CN101971098B - 使用极uv射线且具有包括吸气材料的挥发性有机化合物吸收构件的光刻设备 - Google Patents

使用极uv射线且具有包括吸气材料的挥发性有机化合物吸收构件的光刻设备 Download PDF

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Publication number
CN101971098B
CN101971098B CN200980103842.7A CN200980103842A CN101971098B CN 101971098 B CN101971098 B CN 101971098B CN 200980103842 A CN200980103842 A CN 200980103842A CN 101971098 B CN101971098 B CN 101971098B
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China
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equipment
organic compound
absorption component
gettering material
getter
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CN200980103842.7A
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Chinese (zh)
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CN101971098A (zh
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P·玛尼尼
A·孔特
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SAES Getters SpA
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SAES Getters SpA
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Priority to CN201310276167.6A priority Critical patent/CN103345127B/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electron Tubes For Measurement (AREA)
CN200980103842.7A 2008-02-22 2009-02-10 使用极uv射线且具有包括吸气材料的挥发性有机化合物吸收构件的光刻设备 Active CN101971098B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310276167.6A CN103345127B (zh) 2008-02-22 2009-02-10 使用极uv射线且具有包括吸气材料的挥发性有机化合物吸收构件的光刻设备

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITMI2008A000282 2008-02-22
IT000282A ITMI20080282A1 (it) 2008-02-22 2008-02-22 Apparato per litografia con radiazione nell'uv estremo con un elemento assorbitore di idrocarburi comprendente un materiale getter
PCT/EP2009/051516 WO2009103631A1 (en) 2008-02-22 2009-02-10 Lithography apparatus using extreme uv radiation and having a volatile organic compounds sorbing member comprising a getter material

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201310276167.6A Division CN103345127B (zh) 2008-02-22 2009-02-10 使用极uv射线且具有包括吸气材料的挥发性有机化合物吸收构件的光刻设备

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Publication Number Publication Date
CN101971098A CN101971098A (zh) 2011-02-09
CN101971098B true CN101971098B (zh) 2013-07-10

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CN200980103842.7A Active CN101971098B (zh) 2008-02-22 2009-02-10 使用极uv射线且具有包括吸气材料的挥发性有机化合物吸收构件的光刻设备
CN201310276167.6A Active CN103345127B (zh) 2008-02-22 2009-02-10 使用极uv射线且具有包括吸气材料的挥发性有机化合物吸收构件的光刻设备

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Country Status (10)

Country Link
US (1) US8399861B2 (https=)
EP (1) EP2255252B1 (https=)
JP (2) JP5411167B2 (https=)
KR (1) KR101429440B1 (https=)
CN (2) CN101971098B (https=)
AT (1) ATE514973T1 (https=)
CA (1) CA2711616A1 (https=)
IT (1) ITMI20080282A1 (https=)
TW (1) TW200951628A (https=)
WO (1) WO2009103631A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0696395B2 (ja) 1991-04-30 1994-11-30 工業技術院長 形状可変型多輪全方向移動ビークル
JP5315100B2 (ja) * 2009-03-18 2013-10-16 株式会社ニューフレアテクノロジー 描画装置
ITMI20121732A1 (it) 2012-10-15 2014-04-16 Getters Spa Pompa getter
TWI660125B (zh) * 2014-04-03 2019-05-21 義大利商沙斯格特斯公司 吸氣泵
DE102016213830B3 (de) * 2016-07-27 2017-12-07 Carl Zeiss Smt Gmbh Quell-Hohlkörper sowie EUV-Plasma-Lichtquelle mit einem derartigen Quell-Hohlkörper
KR20220076913A (ko) 2020-12-01 2022-06-08 포항공과대학교 산학협력단 나노 리소그래피 장치
CN113042160A (zh) * 2021-03-10 2021-06-29 南京华东电子真空材料有限公司 一种应用于极紫外设备的吸气剂及制备装置
DE102021205985A1 (de) * 2021-06-11 2022-12-15 Carl Zeiss Smt Gmbh Optische Anordnung für die EUV-Lithographie und Verfahren zum Regenerieren eines gasbindenden Bauteils
DE102022102478A1 (de) * 2022-02-02 2023-08-03 Asml Netherlands B.V. EUV-Lithographiesystem mit einem gasbindenden Bauteil
DE102023200375A1 (de) * 2023-01-18 2024-07-18 Carl Zeiss Smt Gmbh Vorrichtung und Verfahren zur Kontaminationsreduzierung in einem optischen System für die Mikrolithographie

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1174593A (zh) * 1994-12-02 1998-02-25 萨伊斯纯汽油有限公司 吸气泵组件及系统
CN1215799A (zh) * 1997-10-15 1999-05-05 工程吸气公司 高气体吸附速度的吸气泵
CN1989458A (zh) * 2004-07-22 2007-06-27 皇家飞利浦电子股份有限公司 具有清洁装置的光学系统

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US4969556A (en) * 1988-05-10 1990-11-13 Hajime Ishimaru Vacuum container
US5911560A (en) * 1994-10-31 1999-06-15 Saes Pure Gas, Inc. Getter pump module and system
IT237018Y1 (it) * 1995-07-10 2000-08-31 Getters Spa Pompa getter perfezionata in particolare per uno strumento dianalisi chimiche portatile
US6391090B1 (en) * 2001-04-02 2002-05-21 Aeronex, Inc. Method for purification of lens gases used in photolithography
JP2004053264A (ja) 2002-07-16 2004-02-19 Konica Minolta Holdings Inc 放射線像変換パネルおよび製造方法
JP2004214480A (ja) 2003-01-07 2004-07-29 Nikon Corp 露光装置
JP4613167B2 (ja) 2003-05-22 2011-01-12 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 少なくとも一つの光学要素を洗浄する方法および装置
SG112047A1 (en) 2003-11-11 2005-06-29 Asml Netherlands Bv Lithographic apparatus with contamination suppression, device manufacturing method, and device manufactured thereby
JP2005244016A (ja) * 2004-02-27 2005-09-08 Nikon Corp 露光装置、露光方法、及び微細パターンを有するデバイスの製造方法
US7868304B2 (en) * 2005-02-07 2011-01-11 Asml Netherlands B.V. Method for removal of deposition on an optical element, lithographic apparatus, device manufacturing method, and device manufactured thereby
JP2006245254A (ja) * 2005-03-03 2006-09-14 Nikon Corp 露光装置、露光方法、および微細パターンを有するデバイスの製造方法
JP2007018931A (ja) 2005-07-08 2007-01-25 Canon Inc 光源装置、露光装置及びデバイス製造方法
US7473908B2 (en) * 2006-07-14 2009-01-06 Asml Netherlands B.V. Getter and cleaning arrangement for a lithographic apparatus and method for cleaning a surface
DE102006036488A1 (de) 2006-08-04 2008-02-07 Carl Zeiss Smt Ag Optisches System, insbesondere Projektionsobjektiv in der Mikrolithographie
US20080050680A1 (en) * 2006-08-24 2008-02-28 Stefan Brandl Lithography systems and methods
US7959310B2 (en) * 2006-09-13 2011-06-14 Carl Zeiss Smt Gmbh Optical arrangement and EUV lithography device with at least one heated optical element, operating methods, and methods for cleaning as well as for providing an optical element
DE102006044591A1 (de) * 2006-09-19 2008-04-03 Carl Zeiss Smt Ag Optische Anordnung, insbesondere Projektionsbelichtungsanlage für die EUV-Lithographie, sowie reflektives optisches Element mit verminderter Kontamination
US7671348B2 (en) 2007-06-26 2010-03-02 Advanced Micro Devices, Inc. Hydrocarbon getter for lithographic exposure tools

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
CN1174593A (zh) * 1994-12-02 1998-02-25 萨伊斯纯汽油有限公司 吸气泵组件及系统
CN1215799A (zh) * 1997-10-15 1999-05-05 工程吸气公司 高气体吸附速度的吸气泵
CN1989458A (zh) * 2004-07-22 2007-06-27 皇家飞利浦电子股份有限公司 具有清洁装置的光学系统

Also Published As

Publication number Publication date
JP2011512684A (ja) 2011-04-21
JP5357356B2 (ja) 2013-12-04
JP5411167B2 (ja) 2014-02-12
CA2711616A1 (en) 2009-08-27
CN103345127A (zh) 2013-10-09
CN101971098A (zh) 2011-02-09
ITMI20080282A1 (it) 2009-08-23
EP2255252B1 (en) 2011-06-29
TW200951628A (en) 2009-12-16
WO2009103631A1 (en) 2009-08-27
CN103345127B (zh) 2016-01-20
US8399861B2 (en) 2013-03-19
EP2255252A1 (en) 2010-12-01
ATE514973T1 (de) 2011-07-15
KR101429440B1 (ko) 2014-08-12
US20100309446A1 (en) 2010-12-09
KR20100119568A (ko) 2010-11-09
JP2013165293A (ja) 2013-08-22

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