CN101777481B - 用于离子注入系统的混合型磁性/静电偏转器 - Google Patents
用于离子注入系统的混合型磁性/静电偏转器 Download PDFInfo
- Publication number
- CN101777481B CN101777481B CN2009102668721A CN200910266872A CN101777481B CN 101777481 B CN101777481 B CN 101777481B CN 2009102668721 A CN2009102668721 A CN 2009102668721A CN 200910266872 A CN200910266872 A CN 200910266872A CN 101777481 B CN101777481 B CN 101777481B
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- Expired - Fee Related
Links
- 238000005468 ion implantation Methods 0.000 title description 2
- 238000010884 ion-beam technique Methods 0.000 claims abstract description 56
- 230000003213 activating effect Effects 0.000 claims abstract 2
- 239000007943 implant Substances 0.000 claims description 20
- 230000009286 beneficial effect Effects 0.000 claims description 10
- 238000006386 neutralization reaction Methods 0.000 claims description 9
- 230000005686 electrostatic field Effects 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 7
- 230000005591 charge neutralization Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 13
- 238000002513 implantation Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 description 56
- 239000002245 particle Substances 0.000 description 23
- 235000012431 wafers Nutrition 0.000 description 20
- 230000007935 neutral effect Effects 0.000 description 15
- 239000007789 gas Substances 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 12
- 238000011109 contamination Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 239000002019 doping agent Substances 0.000 description 8
- 238000004458 analytical method Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 230000003068 static effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000006399 behavior Effects 0.000 description 5
- 239000003344 environmental pollutant Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 231100000719 pollutant Toxicity 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
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- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
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- 238000004140 cleaning Methods 0.000 description 2
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- 238000009826 distribution Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000005465 channeling Effects 0.000 description 1
- 230000019771 cognition Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/05—Electron or ion-optical arrangements for separating electrons or ions according to their energy or mass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/05—Arrangements for energy or mass analysis
- H01J2237/057—Energy or mass filtering
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Electron Sources, Ion Sources (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/461,702 US6881966B2 (en) | 2003-05-15 | 2003-06-13 | Hybrid magnetic/electrostatic deflector for ion implantation systems |
| US10/461702 | 2003-06-13 | ||
| US10/461,702 | 2003-06-13 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200480016510A Division CN100592459C (zh) | 2003-06-13 | 2004-06-14 | 用于离子注入系统的混合型磁性/静电偏转器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101777481A CN101777481A (zh) | 2010-07-14 |
| CN101777481B true CN101777481B (zh) | 2012-06-27 |
Family
ID=33538973
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102668721A Expired - Fee Related CN101777481B (zh) | 2003-06-13 | 2004-06-14 | 用于离子注入系统的混合型磁性/静电偏转器 |
| CN200480016510A Expired - Fee Related CN100592459C (zh) | 2003-06-13 | 2004-06-14 | 用于离子注入系统的混合型磁性/静电偏转器 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200480016510A Expired - Fee Related CN100592459C (zh) | 2003-06-13 | 2004-06-14 | 用于离子注入系统的混合型磁性/静电偏转器 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6881966B2 (enExample) |
| EP (1) | EP1634316B1 (enExample) |
| JP (2) | JP4650748B2 (enExample) |
| KR (1) | KR101157676B1 (enExample) |
| CN (2) | CN101777481B (enExample) |
| TW (1) | TWI314337B (enExample) |
| WO (1) | WO2004114354A2 (enExample) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4964413B2 (ja) * | 2004-11-30 | 2012-06-27 | 株式会社Sen | イオンビーム/荷電粒子ビーム照射装置 |
| JP5042451B2 (ja) * | 2004-11-30 | 2012-10-03 | 株式会社Sen | ビーム空間電荷中和装置及びこれを備えたイオン注入装置 |
| JP4901094B2 (ja) * | 2004-11-30 | 2012-03-21 | 株式会社Sen | ビーム照射装置 |
| US7598505B2 (en) * | 2005-03-08 | 2009-10-06 | Axcelis Technologies, Inc. | Multichannel ion gun |
| US7361913B2 (en) * | 2005-04-02 | 2008-04-22 | Varian Semiconductor Equipment Associates, Inc. | Methods and apparatus for glitch recovery in stationary-beam ion implantation process using fast ion beam control |
| US7674687B2 (en) * | 2005-07-27 | 2010-03-09 | Silicon Genesis Corporation | Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process |
| US7675047B2 (en) * | 2005-11-15 | 2010-03-09 | Varian Semiconductor Equipment Associates, Inc. | Technique for shaping a ribbon-shaped ion beam |
| US7800082B2 (en) * | 2006-02-15 | 2010-09-21 | Varian Semiconductor Equipment Associates, Inc. | Electromagnet with active field containment |
| US7863157B2 (en) * | 2006-03-17 | 2011-01-04 | Silicon Genesis Corporation | Method and structure for fabricating solar cells using a layer transfer process |
| WO2007118121A2 (en) | 2006-04-05 | 2007-10-18 | Silicon Genesis Corporation | Method and structure for fabricating solar cells using a layer transfer process |
| TWI435378B (zh) * | 2006-04-26 | 2014-04-21 | Axcelis Tech Inc | 劑量均勻性校正方法 |
| JP4828305B2 (ja) * | 2006-05-30 | 2011-11-30 | 株式会社Sen | 静電式ビーム偏向走査装置及びビーム偏向走査方法 |
| US8153513B2 (en) * | 2006-07-25 | 2012-04-10 | Silicon Genesis Corporation | Method and system for continuous large-area scanning implantation process |
| US7227160B1 (en) | 2006-09-13 | 2007-06-05 | Axcelis Technologies, Inc. | Systems and methods for beam angle adjustment in ion implanters |
| US7507978B2 (en) * | 2006-09-29 | 2009-03-24 | Axcelis Technologies, Inc. | Beam line architecture for ion implanter |
| US7750320B2 (en) * | 2006-12-22 | 2010-07-06 | Axcelis Technologies, Inc. | System and method for two-dimensional beam scan across a workpiece of an ion implanter |
| US7586111B2 (en) * | 2007-07-31 | 2009-09-08 | Axcelis Technologies, Inc. | Ion implanter having combined hybrid and double mechanical scan architecture |
| US20090206275A1 (en) * | 2007-10-03 | 2009-08-20 | Silcon Genesis Corporation | Accelerator particle beam apparatus and method for low contaminate processing |
| US20100065761A1 (en) * | 2008-09-17 | 2010-03-18 | Axcelis Technologies, Inc. | Adjustable deflection optics for ion implantation |
| US9443698B2 (en) * | 2008-10-06 | 2016-09-13 | Axcelis Technologies, Inc. | Hybrid scanning for ion implantation |
| US8466431B2 (en) * | 2009-02-12 | 2013-06-18 | Varian Semiconductor Equipment Associates, Inc. | Techniques for improving extracted ion beam quality using high-transparency electrodes |
| US8232532B2 (en) * | 2009-06-23 | 2012-07-31 | Hitachi Global Storage Technologies Netherlands B.V. | Off-axis ion milling device for manufacture of magnetic recording media and method for using the same |
| CN101838797B (zh) * | 2009-12-18 | 2012-07-04 | 上海凯世通半导体有限公司 | 离子注入方法 |
| JP5500500B2 (ja) * | 2010-03-11 | 2014-05-21 | 日新イオン機器株式会社 | 非対称なアインツェルレンズを有するビーム偏向器を備えたイオン注入装置 |
| US8816281B2 (en) | 2011-03-28 | 2014-08-26 | Tokyo Electron Limited | Ion energy analyzer and methods of manufacturing the same |
| CN102751155B (zh) * | 2011-04-22 | 2015-02-11 | 上海凯世通半导体有限公司 | 束流传输系统及其传输方法 |
| JP5800286B2 (ja) * | 2012-03-09 | 2015-10-28 | 日新イオン機器株式会社 | イオン注入装置 |
| US20150228445A1 (en) * | 2014-02-13 | 2015-08-13 | Varian Semiconductor Equipment Associates, Inc. | Method and apparatus for three dimensional ion implantation |
| US9455116B2 (en) | 2014-04-30 | 2016-09-27 | Axcells Technologies, Inc. | Angular scanning using angular energy filter |
| CN105895486A (zh) * | 2014-12-18 | 2016-08-24 | 北京中科信电子装备有限公司 | 一种带电粒子束流偏转磁场结构及应用该结构的离子注入机 |
| CN106653533B (zh) * | 2015-11-04 | 2018-08-14 | 北京中科信电子装备有限公司 | 一种带电粒子束流磁场聚焦结构及应用该结构的离子注入机 |
| JP6854628B2 (ja) * | 2016-11-10 | 2021-04-07 | 東京エレクトロン株式会社 | プラズマ溶射装置及び溶射制御方法 |
| TWI795448B (zh) | 2017-10-09 | 2023-03-11 | 美商艾克塞利斯科技公司 | 用於在角能量過濾器區域中穩定或移除射束線組件上所形成之膜的離子植入系統及方法 |
| US11101134B2 (en) * | 2018-09-10 | 2021-08-24 | Exogenesis Corporation | Method and apparatus to eliminate contaminant particles from an accelerated neutral atom beam and thereby protect a beam target |
| CN109473344B (zh) * | 2018-11-13 | 2021-08-03 | 上海华力微电子有限公司 | 一种离子注入的方法及设备 |
| CN114145078B (zh) | 2019-07-19 | 2025-03-21 | 阳光技术有限责任公司 | 采用气体偏转器板的制造物品、系统和方法 |
| CN112799120B (zh) * | 2019-11-13 | 2024-03-22 | 中国科学院国家空间科学中心 | 一种离子和电子同步测量的双通道静电分析器 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2336029A (en) * | 1998-03-31 | 1999-10-06 | Tadamoto Tamai | Ion implantation, ion source and variable slit mechanism |
| US6313428B1 (en) * | 1999-10-12 | 2001-11-06 | Advanced Ion Beam Technology, Inc. | Apparatus and method for reducing space charge of ion beams and wafer charging |
| CN1405836A (zh) * | 2001-08-09 | 2003-03-26 | 日新电机株式会社 | 在靶上注入离子的装置及其方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| FR2412939A1 (fr) * | 1977-12-23 | 1979-07-20 | Anvar | Implanteur d'ions a fort courant |
| US4737644A (en) * | 1985-10-30 | 1988-04-12 | International Business Machines Corporation | Conductive coated semiconductor electrostatic deflection plates |
| JPH0731996B2 (ja) * | 1985-11-14 | 1995-04-10 | 日新電機株式会社 | イオン注入装置 |
| JP2706471B2 (ja) * | 1987-09-30 | 1998-01-28 | 日本真空技術株式会社 | 静電掃引型イオン注入機用平行掃引装置 |
| EP0334334B1 (en) * | 1988-03-23 | 1995-06-07 | Fujitsu Limited | Photo-cathode image projection apparatus for patterning a semiconductor device |
| JPH02260356A (ja) * | 1989-03-31 | 1990-10-23 | Ulvac Corp | イオン注入装置における平行走査系 |
| GB9005204D0 (en) * | 1990-03-08 | 1990-05-02 | Superion Ltd | Apparatus and methods relating to scanning ion beams |
| US5311028A (en) * | 1990-08-29 | 1994-05-10 | Nissin Electric Co., Ltd. | System and method for producing oscillating magnetic fields in working gaps useful for irradiating a surface with atomic and molecular ions |
| US5132544A (en) * | 1990-08-29 | 1992-07-21 | Nissin Electric Company Ltd. | System for irradiating a surface with atomic and molecular ions using two dimensional magnetic scanning |
| JPH04171648A (ja) * | 1990-11-05 | 1992-06-18 | Nec Corp | イオン注入装置 |
| JPH04171647A (ja) * | 1990-11-05 | 1992-06-18 | Nec Corp | イオン注入装置 |
| US5206516A (en) * | 1991-04-29 | 1993-04-27 | International Business Machines Corporation | Low energy, steered ion beam deposition system having high current at low pressure |
| JPH0547339A (ja) * | 1991-08-21 | 1993-02-26 | Nec Corp | イオン注入装置 |
| JP3448352B2 (ja) * | 1994-07-07 | 2003-09-22 | 株式会社日立製作所 | 半導体装置の製造方法 |
| JP3358336B2 (ja) * | 1994-10-14 | 2002-12-16 | 日新電機株式会社 | イオン注入装置における注入条件異常検出方法 |
| US5468955A (en) * | 1994-12-20 | 1995-11-21 | International Business Machines Corporation | Neutral beam apparatus for in-situ production of reactants and kinetic energy transfer |
| JPH08212965A (ja) * | 1995-01-31 | 1996-08-20 | Ulvac Japan Ltd | イオン注入装置 |
| GB2344214B (en) | 1995-11-08 | 2000-08-09 | Applied Materials Inc | An ion implanter with improved beam definition |
| JPH09213250A (ja) * | 1996-01-30 | 1997-08-15 | Jeol Ltd | 荷電粒子ビームの偏向装置 |
| US5693939A (en) * | 1996-07-03 | 1997-12-02 | Purser; Kenneth H. | MeV neutral beam ion implanter |
| JP3635818B2 (ja) * | 1996-10-03 | 2005-04-06 | 日新電機株式会社 | イオン注入装置 |
| JPH10199460A (ja) * | 1997-01-09 | 1998-07-31 | Jeol Ltd | 集束イオンビーム装置 |
| JP3371753B2 (ja) * | 1997-04-25 | 2003-01-27 | 日新電機株式会社 | イオン注入装置 |
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| JP3449198B2 (ja) * | 1997-10-22 | 2003-09-22 | 日新電機株式会社 | イオン注入装置 |
| JPH11176372A (ja) * | 1997-12-11 | 1999-07-02 | Ulvac Corp | イオン照射装置 |
| GB9813327D0 (en) * | 1998-06-19 | 1998-08-19 | Superion Ltd | Apparatus and method relating to charged particles |
| WO2000017905A1 (en) | 1998-09-24 | 2000-03-30 | Koninklijke Philips Electronics N.V. | Ion implantation device arranged to select neutral ions from the ion beam |
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| JP2001126656A (ja) * | 1999-10-25 | 2001-05-11 | Nissin Electric Co Ltd | イオン注入装置 |
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| US6489622B1 (en) | 2000-03-01 | 2002-12-03 | Advanced Ion Beam Technology, Inc. | Apparatus for decelerating ion beams with minimal energy contamination |
| US6414329B1 (en) * | 2000-07-25 | 2002-07-02 | Axcelis Technologies, Inc. | Method and system for microwave excitation of plasma in an ion beam guide |
| AU2002231340A1 (en) * | 2000-12-27 | 2002-07-08 | Proteros, Llc | Compact beamline and ion implanter system using same |
| JP3869680B2 (ja) | 2001-05-29 | 2007-01-17 | 株式会社 Sen−Shi・アクセリス カンパニー | イオン注入装置 |
| JP3738734B2 (ja) * | 2002-02-06 | 2006-01-25 | 日新電機株式会社 | 静電加速管およびそれを備えるイオン注入装置 |
| EP2800144A1 (en) * | 2013-05-03 | 2014-11-05 | Saint-Gobain Glass France | Back contact substrate for a photovoltaic cell or module |
-
2003
- 2003-06-13 US US10/461,702 patent/US6881966B2/en not_active Expired - Lifetime
-
2004
- 2004-06-11 TW TW093116808A patent/TWI314337B/zh not_active IP Right Cessation
- 2004-06-14 JP JP2006533770A patent/JP4650748B2/ja not_active Expired - Lifetime
- 2004-06-14 WO PCT/US2004/018788 patent/WO2004114354A2/en not_active Ceased
- 2004-06-14 CN CN2009102668721A patent/CN101777481B/zh not_active Expired - Fee Related
- 2004-06-14 CN CN200480016510A patent/CN100592459C/zh not_active Expired - Fee Related
- 2004-06-14 EP EP04755134A patent/EP1634316B1/en not_active Expired - Lifetime
- 2004-06-14 KR KR1020057023293A patent/KR101157676B1/ko not_active Expired - Fee Related
-
2009
- 2009-02-27 JP JP2009046436A patent/JP4645965B2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2336029A (en) * | 1998-03-31 | 1999-10-06 | Tadamoto Tamai | Ion implantation, ion source and variable slit mechanism |
| US6313428B1 (en) * | 1999-10-12 | 2001-11-06 | Advanced Ion Beam Technology, Inc. | Apparatus and method for reducing space charge of ion beams and wafer charging |
| CN1405836A (zh) * | 2001-08-09 | 2003-03-26 | 日新电机株式会社 | 在靶上注入离子的装置及其方法 |
Non-Patent Citations (1)
| Title |
|---|
| JP平10-302707A 1998.11.13 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1634316A2 (en) | 2006-03-15 |
| KR20060018240A (ko) | 2006-02-28 |
| WO2004114354A2 (en) | 2004-12-29 |
| TW200503042A (en) | 2005-01-16 |
| CN101777481A (zh) | 2010-07-14 |
| US20040227105A1 (en) | 2004-11-18 |
| EP1634316B1 (en) | 2011-11-23 |
| CN100592459C (zh) | 2010-02-24 |
| CN1806309A (zh) | 2006-07-19 |
| JP2009117393A (ja) | 2009-05-28 |
| US6881966B2 (en) | 2005-04-19 |
| WO2004114354A3 (en) | 2005-03-17 |
| JP4650748B2 (ja) | 2011-03-16 |
| TWI314337B (en) | 2009-09-01 |
| KR101157676B1 (ko) | 2012-07-03 |
| JP4645965B2 (ja) | 2011-03-09 |
| JP2007517358A (ja) | 2007-06-28 |
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