CN101816221B - 电路连接材料、连接结构体及其制造方法 - Google Patents

电路连接材料、连接结构体及其制造方法 Download PDF

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Publication number
CN101816221B
CN101816221B CN2008801101981A CN200880110198A CN101816221B CN 101816221 B CN101816221 B CN 101816221B CN 2008801101981 A CN2008801101981 A CN 2008801101981A CN 200880110198 A CN200880110198 A CN 200880110198A CN 101816221 B CN101816221 B CN 101816221B
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China
Prior art keywords
circuit
substrate
circuit member
connection
connection material
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Expired - Fee Related
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CN2008801101981A
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English (en)
Chinese (zh)
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CN101816221A (zh
Inventor
广泽幸寿
久保田优
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Resonac Corp
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Hitachi Chemical Co Ltd
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Priority claimed from PCT/JP2008/067491 external-priority patent/WO2009044678A1/ja
Publication of CN101816221A publication Critical patent/CN101816221A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
CN2008801101981A 2007-10-05 2008-09-26 电路连接材料、连接结构体及其制造方法 Expired - Fee Related CN101816221B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007-261994 2007-10-05
JP2007261994 2007-10-05
JP2008-026731 2008-02-06
JP2008026731A JP4978493B2 (ja) 2007-10-05 2008-02-06 回路接続材料、接続構造体及びその製造方法
PCT/JP2008/067491 WO2009044678A1 (ja) 2007-10-05 2008-09-26 回路接続材料、接続構造体及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2011102225114A Division CN102382594A (zh) 2007-10-05 2008-09-26 粘结剂组合物的应用

Publications (2)

Publication Number Publication Date
CN101816221A CN101816221A (zh) 2010-08-25
CN101816221B true CN101816221B (zh) 2011-09-21

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN2008801101981A Expired - Fee Related CN101816221B (zh) 2007-10-05 2008-09-26 电路连接材料、连接结构体及其制造方法
CN2011102225114A Pending CN102382594A (zh) 2007-10-05 2008-09-26 粘结剂组合物的应用

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2011102225114A Pending CN102382594A (zh) 2007-10-05 2008-09-26 粘结剂组合物的应用

Country Status (3)

Country Link
JP (1) JP4978493B2 (https=)
KR (1) KR20090052303A (https=)
CN (2) CN101816221B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011062963A (ja) * 2009-09-18 2011-03-31 Canon Inc 液体吐出ヘッドの製造方法
CN102905473B (zh) * 2011-07-29 2017-06-06 富泰华工业（深圳）有限公司 电路板及电路板的制作方法
CN103079343B (zh) * 2011-10-26 2017-12-05 日立化成株式会社 电路零件
CN105144422B (zh) 2013-03-25 2019-05-10 大日本印刷株式会社 电池用包装材料
JP6425899B2 (ja) * 2014-03-11 2018-11-21 デクセリアルズ株式会社 異方性導電接着剤、接続体の製造方法及び電子部品の接続方法
CN107001865B (zh) * 2014-11-12 2020-08-21 迪睿合株式会社 光固化类各向异性导电粘接剂、连接体的制造方法及电子部件的连接方法
JP2017179128A (ja) * 2016-03-30 2017-10-05 Jnc株式会社 熱硬化性樹脂組成物の硬化物、硬化物を備えた基板および電子部品の製造方法
JP2017185086A (ja) * 2016-04-07 2017-10-12 オリンパス株式会社 医療機器および医療機器用熱硬化型接着剤
JP6428841B2 (ja) * 2017-04-26 2018-11-28 大日本印刷株式会社 電池用包装材料
JP7210845B2 (ja) * 2017-09-11 2023-01-24 株式会社レゾナック 接着剤フィルム収容セット及びその製造方法
CN109082262B (zh) * 2018-08-13 2020-11-03 广东泰强化工实业有限公司 一种基于CuS光热转换机理的红外快固化水性过机胶以及涂布方法
WO2024070436A1 (ja) * 2022-09-28 2024-04-04 綜研化学株式会社 異方導電性材料、異方導電性シートおよび異方導電性ペースト並びに接続構造体および接続構造体の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1551712A (zh) * 2003-05-19 2004-12-01 ���µ�����ҵ��ʽ���� 电子电路的连接结构及其连接方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4867069B2 (ja) * 2000-12-28 2012-02-01 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP4788038B2 (ja) * 2000-12-28 2011-10-05 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP2004160676A (ja) * 2002-11-08 2004-06-10 Hitachi Chem Co Ltd 近赤外線遮蔽性を有する電磁波シールド積層物及びその製造法
JP2005320491A (ja) * 2004-05-11 2005-11-17 Hitachi Chem Co Ltd 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法
JP2006199778A (ja) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
CN101213267A (zh) * 2005-05-10 2008-07-02 株式会社日本触媒 含有近红外线吸收剂的压敏粘合剂组合物
WO2007023834A1 (ja) * 2005-08-23 2007-03-01 Bridgestone Corporation 接着剤組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1551712A (zh) * 2003-05-19 2004-12-01 ���µ�����ҵ��ʽ���� 电子电路的连接结构及其连接方法

Also Published As

Publication number Publication date
CN101816221A (zh) 2010-08-25
JP2009105361A (ja) 2009-05-14
JP4978493B2 (ja) 2012-07-18
KR20090052303A (ko) 2009-05-25
CN102382594A (zh) 2012-03-21

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