KR20090052303A - 회로 접속 재료, 접속 구조체 및 그의 제조 방법 - Google Patents

회로 접속 재료, 접속 구조체 및 그의 제조 방법 Download PDF

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Publication number
KR20090052303A
KR20090052303A KR1020087029026A KR20087029026A KR20090052303A KR 20090052303 A KR20090052303 A KR 20090052303A KR 1020087029026 A KR1020087029026 A KR 1020087029026A KR 20087029026 A KR20087029026 A KR 20087029026A KR 20090052303 A KR20090052303 A KR 20090052303A
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KR
South Korea
Prior art keywords
circuit
connection material
circuit member
connection
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020087029026A
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English (en)
Korean (ko)
Inventor
유끼히사 히로사와
유 구보타
Original Assignee
히다치 가세고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히다치 가세고교 가부시끼가이샤 filed Critical 히다치 가세고교 가부시끼가이샤
Publication of KR20090052303A publication Critical patent/KR20090052303A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
KR1020087029026A 2007-10-05 2008-09-26 회로 접속 재료, 접속 구조체 및 그의 제조 방법 Ceased KR20090052303A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2007-261994 2007-10-05
JP2007261994 2007-10-05
JP2008026731A JP4978493B2 (ja) 2007-10-05 2008-02-06 回路接続材料、接続構造体及びその製造方法
JPJP-P-2008-026731 2008-02-06

Publications (1)

Publication Number Publication Date
KR20090052303A true KR20090052303A (ko) 2009-05-25

Family

ID=40706735

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087029026A Ceased KR20090052303A (ko) 2007-10-05 2008-09-26 회로 접속 재료, 접속 구조체 및 그의 제조 방법

Country Status (3)

Country Link
JP (1) JP4978493B2 (https=)
KR (1) KR20090052303A (https=)
CN (2) CN102382594A (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011062963A (ja) * 2009-09-18 2011-03-31 Canon Inc 液体吐出ヘッドの製造方法
CN102905473B (zh) * 2011-07-29 2017-06-06 富泰华工业（深圳）有限公司 电路板及电路板的制作方法
US9019714B2 (en) * 2011-10-26 2015-04-28 Hitachi Chemical Company, Ltd. Circuit component and method of making the same
EP2980881B1 (en) 2013-03-25 2018-10-24 Dai Nippon Printing Co., Ltd. Battery packaging material
JP6425899B2 (ja) * 2014-03-11 2018-11-21 デクセリアルズ株式会社 異方性導電接着剤、接続体の製造方法及び電子部品の接続方法
KR102031530B1 (ko) * 2014-11-12 2019-10-14 데쿠세리아루즈 가부시키가이샤 광 경화계 이방성 도전 접착제, 접속체의 제조 방법 및 전자 부품의 접속 방법
JP2017179128A (ja) * 2016-03-30 2017-10-05 Jnc株式会社 熱硬化性樹脂組成物の硬化物、硬化物を備えた基板および電子部品の製造方法
JP2017185086A (ja) * 2016-04-07 2017-10-12 オリンパス株式会社 医療機器および医療機器用熱硬化型接着剤
JP6428841B2 (ja) * 2017-04-26 2018-11-28 大日本印刷株式会社 電池用包装材料
CN111094486B (zh) * 2017-09-11 2022-10-04 昭和电工材料株式会社 粘接剂膜收纳组件及其制造方法
CN109082262B (zh) * 2018-08-13 2020-11-03 广东泰强化工实业有限公司 一种基于CuS光热转换机理的红外快固化水性过机胶以及涂布方法
WO2024070436A1 (ja) * 2022-09-28 2024-04-04 綜研化学株式会社 異方導電性材料、異方導電性シートおよび異方導電性ペースト並びに接続構造体および接続構造体の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4788038B2 (ja) * 2000-12-28 2011-10-05 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP4867069B2 (ja) * 2000-12-28 2012-02-01 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP2004160676A (ja) * 2002-11-08 2004-06-10 Hitachi Chem Co Ltd 近赤外線遮蔽性を有する電磁波シールド積層物及びその製造法
JP4389471B2 (ja) * 2003-05-19 2009-12-24 パナソニック株式会社 電子回路の接続構造とその接続方法
JP2005320491A (ja) * 2004-05-11 2005-11-17 Hitachi Chem Co Ltd 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法
JP2006199778A (ja) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
CN101213267A (zh) * 2005-05-10 2008-07-02 株式会社日本触媒 含有近红外线吸收剂的压敏粘合剂组合物
JPWO2007023834A1 (ja) * 2005-08-23 2009-02-26 株式会社ブリヂストン 接着剤組成物

Also Published As

Publication number Publication date
CN101816221A (zh) 2010-08-25
CN101816221B (zh) 2011-09-21
CN102382594A (zh) 2012-03-21
JP2009105361A (ja) 2009-05-14
JP4978493B2 (ja) 2012-07-18

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