CN101790774B - 半导体晶圆在薄膜包衣中的重结晶以及有关工艺 - Google Patents

半导体晶圆在薄膜包衣中的重结晶以及有关工艺 Download PDF

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Publication number
CN101790774B
CN101790774B CN2008801047629A CN200880104762A CN101790774B CN 101790774 B CN101790774 B CN 101790774B CN 2008801047629 A CN2008801047629 A CN 2008801047629A CN 200880104762 A CN200880104762 A CN 200880104762A CN 101790774 B CN101790774 B CN 101790774B
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wafer
film
recrystallization
heating
original
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Chinese (zh)
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CN101790774A (zh
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E·M·萨赫斯
J·G·塞尔迪
E·T·汉特苏
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Massachusetts Institute of Technology
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    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B1/00—Single-crystal growth directly from the solid state
    • C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B28/00—Production of homogeneous polycrystalline material with defined structure
    • C30B28/02—Production of homogeneous polycrystalline material with defined structure directly from the solid state
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body

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  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)
  • Chemical Vapour Deposition (AREA)
  • Silicon Compounds (AREA)
CN2008801047629A 2007-06-26 2008-06-26 半导体晶圆在薄膜包衣中的重结晶以及有关工艺 Expired - Fee Related CN101790774B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US93712907P 2007-06-26 2007-06-26
US60/937129 2007-06-26
PCT/US2008/008030 WO2009002550A1 (en) 2007-06-26 2008-06-26 Recrystallization of semiconductor wafers in a thin film capsule and related processes

Publications (2)

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CN101790774A CN101790774A (zh) 2010-07-28
CN101790774B true CN101790774B (zh) 2012-05-02

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CN2008801047629A Expired - Fee Related CN101790774B (zh) 2007-06-26 2008-06-26 半导体晶圆在薄膜包衣中的重结晶以及有关工艺

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Country Link
US (2) US8633483B2 (https=)
EP (1) EP2168145A4 (https=)
JP (1) JP5591695B2 (https=)
KR (1) KR101527139B1 (https=)
CN (1) CN101790774B (https=)
WO (1) WO2009002550A1 (https=)

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KR20100123745A (ko) 2008-02-29 2010-11-24 코닝 인코포레이티드 순수 또는 도핑된 반도체 물질의 비지지 제품을 제조하는 방법
US7771643B1 (en) 2009-02-27 2010-08-10 Corning Incorporated Methods of making an unsupported article of semiconducting material by controlled undercooling
MY160016A (en) * 2009-03-09 2017-02-15 1366 Tech Inc Methods and apparati for making thin semiconductor bodies from molten material
US8540920B2 (en) * 2009-05-14 2013-09-24 Corning Incorporated Methods of making an article of semiconducting material on a mold comprising particles of a semiconducting material
FR2948492B1 (fr) * 2009-07-24 2012-03-09 Tile S Recristallisation complete de plaquettes semiconductrices
US8480803B2 (en) 2009-10-30 2013-07-09 Corning Incorporated Method of making an article of semiconducting material
US8591795B2 (en) * 2009-12-04 2013-11-26 Corning Incorporated Method of exocasting an article of semiconducting material
US8242033B2 (en) 2009-12-08 2012-08-14 Corning Incorporated High throughput recrystallization of semiconducting materials
EP2619355B1 (en) * 2010-09-23 2015-01-07 Corning Incorporated Technique to modify the microstructure of semiconducting materials
SG190288A1 (en) * 2010-12-01 2013-06-28 1366 Tech Inc Making semiconductor bodies from molten material using a free-standing interposer sheet
US9879357B2 (en) * 2013-03-11 2018-01-30 Tivra Corporation Methods and systems for thin film deposition processes
JP5975785B2 (ja) * 2012-08-14 2016-08-23 株式会社アドテックエンジニアリング 描画装置、露光描画装置、プログラム及び描画方法
CN104047052B (zh) * 2013-03-11 2018-10-19 三菱综合材料株式会社 半导体装置用硅部件及半导体装置用硅部件的制造方法
US9802827B2 (en) 2015-10-09 2017-10-31 Milwaukee Silicon, Llc Purified silicon, devices and systems for producing same
CN114195519A (zh) * 2020-09-17 2022-03-18 山东硅纳新材料科技有限公司 一种先驱体转化碳化硅陶瓷及其制备方法
CN112831185B (zh) * 2021-02-23 2022-09-20 中北大学 梯度导电-均匀导热双功能网络低反射高吸收电磁屏蔽聚合物复合材料

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US4461670A (en) * 1982-05-03 1984-07-24 At&T Bell Laboratories Process for producing silicon devices
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US20050121111A1 (en) * 2001-09-10 2005-06-09 Yasuhisa Oana Thin film semiconductor device having a gate electrode insulator formed through high-heat oxidization

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US20050121111A1 (en) * 2001-09-10 2005-06-09 Yasuhisa Oana Thin film semiconductor device having a gate electrode insulator formed through high-heat oxidization

Also Published As

Publication number Publication date
US9932689B2 (en) 2018-04-03
KR20100038306A (ko) 2010-04-14
CN101790774A (zh) 2010-07-28
JP5591695B2 (ja) 2014-09-17
EP2168145A4 (en) 2011-06-29
HK1146765A1 (en) 2011-07-08
WO2009002550A1 (en) 2008-12-31
US20100295061A1 (en) 2010-11-25
US20140124963A1 (en) 2014-05-08
EP2168145A1 (en) 2010-03-31
JP2010532570A (ja) 2010-10-07
US8633483B2 (en) 2014-01-21
KR101527139B1 (ko) 2015-06-08

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