CN101959947B - 硅氧烷组合物,硅氧烷粘合剂,涂布和层压的基底 - Google Patents

硅氧烷组合物,硅氧烷粘合剂,涂布和层压的基底 Download PDF

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Publication number
CN101959947B
CN101959947B CN200980107605.8A CN200980107605A CN101959947B CN 101959947 B CN101959947 B CN 101959947B CN 200980107605 A CN200980107605 A CN 200980107605A CN 101959947 B CN101959947 B CN 101959947B
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China
Prior art keywords
sio
silicone
silicon
silicone resin
bonded
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Expired - Fee Related
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CN200980107605.8A
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English (en)
Chinese (zh)
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CN101959947A (zh
Inventor
C·法尔班克
N·P·格里尔
朱弼忠
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Dow Silicones Corp
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Dow Corning Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing
    • Y10T428/31612—As silicone, silane or siloxane

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
CN200980107605.8A 2008-03-04 2009-02-23 硅氧烷组合物,硅氧烷粘合剂,涂布和层压的基底 Expired - Fee Related CN101959947B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3344108P 2008-03-04 2008-03-04
US61/033,441 2008-03-04
PCT/US2009/034812 WO2009111190A1 (en) 2008-03-04 2009-02-23 Silicone composition, silicone adhesive, coated and laminated substrates

Publications (2)

Publication Number Publication Date
CN101959947A CN101959947A (zh) 2011-01-26
CN101959947B true CN101959947B (zh) 2014-02-26

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CN200980107605.8A Expired - Fee Related CN101959947B (zh) 2008-03-04 2009-02-23 硅氧烷组合物,硅氧烷粘合剂,涂布和层压的基底

Country Status (6)

Country Link
US (1) US20120052309A1 (https=)
EP (1) EP2265666B1 (https=)
JP (1) JP2011517327A (https=)
KR (1) KR20100137441A (https=)
CN (1) CN101959947B (https=)
WO (1) WO2009111190A1 (https=)

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JP5640476B2 (ja) * 2010-06-08 2014-12-17 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び発光装置
KR101762348B1 (ko) * 2010-06-11 2017-07-27 가부시키가이샤 아데카 규소 함유 경화성 조성물, 그 규소 함유 경화성 조성물의 경화물 및 그 규소 함유 경화성 조성물로 형성되는 리드 프레임 기판
US8920931B2 (en) 2010-08-23 2014-12-30 Dow Corning Corporation Phosphosiloxane resins, and curable silicone compositions, free-standing films, and laminates comprising the phosphosiloxane resins
JP5760376B2 (ja) * 2010-10-22 2015-08-12 旭硝子株式会社 支持体、ガラス基板積層体、支持体付き表示装置用パネル、オルガノポリシロキサン組成物、および表示装置用パネルの製造方法
JP2014500897A (ja) 2010-11-09 2014-01-16 ダウ コーニング コーポレーション 有機リン酸化合物により可塑化されたヒドロシリル化硬化シリコーン樹脂
WO2013103330A2 (en) * 2010-12-22 2013-07-11 Dow Corning Corporation Silicone composition, silicone adhesive, coated and laminated substrates
FI127433B (fi) 2011-06-14 2018-05-31 Pibond Oy Menetelmä siloksaanimonomeerien syntetisoimiseksi sekä näiden käyttö
TW201412758A (zh) * 2012-07-19 2014-04-01 Hitachi Chemical Co Ltd 鈍化層形成用組成物、帶有鈍化層的半導體基板、帶有鈍化層的半導體基板的製造方法、太陽電池元件、太陽電池元件的製造方法以及太陽電池
CN102796488B (zh) * 2012-07-26 2014-08-20 深圳大学 耐高温绝缘胶粘剂
US20140127857A1 (en) * 2012-11-07 2014-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Carrier Wafers, Methods of Manufacture Thereof, and Packaging Methods
US10290531B2 (en) * 2013-04-30 2019-05-14 John Cleaon Moore Release layer for subsequent manufacture of flexible substrates in microelectronic applications
US9751989B2 (en) * 2015-12-22 2017-09-05 Shin-Etsu Chemical Co., Ltd. Condensation curable resin composition and semiconductor package
CN106739411A (zh) * 2016-11-17 2017-05-31 江苏铁锚玻璃股份有限公司 一种带硅氧表面涂层塑料板与玻璃板的粘接方法
KR102535446B1 (ko) * 2018-06-08 2023-05-22 엘켐 실리콘즈 상하이 컴퍼니 리미티드 경화성 실리콘 조성물
JP7172805B2 (ja) * 2019-04-02 2022-11-16 信越化学工業株式会社 付加硬化型シリコーン接着剤組成物
CN114269506B (zh) * 2019-08-05 2025-02-25 J·罗杰斯 具有可调电极接收器的惰性气体焊炬头
CN118480270A (zh) 2019-10-30 2024-08-13 瓦克化学股份公司 含硅酸的含cnt硅氧烷的配制品
CN113980614B (zh) * 2021-11-18 2023-04-28 江阴市江泰高分子新材料有限公司 一种高洁净度保护膜及其制备方法

Citations (2)

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US20010041252A1 (en) * 2000-03-06 2001-11-15 Laird Ronald E. Low-emissivity glass coatings having a layer of nitrided nichrome and methods of making same
CN1671823A (zh) * 2002-08-01 2005-09-21 陶瓷聚合体有限公司 耐火硅氧烷聚合物组合物

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JPS5950181B2 (ja) * 1979-03-07 1984-12-06 ト−レ・シリコ−ン株式会社 高温でセラミツク化するシリコ−ン組成物
JPH0781074B2 (ja) * 1990-07-06 1995-08-30 信越化学工業株式会社 発泡性シリコーンゴム組成物及び耐火性目地シール材ならびにその製造方法
JPH05254912A (ja) * 1992-03-10 1993-10-05 Sumitomo Electric Ind Ltd 耐火性組成物
JP3574226B2 (ja) * 1994-10-28 2004-10-06 東レ・ダウコーニング・シリコーン株式会社 硬化性シリコーン組成物およびその硬化物
US5880194A (en) * 1997-09-09 1999-03-09 Dow Corning Corporation Firewall sealant
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US6623864B1 (en) * 2003-01-13 2003-09-23 Dow Corning Corporation Silicone composition useful in flame retardant applications
JP2004361692A (ja) * 2003-04-07 2004-12-24 Dow Corning Asia Ltd 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
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KR100619352B1 (ko) * 2005-04-29 2006-09-06 삼성전기주식회사 개질된 환형 올레핀 공중합체를 이용한 섬유 직물 강화재,및 인쇄회로기판용 수지기판
JP2007246775A (ja) * 2006-03-17 2007-09-27 Nisshin Steel Co Ltd 耐熱塗料およびプレコート鋼板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010041252A1 (en) * 2000-03-06 2001-11-15 Laird Ronald E. Low-emissivity glass coatings having a layer of nitrided nichrome and methods of making same
CN1671823A (zh) * 2002-08-01 2005-09-21 陶瓷聚合体有限公司 耐火硅氧烷聚合物组合物

Also Published As

Publication number Publication date
WO2009111190A1 (en) 2009-09-11
US20120052309A1 (en) 2012-03-01
EP2265666A1 (en) 2010-12-29
JP2011517327A (ja) 2011-06-02
KR20100137441A (ko) 2010-12-30
CN101959947A (zh) 2011-01-26
EP2265666B1 (en) 2015-03-25

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