CN101902875B - 多层布线基板 - Google Patents

多层布线基板 Download PDF

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Publication number
CN101902875B
CN101902875B CN201010188780.9A CN201010188780A CN101902875B CN 101902875 B CN101902875 B CN 101902875B CN 201010188780 A CN201010188780 A CN 201010188780A CN 101902875 B CN101902875 B CN 101902875B
Authority
CN
China
Prior art keywords
layer
substrate
fibre bundle
coefficient
linear expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010188780.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN101902875A (zh
Inventor
冈崎亨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN101902875A publication Critical patent/CN101902875A/zh
Application granted granted Critical
Publication of CN101902875B publication Critical patent/CN101902875B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3179—Woven fabric is characterized by a particular or differential weave other than fabric in which the strand denier or warp/weft pick count is specified
    • Y10T442/322—Warp differs from weft
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3179—Woven fabric is characterized by a particular or differential weave other than fabric in which the strand denier or warp/weft pick count is specified
    • Y10T442/322—Warp differs from weft
    • Y10T442/3228—Materials differ

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
CN201010188780.9A 2009-05-19 2010-05-18 多层布线基板 Expired - Fee Related CN101902875B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009120817A JP5497334B2 (ja) 2009-05-19 2009-05-19 多層配線基板
JP2009-120817 2009-05-19

Publications (2)

Publication Number Publication Date
CN101902875A CN101902875A (zh) 2010-12-01
CN101902875B true CN101902875B (zh) 2015-12-09

Family

ID=43123819

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010188780.9A Expired - Fee Related CN101902875B (zh) 2009-05-19 2010-05-18 多层布线基板

Country Status (3)

Country Link
US (1) US8344260B2 (enExample)
JP (1) JP5497334B2 (enExample)
CN (1) CN101902875B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8022310B2 (en) * 2007-08-23 2011-09-20 Panasonic Corporation Multilayer wiring board
JP5302635B2 (ja) * 2008-11-13 2013-10-02 パナソニック株式会社 多層配線基板
US20120090883A1 (en) * 2010-10-13 2012-04-19 Qualcomm Incorporated Method and Apparatus for Improving Substrate Warpage
US8502391B2 (en) * 2011-12-08 2013-08-06 Stats Chippac, Ltd. Semiconductor device and method of making single layer substrate with asymmetrical fibers and reduced warpage
CN104066265A (zh) * 2013-03-22 2014-09-24 叶云照 多层印刷电路板结构
JP2015023251A (ja) * 2013-07-23 2015-02-02 ソニー株式会社 多層配線基板およびその製造方法、並びに半導体製品
JP5934171B2 (ja) 2013-11-29 2016-06-15 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ インターボーザの厚さ決定方法、コンピュータプログラム、インターボーザおよびチップ実装構造体
JP6751910B2 (ja) * 2016-10-05 2020-09-09 パナソニックＩｐマネジメント株式会社 多層プリント配線板、多層プリント配線板の製造方法
KR102419891B1 (ko) * 2017-08-14 2022-07-13 삼성전자주식회사 회로 기판 및 이를 이용한 반도체 패키지
KR102206937B1 (ko) * 2017-11-03 2021-01-25 주식회사 네패스 반도체 패키지용 인터포저
CN108304963B (zh) * 2018-04-11 2022-03-11 惠州美锐电子科技有限公司 一种多层线路板的涨缩预测方法
EP3964824B1 (en) * 2020-09-02 2024-02-14 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Expansion coefficient determination with deformation measurement and simulation

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4513055A (en) * 1981-11-30 1985-04-23 Trw Inc. Controlled thermal expansion composite and printed circuit board embodying same
US4737672A (en) * 1986-01-16 1988-04-12 Sanyo Electric Co., Ltd. Hybrid integrated circuit magnetic substrate for motor or generator circuit
US5781264A (en) * 1995-03-24 1998-07-14 Shin-Kobe Electric Machinery Co., Ltd. Liquid crystal display device
US6492008B1 (en) * 1999-10-13 2002-12-10 Hitachi, Ltd. Multilayer printed wiring board and electronic equipment
CN101374391A (zh) * 2007-08-23 2009-02-25 松下电器产业株式会社 多层布线基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4414264A (en) * 1981-12-28 1983-11-08 Uop Inc. Chip carrier substrates of hybrid woven glass cloths
US4372347A (en) * 1981-12-28 1983-02-08 Uop Inc. Hybrid woven glass cloths
US5350621A (en) * 1992-11-30 1994-09-27 Allied-Signal Inc. System of electronic laminates with improved registration properties
JP3116341B2 (ja) * 1995-04-26 2000-12-11 新神戸電機株式会社 積層板および積層板基材用ガラス織布、ならびに積層板の使用法
JPH10121346A (ja) * 1996-10-15 1998-05-12 Sakai Composite Kk 土木建築構造物強化用織物及び土木建築構造物の施工方法
JP2000151035A (ja) 1998-11-18 2000-05-30 Toshiba Corp 配線基板とその製造方法
JP4113389B2 (ja) 2002-07-30 2008-07-09 富士フイルム株式会社 電子カメラ
CN100477891C (zh) 2003-01-16 2009-04-08 富士通株式会社 多层布线基板及其制造方法、纤维强化树脂基板制造方法
JP2005217029A (ja) 2004-01-28 2005-08-11 Kyocera Corp 配線基板
JP2007149870A (ja) 2005-11-25 2007-06-14 Denso Corp 回路基板及び回路基板の製造方法。
JP4907216B2 (ja) 2006-04-19 2012-03-28 三菱電機株式会社 プリント配線板及びプリント配線板の製造方法
JP4869007B2 (ja) 2006-09-28 2012-02-01 京セラ株式会社 プリント配線板
US8022310B2 (en) 2007-08-23 2011-09-20 Panasonic Corporation Multilayer wiring board
JP5302635B2 (ja) * 2008-11-13 2013-10-02 パナソニック株式会社 多層配線基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4513055A (en) * 1981-11-30 1985-04-23 Trw Inc. Controlled thermal expansion composite and printed circuit board embodying same
US4737672A (en) * 1986-01-16 1988-04-12 Sanyo Electric Co., Ltd. Hybrid integrated circuit magnetic substrate for motor or generator circuit
US5781264A (en) * 1995-03-24 1998-07-14 Shin-Kobe Electric Machinery Co., Ltd. Liquid crystal display device
US6492008B1 (en) * 1999-10-13 2002-12-10 Hitachi, Ltd. Multilayer printed wiring board and electronic equipment
CN101374391A (zh) * 2007-08-23 2009-02-25 松下电器产业株式会社 多层布线基板

Also Published As

Publication number Publication date
CN101902875A (zh) 2010-12-01
JP2010272570A (ja) 2010-12-02
US8344260B2 (en) 2013-01-01
JP5497334B2 (ja) 2014-05-21
US20100294554A1 (en) 2010-11-25

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20151231

Address after: Osaka Japan

Patentee after: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co.,Ltd.

Address before: Osaka Japan

Patentee before: Matsushita Electric Industrial Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151209