CN101877769B - 具有全域快门的图像传感器 - Google Patents
具有全域快门的图像传感器 Download PDFInfo
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- CN101877769B CN101877769B CN201010169638XA CN201010169638A CN101877769B CN 101877769 B CN101877769 B CN 101877769B CN 201010169638X A CN201010169638X A CN 201010169638XA CN 201010169638 A CN201010169638 A CN 201010169638A CN 101877769 B CN101877769 B CN 101877769B
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- 238000003860 storage Methods 0.000 claims abstract description 116
- 238000003384 imaging method Methods 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 33
- 230000004913 activation Effects 0.000 claims description 12
- 238000009792 diffusion process Methods 0.000 claims description 5
- 238000007667 floating Methods 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 abstract description 6
- 230000008569 process Effects 0.000 description 9
- 230000006870 function Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 230000009977 dual effect Effects 0.000 description 5
- 238000005070 sampling Methods 0.000 description 5
- 230000002596 correlated effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 230000006399 behavior Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- AZFKQCNGMSSWDS-UHFFFAOYSA-N MCPA-thioethyl Chemical compound CCSC(=O)COC1=CC=C(Cl)C=C1C AZFKQCNGMSSWDS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 208000004350 Strabismus Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 208000024754 bloodshot eye Diseases 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 201000005111 ocular hyperemia Diseases 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/53—Control of the integration time
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/433,598 US8089036B2 (en) | 2009-04-30 | 2009-04-30 | Image sensor with global shutter and in pixel storage transistor |
US12/433,598 | 2009-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101877769A CN101877769A (zh) | 2010-11-03 |
CN101877769B true CN101877769B (zh) | 2012-10-10 |
Family
ID=42663784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010169638XA Active CN101877769B (zh) | 2009-04-30 | 2010-04-30 | 具有全域快门的图像传感器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8089036B2 (zh) |
EP (1) | EP2247093B1 (zh) |
CN (1) | CN101877769B (zh) |
TW (1) | TWI422222B (zh) |
Cited By (1)
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CN105374832A (zh) * | 2014-08-07 | 2016-03-02 | 全视科技有限公司 | 用于飞行时间3d图像传感器的预充电经锁存像素单元 |
CN105374832B (zh) * | 2014-08-07 | 2018-08-24 | 豪威科技股份有限公司 | 用于飞行时间3d图像传感器的预充电经锁存像素单元 |
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TWI422222B (zh) | 2014-01-01 |
US20100276574A1 (en) | 2010-11-04 |
EP2247093A2 (en) | 2010-11-03 |
CN101877769A (zh) | 2010-11-03 |
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US8089036B2 (en) | 2012-01-03 |
EP2247093B1 (en) | 2016-08-10 |
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