CN101798432B - 固化性树脂组合物、以及使用其的印刷电路板和反射板 - Google Patents

固化性树脂组合物、以及使用其的印刷电路板和反射板 Download PDF

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Publication number
CN101798432B
CN101798432B CN2010101308295A CN201010130829A CN101798432B CN 101798432 B CN101798432 B CN 101798432B CN 2010101308295 A CN2010101308295 A CN 2010101308295A CN 201010130829 A CN201010130829 A CN 201010130829A CN 101798432 B CN101798432 B CN 101798432B
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China
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resin composition
curable resin
resin
methyl
mass parts
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Chinese (zh)
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CN101798432A (zh
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能坂麻美
大胡义和
宇敷滋
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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  • Materials For Photolithography (AREA)
  • Chemical & Material Sciences (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN2010101308295A 2009-03-31 2010-03-11 固化性树脂组合物、以及使用其的印刷电路板和反射板 Active CN101798432B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009085909A JP6054012B2 (ja) 2009-03-31 2009-03-31 硬化性樹脂組成物およびそれを用いたプリント配線板と反射板
JP2009-085909 2009-03-31

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CN101798432A CN101798432A (zh) 2010-08-11
CN101798432B true CN101798432B (zh) 2012-10-10

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JP (1) JP6054012B2 (ja)
KR (1) KR100987542B1 (ja)
CN (1) CN101798432B (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5147820B2 (ja) * 2009-12-24 2013-02-20 株式会社タムラ製作所 スプレー塗装用白色ソルダーレジスト組成物
JP2011248322A (ja) * 2010-04-26 2011-12-08 Sekisui Chem Co Ltd 感光性組成物、ソルダーレジスト組成物及び基板
JP5806492B2 (ja) * 2011-03-31 2015-11-10 太陽インキ製造株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5688129B1 (ja) * 2013-09-30 2015-03-25 太陽インキ製造株式会社 プリント配線板用硬化型組成物、これを用いた硬化塗膜及びプリント配線板
JP2016100182A (ja) * 2014-11-21 2016-05-30 スタンレー電気株式会社 表示装置
KR101685520B1 (ko) 2014-12-10 2016-12-12 고오 가가쿠고교 가부시키가이샤 액상 솔더 레지스트 조성물 및 피복 프린트 배선판
JP6321059B2 (ja) * 2015-02-18 2018-05-09 株式会社タムラ製作所 感光性樹脂組成物
CN106918988B (zh) * 2015-12-25 2021-04-20 太阳油墨（苏州）有限公司 固化性树脂组合物以及使用了其的反射膜和印刷电路板
WO2017135751A1 (ko) * 2016-02-05 2017-08-10 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
JP2018048268A (ja) * 2016-09-21 2018-03-29 日本ゼオン株式会社 塩化ビニル樹脂組成物、塩化ビニル樹脂成形体および積層体
KR20190043896A (ko) * 2017-10-19 2019-04-29 삼성전기주식회사 광경화성 및 열경화성 수지 조성물, 및 그 경화물

Citations (1)

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Publication number Priority date Publication date Assignee Title
CN101266398A (zh) * 2007-03-16 2008-09-17 北京传世唯信科技有限责任公司 用于背投屏幕的组合物及整体式背投屏幕的制备方法

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US5203916A (en) * 1992-04-10 1993-04-20 Kerr-Mcgee Chemical Corporation Titanium dioxide pigment and method of preparation
JP2000181058A (ja) 1998-12-18 2000-06-30 Hitachi Chem Co Ltd 感光性樹脂組成物
JP2005258460A (ja) * 1999-09-17 2005-09-22 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
CN100454142C (zh) 2000-03-29 2009-01-21 学校法人神奈川大学 光固化性和热固化性树脂组合物、其感光性干薄膜及使用其的图案形成方法
KR100845657B1 (ko) 2004-07-07 2008-07-10 다이요 잉키 세이조 가부시키가이샤 광 경화성·열 경화성 수지 조성물과 그것을 사용한 건식필름, 및 그의 경화물
JP2007332166A (ja) * 2004-09-29 2007-12-27 Taiyo Ink Mfg Ltd 光硬化性白色インク組成物
CN101410757A (zh) * 2006-03-29 2009-04-15 太阳油墨制造株式会社 光固化性热固化性树脂组合物及其固化物以及使用其所得到的印刷电路板
JP5066376B2 (ja) * 2007-02-27 2012-11-07 株式会社タムラ製作所 プリント配線板用のソルダーレジスト組成物およびプリント配線板
JP4994922B2 (ja) * 2007-04-06 2012-08-08 太陽ホールディングス株式会社 ソルダーレジスト組成物およびその硬化物
JP2009194222A (ja) * 2008-02-15 2009-08-27 Denki Kagaku Kogyo Kk 白色のアルカリ現像型光硬化性・熱硬化性ソルダーレジスト組成物、及びそれを用いた金属ベース回路基板
JP5089426B2 (ja) * 2008-02-15 2012-12-05 電気化学工業株式会社 アルカリ現像型光硬化性・熱硬化性ソルダーレジスト組成物およびそれを用いた金属ベース回路基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101266398A (zh) * 2007-03-16 2008-09-17 北京传世唯信科技有限责任公司 用于背投屏幕的组合物及整体式背投屏幕的制备方法

Also Published As

Publication number Publication date
KR20100109367A (ko) 2010-10-08
CN101798432A (zh) 2010-08-11
JP6054012B2 (ja) 2016-12-27
JP2010235798A (ja) 2010-10-21
KR100987542B1 (ko) 2010-10-12

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EE01 Entry into force of recordation of patent licensing contract

Assignee: Taiyo Ink Mfg.Co., Ltd.

Assignor: Taiyo Ink Manufacturing Co., Ltd.

Contract record no.: 2010990000679

Denomination of invention: Curable resin composition and printed circuit board and reflection board using same

License type: Common License

Open date: 20100811

Record date: 20100830

EC01 Cancellation of recordation of patent licensing contract

Assignee: Taiyo Ink Mfg.Co., Ltd.

Assignor: Taiyo Ink Manufacturing Co., Ltd.

Contract record no.: 2010990000679

Date of cancellation: 20110302

EE01 Entry into force of recordation of patent licensing contract

Assignee: Taiyo Ink Mfg.Co., Ltd.

Assignor: Taiyo Holding Co., Ltd.

Contract record no.: 2011990000116

Denomination of invention: Curable resin composition and printed circuit board and reflection board using same

License type: Common License

Open date: 20100811

Record date: 20110302

C14 Grant of patent or utility model
GR01 Patent grant