CN101894825A - 半导体封装 - Google Patents
半导体封装 Download PDFInfo
- Publication number
- CN101894825A CN101894825A CN2010101817327A CN201010181732A CN101894825A CN 101894825 A CN101894825 A CN 101894825A CN 2010101817327 A CN2010101817327 A CN 2010101817327A CN 201010181732 A CN201010181732 A CN 201010181732A CN 101894825 A CN101894825 A CN 101894825A
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- semiconductor chip
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- 238000004382 potting Methods 0.000 claims abstract description 50
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
本发明涉及半导体封装。半导体芯片和内插板通过导电性的粘接材相连接,并且在半导体芯片和内插板之间,形成有上述粘接材存在的涂敷区域和封装树脂存在的区域。根据上述,由于可增强上述半导体芯片和上述内插板之间的粘接力,使得强于现有的半导体封装的粘接力,因此在粘接界面不会发生剥离。从而,较之于现有的半导体封装,可提高电气特性和耐久性且可防止上述半导体芯片发生翘曲。
Description
技术领域
本发明涉及一种半导体封装。
背景技术
半导体封装具有其半导体芯片和内插板(interposer:中介基板)通过粘接材形成连接的结构。具体而言,通过导电性银浆(Ag paste:银膏)电连接内插板连接端子和半导体芯片的背面,其中,该内插板连接端子主要是经过镀金处理的端子。
图13是现有半导体封装101的说明图。图13(a)是现有半导体封装101的剖面图,图13(b)是现有半导体封装101的平面图。在半导体封装101中,在内插板102上所形成的经过镀金处理的内插板连接端子103与半导体芯片104的背面104′之间,通过导电性银浆105形成电连接。
使用封装树脂106对电连接后的半导体芯片104进行树脂封装时,为了确保封装树脂106和内插板102之间的粘接力,在内插板102上形成了阻焊层107。
如图13(b)的平面图所示,半导体封装101具有尺寸大致与半导体芯片104的轮廓近似相同的内插板连接端子103。为了便于进行说明,在图13(b)中省略了对封装树脂106以及阻焊层107的图示。为了使得搭载半导体芯片104之后的银浆105的形状尺寸大致等同于半导体芯片104,在考虑银浆的扩散的基础上,涂敷银浆105。
非专利文献1中揭示了一种现有半导体封装的半导体芯片的树脂粘接方式。
图26是现有的半导体封装132的剖面图。在半导体封装132中,通过粘接材(导电性粘接剂)137来连接在内插板133上形成的基板配线部134和在半导体芯片135的背面上形成的背面电极136。通过上述,实现半导体芯片135和内插板133之间的电连接。
图26中的半导体封装132是太阳能电池模块的情况下,半导体芯片135即为太阳能电池单元。另外,基板配线部134例如由铜形成,粘接材137例如是导电性银浆,背面电极136例如由烧结铝(burnedaluminum)形成。
非专利文献1:ISBN-88657-512-9,株式会社Triceps发行,1987年3月31日发行,“LSI装配技术”P.27~P.302.3树脂粘接方式
发明内容
(发明所要解决的课题)
但是,在图13的半导体封装101中,银浆105和半导体芯片104的背面104′之间的粘接性以及银浆105和内插板连接端子103之间的粘接性较低。因此,由于施加在半导体封装101上的机械应力(外部应力、内部应力)或物理应力(热应力),有时会导致银浆105和半导体芯片104的背面104′之间的粘接界面或者银浆105和内插板连接端子103之间的粘接界面发生局部剥离或者完全剥离。
另外,图13的半导体封装101具有由内插板102、银浆105、半导体芯片104以及封装树脂106等物理特性值不同的多种材料构成的层结构。因此,会出现与双金属同样的现象,半导体封装101易发生翘曲。在此,双金属是指粘接2种热膨胀率不同的金属板而成的材料,具有弯曲程度随着温度变化而变化的性质。
因此,半导体封装的课题在于防止发生粘接界面剥离所致的电气特性劣化、耐久性低下以及防止发生半导体芯片翘曲。
本发明是鉴于上述课题而开发的,其目的在于提供较之于现有的半导体封装能够提高电气特性以及耐久性并且可防止半导体芯片发生翘曲的半导体封装。
此外,对于图26所示的现有的太阳能电池模块用于小型便携式设备,除了高温潮湿的环境条件之外,使用中还可能遇到摔落或者负重等有外部负载作用的环境。因此,要求太阳能电池模块具有可适于上述环境条件的结构。
另外,图26中的背面电极136所使用的烧结铝具有多孔性(porous)。在使用烧结铝形成的背面电极136和银浆粘接材137之间的界面进行粘接时粘接强度较高,从而具有可适于上述环境条件的结构,在此基础上,还需要进一步要求提高耐久性。
本发明是鉴于上述课题而开发的,其目的在于提供比现有的半导体封装更具耐久性的半导体封装。
(解决上述课题的手段)
为了解决上述课题,本发明的半导体封装包括半导体芯片、用于搭载上述半导体芯片的内插板和在上述内插板上形成的封装树脂,并由该封装树脂包覆上述半导体芯片,该半导体封装的特征在于:上述半导体芯片和上述内插板通过导电性的粘接材相连接,在上述半导体芯片和上述内插板之间,形成有上述粘接材存在的第1区域和上述封装树脂存在的第2区域。
根据上述发明,通过在上述第2区域也充填上述封装树脂的结构,将粘接力较低的上述第1区域减小到最小,并且以粘接力较高的上述第2区域包围上述第1区域。由此,能够使得上述半导体芯片和上述内插板之间的粘接力高于现有的半导体封装,因此粘接界面不易发生剥离。从而,较之于现有的半导体封装,可提高电气特性和耐久性。
此外,通过向上述第2区域充填上述封装树脂,获得上述半导体芯片和上述内插板2之间夹有上述封装树脂的结构。根据上述,可防止上述半导体芯片发生翘曲。
为了解决上述课题,本发明的半导体封装包括半导体芯片、用于搭载上述半导体芯片的内插板和在上述内插板上形成的封装树脂,并由该封装树脂包覆上述半导体芯片,上述半导体封装的特征在于:在上述半导体芯片的与上述内插板相对的面上所形成的电极由包含第1金属的第1区域和包含第2金属的第2区域构成,上述内插板和上述电极之间通过包含有上述第1金属的、导电性的粘接材来形成电连接。
根据上述发明,导电性的粘接材包含第1金属。第1金属和包含第1金属的导电性粘接材之间的粘接强度高于第2金属和包含第1金属的导电性粘接材之间的粘接强度。因此,能使得上述电极和导电性粘接材之间的界面粘接强度比现有的电极和导电性粘接材之间的粘接强度更强,并能降低接触抵抗。从而,可提供比现有的半导体封装更具耐久性的半导体封装。
此外,由于第2金属具有多孔性,并且包含上述第1金属的导电性粘接材包含有机粘接剂,因此,具有降低施加在半导体封装上的应力的效果。
(发明的效果)
如上所述,本发明的半导体封装中,半导体芯片和内插板通过导电性粘接材相连接,在上述半导体芯片和上述内插板之间,形成有上述粘接材存在的第1区域和封装树脂存在的第2区域。
因此,较之于现有的半导体封装,本发明可提供提高了电气特性以及耐久性并且能够防止半导体芯片发生翘曲的半导体封装。
本发明的半导体封装如上所述,在半导体芯片的与内插板相对的面上所形成的电极由包含第1金属的第1区域和包含第2金属的第2区域构成,并且上述内插板和上述电极通过包含上述第1金属的导电性粘接材来形成电连接。
因此,能够提供比现有的半导体封装更具耐久性的半导体封装。
另外,由于第2金属具有多孔性并且含上述第1金属的导电性粘接材包含有机粘接剂,因此可取得降低施加在半导体封装上的应力的效果。
附图说明
图1是表示本发明的实施方式的半导体封装的说明图,(a)是本发明是实施方式的半导体封装的剖面图,(b)是本发明的实施方式的半导体封装的平面图。
图2是本发明的实施方式的半导体封装的其他平面图。
图3是本发明的实施方式的半导体封装的其他平面图。
图4是本发明的实施方式的半导体封装的其他平面图。
图5是本发明的实施方式的半导体封装的其他平面图。
图6是本发明的实施方式的半导体封装的其他平面图。
图7是本发明的实施方式的半导体封装的其他平面图。
图8是作为本发明的实施方式的半导体封装的一个例子的太阳能电池模块的说明图,(a)是表示作为本发明的实施方式的半导体封装的一个例子的太阳能电池模块表面的平面图,(b)是上述太阳能电池模块的侧视图,(c)是上述太阳能电池模块背面的平面图。
图9是本发明的实施方式的太阳能电池单元的说明图,(a)是表示本发明的实施方式的太阳能电池单元的斜视图,(b)是上述太阳能电池单元的B-B线剖面图,(c)是本发明的实施方式的太阳能电池模块所具备的电路的等效电路图。
图10是表示本发明的实施方式的太阳能电池模块的使用例的图,(a)是具备本发明的实施方式的太阳能电池模块的便携式电话在展开状态下的侧视图,(b)是上述便携式电话的俯视图,(c)是上述便携式电话在闭合状态下的侧视图,(d)是上述便携式电话的仰视图。
图11是本发明的实施方式中具有连接部的半导体封装的说明图,(a)是本发明的实施方式中具有连接部的半导体封装的A-A线剖面图,(b)是本发明的实施方式中具有连接部的半导体封装的平面图。
图12是表示搭载半导体芯片之前的内插板和内插板连接端子、阻焊层的平面图。
图13是现有的半导体封装的说明图,(a)是现有的半导体封装的剖面图,(b)是现有的半导体封装的平面图。
图14是本发明的实施方式的半导体封装的剖面图。
图15是本发明的实施方式的半导体芯片的说明图,(a)是从背侧观察本发明的实施方式的半导体芯片的平面图,(b)是(a)中的半导体芯片的A-A′线剖面图,(c)是(a)中的半导体芯片的B-B′线剖面图。
图16是从背侧观察本发明的实施方式的其他半导体芯片的平面图。
图17是从背侧观察本发明的实施方式的其他半导体芯片的平面图。
图18是从背侧观察本发明的实施方式的其他半导体芯片的平面图。
图19是从背侧观察本发明的实施方式的其他半导体芯片的平面图。
图20是从背侧观察本发明的实施方式的其他半导体芯片的平面图。
图21是从背侧观察本发明的实施方式的其他半导体芯片的平面图。
图22是从背侧观察本发明的实施方式的其他半导体芯片的平面图。
图23是从背侧观察本发明的实施方式的其他半导体芯片的平面图。
图24是从背侧观察本发明的实施方式的其他半导体芯片的平面图。
图25是从背侧观察本发明的实施方式的其他半导体芯片的平面图。
图26是现有的半导体封装的剖面图。
<附图标记说明>
1-半导体封装,2-内插板,3-内插板连接端子,4-半导体芯片,4′-背面,5-银浆(银膏、导电性粘接材),6-封装树脂,7-阻焊层,9-涂敷区域(第1区域),10-区域(第2区域),11-太阳能电池模块,12-太阳能电池单元,13-模块基板,14-安装电极,15-烧结材,16-连接部,17-p-层,18-铝,19-n+层,20-p+层,21-便携式电话,22-操作面,23-画面,24-铰链部,25-照相机,26-电池盖,27-芯片搭载区域,28-串联连接用外引线,29-引线键合用垫,30-阴极用转接孔,31-阳极用转接孔,I-电流源,L-负载,R1-电流等效电阻,R2-串联电阻,32-半导体封装,33-内插板,34-基板配线部,35-半导体芯片,36-背面电极(电极),36a-背面电极部(第1区域),36b-背面电极部(第2区域),36c-重叠部,37-粘接材,38-空隙,38a、38b-区域,39-封装树脂。
具体实施方式
以下,参照图1~图12说明本发明的一个实施方式。
图1是本发明的实施方式的半导体封装1的说明图。图1(a)是本发明的实施方式的半导体封装1的剖面图,图1(b)是本发明的实施方式半导体封装1的平面图。在半导体封装1中,在内插板2上形成的经过镀金处理的内插板连接端子3和半导体芯片4的背面4′通过导电性的银浆5(银浆、导电性的粘接材)形成电连接。
然后,使用封装树脂6对电连接后的半导体芯片4进行树脂封装,并且为确保封装树脂6和内插板2间的粘接力,在内插板2上形成阻焊层7。
如图1(b)的平面图所示,半导体封装1具有尺寸小于半导体芯片4的轮廓的内插板连接端子3。为了便于进行说明,在图1(b)中,省略了对封装树脂6以及阻焊层7的图示。
图1(b)的内插板连接端子3是一个短边与X方向平行、长边与Y方向平行的长方形。但是,如下述图2~图7所示,内插板连接端子3的位置、形状以及个数并不限于图1(b)所示的位置、形状以及个数。
图1(b)例示了银浆5的涂敷区域大致与内插板连接端子3的尺寸等同的情况。下述银浆5的涂敷区域9的轮廓,根据图1(a)所示的在内插板连接端子3和阻焊层7之间形成的槽8而定。
已知封装树脂6对于被粘接体的粘接力强于银浆5。如图1所示的具体例,半导体芯片4和封装树脂6之间的粘接力大于半导体芯片4和银浆5之间的粘接力。另外,封装树脂6和内插板2之间的粘接力大于银浆5和内插板2之间的粘接力。并且,封装树脂6和阻焊层7之间的粘接力大于银浆5和阻焊层7之间的粘接力。
利用如上所述的粘接力的相关特性,在半导体封装1中,实现了最小的内插板连接端子3的面积以及银浆5的涂敷区域(粘接区域)9。在银浆5的涂敷区域9上,银浆5与半导体芯片4的背面4′相粘接,并且银浆5与内插板连接端子3也粘接。
相反,如上所述,内插板连接端子3的尺寸小于半导体芯片4的轮廓。因此,如图1(a)所示,在半导体芯片4和阻焊层7之间形成未涂敷银浆5的区域10。区域10是图1(b)中以斜线表示的部分。在半导体封装1中,在该区域10也充填了封装树脂6,以提高粘接力。阻焊层7不仅用于形成槽8,还起到确保封装树脂6和内插板2之间的粘接力的作用。
在半导体封装1中,通过在区域10也充填封装树脂的结构,将粘接力较低的涂敷区域9减小到最小,并且用粘接力较高的区域10包围该涂敷区域9的周围。根据上述,能够使得半导体芯片4和内插板2之间的粘接力,即,半导体芯片4和阻焊层7之间的粘接力高于现有的半导体封装。因此,粘接界面不易发生剥离。从而,可提高电气特性以及耐久性。
另外,通过在区域10充填封装树脂6,获得在半导体芯片4和内插板2之间夹有封装树脂6的结构。根据上述,可防止半导体芯片4发生翘曲。
半导体封装1的制造方法是一种制造半导体封装1的制造方法,其中该半导体封装1包括半导体芯片4、用于搭载半导体芯片4的内插板2、在内插板2上的包覆半导体芯片4的封装树脂6,该半导体封装1的制造方法包括:向内插板2的用于搭载半导体芯片4的区域的涂敷区域9提供导电性粘接材的工序;在提供的上述粘接材上搭载半导体芯片4的工序;通过上述粘接材的硬化,使得内插板2和半导体芯片4相粘接的工序;使用转移成型加工法或者键合法或者印刷法提供封装树脂6,并且向用于搭载半导体芯片4的未供给上述粘接材的区域10也供给封装树脂6的工序。
接下来,参照图2~图7,说明半导体封装1的内插板2上的内插板连接端子3以及银浆5的涂敷区域9的例子。在图2~图7中,与图1同样,以斜线部分表示区域10,并省略了封装树脂6以及阻焊层7。
图2是本发明的实施方式的半导体封装1的其它平面图。图2的内插板连接端子3与图1(b)中的内插板连接端子3同样,是一个短边与X方向平行,长边与Y方向平行的长方形。图2和图1(b)的不同点在于银浆5的涂敷区域9的形状。图2的银浆5的涂敷区域9具有大致为I字形的形状,图2的内插板连接端子3完全在涂敷区域9的内侧。
图3是本发明的实施方式的半导体封装1的另一个平面图。图3的银浆5的涂敷区域9与图2的银浆5的涂敷区域9同样,具有大致为I字形的形状。图3和图2的不同点在于内插板连接端子3的形状。图3的内插板连接端子3具有在其长方形的连接端子的2个短边上分别连接有1个圆形的连接端子的形状。图3的内插板连接端子3也与图2的内插板连接端子3同样,完全在涂敷区域9的内侧。
图4是本发明的实施方式的半导体封装1的另一个平面图。图4的内插板连接端子3与图3的内插板连接端子3同样,具有在其长方形的连接端子的2个短边上分别连接有1个圆形的连接端子的形状。图4和图3的不同点在于银浆5的涂敷区域9的形状,1个半导体芯片4上共有3个长边与Y方向平行的长方形的涂敷区域9。
另外,图4的内插板连接端子3的以符号3′所示的部分超出了银浆5的涂敷区域9,并且与区域10同样,充填有封装树脂6。如上所述,在半导体芯片4和内插板连接端子3之间,可存在银浆5的涂敷区域9和充填有封装树脂6的区域两者。
图5是本发明的实施方式的半导体封装1的另一个平面图。在图5的半导体封装1中,对于1个半导体芯片4,存在有1个长边与Y方向平行的长方形内插板连接端子3以及4个圆形的内插板连接端子3。通过将长方形的内插板连接端子3配置在半导体芯片4的中央,并将圆形的内插板连接端子3配置于半导体芯片4的4个角部,使得内插板连接端子3成为I字形状的配置。
图6是本发明的实施方式的半导体封装1的另一个平面图。在图6的半导体封装1中,对于1个半导体芯片4,存在有9个圆形的内插板连接端子3。在半导体芯片4的中央,有1个圆形的内插板连接端子3,在其上下左右共有4个圆形的内插板连接端子3。并且,在半导体芯片4的4个角部也各有1个内插板连接端子3。9个圆形的内插板连接端子3分别具有圆形的银浆5的涂敷区域9。
图7是本发明的实施方式的半导体封装1的另一个平面图。图7的半导体芯片4与图6的半导体芯片4同样,有9个圆形的内插板连接端子3。图7与图6的不同点在于银浆5的涂敷区域9的形状,对于1个半导体芯片4,有3个长边与Y方向平行的长方形涂敷区域9。对于1个长方形的涂敷区域,连接有3个圆形的内插板连接端子3。
如上述图2~图7所示,通过适宜设定内插板连接端子3的位置、形状、个数以及银浆5的涂敷区域9的位置、形状、个数,便能够增强半导体芯片4和内插板2之间的粘接力,即,半导体芯片4和阻焊层7之间的粘接力,使得强于现有的半导体封装。因此,可防止发生粘接界面剥离,并提高电气特性以及耐久性。
另外,与图1(b)同样,通过向区域10充填封装树脂6,获得在半导体芯片4和阻焊层7之间夹有封装树脂6的结构。根据上述,可防止半导体芯片4发生翘曲。
图8是作为本发明的实施方式的半导体封装1的1个例子的太阳能电池模块11的说明图。图8(a)是表示作为本发明的实施方式的半导体封装1的1个例子的太阳能电池模块11表面的平面图。图8(b)是太阳能电池模块11的侧视图。图8(c)是表示太阳能电池模块11背面的平面图。
太阳能电池模块11具有10个太阳能电池单元12。在此,以沿着X方向排列5个、沿着Y方向排列2个的方式来配置太阳能电池单元12。与图1的半导体封装同样,在太阳能电池单元12和模块基板13之间形成有内插板连接端子3以及阻焊层7。另外,与图1的半导体封装同样,在太阳能电池单元12和模块基板13之间,形成有银浆5的涂敷区域(粘接区域)9以及未涂敷有银浆5的区域10。
如图8(c)所示,在太阳能电池模块11的背面上形成有安装电极14。在未图示的安装基板上安装太阳能电池模块11时,通过上述安装电极14与上述安装基板的电极形成电连接。
图9是本发明的实施方式的太阳能电池单元12的说明图。图9(a)是本发明的实施方式的太阳能电池单元12的斜视图。图9(b)是太阳能电池单元12的B-B线剖面图。图9(c)是本发明的太阳能电池模块11的电路的等效电路图。
如图9(a)的斜视图以及图9(b)的B-B线剖面图所示,太阳能电池单元12包括烧结材15、连接部16、由硅形成的p-层17、铝18、n+层19以及p+层20。使用铝的烧结材15和连接部16具有梳齿形结构,通过对连接部16进行引线键合,可使太阳能电池单元12和其它装置连接。其它装置中也包括太阳能电池单元12。
在图9(c)的等效电路图中,太阳能电池模块11包括电流源I、漏电流等效电阻R1、以二极管记号表示的10个串联太阳能电池单元12。
10个串联太阳能电池单元12的输入端、电流源的输出端、漏电流等效电阻R1的一端与太阳能电池模块11外部的负载L的一端相连接。负载L例如是电池。
负载L的另一端与串联电阻R2的一端相连接。串联电阻R2的另一端与10个串联太阳能电池单元12的输出端、电流源的输入端、漏电流等效电阻R1的另一端相连接。
图10是表示本发明的实施方式的太阳能电池模块11的使用例的图,是具有太阳能电池模块11的便携式电话21的图。图10(a)是展开状态下的便携式电话21的侧视图,图10(b)是便携式电话21的俯视图,图10(c)是闭合状态下的便携式电话21的侧视图,图10(d)是便携式电话21的仰视图。
如图10(a)所示,便携式电话21包括具备有按钮(未图示)的操作面22、画面23、铰链部24、照相部25、电池盖26和2个太阳能电池模块11。能以铰链部24为轴,展开和闭合便携式电话21。
在操作面22的背面上,配置有太阳能电池模块11以及电池盖26。可使用太阳能电池模块11,来对收容在电池盖26内侧的未图示的电池进行充电。在画面23的背侧,配置有太阳能电池模块11以及照相部25。
在图10中,在便携式电话21的上下两面设有太阳能电池模块11,但是本发明并不限定于此,也可只在上面或者下面设置。
图11是本发明的实施方式中具有连接部16的半导体封装1的说明图,图11(a)是本发明的实施方式中具有连接部16的半导体封装1的A-A线剖面图,图11(b)是本发明的实施方式中具有连接部16的半导体封装1的平面图。
在半导体封装1中,在半导体芯片4的表面,即,在半导体芯片4的与内插板2相对的面的背面上,设有用于电连接半导体芯片4和内插板2的连接部16,并通过引线键合来连接内插板2和连接部16。可在半导体芯片4的、形成有连接部16的部分的下部形成上述粘接材。
另外,作为半导体封装1的制造方法,可以在半导体芯片4的表面,即,半导体芯片的与内插板2相对的面的背面上,设置用于电连接半导体芯片4和内插板2的连接部16,并通过引线键合连接内插板2和连接部16,在半导体芯片4的、形成有连接部16的部分的下部附近形成上述粘接材,使得上述粘接材向半导体芯片4的短边方向扩散。
有时也采用引线键合法来电连接半导体芯片和内插板。此时,在半导体芯片的突出部分(半导体芯片和内插板之间的、未形成粘接材的部分,即,缝隙部分)的上部有连接部,对于该连接部进行引线键合时,由于进行引线键合时的荷重,会导致半导体芯片振动。因此,难以进行稳定的引线键合。上述现象随着上部的半导体芯片的薄层化而越为显著。如果半导体芯片过薄,进行引线键合时可能会造成半导体芯片破损。
为了解决上述课题,在半导体芯片的、形成有连接部的部分的下部,形成粘接材。根据上述,能够支持半导体芯片的突出部分。从而,能够抑制进行引线键合时由荷重所致的振动,可对半导体芯片的连接部和内插板进行稳定的引线键合。
在此,图12是表示半导体芯片4搭载前的内插板2、内插板连接端子3和阻焊层7的平面图。在图12中,搭载于芯片搭载区域27的中央部的I字形状的部件是内插板连接端子3,在内插板连接端子3的外侧形成有阻焊层7。
另外,在图12中以符号28表示的部件是在内插板2上形成的串联连接用引出线。另外,符号29所表示的部件是在内插板2上形成的引线键合用垫。此外,符号30所表示的部件是内插板2的背面上的用于连接安装电极14以及测试垫的阴极用转接孔。并且,符号31所表示的部件是内插板2的背面上的用于连接安装电极14以及测试垫的阳极用转接孔。
在半导体封装1以及半导体封装1的制造方法中,作为封装树脂6可使用透光的树脂。
另外,在半导体封装1以及半导体封装1的制造方法中,作为封装树脂6可使用环氧类树脂或者丙烯类树脂。
此外,在半导体封装1以及半导体封装1的制造方法中,半导体芯片4也可为太阳能电池单元12。
另外,在半导体封装1以及半导体封装1的制造方法中,作为上述粘接材可使用银浆5。
此外,在半导体封装1以及半导体封装1的制造方法中,太阳能电池单元12的厚度可在0.25毫米以下。
另外,在半导体封装1以及半导体封装1的制造方法中,上述太阳能电池单元上的封装树脂6的厚度T2除以上述太阳能电池单元12的厚度T1而获得的比T2/T1可以在1以上2以下。
此外,在半导体封装1以及半导体封装1的制造方法中,涂敷区域9的面积除以区域10的面积而获得的面积比可在1/4以上3/2以下。
接下来,参照图14~图25说明本发明的一个实施方式。
图14是本发明的实施方式的半导体封装32的剖面图。在半导体封装32中,在用于搭载半导体芯片35的内插板33上所形成的基板配线部34和在半导体芯片35的背面(与内插板33相对的面)上所形成的背面电极36之间,通过导电性粘接材37形成连接。通过上述,半导体芯片35和内插板33形成电连接。
图14中的半导体封装32为太阳能电池模块时,半导体芯片35即是太阳能电池单元。另外,基板配线部34例如由铜形成,粘接材37例如是导电性的银浆。并且,背面电极部36a例如由银(第1金属)形成,背面电极部36b例如由铝(第2金属)形成。
在图26的现有半导体封装132为太阳能电池单元的情况下,作为背面电极136只使用了具有多孔性的烧结铝。
相对而言,在本发明的实施方式的半导体封装32中,设有由银形成的背面电极部36a和由烧结铝形成的背面电极部36b,其中,银能够形成比烧结铝更精细的膜。且银和银浆之间的粘接强度高于铝和银浆之间的粘接强度,也高于烧结铝和银浆之间的粘接强度。因此,能够获得由烧结铝以及银构成的背面电极36和银浆粘接材37之间的较高的界面粘接强度,即,高于只由烧结铝构成的现有背面电极136和银浆粘接材137之间的界面粘接强度的强度,并且能够降低接触抵抗。从而,可提供比现有的半导体封装132更具耐久性的半导体封装32。
在图14的半导体封装32中,由于在半导体芯片35的周围充填有封装树脂39,因此,能够加强背面电极部36和粘接材37之间的界面粘接强度。在半导体封装32中,通过封装树脂39来防止半导体芯片35发生翘曲和减少施加于上述界面的应力的作用,还具备由银形成的背面电极部36a。因此,通过粘接材37粘接上述界面,可获得比现有的粘接界面更强的强度,从而可实现比现有的半导体封装更为优越的耐久性。
并且,例如由铝构成背面电极部36b相对具有多孔性,例如含有银的导电性粘接材37由于含有有机粘合剂,因此具有减小施加于半导体封装32上的应力的效果。
以下,参照图15~图25,说明半导体封装32的半导体芯片35的背面电极36的例子。
图15是本发明的实施方式的半导体芯片35的说明图。图15(a)是从背面观察本发明的实施方式的半导体芯片35时的平面图。图15(b)是图15(a)所示的半导体芯片35的A-A′线剖面图,图15(c)是图15(a)所示的半导体芯片35的B-B′线剖面图。
如图15(a)所示,在背面电极36中,背面电极部36a和下述重叠部36c形成大致I字形,在其周围形成有下述空隙38。并且,在空隙38的周围形成有背面电极部36b。
如图15(a)以及图15(b)所示,背面电极36可具有由背面电极部36a和背面电极部36b重叠而成的重叠部36c。不存在重叠部36c时,从背面电极36b通过导电性粘接材向内插板33传送光起电,形成电连接。在此种情况下,背面电极部36a也有利于提高与导电性粘接材37的粘接强度。另一方面,存在重叠部36c时,还形成从背面电极36b通过背面电极部36a、导电性粘接材向内插板传送光起电的电连接路径。
另外,如图15(a)以及图15(c)所示,背面电极36中,背面电极部36a和背面电极36b之间可有空隙38。在此,可以用导电性的银浆37来充填空隙38,也可以使得空隙38的一部分保持空隙状态。
图16是从背面观察本发明的实施方式的其他半导体芯片35的平面图。图16的半导体芯片35具有2个圆形的背面电极部36a。在圆形的背面电极部36a周围形成有环状的空隙38,在环状的空隙38的外侧形成有背面电极部36b。
图17是从背面观察本发明的实施方式的其他半导体芯片35的平面图。图17的半导体芯片35具有2个圆形的背面电极部36a。在圆形的背面电极部36a的周围形成有环状的重叠部36c,在环状的重叠部36c的外侧形成有背面电极部36b。
图18是从背面观察本发明的实施方式的其他半导体芯片35的平面图。在图18的半导体芯片35中,背面电极部36a具有在其长方形的电极部的两个短边上分别连接有1个圆形电极部的形状。在具有上述形状的背面电极部36a的周围形成有空隙38,在空隙38的外侧形成有背面电极部36b。
图19是从背面观察本发明的实施方式的其他半导体芯片35的平面图。在图19的半导体芯片35中,背面电极部36a具有在长方形的电极部的两个短边上分别连接有1个圆形电极部的形状。在具有上述形状的背面电极部36a的周围形成有重叠部36c,在重叠部36c的外侧形成有背面电极部36b。
图20是从背面观察本发明的实施方式的其他半导体芯片35的平面图。在图20的半导体芯片35中,背面电极部36a为长方形。例如,背面电极部36a是一个短边与背面电极36的短边相平行、长边与背面电极36的长边相平行的长方形。在具有上述形状的背面电极部36a的周围形成有空隙38,在空隙38的外侧形成有背面电极部36b。
另外,可使得背面电极部36a从图20所示的状态旋转90度。即,背面电极部36a可以是一个其短边与背面电极36的长边平行、其长边与背面电极36的短边平行的长方形。
图21是从背面观察本发明的实施方式的其他半导体芯片35的平面图。在图21的半导体芯片35中,背面电极部36a为长方形。例如,背面电极部36a是一个短边与背面电极36的短边相平行、长边与背面电极36的长边相平行长方形。在具有上述形状的背面电极部36a的周围,形成有重叠部36c,在重叠部36c的外侧形成有背面电极部36b。
另外,背面电极部36a可具有使其从图21所示的状态旋转90度的形状。即,背面电极部36a可以是一个其短边与背面电极36的长边平行、其长边与背面电极36的短边平行的长方形。
图22是从背面观察本发明的实施方式的其他半导体芯片35的平面图。在图22的半导体芯片35中,背面电极部36a具有在纵方向上连接3个“+”形的形状。图22中的纵方向是指背面电极36的长边的延伸方向。在背面电极36a的周围,形成有用于设置空隙38的区域38a和用于设置背面电极部36b的区域38b。此外,在背面电极部36a的周围,可以只形成区域38a,也可以只形成区域38b。即,在背面电极部36a的周围,可以只形成空隙38,也可以只形成背面电极部36b。
图23是从背面观察本发明的实施方式的其他半导体芯片35的平面图。在图23的半导体芯片35中,重叠部36c具有在纵方向上连接3个“+”形的形状。图23中的纵方向是指背面电极36的长边的延伸方向。在图23的半导体芯片35中,在重叠部36c内有背面电极部36a。在图23的半导体芯片35中,背面电极部36a是一个其短边与背面电极36的短边平行,其长边与背面电极36的长边平行的长方形。
图24是从背面观察本发明的实施方式的其他半导体芯片35的平面图。在图24的半导体芯片35中,背面电极36具有1个长边与该背面电极36的长边平行的长方形背面电极部36a和4个圆形的背面电极部36a。通过在背面电极36的中央,配置长方形的背面电极部36a,并在半导体芯片35的4个角,配置4个圆形的背面电极部36a,背面电极部36a形成大致的I字状。此外,在背面电极部36a的周围形成有空隙38,在空隙38的外侧形成有背面电极部36b。
图25是从背面观察本发明的实施方式的其他半导体芯片35的平面图。背面电极36具有1个长边与该背面电极36的长边平行的长方形背面电极部36a和4个圆形的背面电极部36a。通过在背面电极36的中央配置长方形的背面电极部36a,并在半导体芯片35的4个角,配置4个圆形的背面电极部36a,背面电极部36a形成大致的I字状。此外,在背面电极部36a的周围形成有重叠部36c,在重叠部36c的外侧形成有背面电极部36b。
另外,在半导体封装32中,背面电极部36a可小于背面电极部36b。
此外,在半导体封装32中,背面电极部36a的一部分不与背面电极部36b重叠。
此外,在半导体封装32中,背面电极部36a分布在半导体芯片35的中央部,背面电极部36b分布在半导体芯片35的周边部。
另外,在半导体封装32中,背面电极部36a可散布在半导体芯片35上,背面电极部36b可分布在半导体芯片35的周边部。
此外,在半导体封装32中,粘接材37的80%以上可存在于背面电极部36a上。
另外,在半导体封装32中,在半导体芯片35和内插板33之间,可形成有粘接材37存在的区域和封装树脂39存在的区域。
此外,在半导体封装32中,半导体芯片35可以是太阳能电池单元。
并且,与图15(a)以及图15(b)同样,图17、图19、图21、图23以及图25的半导体芯片35的背面电极36可具有重叠部36c。
(工业上的可利用性)
本发明的半导体封装以及半导体封装的制造方法,较之于现有的半导体封装,能够提高电气特性以及耐久性且可防止半导体芯片方式翘曲,因此,适用于易发生粘接界面剥离或者半导体芯片翘曲的半导体封装。
另外,本发明的半导体封装其耐久性优于现有的半导体封装,因此,可适用于小型的便携式设备。
Claims (20)
1.一种半导体封装,其包括半导体芯片、用于搭载上述半导体芯片的内插板和在上述内插板上形成的封装树脂,并由该封装树脂包覆上述半导体芯片,该半导体封装的特征在于:
上述半导体芯片和上述内插板通过导电性的粘接材相连接,
在上述半导体芯片和上述内插板之间,形成有上述粘接材存在的第1区域和上述封装树脂存在的第2区域。
2.根据权利要求1所述的半导体封装,其特征在于:
在上述半导体芯片的、与上述内插板相对的面的背面上,设有用于电连接上述半导体芯片和上述内插板的连接部,
上述内插板和上述连接部通过引线键合形成连接,
在上述半导体芯片的形成有上述连接部的部分的下部,形成有上述粘接材。
3.根据权利要求1所述的半导体封装,其特征在于:
上述封装树脂为透光的树脂。
4.根据权利要求3所述的半导体封装,其特征在于:
上述封装树脂为环氧类树脂或者丙烯类树脂。
5.根据权利要求1所述的半导体封装,其特征在于:
上述半导体芯片为太阳能电池单元。
6.根据权利要求1所述的半导体封装,其特征在于:
上述粘接材为银浆。
7.根据权利要求5所述的半导体封装,其特征在于:
上述太阳能电池单元的厚度为0.25毫米以下。
8.根据权利要求7所述的半导体封装,其特征在于:
上述太阳能电池单元上的上述封装树脂的厚度除以上述太阳能电池单元的厚度所获得的比值为1以上2以下。
9.根据权利要求1所述的半导体封装,其特征在于:
上述第1区域的面积除以上述第2区域的面积所获得的面积比为1/4以上3/2以下。
10.一种半导体封装,其包括半导体芯片、用于搭载上述半导体芯片的内插板和在上述内插板上形成的封装树脂,并由该封装树脂包覆上述半导体芯片,该半导体封装的特征在于:
在上述半导体芯片的与上述内插板相对的面上形成的电极由包含第1金属的第1区域和包含第2金属的第2区域构成,
上述内插板和上述电极之间通过导电性的粘接材来形成电连接,其中,该粘接材包含有上述第1金属。
11.根据权利要求10所述的半导体封装,其特征在于:
上述第1金属为银,上述第2金属为铝。
12.根据权利要求10所述的半导体封装,其特征在于:
上述第1金属为银,上述第2金属为烧结铝。
13.根据权利要求11所述的半导体封装,其特征在于:
包含有上述第1金属的导电性的粘接材为银浆。
14.根据权利要求10所述的半导体封装,其特征在于:
上述第1区域小于上述第2区域。
15.根据权利要求10所述的半导体封装,其特征在于:
上述第1区域的一部分与上述第2区域的一部分相重叠。
16.根据权利要求10所述的半导体封装,其特征在于:
上述第1区域分布在上述半导体芯片的中央部,上述第2区域分布在上述半导体芯片的周边部。
17.根据权利要求10所述的半导体封装,其特征在于:
上述第1区域散布在上述半导体芯片上,上述第2区域分布在上述半导体芯片的周边部。
18.根据权利要求10所述的半导体封装,其特征在于:
上述粘接材的80%以上存在于上述第1区域。
19.根据权利要求10所述的半导体封装,其特征在于:
在上述半导体芯片和上述内插板之间,形成有上述粘接材存在的区域和上述封装树脂存在的区域。
20.根据权利要求10所述的半导体封装,其特征在于:
上述半导体芯片为太阳能电池单元。
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