CN101960043A - 靶构造及靶构造的制造方法 - Google Patents

靶构造及靶构造的制造方法 Download PDF

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Publication number
CN101960043A
CN101960043A CN2010800012070A CN201080001207A CN101960043A CN 101960043 A CN101960043 A CN 101960043A CN 2010800012070 A CN2010800012070 A CN 2010800012070A CN 201080001207 A CN201080001207 A CN 201080001207A CN 101960043 A CN101960043 A CN 101960043A
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China
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target
fixed
flow path
fluid flow
fixing plate
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Pending
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CN2010800012070A
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English (en)
Chinese (zh)
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上野顺
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Individual
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Individual
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Publication of CN101960043A publication Critical patent/CN101960043A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CN2010800012070A 2009-01-22 2010-01-19 靶构造及靶构造的制造方法 Pending CN101960043A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009011919A JP4382867B1 (ja) 2009-01-22 2009-01-22 ターゲット構造及びターゲット構造の製造方法
JP2009-011919 2009-01-22
PCT/JP2010/050555 WO2010084857A1 (ja) 2009-01-22 2010-01-19 ターゲット構造及びターゲット構造の製造方法

Publications (1)

Publication Number Publication Date
CN101960043A true CN101960043A (zh) 2011-01-26

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ID=41549762

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800012070A Pending CN101960043A (zh) 2009-01-22 2010-01-19 靶构造及靶构造的制造方法

Country Status (5)

Country Link
JP (1) JP4382867B1 (enExample)
KR (1) KR101059940B1 (enExample)
CN (1) CN101960043A (enExample)
TW (1) TW201033388A (enExample)
WO (1) WO2010084857A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104588807A (zh) * 2013-10-31 2015-05-06 宁波江丰电子材料股份有限公司 背板的形成方法和背板
CN107851548A (zh) * 2015-07-24 2018-03-27 应用材料公司 热敏粘结的金属靶的冷却和利用优化
CN108018534A (zh) * 2017-12-12 2018-05-11 中国电子科技集团公司第四十八研究所 一种用于装夹靶材的磁控溅射镀膜装夹装置
CN110684951A (zh) * 2018-09-07 2020-01-14 住华科技股份有限公司 背板、使用其的溅射靶材及其使用方法
CN110828021A (zh) * 2019-11-04 2020-02-21 中国原子能科学研究院 一种用于医用同位素生产靶的水冷机构
CN112239852A (zh) * 2019-07-18 2021-01-19 东京毅力科创株式会社 靶结构和成膜装置
CN112323026A (zh) * 2020-10-29 2021-02-05 珠海和泽科技有限公司 靶材背板及其制作方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103080369B (zh) * 2010-07-23 2015-01-21 吉坤日矿日石金属株式会社 在靶的背面具有沟的磁性材料溅射靶
KR20130099194A (ko) * 2011-04-12 2013-09-05 가부시키가이샤 아루박 타겟 및 타겟의 제조 방법
KR101079621B1 (ko) * 2011-06-30 2011-11-03 박경일 타겟과 백킹 플레이트의 비접착식 체결구조
CN102501045B (zh) * 2011-10-20 2014-10-08 宁波江丰电子材料股份有限公司 镍靶材组件的加工方法及加工装置
WO2017083113A1 (en) * 2015-11-12 2017-05-18 Honeywell International Inc. Sputter target backing plate assemblies with cooling structures
CN111455335B (zh) * 2020-04-24 2022-10-21 河北恒博新材料科技股份有限公司 一种平面靶材的绑定方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59009549D1 (de) * 1989-06-05 1995-09-28 Balzers Hochvakuum Verfahren zum Kühlen von Targets sowie Kühleinrichtung für Targets.
JPH0625839A (ja) * 1992-01-10 1994-02-01 Sony Corp スパッタ装置及びカソード
JP3747447B2 (ja) * 1996-11-08 2006-02-22 ソニー株式会社 スパッタ装置
JP2000026962A (ja) * 1998-07-09 2000-01-25 Matsushita Electric Ind Co Ltd スパッタリング装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104588807A (zh) * 2013-10-31 2015-05-06 宁波江丰电子材料股份有限公司 背板的形成方法和背板
CN107851548A (zh) * 2015-07-24 2018-03-27 应用材料公司 热敏粘结的金属靶的冷却和利用优化
CN108018534A (zh) * 2017-12-12 2018-05-11 中国电子科技集团公司第四十八研究所 一种用于装夹靶材的磁控溅射镀膜装夹装置
CN108018534B (zh) * 2017-12-12 2020-12-11 中国电子科技集团公司第四十八研究所 一种用于装夹靶材的磁控溅射镀膜装夹装置
CN110684951A (zh) * 2018-09-07 2020-01-14 住华科技股份有限公司 背板、使用其的溅射靶材及其使用方法
CN112239852A (zh) * 2019-07-18 2021-01-19 东京毅力科创株式会社 靶结构和成膜装置
CN112239852B (zh) * 2019-07-18 2023-11-14 东京毅力科创株式会社 靶结构和成膜装置
CN110828021A (zh) * 2019-11-04 2020-02-21 中国原子能科学研究院 一种用于医用同位素生产靶的水冷机构
CN112323026A (zh) * 2020-10-29 2021-02-05 珠海和泽科技有限公司 靶材背板及其制作方法

Also Published As

Publication number Publication date
TWI359202B (enExample) 2012-03-01
JP2010168621A (ja) 2010-08-05
KR20100114923A (ko) 2010-10-26
JP4382867B1 (ja) 2009-12-16
KR101059940B1 (ko) 2011-08-29
WO2010084857A1 (ja) 2010-07-29
TW201033388A (en) 2010-09-16

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Application publication date: 20110126