CN101910253B - 倍半硅氧烷树脂 - Google Patents

倍半硅氧烷树脂 Download PDF

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Publication number
CN101910253B
CN101910253B CN200880124813.4A CN200880124813A CN101910253B CN 101910253 B CN101910253 B CN 101910253B CN 200880124813 A CN200880124813 A CN 200880124813A CN 101910253 B CN101910253 B CN 101910253B
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CN
China
Prior art keywords
numerical value
composition
silsesquioxane resins
solvent
silsesquioxane
Prior art date
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CN200880124813.4A
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English (en)
Chinese (zh)
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CN101910253A (zh
Inventor
P-F·付
E·S·莫耶
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Dow Silicones Corp
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Dow Corning Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/111—Anti-reflection coatings using layers comprising organic materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0752—Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Silicon Polymers (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN200880124813.4A 2008-01-15 2008-11-18 倍半硅氧烷树脂 Active CN101910253B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US2109708P 2008-01-15 2008-01-15
US61/021,097 2008-01-15
PCT/US2008/083849 WO2009091440A1 (en) 2008-01-15 2008-11-18 Silsesquioxane resins

Publications (2)

Publication Number Publication Date
CN101910253A CN101910253A (zh) 2010-12-08
CN101910253B true CN101910253B (zh) 2013-04-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880124813.4A Active CN101910253B (zh) 2008-01-15 2008-11-18 倍半硅氧烷树脂

Country Status (7)

Country Link
US (1) US9023433B2 (cg-RX-API-DMAC7.html)
EP (1) EP2238198A4 (cg-RX-API-DMAC7.html)
JP (1) JP2011510133A (cg-RX-API-DMAC7.html)
KR (1) KR20100114075A (cg-RX-API-DMAC7.html)
CN (1) CN101910253B (cg-RX-API-DMAC7.html)
TW (1) TWI437048B (cg-RX-API-DMAC7.html)
WO (1) WO2009091440A1 (cg-RX-API-DMAC7.html)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5581224B2 (ja) * 2008-03-05 2014-08-27 ダウ・コーニング・コーポレイション シルセスキオキサン樹脂
CN102245722B (zh) 2008-12-10 2014-12-10 陶氏康宁公司 可转换的抗反射涂层
JP5662338B2 (ja) 2008-12-10 2015-01-28 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ シルセスキオキサン樹脂
CN102933626B (zh) * 2010-05-13 2015-01-28 日产化学工业株式会社 热固化性树脂组合物及显示器装置
CN101891893B (zh) * 2010-07-23 2012-01-04 深圳市安品有机硅材料有限公司 Led封装用苯基氢基硅树脂的制备方法
KR101957746B1 (ko) * 2011-03-29 2019-03-15 다우 실리콘즈 코포레이션 디바이스 제조에 사용하기 위한 광-패턴화가능하고 현상가능한 실세스퀴옥산 수지
KR101878016B1 (ko) * 2011-07-11 2018-07-12 가부시끼가이샤 도꾸야마 포토크로믹 경화성 조성물
WO2014099699A1 (en) * 2012-12-21 2014-06-26 3M Innovative Properties Company Curable silsesquioxane polymers, compositions, articles, and methods
US20140178698A1 (en) 2012-12-21 2014-06-26 3M Innovative Properties Company Curable silsesquioxane polymers, compositions, articles, and methods
US8999625B2 (en) 2013-02-14 2015-04-07 International Business Machines Corporation Silicon-containing antireflective coatings including non-polymeric silsesquioxanes
KR101665308B1 (ko) * 2014-06-05 2016-10-13 한국과학기술연구원 양이온 경화성을 갖는 폴리에폭시계실세스퀴옥산 및 이를 이용한 고강도 필름
CN104356392B (zh) * 2014-11-07 2017-04-19 广州市白云化工实业有限公司 笼型枝状有机硅树脂及其制备方法和应用
TWI747956B (zh) 2016-09-30 2021-12-01 美商道康寧公司 橋接聚矽氧樹脂、膜、電子裝置及相關方法
TWI742160B (zh) 2016-09-30 2021-10-11 美商道康寧公司 橋接聚矽氧樹脂、膜、電子裝置及相關方法
WO2019022855A1 (en) * 2017-07-28 2019-01-31 Dow Silicones Corporation SILSESQUIOXANE COMPOSITION HAVING POSITIVE AND NEGATIVE PHOTORESIN CHARACTERISTICS
JP6999808B2 (ja) * 2018-06-06 2022-02-10 富士フイルム株式会社 組成物、ハードコートフィルム、ハードコートフィルムを備えた物品、及び画像表示装置
JP7263356B2 (ja) * 2018-07-27 2023-04-24 富士フイルム株式会社 ハードコートフィルム、ハードコートフィルムを備えた物品、及び画像表示装置
JP7119997B2 (ja) * 2018-12-28 2022-08-17 信越化学工業株式会社 感光性樹脂組成物、積層体、及びパターン形成方法
CN110452384B (zh) * 2019-08-30 2020-10-23 北京理工大学 一种笼型结构环氧基苯基硅倍半氧烷及其制备方法
CN111100463A (zh) * 2019-12-26 2020-05-05 广东盈骅新材料科技有限公司 环氧改性硅树脂组合物及其应用
WO2021225675A1 (en) 2020-05-07 2021-11-11 Dow Silicons Corporation Silicone hybrid pressure sensitive adhesive and methods for its preparation and use on uneven surfaces
EP4146761A1 (en) 2020-05-07 2023-03-15 Dow Silicones Corporation Silicone hybrid pressure sensitive adhesive and methods for its preparation and use in protective films for (opto)electronic device fabrication
WO2021225757A1 (en) 2020-05-07 2021-11-11 Dow Silicones Corporation (meth)acrylate functional silicone and methods for its preparation and use
CN116348567A (zh) 2020-09-22 2023-06-27 美国陶氏有机硅公司 可固化硅酮-(甲基)丙烯酸酯组合物以及其制备方法和用途

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1784471A (zh) * 2003-04-07 2006-06-07 陶氏康宁公司 用于透光组件的固化性有机聚硅氧烷树脂组合物,透光组件及其制造方法
CN1968992A (zh) * 2004-07-16 2007-05-23 陶氏康宁公司 辐射敏感的有机硅树脂组合物

Family Cites Families (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587138A (en) * 1984-11-09 1986-05-06 Intel Corporation MOS rear end processing
US5010159A (en) * 1989-09-01 1991-04-23 Dow Corning Corporation Process for the synthesis of soluble, condensed hydridosilicon resins containing low levels of silanol
US5100503A (en) * 1990-09-14 1992-03-31 Ncr Corporation Silica-based anti-reflective planarizing layer
US5210168A (en) * 1992-04-02 1993-05-11 Dow Corning Corporation Process for forming siloxane bonds
EP0568476B1 (en) * 1992-04-30 1995-10-11 International Business Machines Corporation Silicon-containing positive resist and method of using the same in thin film packaging technology
JPH0656560A (ja) 1992-08-10 1994-03-01 Sony Corp Ｓｏｇ組成物及びそれを用いた半導体装置の製造方法
US5412053A (en) * 1993-08-12 1995-05-02 The University Of Dayton Polymers containing alternating silsesquioxane and bridging group segments and process for their preparation
US5484867A (en) * 1993-08-12 1996-01-16 The University Of Dayton Process for preparation of polyhedral oligomeric silsesquioxanes and systhesis of polymers containing polyhedral oligomeric silsesqioxane group segments
US5441765A (en) * 1993-09-22 1995-08-15 Dow Corning Corporation Method of forming Si-O containing coatings
JP3499032B2 (ja) * 1995-02-02 2004-02-23 ダウ コーニング アジア株式会社 放射線硬化性組成物、その硬化方法及びパターン形成方法
JP3324360B2 (ja) * 1995-09-25 2002-09-17 信越化学工業株式会社 ポリシロキサン化合物及びポジ型レジスト材料
GB9521996D0 (en) * 1995-10-27 1996-01-03 Boc Group Plc Air separation
JPH09124794A (ja) * 1995-11-06 1997-05-13 Dow Corning Asia Ltd 有機光機能材を含有するポリシロキサン樹脂組成物及びそれから得られる透明な光機能素子
JP3192947B2 (ja) * 1995-11-16 2001-07-30 東京応化工業株式会社 シリカ系被膜形成用塗布液の製造方法
JPH09221630A (ja) 1996-02-13 1997-08-26 Showa Denko Kk 塗料組成物及びそれを用いて得られる塗膜
US6143855A (en) * 1997-04-21 2000-11-07 Alliedsignal Inc. Organohydridosiloxane resins with high organic content
US6057239A (en) * 1997-12-17 2000-05-02 Advanced Micro Devices, Inc. Dual damascene process using sacrificial spin-on materials
US6962727B2 (en) * 1998-03-20 2005-11-08 Honeywell International Inc. Organosiloxanes
US6344284B1 (en) * 1998-04-10 2002-02-05 Organic Display Technology Organic electroluminescent materials and devices made from such materials
US6156640A (en) * 1998-07-14 2000-12-05 United Microelectronics Corp. Damascene process with anti-reflection coating
US6087064A (en) * 1998-09-03 2000-07-11 International Business Machines Corporation Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method
US6177143B1 (en) * 1999-01-06 2001-01-23 Allied Signal Inc Electron beam treatment of siloxane resins
US6461955B1 (en) * 1999-04-29 2002-10-08 Texas Instruments Incorporated Yield improvement of dual damascene fabrication through oxide filling
US6281285B1 (en) * 1999-06-09 2001-08-28 Dow Corning Corporation Silicone resins and process for synthesis
US6509259B1 (en) * 1999-06-09 2003-01-21 Alliedsignal Inc. Process of using siloxane dielectric films in the integration of organic dielectric films in electronic devices
AU5600200A (en) * 1999-06-10 2001-01-02 Allied-Signal Inc. Spin-on-glass anti-reflective coatings for photolithography
WO2003044078A1 (en) 2001-11-15 2003-05-30 Honeywell International Inc. Anti-reflective coatings for photolithography and methods of preparation thereof
US6824879B2 (en) 1999-06-10 2004-11-30 Honeywell International Inc. Spin-on-glass anti-reflective coatings for photolithography
US6268457B1 (en) * 1999-06-10 2001-07-31 Allied Signal, Inc. Spin-on glass anti-reflective coatings for photolithography
US6890448B2 (en) * 1999-06-11 2005-05-10 Shipley Company, L.L.C. Antireflective hard mask compositions
WO2000077429A1 (en) 1999-06-15 2000-12-21 Ip.One Pty. Ltd. A non-return valve
US6329118B1 (en) * 1999-06-21 2001-12-11 Intel Corporation Method for patterning dual damascene interconnects using a sacrificial light absorbing material
US6982006B1 (en) * 1999-10-19 2006-01-03 Boyers David G Method and apparatus for treating a substrate with an ozone-solvent solution
US6359096B1 (en) * 1999-10-25 2002-03-19 Dow Corning Corporation Silicone resin compositions having good solution solubility and stability
KR100355604B1 (ko) * 1999-12-23 2002-10-12 주식회사 하이닉스반도체 난반사 방지막용 중합체와 그 제조방법
JP3795333B2 (ja) * 2000-03-30 2006-07-12 東京応化工業株式会社 反射防止膜形成用組成物
US6420084B1 (en) * 2000-06-23 2002-07-16 International Business Machines Corporation Mask-making using resist having SIO bond-containing polymer
US6420088B1 (en) * 2000-06-23 2002-07-16 International Business Machines Corporation Antireflective silicon-containing compositions as hardmask layer
US20030176614A1 (en) 2000-06-30 2003-09-18 Nigel Hacker Organohydridosiloxane resins with high organic content
US6368400B1 (en) * 2000-07-17 2002-04-09 Honeywell International Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography
JP4141625B2 (ja) * 2000-08-09 2008-08-27 東京応化工業株式会社 ポジ型レジスト組成物およびそのレジスト層を設けた基材
EP1197998A3 (en) * 2000-10-10 2005-12-21 Shipley Company LLC Antireflective porogens
EP1197511A1 (en) * 2000-10-10 2002-04-17 Shipley Company LLC Antireflective composition
JP3931951B2 (ja) 2001-03-13 2007-06-20 信越化学工業株式会社 高分子化合物、レジスト材料及びパターン形成方法
JP2002299441A (ja) * 2001-03-30 2002-10-11 Jsr Corp デュアルダマシン構造の形成方法
US6589711B1 (en) * 2001-04-04 2003-07-08 Advanced Micro Devices, Inc. Dual inlaid process using a bilayer resist
JP5225528B2 (ja) * 2001-05-30 2013-07-03 株式会社Ａｄｅｋａ ケイ素含有重合体の製造方法
JP2003025510A (ja) * 2001-07-16 2003-01-29 Shin Etsu Chem Co Ltd 反射防止性及び耐擦傷性を有する多層積層体
US6746530B2 (en) * 2001-08-02 2004-06-08 Chunghwa Pictures Tubes, Ltd. High contrast, moisture resistant antistatic/antireflective coating for CRT display screen
US20030096090A1 (en) * 2001-10-22 2003-05-22 Boisvert Ronald Paul Etch-stop resins
EP1472574A4 (en) 2001-11-15 2005-06-08 Honeywell Int Inc ANTI-REFLECTIVE COATINGS DESIGNED TO BE INSTALLED BY ROTATION FOR PHOTOLITHOGRAPHY
KR100818678B1 (ko) 2001-11-16 2008-04-01 허니웰 인터내셔널 인코포레이티드 포토리소그라피용 스핀온 유리 반사 방지 피막
TW200307709A (en) * 2002-02-19 2003-12-16 Honeywell Int Inc Organosiloxanes
US6730454B2 (en) 2002-04-16 2004-05-04 International Business Machines Corporation Antireflective SiO-containing compositions for hardmask layer
US7294732B2 (en) * 2002-08-07 2007-11-13 Chisso Corporation Silicon compound
WO2004044025A2 (en) 2002-11-12 2004-05-27 Honeywell International Inc Anti-reflective coatings for photolithography and methods of preparation thereof
KR20050084283A (ko) * 2002-12-02 2005-08-26 토쿄오오카코교 가부시기가이샤 래더형 실리콘 공중합체
TW200505966A (en) 2003-04-02 2005-02-16 Dow Global Technologies Inc Organosilicate resin formulation for use in microelectronic devices
JP2004361692A (ja) * 2003-04-07 2004-12-24 Dow Corning Asia Ltd 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法
ATE377036T1 (de) 2003-05-23 2007-11-15 Dow Corning Siloxan-harz basierte anti- reflektionsbeschichtung mit hoher nassätzgeschwindigkeit
US7202013B2 (en) * 2003-06-03 2007-04-10 Shin-Etsu Chemical Co., Ltd. Antireflective film material, and antireflective film and pattern formation method using the same
WO2004113966A1 (ja) * 2003-06-18 2004-12-29 Asahi Kasei Kabushiki Kaisha 反射防止膜
WO2005005237A1 (en) 2003-07-02 2005-01-20 Keith Gilstrap Handlebar/stem mounted bicycle wheel holding device
WO2005035236A1 (en) 2003-09-15 2005-04-21 Sunco Products, Inc. Sheeting system
WO2005034236A1 (de) 2003-09-29 2005-04-14 Siemens Aktiengesellschaft Plastisch verformbarer kühlkörper für elektrische und/ oder elektronische bauelemente
KR20060131735A (ko) * 2003-10-07 2006-12-20 허니웰 인터내셔날 인코포레이티드 집적 회로 장치를 위한 코팅 및 하드 마스크 조성물, 생산방법 및 이들의 용도
SG119201A1 (en) 2003-10-13 2006-02-28 Sportiv Tech Lab Pte Ltd Utility garment
EP1724815B1 (en) * 2004-02-10 2012-06-13 Nikon Corporation Aligner, device manufacturing method, maintenance method and aligning method
US20060019468A1 (en) 2004-07-21 2006-01-26 Beatty John J Method of manufacturing a plurality of electronic assemblies
JP2006117867A (ja) * 2004-10-25 2006-05-11 Takemoto Oil & Fat Co Ltd 有機シリコーン微粒子、有機シリコーン微粒子の製造方法、高分子材料改質剤及び化粧品原料
US7756384B2 (en) * 2004-11-08 2010-07-13 Dow Corning Corporation Method for forming anti-reflective coating
US20060128163A1 (en) * 2004-12-14 2006-06-15 International Business Machines Corporation Surface treatment of post-rie-damaged p-osg and other damaged materials
US7833696B2 (en) * 2004-12-17 2010-11-16 Dow Corning Corporation Method for forming anti-reflective coating
ATE486098T1 (de) 2004-12-17 2010-11-15 Dow Corning Siloxanharzbeschichtung
WO2006065320A1 (en) 2004-12-17 2006-06-22 Dow Corning Corporation Method for forming anti-reflective coating
JP4995096B2 (ja) * 2004-12-17 2012-08-08 ダウ・コーニング・コーポレイション 反射防止膜の形成方法、レジスト画像の形成方法、パターンの形成方法、電子デバイスの製造方法及びａｒｃ組成物
EP1989593A2 (en) * 2006-02-13 2008-11-12 Dow Corning Corporation Antireflective coating material
WO2007094849A2 (en) 2006-02-13 2007-08-23 Dow Corning Corporation Antireflective coating material
US20070212886A1 (en) * 2006-03-13 2007-09-13 Dong Seon Uh Organosilane polymers, hardmask compositions including the same and methods of producing semiconductor devices using organosilane hardmask compositions
US20070298349A1 (en) 2006-06-22 2007-12-27 Ruzhi Zhang Antireflective Coating Compositions Comprising Siloxane Polymer
US7736837B2 (en) * 2007-02-20 2010-06-15 Az Electronic Materials Usa Corp. Antireflective coating composition based on silicon polymer
US20100093969A1 (en) * 2007-02-26 2010-04-15 Ruzhi Zhang Process for making siloxane polymers
WO2009088600A1 (en) 2008-01-08 2009-07-16 Dow Corning Toray Co., Ltd. Silsesquioxane resins
KR20100134578A (ko) 2008-03-04 2010-12-23 다우 코닝 코포레이션 실세스퀴옥산 수지
JP5581224B2 (ja) * 2008-03-05 2014-08-27 ダウ・コーニング・コーポレイション シルセスキオキサン樹脂
EP2376584B1 (en) * 2008-12-10 2014-07-16 Dow Corning Corporation Wet-etchable antireflective coatings
JP5662338B2 (ja) * 2008-12-10 2015-01-28 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ シルセスキオキサン樹脂
CN102245722B (zh) * 2008-12-10 2014-12-10 陶氏康宁公司 可转换的抗反射涂层

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1784471A (zh) * 2003-04-07 2006-06-07 陶氏康宁公司 用于透光组件的固化性有机聚硅氧烷树脂组合物,透光组件及其制造方法
CN1968992A (zh) * 2004-07-16 2007-05-23 陶氏康宁公司 辐射敏感的有机硅树脂组合物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2002-356617A 2002.12.13

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JP2011510133A (ja) 2011-03-31
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