 | David Naylor | Three layer glued laminate heating unit |
US20090107975A1 (en) * | 2005-02-17 | 2009-04-30 | Thomas Caterina | Heating unit for warming pallets |
US7880121B2 (en) * | 2005-02-17 | 2011-02-01 | David Naylor | Modular radiant heating apparatus |
US9945080B2 (en) * | 2005-02-17 | 2018-04-17 | Greenheat Ip Holdings, Llc | Grounded modular heated cover |
US20070262073A1 (en) * | 2005-09-01 | 2007-11-15 | David Naylor | Modular heated cover |
US20090114634A1 (en) | 2005-02-17 | 2009-05-07 | David Naylor | Heating unit for warming fluid conduits |
US8258443B2 (en) * | 2005-02-17 | 2012-09-04 | 417 And 7/8, Llc | Heating unit for warming pallets |
US8633425B2 (en) * | 2005-02-17 | 2014-01-21 | 417 And 7/8, Llc | Systems, methods, and devices for storing, heating, and dispensing fluid |
US20090114633A1 (en) * | 2005-02-17 | 2009-05-07 | David Naylor | Portable Pouch Heating Unit |
US20060225874A1 (en) * | 2005-04-11 | 2006-10-12 | Shives Gary D | Sandwiched thermal article |
US20060266496A1 (en) * | 2005-05-31 | 2006-11-30 | Sensis Corporation | Method and apparatus for dissipating heat |
KR20080006304A (ko) * | 2006-07-12 | 2008-01-16 | 삼성전자주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
JP5025328B2 (ja) * | 2007-05-16 | 2012-09-12 | 株式会社東芝 | 熱伝導体 |
US8051896B2 (en) * | 2007-07-31 | 2011-11-08 | Adc Telecommunications, Inc. | Apparatus for spreading heat over a finned surface |
US20090032218A1 (en) * | 2007-07-31 | 2009-02-05 | Adc Telecommunications, Inc. | Apparatus for transferring between two heat conducting surfaces |
US8235094B2 (en) * | 2007-07-31 | 2012-08-07 | Adc Telecommunications, Inc. | Apparatus for transferring heat in a fin of a heat sink |
KR101420802B1 (ko) * | 2008-01-17 | 2014-07-21 | 삼성전자주식회사 | 전자모듈용 방열구조체 및 이를 구비한 전자기기 |
US8570747B2 (en) * | 2008-12-04 | 2013-10-29 | Hewlett-Packard Development Company, L.P. | Carbon laminated enclosure |
TW201035513A (en) * | 2009-03-25 | 2010-10-01 | Wah Hong Ind Corp | Method for manufacturing heat dissipation interface device and product thereof |
US8955580B2 (en) * | 2009-08-14 | 2015-02-17 | Wah Hong Industrial Corp. | Use of a graphite heat-dissipation device including a plating metal layer |
US7903418B2 (en) | 2009-04-21 | 2011-03-08 | Hewlett-Packard Development Company, L.P. | Thermal mitigation device and method |
US8081468B2 (en) | 2009-06-17 | 2011-12-20 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
US20100321897A1 (en) * | 2009-06-17 | 2010-12-23 | Laird Technologies, Inc. | Compliant multilayered thermally-conductive interface assemblies |
US20120033384A1 (en) * | 2010-08-06 | 2012-02-09 | Pillai Unnikrishnan G | Graphite wrapped heat spreading pillow |
CN102555340B (zh) * | 2010-12-28 | 2015-08-19 | 碳元科技股份有限公司 | 一种高散热膜复合结构及其制造方法 |
US10347559B2 (en) | 2011-03-16 | 2019-07-09 | Momentive Performance Materials Inc. | High thermal conductivity/low coefficient of thermal expansion composites |
US20130327508A1 (en) * | 2012-06-07 | 2013-12-12 | Mark A. Zaffetti | Cold plate assembly incorporating thermal heat spreader |
JP6089598B2 (ja) * | 2012-11-01 | 2017-03-08 | 三菱電機株式会社 | 照明用ヒートシンク及び照明器具 |
US9338927B2 (en) * | 2013-05-02 | 2016-05-10 | Western Digital Technologies, Inc. | Thermal interface material pad and method of forming the same |
TWM467917U (zh) * | 2013-06-17 | 2013-12-11 | Giant Technology Co Ltd | 運用於電子罩蓋之多重散熱組件結構 |
WO2015026704A1 (en) * | 2013-08-21 | 2015-02-26 | Graftech International Holdings Inc. | Mechanically isolated thermal link |
US8861191B1 (en) | 2013-09-30 | 2014-10-14 | Google Inc. | Apparatus related to a structure of a base portion of a computing device |
US9430006B1 (en) | 2013-09-30 | 2016-08-30 | Google Inc. | Computing device with heat spreader |
US9700968B2 (en) | 2013-12-26 | 2017-07-11 | Terrella Energy Systems Ltd. | Apparatus and methods for processing exfoliated graphite materials |
US9706684B2 (en) | 2013-12-26 | 2017-07-11 | Terrella Energy Systems Ltd. | Exfoliated graphite materials and composite materials and devices for thermal management |
US9442514B1 (en) | 2014-07-23 | 2016-09-13 | Google Inc. | Graphite layer between carbon layers |
US20190032909A1 (en) * | 2015-11-20 | 2019-01-31 | Jnc Corporation | Radiator, electronic device, illumination device, and method for manufacturing radiator |
US11543188B2 (en) | 2016-06-15 | 2023-01-03 | Delta Electronics, Inc. | Temperature plate device |
US11306974B2 (en) * | 2016-06-15 | 2022-04-19 | Delta Electronics, Inc. | Temperature plate and heat dissipation device |
US20190244873A1 (en) * | 2016-10-14 | 2019-08-08 | Jason Davis | Flexible graphite ribbon heat sink for thermoelectric device |
JP2018093119A (ja) * | 2016-12-06 | 2018-06-14 | パナソニックIpマネジメント株式会社 | ヒートシンク |
US20180376618A1 (en) * | 2017-06-27 | 2018-12-27 | Joinset Co., Ltd. | Thermally conductive member |
JP2019096702A (ja) * | 2017-11-21 | 2019-06-20 | トヨタ自動車株式会社 | 冷却器 |
US11840013B2 (en) | 2018-02-27 | 2023-12-12 | Matthews International Corporation | Graphite materials and devices with surface micro-texturing |
IT201800005278A1 (it) * | 2018-05-11 | 2019-11-11 | Piste termiche. |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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GB991581A (en) | 1962-03-21 | 1965-05-12 | High Temperature Materials Inc | Expanded pyrolytic graphite and process for producing the same |
US4895713A (en) | 1987-08-31 | 1990-01-23 | Union Carbide Corporation | Intercalation of graphite |
FR2654387B1 (fr) * | 1989-11-16 | 1992-04-10 | Lorraine Carbone | Materiau multicouche comprenant du graphite souple renforce mecaniquement, electriquement et thermiquement par un metal et procede de fabrication. |
US4995451A (en) * | 1989-12-29 | 1991-02-26 | Digital Equipment Corporation | Evaporator having etched fiber nucleation sites and method of fabricating same |
US4961991A (en) * | 1990-01-29 | 1990-10-09 | Ucar Carbon Technology Corporation | Flexible graphite laminate |
US5972737A (en) * | 1993-04-14 | 1999-10-26 | Frank J. Polese | Heat-dissipating package for microcircuit devices and process for manufacture |
US5902762A (en) | 1997-04-04 | 1999-05-11 | Ucar Carbon Technology Corporation | Flexible graphite composite |
US6131651A (en) * | 1998-09-16 | 2000-10-17 | Advanced Ceramics Corporation | Flexible heat transfer device and method |
EP0971407B1 (en) | 1997-10-14 | 2004-07-21 | Matsushita Electric Industrial Co., Ltd. | Thermal conductive unit and thermal connection structure using same |
US6175495B1 (en) * | 1998-09-15 | 2001-01-16 | John Samuel Batchelder | Heat transfer apparatus |
US6245400B1 (en) | 1998-10-07 | 2001-06-12 | Ucar Graph-Tech Inc. | Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner |
US6075701A (en) | 1999-05-14 | 2000-06-13 | Hughes Electronics Corporation | Electronic structure having an embedded pyrolytic graphite heat sink material |
US6482520B1 (en) * | 2000-02-25 | 2002-11-19 | Jing Wen Tzeng | Thermal management system |
US6503626B1 (en) | 2000-02-25 | 2003-01-07 | Graftech Inc. | Graphite-based heat sink |
MXPA03006498A (es) | 2001-01-22 | 2003-10-15 | Parker Hannifin Corp | Entrecara termica de cambio de fase, de liberacion limpia. |
US6538892B2 (en) | 2001-05-02 | 2003-03-25 | Graftech Inc. | Radial finned heat sink |
US6777086B2 (en) * | 2001-08-31 | 2004-08-17 | Julian Norley | Laminates prepared from impregnated flexible graphite sheets |
US6758263B2 (en) * | 2001-12-13 | 2004-07-06 | Advanced Energy Technology Inc. | Heat dissipating component using high conducting inserts |
US6771502B2 (en) * | 2002-06-28 | 2004-08-03 | Advanced Energy Technology Inc. | Heat sink made from longer and shorter graphite sheets |
US6749010B2 (en) * | 2002-06-28 | 2004-06-15 | Advanced Energy Technology Inc. | Composite heat sink with metal base and graphite fins |
CN2620238Y (zh) * | 2003-01-17 | 2004-06-09 | 臧文斌 | 双头浮动列管式石墨换热器 |
TWI220467B (en) * | 2003-01-21 | 2004-08-21 | Jau-Ming Chen | High efficiency heat dissipation sheet and manufacturing method of the same |
-
2004
- 2004-09-17 US US10/943,791 patent/US7393587B2/en not_active Expired - Fee Related
-
2005
- 2005-09-01 CA CA2580625A patent/CA2580625C/en not_active Expired - Fee Related
- 2005-09-01 EP EP05793367A patent/EP1789217A4/en not_active Withdrawn
- 2005-09-01 WO PCT/US2005/031302 patent/WO2006033808A2/en active Application Filing
- 2005-09-01 KR KR1020077008733A patent/KR101061262B1/ko active IP Right Grant
- 2005-09-01 CN CN2005800392609A patent/CN101060974B/zh not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101971310A (zh) * | 2007-12-31 | 2011-02-09 | 通用电气智能平台嵌入系统公司 | 形成内嵌热解石墨的散热器的方法 |
CN101971310B (zh) * | 2007-12-31 | 2013-09-25 | 通用电气智能平台嵌入系统公司 | 形成内嵌热解石墨的散热器的方法 |
CN103568389A (zh) * | 2012-07-26 | 2014-02-12 | 苏州沛德导热材料有限公司 | 一种石墨复合非金属材料 |
CN105882041A (zh) * | 2015-03-27 | 2016-08-24 | 东莞市闻誉实业有限公司 | 用于led散热器的复合材料 |
CN105882041B (zh) * | 2015-03-27 | 2017-11-07 | 东莞市闻誉实业有限公司 | 用于led散热器的复合材料 |
CN105120634A (zh) * | 2015-09-06 | 2015-12-02 | 张永锋 | 一种高导散热器 |
CN105120634B (zh) * | 2015-09-06 | 2017-11-14 | 张永锋 | 一种高导散热器 |
CN110213944A (zh) * | 2019-06-05 | 2019-09-06 | 湖南同能机电科技有限公司 | 一种吸水性金属片、散热方法及散热器 |
CN115682810A (zh) * | 2022-10-27 | 2023-02-03 | 常州富烯科技股份有限公司 | 石墨烯金属复合散热翅片、散热器、制备方法 |
CN115682810B (zh) * | 2022-10-27 | 2024-07-26 | 常州富烯科技股份有限公司 | 石墨烯金属复合散热翅片、散热器、制备方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101061262B1 (ko) | 2011-08-31 |
WO2006033808A3 (en) | 2006-10-19 |
US20060063018A1 (en) | 2006-03-23 |
CN101060974B (zh) | 2012-01-25 |
CA2580625C (en) | 2013-08-06 |
EP1789217A2 (en) | 2007-05-30 |
EP1789217A4 (en) | 2008-06-25 |
KR20070051943A (ko) | 2007-05-18 |
WO2006033808A2 (en) | 2006-03-30 |
CA2580625A1 (en) | 2006-03-30 |
US7393587B2 (en) | 2008-07-01 |
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