CN101765809B - 压印方法和使用压印方法的基板的处理方法 - Google Patents

压印方法和使用压印方法的基板的处理方法 Download PDF

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Publication number
CN101765809B
CN101765809B CN2008801009858A CN200880100985A CN101765809B CN 101765809 B CN101765809 B CN 101765809B CN 2008801009858 A CN2008801009858 A CN 2008801009858A CN 200880100985 A CN200880100985 A CN 200880100985A CN 101765809 B CN101765809 B CN 101765809B
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China
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resin material
pattern
area
processing
material layer
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CN101765809A (zh
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奥岛真吾
关淳一
小野治人
中辻七朗
寺崎敦则
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Canon Inc
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Canon Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

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  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2008801009858A 2007-08-03 2008-08-01 压印方法和使用压印方法的基板的处理方法 Expired - Fee Related CN101765809B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2007203044 2007-08-03
JP2007203050 2007-08-03
JP2007-203044 2007-08-03
JP2007-203050 2007-08-03
JP2008-182297 2008-07-14
JP2008182297A JP5473266B2 (ja) 2007-08-03 2008-07-14 インプリント方法および基板の加工方法、基板の加工方法による半導体デバイスの製造方法
PCT/JP2008/064265 WO2009020196A1 (en) 2007-08-03 2008-08-01 Imprint method and processing method of substrate using the imprint method

Publications (2)

Publication Number Publication Date
CN101765809A CN101765809A (zh) 2010-06-30
CN101765809B true CN101765809B (zh) 2012-05-16

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CN2008801009858A Expired - Fee Related CN101765809B (zh) 2007-08-03 2008-08-01 压印方法和使用压印方法的基板的处理方法

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US (1) US8361336B2 (enExample)
EP (1) EP2176709B1 (enExample)
JP (1) JP5473266B2 (enExample)
KR (1) KR101155200B1 (enExample)
CN (1) CN101765809B (enExample)
WO (1) WO2009020196A1 (enExample)

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JP4963718B2 (ja) * 2009-10-23 2012-06-27 キヤノン株式会社 インプリント方法及びインプリント装置、それを用いた物品の製造方法
JP5546893B2 (ja) 2010-02-16 2014-07-09 東京エレクトロン株式会社 インプリント方法
JP5850717B2 (ja) * 2010-12-02 2016-02-03 キヤノン株式会社 インプリント装置、及びそれを用いた物品の製造方法
JP5558327B2 (ja) 2010-12-10 2014-07-23 株式会社東芝 パターン形成方法、半導体装置の製造方法およびテンプレートの製造方法
JP5863286B2 (ja) * 2011-06-16 2016-02-16 キヤノン株式会社 インプリント方法、インプリント装置及び物品の製造方法
JP6056294B2 (ja) * 2011-09-28 2017-01-11 大日本印刷株式会社 パターンの形成方法
TWI570771B (zh) 2011-12-19 2017-02-11 分子壓模公司 使用步進及重複工具之用於壓印微影術之無接縫大區域主模板之製造技術
WO2014145036A1 (en) * 2013-03-15 2014-09-18 The Trustees Of Princeton University Rapid and sensitive analyte measurement assay
JP2015028978A (ja) * 2013-07-30 2015-02-12 大日本印刷株式会社 異物検出方法、インプリント方法及びインプリントシステム
WO2016065308A1 (en) * 2014-10-23 2016-04-28 Board Of Regents, The University Of Texas System Nanoshape patterning techniques that allow high-speed and low-cost fabrication of nanoshape structures
DE102015118991A1 (de) * 2015-11-05 2017-05-11 Ev Group E. Thallner Gmbh Verfahren zur Behandlung von Millimeter- und/oder Mikrometer- und/oder Nanometerstrukturen an einer Oberfläche eines Substrats
JP6655988B2 (ja) * 2015-12-25 2020-03-04 キヤノン株式会社 インプリント装置の調整方法、インプリント方法および物品製造方法
KR102535820B1 (ko) 2016-05-19 2023-05-24 삼성디스플레이 주식회사 임프린트 리소그래피 방법, 임프린트용 마스터 템플릿, 이를 이용하여 제조된 와이어 그리드 편광소자 및 이를 포함하는 표시 기판
KR20180009825A (ko) * 2016-07-19 2018-01-30 삼성디스플레이 주식회사 롤 타입 임프린트 마스터 몰드, 이의 제조 방법 및 이를 이용한 임프린트 방법
MY193101A (en) * 2016-09-27 2022-09-26 Illumina Inc Imprinted substrates
KR20180039228A (ko) 2016-10-07 2018-04-18 삼성디스플레이 주식회사 표시 장치의 제조 방법
KR102256347B1 (ko) * 2017-03-08 2021-05-27 캐논 가부시끼가이샤 패턴 형성 방법, 및 가공 기판, 광학 부품 및 석영 몰드 레플리카의 제조 방법, 및 임프린트 전처리 코팅 재료 및 그와 임프린트 레지스트와의 세트
KR102350286B1 (ko) * 2017-05-15 2022-01-14 캐논 가부시끼가이샤 드롭 레시피를 결정하는 결정 방법, 임프린트 장치 및 물품 제조 방법
TWI646389B (zh) 2017-09-12 2019-01-01 友達光電股份有限公司 壓印模具以及壓印模具製造方法
KR102666843B1 (ko) * 2018-08-31 2024-05-21 삼성디스플레이 주식회사 나노 임프린트용 스탬프 및 이의 제조 방법
CN109188863B (zh) * 2018-11-05 2021-11-26 京东方科技集团股份有限公司 膜层图案化的方法
CN110764364B (zh) * 2019-11-01 2021-05-25 京东方科技集团股份有限公司 一种纳米图案的制作方法、纳米压印基板、显示基板
JP7619015B2 (ja) * 2020-11-18 2025-01-22 大日本印刷株式会社 インプリント装置、インプリント方法及び凹凸構造体の製造方法

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CN1591588A (zh) * 2003-08-26 2005-03-09 Tdk股份有限公司 形成凹凸图案用压印模、凹凸图案形成方法及磁记录媒体
CN1791967A (zh) * 2003-04-25 2006-06-21 分子制模股份有限公司 使用压印平板印刷术形成有台阶的结构的方法
CN1928711A (zh) * 2005-09-06 2007-03-14 佳能株式会社 模具、压印方法和用于生产芯片的工艺
CN101009218A (zh) * 2006-01-24 2007-08-01 株式会社日立制作所 图形形成方法及图形形成装置

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JP4002154B2 (ja) * 2002-08-13 2007-10-31 東芝松下ディスプレイテクノロジー株式会社 液晶表示素子の製造方法およびその装置
US7435074B2 (en) * 2004-03-13 2008-10-14 International Business Machines Corporation Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning
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US20060177532A1 (en) * 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography method to control extrusion of a liquid from a desired region on a substrate
US8999218B2 (en) 2005-06-06 2015-04-07 Canon Kabushiki Kaisha Process for producing member having pattern, pattern transfer apparatus, and mold
JP3958344B2 (ja) * 2005-06-07 2007-08-15 キヤノン株式会社 インプリント装置、インプリント方法及びチップの製造方法
US7927089B2 (en) * 2005-06-08 2011-04-19 Canon Kabushiki Kaisha Mold, apparatus including mold, pattern transfer apparatus, and pattern forming method
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JP4630795B2 (ja) * 2005-10-26 2011-02-09 株式会社東芝 パターン形成方法および磁気記録媒体の製造方法
JP4861044B2 (ja) 2006-04-18 2012-01-25 キヤノン株式会社 基板の加工方法、パターン領域を有する部材の製造方法
KR20070105040A (ko) * 2006-04-25 2007-10-30 엘지.필립스 엘시디 주식회사 레지스트 조성물, 이를 이용한 레지스트 패턴 형성방법 및이를 이용하여 제조된 어레이 기판

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CN1791967A (zh) * 2003-04-25 2006-06-21 分子制模股份有限公司 使用压印平板印刷术形成有台阶的结构的方法
CN1591588A (zh) * 2003-08-26 2005-03-09 Tdk股份有限公司 形成凹凸图案用压印模、凹凸图案形成方法及磁记录媒体
CN1928711A (zh) * 2005-09-06 2007-03-14 佳能株式会社 模具、压印方法和用于生产芯片的工艺
CN101009218A (zh) * 2006-01-24 2007-08-01 株式会社日立制作所 图形形成方法及图形形成装置

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Publication number Publication date
US8361336B2 (en) 2013-01-29
EP2176709A1 (en) 2010-04-21
KR20100047268A (ko) 2010-05-07
US20110042352A1 (en) 2011-02-24
WO2009020196A1 (en) 2009-02-12
EP2176709B1 (en) 2012-07-18
CN101765809A (zh) 2010-06-30
JP2009060084A (ja) 2009-03-19
JP5473266B2 (ja) 2014-04-16
KR101155200B1 (ko) 2012-06-13

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