KR20100137441A - 실리콘 조성물, 실리콘 접착제, 피복된 기판 및 적층 기판 - Google Patents
실리콘 조성물, 실리콘 접착제, 피복된 기판 및 적층 기판 Download PDFInfo
- Publication number
- KR20100137441A KR20100137441A KR1020107019633A KR20107019633A KR20100137441A KR 20100137441 A KR20100137441 A KR 20100137441A KR 1020107019633 A KR1020107019633 A KR 1020107019633A KR 20107019633 A KR20107019633 A KR 20107019633A KR 20100137441 A KR20100137441 A KR 20100137441A
- Authority
- KR
- South Korea
- Prior art keywords
- silicone
- substrate
- silicone resin
- silicon
- groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31609—Particulate metal or metal compound-containing
- Y10T428/31612—As silicone, silane or siloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3344108P | 2008-03-04 | 2008-03-04 | |
| US61/033,441 | 2008-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20100137441A true KR20100137441A (ko) | 2010-12-30 |
Family
ID=40565115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107019633A Ceased KR20100137441A (ko) | 2008-03-04 | 2009-02-23 | 실리콘 조성물, 실리콘 접착제, 피복된 기판 및 적층 기판 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20120052309A1 (https=) |
| EP (1) | EP2265666B1 (https=) |
| JP (1) | JP2011517327A (https=) |
| KR (1) | KR20100137441A (https=) |
| CN (1) | CN101959947B (https=) |
| WO (1) | WO2009111190A1 (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5844798B2 (ja) * | 2010-04-28 | 2016-01-20 | スリーエム イノベイティブ プロパティズ カンパニー | ポリマーコーティングのためのナノシリカ系プライマーを含む物品及び方法 |
| JP5434954B2 (ja) * | 2010-05-07 | 2014-03-05 | 信越化学工業株式会社 | 剥離紙又は剥離フィルム用下塗りシリコーン組成物、並びに処理紙又は処理フィルム |
| JP5640476B2 (ja) * | 2010-06-08 | 2014-12-17 | 信越化学工業株式会社 | 光半導体素子封止用樹脂組成物及び発光装置 |
| US8809478B2 (en) * | 2010-06-11 | 2014-08-19 | Adeka Corporation | Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition |
| CN103068886A (zh) | 2010-08-23 | 2013-04-24 | 道康宁公司 | 磷硅氧烷树脂以及包含磷硅氧烷树脂的可固化有机硅组合物、自立式膜和层合物 |
| JP5760376B2 (ja) * | 2010-10-22 | 2015-08-12 | 旭硝子株式会社 | 支持体、ガラス基板積層体、支持体付き表示装置用パネル、オルガノポリシロキサン組成物、および表示装置用パネルの製造方法 |
| JP2014500897A (ja) | 2010-11-09 | 2014-01-16 | ダウ コーニング コーポレーション | 有機リン酸化合物により可塑化されたヒドロシリル化硬化シリコーン樹脂 |
| EP2655057A2 (en) * | 2010-12-22 | 2013-10-30 | Dow Corning Corporation | Silicone composition, silicone adhesive, coated and laminated substrates |
| FI127433B (fi) | 2011-06-14 | 2018-05-31 | Pibond Oy | Menetelmä siloksaanimonomeerien syntetisoimiseksi sekä näiden käyttö |
| CN104488089A (zh) * | 2012-07-19 | 2015-04-01 | 日立化成株式会社 | 钝化层形成用组合物、带钝化层的半导体基板、带钝化层的半导体基板的制造方法、太阳能电池元件、太阳能电池元件的制造方法及太阳能电池 |
| CN102796488B (zh) * | 2012-07-26 | 2014-08-20 | 深圳大学 | 耐高温绝缘胶粘剂 |
| US20140127857A1 (en) * | 2012-11-07 | 2014-05-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Carrier Wafers, Methods of Manufacture Thereof, and Packaging Methods |
| US10290531B2 (en) * | 2013-04-30 | 2019-05-14 | John Cleaon Moore | Release layer for subsequent manufacture of flexible substrates in microelectronic applications |
| US9751989B2 (en) * | 2015-12-22 | 2017-09-05 | Shin-Etsu Chemical Co., Ltd. | Condensation curable resin composition and semiconductor package |
| CN106739411A (zh) * | 2016-11-17 | 2017-05-31 | 江苏铁锚玻璃股份有限公司 | 一种带硅氧表面涂层塑料板与玻璃板的粘接方法 |
| US20210277237A1 (en) * | 2018-06-08 | 2021-09-09 | Elkem Silicones Shanghai Co., Ltd. | Curable silicone composition |
| JP7172805B2 (ja) * | 2019-04-02 | 2022-11-16 | 信越化学工業株式会社 | 付加硬化型シリコーン接着剤組成物 |
| JP7677641B2 (ja) * | 2019-08-05 | 2025-05-15 | ジェセ ロジャース, | 調整可能な電極受入部を持つ不活性ガス溶接トーチヘッド |
| JP7514921B2 (ja) | 2019-10-30 | 2024-07-11 | ワッカー ケミー アクチエンゲゼルシャフト | ケイ酸を含むcnt含有シロキサンの配合物 |
| CN113980614B (zh) * | 2021-11-18 | 2023-04-28 | 江阴市江泰高分子新材料有限公司 | 一种高洁净度保护膜及其制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4184995A (en) * | 1976-11-05 | 1980-01-22 | General Electric Company | Flame insulative silicone compositions |
| JPS5950181B2 (ja) * | 1979-03-07 | 1984-12-06 | ト−レ・シリコ−ン株式会社 | 高温でセラミツク化するシリコ−ン組成物 |
| JPH0781074B2 (ja) * | 1990-07-06 | 1995-08-30 | 信越化学工業株式会社 | 発泡性シリコーンゴム組成物及び耐火性目地シール材ならびにその製造方法 |
| JPH05254912A (ja) * | 1992-03-10 | 1993-10-05 | Sumitomo Electric Ind Ltd | 耐火性組成物 |
| JP3574226B2 (ja) * | 1994-10-28 | 2004-10-06 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性シリコーン組成物およびその硬化物 |
| US5880194A (en) * | 1997-09-09 | 1999-03-09 | Dow Corning Corporation | Firewall sealant |
| US5972512A (en) * | 1998-02-16 | 1999-10-26 | Dow Corning Corporation | Silicone resin composites for fire resistance applications and method for fabricating same |
| WO2001066483A1 (en) * | 2000-03-06 | 2001-09-13 | Guardian Industries, Inc. | Low-emissivity glass coatings having a layer of nitrided nichrome and methods of making same |
| CN1298809C (zh) * | 2002-08-01 | 2007-02-07 | 陶瓷聚合体有限公司 | 耐火硅氧烷聚合物组合物 |
| US6623864B1 (en) * | 2003-01-13 | 2003-09-23 | Dow Corning Corporation | Silicone composition useful in flame retardant applications |
| JP2004361692A (ja) * | 2003-04-07 | 2004-12-24 | Dow Corning Asia Ltd | 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法 |
| JP4908736B2 (ja) * | 2003-10-01 | 2012-04-04 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP2005171191A (ja) * | 2003-12-15 | 2005-06-30 | Fujikura Ltd | 耐火性シリコーン樹脂組成物および低圧耐火ケーブル |
| KR100619352B1 (ko) * | 2005-04-29 | 2006-09-06 | 삼성전기주식회사 | 개질된 환형 올레핀 공중합체를 이용한 섬유 직물 강화재,및 인쇄회로기판용 수지기판 |
| JP2007246775A (ja) * | 2006-03-17 | 2007-09-27 | Nisshin Steel Co Ltd | 耐熱塗料およびプレコート鋼板 |
-
2009
- 2009-02-23 CN CN200980107605.8A patent/CN101959947B/zh not_active Expired - Fee Related
- 2009-02-23 WO PCT/US2009/034812 patent/WO2009111190A1/en not_active Ceased
- 2009-02-23 KR KR1020107019633A patent/KR20100137441A/ko not_active Ceased
- 2009-02-23 JP JP2010549712A patent/JP2011517327A/ja active Pending
- 2009-02-23 EP EP20090718016 patent/EP2265666B1/en not_active Not-in-force
- 2009-02-23 US US12/867,894 patent/US20120052309A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009111190A1 (en) | 2009-09-11 |
| JP2011517327A (ja) | 2011-06-02 |
| EP2265666B1 (en) | 2015-03-25 |
| EP2265666A1 (en) | 2010-12-29 |
| US20120052309A1 (en) | 2012-03-01 |
| CN101959947A (zh) | 2011-01-26 |
| CN101959947B (zh) | 2014-02-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| A201 | Request for examination | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18 | Changes to party contact information recorded |
Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |