CN101765676A - Multipurpose carrier of vacuum vapor deposition material and method thereof - Google Patents
Multipurpose carrier of vacuum vapor deposition material and method thereof Download PDFInfo
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- CN101765676A CN101765676A CN200880100645A CN200880100645A CN101765676A CN 101765676 A CN101765676 A CN 101765676A CN 200880100645 A CN200880100645 A CN 200880100645A CN 200880100645 A CN200880100645 A CN 200880100645A CN 101765676 A CN101765676 A CN 101765676A
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- vacuum vapor
- vapor deposition
- deposition material
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- described metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to a multipurpose carrier for vacuum vapor deposition material and manufacturing method thereof. A multipurpose carrier for vacuum vapor deposition materials of the present invention comprises: an outer container made of metallic materials such as stainless steel, iron, copper, molybdenum, tungsten, or titanium etc.; an inner filler such as carbon fiber felt, carbon fiber or metal felt, etc.; and a mesh and a washer which are disposed thereon and are made of metallic materials such as stainless steel, iron, copper, molybdenum, tungsten, or titanium etc., wherein these elements are assembled or welded as a securely-integrated structure. The technical feature of the present invention is that various types of deposition materials with various functions, which are impregnated or filled in a multipurpose carrier of the present invention, can be uniformly deposited as a very thin-film by an electron-beam heating method or a resistance heating method in a vacuum vapor deposition device, wherein the deposition material is composed of organic and/or inorganic compounds which has a solid state such as powder and particle, a liquid state having various viscosity, and a semi-solid state such as slurry.
Description
Technical field
Target of the present invention is that dipping or various types of deposition material of being filled in the multipurpose carrier of the present invention can deposit by electron beam heating or electrical resistance heating in vacuum vapor deposition equipment equably, wherein deposition material is made of organic and/or mineral compound, and it has solid-state (such as powder and particulate state), liquid state and semi-solid state (such as pulpous state) that viscosity is different.
Background technology
The multipurpose carrier that is used for vacuum vapor deposition material of the present invention comprises: by the outside vessel that metallic substance is made, and all stainless steels in this way of described metallic substance, iron, copper, molybdenum, tungsten or titanium etc.; Inner stuffing is such as carbon fiber felt, carbon fiber or metal felt etc.; And net and packing ring placed on it and that make by metallic substance (such as stainless steel, iron, copper, molybdenum, tungsten or titanium etc.), wherein these elements are assembled or be welded into firm bonded structure.
Technical characterictic of the present invention is that dipping or the various types of deposition material with various functions that are filled in the multipurpose carrier of the present invention can be deposited as extremely thin film by electron beam heating or electrical resistance heating equably in vacuum vapor deposition equipment, wherein deposition material is made of organic and/or mineral compound, and it has solid-state (such as powder and particulate state), liquid state and semi-solid state (such as pulpous state) that viscosity is different.
Recently, having carried out various trials comes in display application and portable electronic instrument is used in (such as mobile phone, MP3 player, PMP and portable computer) and vacuum vapor deposition technology is used for antireflection, optical filtering in optical lens/strainer (such as glass lens), absorption/reflectivity is regulated and color deposition etc.In vacuum vapor deposition technology, the thin film vapor deposition layer that is made of the inorganic powder/particle material is formed in the substrate that is made of glass, plastics or metal, and described inorganic powder/particle material is an oxide compound, such as silicon oxide, titanium oxide and zirconium white; Fluorochemical is such as magnesium fluoride; Metal is such as chromium, nickel, aluminium and SUS.
Yet the vapor deposition layer that is made of metal and metal oxide externally suffers erosion easily in the environment or pollutes, and this causes layer to reduce.For trapping layer reduces, attempted forming hydrophobic membrane or waterproof membrane by on layer, applying organic materials.
Be the vapour deposition organic materials, can in vacuum apparatus, use the carrier that is impregnated with the organic deposit material.Korean Utility Model Application discloses for 20-2003-0015078 number a kind of by the carrier of making through the porous ceramic film material of high-temperature heat treatment.And korean patent application discloses a kind of metal-powder and metal felt through high-temperature heat treatment for 10-2003-0058223 number.
Usually, wherein use the vaccum gas phase sedimentation method of electron beam and be used to depositing operation such as the such thermology method of electrical resistance heating.With regard to the convenience and automatization of depositing operation, preferably use the deposition method of electron beam.Yet owing to be used in the organic deposit properties of materials in the vacuum vapor deposition technology and wherein flood the carrier of organic deposition material, electrical resistance heating obtains enforcement more widely at present.
Though cellular ceramic substrate has certain chemical stability, necessary control of density is because must exist the hole to flood organic gas-phase depositing materials in carrier inside.And must take in preventing structure and in the impregnation technology of liquid organic deposit material, leak.
Because the characteristic of stupalith, cellular ceramic substrate are broken easily when being subjected to external impacts.Therefore, need carry out high-temperature heat treatment and prevent any infringement that causes because of this friability.But the thermal treatment meeting increases density, and is difficult to obtain required porosity (promptly flooding the space).
In addition, the low-temperature heat treatment that is used to obtain required porosity reduces the hardness of ceramic monolith, so ceramic monolith exists frangible and can and produce the shortcoming of dust between the shelf lives in processing, transportation.
When under can the high-output power of heating ceramic, using the electron beam heating of one of vaccum gas phase sedimentation method, the dust of cellular ceramic substrate can mix with deposition material, and be deposited in the substrate the feasible functional performance that can not realize needed deposit film fully.
Just as cellular ceramic substrate, metal-powder and metal felt also need to experience high-temperature heat treatment to form porousness.Therefore, need in manufacturing process, expend more considerable time and cost.And, owing to form pressure and plasticity temperature, can not on whole carrier, obtain to flood porosity uniformly, this has reduced the efficient of organic vapor phase deposition material.
In addition, if use porous ceramic film material, metal-powder and metal felt and liquid organic vapor phase deposition material by oversteeping, then they solidify when being exposed to the carrier outside, thereby understand the oxidation of suppressed by vector air outside, and are decomposed by electron beam.Therefore, above-mentioned these problems have hindered the formation of high quality thin film.
If porous ceramics, metal-powder or metal felt are to be heated by resistive method but not vaccum gas phase sedimentation method (being electron beam heating) is handled, then there are some defectives, that is: must use and at the heat conduction ship that uses several times replacing afterwards to make by tungsten, tantalum or molybdenum.Therefore, there is additional cost and the inconvenience that causes because of more changing ships.
In addition, electrical resistance heating makes and is difficult to realize automatic operation, so this technology must manual operation.Than electron beam heating, electrical resistance heating is difficult to obtain uniform film.
For agglomerating cellular ceramic substrate, metal-powder carrier and metal felt carrier, they can only be with liquid organic deposit material soaking in wherein.Because void size can not be regulated easily, therefore in vacuum vapor deposition, can not use thin solid-state organic deposit material.In addition, above-mentioned carrier can not together use with solid-state organic vapor phase deposition material.Therefore, their use range is very limited.
Summary of the invention
Multipurpose carrier of the present invention has solved the existing problem that comes from cellular ceramic substrate, metal-powder carrier and metal felt carrier, and has provided a kind of vacuum vapor deposition carrier that suitable convenience and widespread use are provided.
Because carrier of the present invention is a upper and lower part sealed whole body structure, therefore can not produce dust, and can be to its applying electronic bundle heating method and electrical resistance heating.
Technical characterictic of the present invention is that dipping or the various types of deposition material with various functions that are filled in the multipurpose carrier of the present invention can be deposited as extremely thin film by electron beam heating or electrical resistance heating equably in vacuum vapor deposition equipment, wherein deposition material is made of organic and/or mineral compound, and it has solid-state (such as powder and particulate state), liquid state and semi-solid state (such as pulpous state) that viscosity is different.
Preferred embodiment according to vacuum vapor deposition carrier of the present invention comprises: the external metallization container of the cylindrical or hexahedron that constitutes by stainless steel, iron, copper, molybdenum, tungsten or titanium, and it can give security and can conduct heat for processing, storage and transportation; And, wherein make the upper limb of metal vessel form ring-type downwards to press down metal washer by the metal washer that stainless steel, iron, copper, molybdenum, tungsten or titanium constitute; Perhaps wherein metal washer is welded on the metal vessel.
Multipurpose carrier of the present invention has following effect:
(1) with deposition material dipping or be filled in the dipping or fill process in the carrier, the loss of deposition material can be prevented from, vacuum moulding machine efficient with deposition material of various functions and type can obtain maximization, wherein deposition material is made of organic and/or mineral compound, and it has solid-state (such as powder and particulate state), liquid state and semi-solid state (such as pulpous state) that viscosity is different.
(2) electron beam heating and electrical resistance heating all can be used to carrier of the present invention.
(3) because container is made by metallic substance, therefore carrier of the present invention can recycle, and is reliable in processing, storage and transportation technology.
(4) in multi-usage vacuum vapor deposition carrier of the present invention, can flood liquid organic/inorganic deposition material, and solid-state organic/inorganic deposition material and semi-solid state SOLID ORGANIC/inorganic deposition material can obtain using by mixing with weighting material and being filled in the carrier.
Description of drawings
Fig. 1 is the decomposition diagram of carrier of the present invention.
＜list of parts 〉
10 external metallization containers
20 carbon fibers (felt) weighting material
30 carbon felts
40 metal protection nets
50 metal washers
Embodiment
As shown in Figure 1, basic structure of the present invention has columniform outside vessel 10, and it is made of stainless steel, iron, copper, molybdenum, tungsten or titanium, and thickness is 0.10mm～0.50mm, and diameter is 5mm～60mm.
Preferably, thickness can be 0.15mm～0.35mm, and diameter can be 10mm～25mm.If outside vessel is thin excessively, then if easy deformation blocked up, then can make post-production (such as assembling and welding) more difficult.
The height of outside vessel is 4mm～12mm, preferred 6mm～8mm.
Outside vessel can be protected the weighting material that is contained in wherein.And can prevent fully that loss from appearring in deposition material, and wherein deposition material is made of organic and/or mineral compound, and it has solid-state (such as powder and particulate state), liquid state and semi-solid state (such as pulpous state) that viscosity is different.The outside vessel that is made of stainless steel can conduct heat effectively, and no matter what use is electron beam heating or electrical resistance heating.
It is stainless steel that the material of outside vessel is not only limited to, but comprises other metallic substance, such as iron, copper, molybdenum, tungsten or titanium and the material that similarly can effectively conduct heat.
Inner stuffing 20 as one of critical elements of the present invention chooses from carbon fiber felt, carbon fiber, carbon dust or metal felt/metal-powder (such as iron, copper and stainless steel) rightly according to the coated material characteristic.
Preferably, extremely light carbon fiber and carbon fiber felt are very effective, because they are highly stable and have a high heat transfer efficiency for outside atmosphere.
In order to control void size and porosity, can only use a kind of carbon fiber separately with wide diameter scope, perhaps use at least two kinds of carbon fibers.
Preferably, diameter is 20 μ m～500 μ m, preferred 100 μ m～300 μ m.
Usually can control void size and porosity by carbon fiber diameter and carbon fiber content.Extra control to void size and porosity can realize by following manner, carbon fiber is inserted metal vessel 10 that is:; Stainless (steel) wire and packing ring are placed on the carbon fiber; Make the upper limb of metal vessel 10 form ring-type downwards; With the density of regulating weighting material (being carbon fiber) by the height that reduces metal vessel.Therefore, can be according to the content of deposition material and the size and the porosity in density control space, wherein deposition material is made of organic and/or mineral compound, and it has solid-state (such as powder and particulate state), liquid state and semi-solid state (such as pulpous state) that viscosity is different.
And, because carbon fiber has outstanding heat transfer efficiency, therefore it has the following advantages, that is: can be effectively with the heat transferred deposition material that produces by electrical resistance heating or electron beam heating, thus allow the deposition material rapid evaporation and make the thin film deposition maximizing efficiency.
Carbon fiber can standing storage, because it can remain unchanged with respect to outside atmosphere, and unlike metallic substance, therefore carrier of the present invention can be recycled after the experience high-temperature heat treatment.
Be provided with wire netting 40 and metal washer 50 above weighting material, they are made of stainless steel, iron, copper, molybdenum, tungsten or titanium.
Wire netting 40 prevents to separate with container as the fine carbon of weighting material.
In order to prevent that more effectively weighting material from separating or prevent that weighting material from disperseing in vacuum vapor deposition technology, can on fine carbon, place thin carbon fiber felt 30, it is inserted into container to cover fine carbon.
When making the container upper limb form annular downwards, metal washer 50 presses down all weighting materials, therefore can finally control the size and the porosity in space by the carbon fiber of pressurized.
Can under the situation of the size of having considered the vacuum vapor deposition chamber and the size of height and outside vessel, determine the size in hole rightly.Hole dimension is 3mm～20mm, preferred 5mm～8mm.
The size in the hole of packing ring is extremely important, thereby because it has determined the organic deposit material of evaporation to disperse to move to as the crow flies suprabasil angle in vacuum vapor deposition technology, this makes the loss minimum of organic vapor phase deposition material.
The manufacturing process of multi-usage vacuum vapor deposition carrier of the present invention is described below:
＜example 1 〉
＜example 2 〉
The vacuum vapor deposition material unit that produces in example 1 is recharged in the electron beam port of vacuum sediment equipment.Vacuum tightness at vacuum vapor deposition equipment is 5 * 10
-5Torr and electron beam current are under the situation of 20mA, and the diameter of electron beam is set as 30mm.Vacuum vapor deposition material is applied on glass, PMMA, PC and the PET plate.
＜example 3 〉
The vacuum vapor deposition material unit that produces in example 1 is recharged in the molybdenum heating unit ship of vacuum vapor deposition equipment, and is that 50mA and vacuum tightness are 5 * 10 at electric current
-5Be applied under the situation of torr on glass, PMMA, PC and the PET plate.
Claims (7)
1. carrier that is used for vacuum vapor deposition, it comprises:
Deposition material is received in wherein metal vessel; And
Place the metal washer of the described deposition material top of described metal vessel,
Wherein, the upper limb of described metal vessel forms annular downwards; And
Wherein, by the annular upper limb that described metal washer is depressed on the described deposition material described metal washer is fixed in the described metal vessel.
2. carrier that is used for vacuum vapor deposition, it comprises:
Deposition material is received in wherein metal vessel; And
Place the metal washer of the described deposition material top of described metal vessel,
Wherein, described metal washer is welded on the described metal vessel to push down described deposition material.
3. the carrier that is used for vacuum vapor deposition as claimed in claim 1 or 2, it also comprises: wire netting, described wire netting are set between described deposition material and the described metal washer to prevent that described deposition material from separating with described metal vessel.
4. the carrier that is used for vacuum vapor deposition as claimed in claim 1 or 2, wherein, described metal vessel, described metal washer and described wire netting are made of stainless steel, iron, copper, molybdenum, tungsten or titanium.
5. the carrier that is used for vacuum vapor deposition as claimed in claim 1 or 2, it also comprises: carbon fiber felt, described carbon fiber felt are set between described deposition material and the described metal washer to prevent that described deposition material from separating with described metal vessel.
6. the carrier that is used for vacuum vapor deposition as claimed in claim 1 or 2, wherein, described metal vessel is cylindrical or hexahedron.
7. the carrier that is used for vacuum vapor deposition as claimed in claim 1 or 2, wherein, the described metal washer heart therein has the hole.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2007-0075000 | 2007-07-26 | ||
| KR1020070075000A KR101025005B1 (en) | 2007-07-26 | 2007-07-26 | Multipurpose carrier of vacuum vapor deposition material and method thereof |
| PCT/KR2008/004352 WO2009014398A2 (en) | 2007-07-26 | 2008-07-25 | Multipurpose carrier of vacuum vapor deposition material and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101765676A true CN101765676A (en) | 2010-06-30 |
| CN101765676B CN101765676B (en) | 2012-04-11 |
Family
ID=40281990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801006455A Active CN101765676B (en) | 2007-07-26 | 2008-07-25 | Multipurpose carrier of vacuum vapor deposition material and method thereof |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5188575B2 (en) |
| KR (1) | KR101025005B1 (en) |
| CN (1) | CN101765676B (en) |
| HK (1) | HK1145093A1 (en) |
| WO (1) | WO2009014398A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114134464A (en) * | 2021-10-26 | 2022-03-04 | 惠州市华阳光学技术有限公司 | Structural color pigment and preparation method thereof |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9972128B2 (en) | 2012-07-20 | 2018-05-15 | The University Of British Columbia | Methods and systems for generating polycubes and all-hexahedral meshes of an object |
| KR20140013471A (en) | 2012-07-24 | 2014-02-05 | 주식회사 쎄코 | Heating assembly for vacuum deposition and vacuum deposition apparatus having the same |
| KR101355208B1 (en) * | 2012-08-02 | 2014-01-27 | 주식회사 유라마 | Organic matter carrier housing for vacuum metalizing |
| KR101480726B1 (en) * | 2012-12-21 | 2015-01-09 | 주식회사 선익시스템 | Vacuum Evaporating Apparatus |
| WO2015061914A1 (en) | 2013-11-04 | 2015-05-07 | The University Of British Columbia | Methods and systems for generating polycube segmentations from input meshes of objects |
| KR101404047B1 (en) | 2013-11-29 | 2014-06-10 | (주)파인켐텍 | Container of vacuum deposition material |
| JP6694673B2 (en) * | 2014-06-02 | 2020-05-20 | キヤノンオプトロン株式会社 | Evaporation source and vapor deposition method using the same |
| KR200480271Y1 (en) | 2014-11-26 | 2016-05-18 | (주)파인켐텍 | Container For Vacuum Deposition Material |
| JP6896629B2 (en) * | 2014-12-19 | 2021-06-30 | タタ、スティール、ネダーランド、テクノロジー、ベスローテン、フェンノートシャップＴａｔａ Ｓｔｅｅｌ Ｎｅｄｅｒｌａｎｄ Ｔｅｃｈｎｏｌｏｇｙ Ｂｖ | Filter device for removing particles from steam stream |
| US10210657B2 (en) | 2015-07-24 | 2019-02-19 | The University Of British Columbia | Methods and systems for hex-mesh optimization via edge-cone rectification |
| KR20170116398A (en) * | 2016-04-11 | 2017-10-19 | 주식회사 쎄코 | Carrier for deposition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02197564A (en) * | 1989-01-27 | 1990-08-06 | Nippon Dempa Kogyo Co Ltd | Vacuum deposition device |
| JPH0783913B2 (en) * | 1990-04-17 | 1995-09-13 | 国産部品工業株式会社 | Wire mesh porous body for engine muffler and method of manufacturing the same |
| JPH04272169A (en) * | 1991-02-25 | 1992-09-28 | Shimadzu Corp | Impregnating type vacuum deposition device |
| JPH04285157A (en) * | 1991-03-12 | 1992-10-09 | Hitachi Ltd | Method for vaporizing metal |
| JP2892620B2 (en) * | 1996-06-17 | 1999-05-17 | 株式会社東京製品開発研究所 | Vacuum evaporation method for optical parts using porous ceramics sintered compact impregnated with organic film-forming substance for optical parts |
| JP2001183503A (en) * | 1999-12-24 | 2001-07-06 | Toray Ind Inc | Method of producing optical article |
| JP2001323367A (en) * | 2000-03-09 | 2001-11-22 | Junji Kido | Method for vapor depositing organic compound, and method for purifying organic compound |
| JP2001335920A (en) * | 2000-05-26 | 2001-12-07 | Toray Ind Inc | Vapor deposition source, optical article and the producing method |
| JP2002335920A (en) * | 2001-05-17 | 2002-11-26 | House Foods Corp | White color-based liquid food |
| JP2003264079A (en) * | 2002-03-11 | 2003-09-19 | Sanyo Electric Co Ltd | Evaporation source for evaporator, evaporator using the same, and manufacturing method of organic el element |
| KR200322862Y1 (en) * | 2003-05-16 | 2003-08-14 | 김영정 | Porous Ceramic Tablet for Vacuum Coating |
| KR100528892B1 (en) * | 2003-08-22 | 2005-11-15 | 신도현 | Vehicle for carrying repellent agent for coating treatment under vacuum state |
| JP4001296B2 (en) * | 2005-08-25 | 2007-10-31 | トッキ株式会社 | Method and apparatus for vacuum deposition of organic materials |
| JP2008150678A (en) * | 2006-12-19 | 2008-07-03 | Sony Corp | Evaporation source, vapor deposition apparatus, vapor deposition method, apparatus for manufacturing organic electroluminescence display unit, and method for manufacturing organic electroluminescence display unit |
-
2007
- 2007-07-26 KR KR1020070075000A patent/KR101025005B1/en active IP Right Grant
-
2008
- 2008-07-25 CN CN2008801006455A patent/CN101765676B/en active Active
- 2008-07-25 WO PCT/KR2008/004352 patent/WO2009014398A2/en active Application Filing
- 2008-07-25 JP JP2010518125A patent/JP5188575B2/en active Active
-
2010
- 2010-12-14 HK HK10111608.9A patent/HK1145093A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114134464A (en) * | 2021-10-26 | 2022-03-04 | 惠州市华阳光学技术有限公司 | Structural color pigment and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101025005B1 (en) | 2011-03-24 |
| WO2009014398A2 (en) | 2009-01-29 |
| WO2009014398A3 (en) | 2009-04-02 |
| JP2010534767A (en) | 2010-11-11 |
| JP5188575B2 (en) | 2013-04-24 |
| CN101765676B (en) | 2012-04-11 |
| HK1145093A1 (en) | 2011-04-01 |
| KR20090011432A (en) | 2009-02-02 |
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