CN101789358B - 加热处理装置 - Google Patents

加热处理装置 Download PDF

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Publication number
CN101789358B
CN101789358B CN200910129865.7A CN200910129865A CN101789358B CN 101789358 B CN101789358 B CN 101789358B CN 200910129865 A CN200910129865 A CN 200910129865A CN 101789358 B CN101789358 B CN 101789358B
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CN
China
Prior art keywords
chamber
substrate
heating device
heat treatment
processing space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200910129865.7A
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English (en)
Chinese (zh)
Other versions
CN101789358A (zh
Inventor
池田均
冈山智彦
松本浩一
森冈和
目崎芳则
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of CN101789358A publication Critical patent/CN101789358A/zh
Application granted granted Critical
Publication of CN101789358B publication Critical patent/CN101789358B/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches

Landscapes

  • Furnace Details (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN200910129865.7A 2009-01-22 2009-03-30 加热处理装置 Active CN101789358B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-012401 2009-01-22
JP2009012401A JP5274275B2 (ja) 2009-01-22 2009-01-22 加熱処理装置

Publications (2)

Publication Number Publication Date
CN101789358A CN101789358A (zh) 2010-07-28
CN101789358B true CN101789358B (zh) 2014-02-19

Family

ID=42532520

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910129865.7A Active CN101789358B (zh) 2009-01-22 2009-03-30 加热处理装置

Country Status (4)

Country Link
JP (1) JP5274275B2 (https=)
KR (1) KR101591088B1 (https=)
CN (1) CN101789358B (https=)
TW (1) TWI452251B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7272639B1 (en) 1995-06-07 2007-09-18 Soverain Software Llc Internet server access control and monitoring systems
US9900305B2 (en) 1998-01-12 2018-02-20 Soverain Ip, Llc Internet server access control and monitoring systems
US7257132B1 (en) 1998-02-26 2007-08-14 Hitachi, Ltd. Receiver set, information apparatus and receiving system
CN104197668B (zh) * 2014-09-24 2016-03-02 南京耀天干燥设备有限公司 一种改进的低温真空干燥箱
JP7406749B2 (ja) * 2019-06-28 2023-12-28 日新イオン機器株式会社 加熱装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0769391A (ja) * 1993-01-19 1995-03-14 Gold Kogyo Kk 精密部品搬送用トレー
JP2000114151A (ja) * 1998-10-08 2000-04-21 Hitachi Ltd 基板加熱装置
KR100837599B1 (ko) * 2007-03-27 2008-06-13 주식회사 에스에프에이 기판 지지용 스테이지
JP4312787B2 (ja) * 2006-11-15 2009-08-12 東京エレクトロン株式会社 減圧乾燥装置
JP5052152B2 (ja) * 2007-02-13 2012-10-17 株式会社アルバック 真空チャンバ、ロードロックチャンバ、及び処理装置
JP2008311250A (ja) * 2007-06-12 2008-12-25 Tokyo Electron Ltd リフローシステムおよびリフロー方法

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2000-114151A 2000.04.21
JP特开2008-197374A 2008.08.28
JP特开2008-311250A 2008.12.25

Also Published As

Publication number Publication date
CN101789358A (zh) 2010-07-28
KR101591088B1 (ko) 2016-02-02
KR20100086399A (ko) 2010-07-30
JP5274275B2 (ja) 2013-08-28
JP2010171206A (ja) 2010-08-05
TWI452251B (zh) 2014-09-11
TW201028629A (en) 2010-08-01

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