CN101909786B - 银微粉、银油墨及银涂料以及它们的制造方法 - Google Patents

银微粉、银油墨及银涂料以及它们的制造方法 Download PDF

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CN101909786B
CN101909786B CN200880124131.3A CN200880124131A CN101909786B CN 101909786 B CN101909786 B CN 101909786B CN 200880124131 A CN200880124131 A CN 200880124131A CN 101909786 B CN101909786 B CN 101909786B
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silver
liquid
organic media
manufacture method
primary amine
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CN101909786A (zh
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佐滕王高
冈野卓
中野谷太郎
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Dowa Electronics Materials Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0545—Dispersions or suspensions of nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/88—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by thermal analysis data, e.g. TGA, DTA, DSC
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated

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  • Nanotechnology (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Paints Or Removers (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Insulated Conductors (AREA)
CN200880124131.3A 2008-01-06 2008-12-25 银微粉、银油墨及银涂料以及它们的制造方法 Expired - Fee Related CN101909786B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008000220A JP5371247B2 (ja) 2008-01-06 2008-01-06 銀塗料およびその製造法
JP2008-000220 2008-01-06
PCT/JP2008/073623 WO2009087918A1 (ja) 2008-01-06 2008-12-25 銀微粉、銀インクおよび銀塗料ならびにそれらの製造法

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CN101909786A CN101909786A (zh) 2010-12-08
CN101909786B true CN101909786B (zh) 2014-01-08

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US (1) US8916068B2 (enExample)
EP (1) EP2233230B1 (enExample)
JP (1) JP5371247B2 (enExample)
KR (1) KR101526233B1 (enExample)
CN (1) CN101909786B (enExample)
TW (1) TWI389751B (enExample)
WO (1) WO2009087918A1 (enExample)

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US8575059B1 (en) 2007-10-15 2013-11-05 SDCmaterials, Inc. Method and system for forming plug and play metal compound catalysts
JP5246096B2 (ja) * 2009-08-10 2013-07-24 日立電線株式会社 複合金属微粒子材料、金属膜及び金属膜の製造方法、並びにプリント配線板及び電線ケーブル
US9126191B2 (en) 2009-12-15 2015-09-08 SDCmaterials, Inc. Advanced catalysts for automotive applications
US8652992B2 (en) 2009-12-15 2014-02-18 SDCmaterials, Inc. Pinning and affixing nano-active material
DE112010004973T5 (de) * 2009-12-22 2013-02-28 Dic Corp. Leitpaste für Siebdruckverfahren
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US8673049B2 (en) 2010-08-27 2014-03-18 Dowa Electronics Materials Co., Ltd. Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same
JP5852360B2 (ja) * 2010-09-29 2016-02-03 トッパン・フォームズ株式会社 銀インク組成物
JP5623861B2 (ja) 2010-10-14 2014-11-12 株式会社東芝 金属ナノ粒子分散組成物
US8669202B2 (en) 2011-02-23 2014-03-11 SDCmaterials, Inc. Wet chemical and plasma methods of forming stable PtPd catalysts
US20120288697A1 (en) * 2011-05-13 2012-11-15 Xerox Corporation Coating methods using silver nanoparticles
JP2013079431A (ja) * 2011-10-05 2013-05-02 Nippon Synthetic Chem Ind Co Ltd:The 金属複合超微粒子の製造方法
JP2013079430A (ja) * 2011-10-05 2013-05-02 Nippon Synthetic Chem Ind Co Ltd:The 金属複合超微粒子の製造方法
EP2812139B1 (en) * 2012-02-10 2017-12-27 Lockheed Martin Corporation Nanoparticle paste formulations and methods for production and use thereof
JP5850784B2 (ja) * 2012-03-29 2016-02-03 Ｄｏｗａエレクトロニクス株式会社 ブースターアンテナおよびその製造方法
JP5991067B2 (ja) * 2012-08-02 2016-09-14 東ソー株式会社 耐溶剤性透明導電膜用塗工液及びこれよりなる耐溶剤性透明導電膜
CN102816462B (zh) * 2012-08-13 2014-04-16 中国科学院宁波材料技术与工程研究所 一种表面包覆着有机保护剂的纳米银颗粒的制备方法
WO2014030310A1 (ja) * 2012-08-23 2014-02-27 バンドー化学株式会社 導電性ペースト
CN108907178B (zh) * 2012-10-29 2020-12-15 阿尔法组装解决方案公司 烧结粉末
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CN103194117B (zh) * 2013-04-08 2014-12-03 电子科技大学 一种免烧结超细银纳米油墨的制备方法及其应用
CN103194118A (zh) * 2013-04-23 2013-07-10 电子科技大学 一种免烧结超细银纳米油墨的制备方法及其应用
JP6099472B2 (ja) * 2013-04-26 2017-03-22 Ｄｏｗａエレクトロニクス株式会社 金属ナノ粒子分散体、金属ナノ粒子分散体の製造方法および接合方法
CN105592921A (zh) 2013-07-25 2016-05-18 Sdc材料公司 用于催化转化器的洗涂层和经涂覆基底及其制造和使用方法
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WO2018180286A1 (ja) * 2017-03-31 2018-10-04 富士フイルム株式会社 金被覆銀平板状粒子、金被覆銀平板状粒子分散液及びその製造方法、塗布膜、並びに、反射防止光学部材
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US8916068B2 (en) 2014-12-23
EP2233230B1 (en) 2014-04-16
KR101526233B1 (ko) 2015-06-05
CN101909786A (zh) 2010-12-08
KR20100112555A (ko) 2010-10-19
JP5371247B2 (ja) 2013-12-18
JP2009161808A (ja) 2009-07-23
TWI389751B (zh) 2013-03-21
US20100283013A1 (en) 2010-11-11
WO2009087918A1 (ja) 2009-07-16
EP2233230A1 (en) 2010-09-29
TW200936276A (en) 2009-09-01
EP2233230A4 (en) 2012-02-01

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