JPH02197564A - Vacuum deposition device - Google Patents

Abstract

PURPOSE:To form a high-quality vapor-deposited face without causing bumping by impregnating a packing material having the fine gaps with vapor depositing metal and storing this packing material in a vapor deposition boat and covering the opening part of this boat by a network screen. CONSTITUTION:A vapor deposition boat 11 is maked by forming a band-shaped metallic plate (preferably W) into a boat-form storage vessel 13. A packing material 14 such as metal which has fine gaps and is unreactive with vapor depositing metal 12 is arranged in this storage vessel 13. Further the packing material 14 formed by rounding a tangsten wire having about 0.2mm diameter into a lumpy shape is preferably utilized. Then the upper opening part of the vapor deposition boat 11 is covered by a network screen 15 (the tungsten wire having about 0.3mm diameter is woven into a mesh of about 3mm). The lumps 17 of vapor deposition metal 12 are arranged on the screen 15 and melted and the packing material 14 is impregnated therewith. A high-quality vapor deposited face is formed on the material to be vapor-deposited without causing bumping, etc., by providing the electrodes 16 used as the clampers in combination to both end parts of the boat 11 constituted by such a way and conducting electricity.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a vacuum evaporation apparatus that can prevent bumping of evaporated metal and obtain a high-quality evaporation surface.

(Technical background of the invention and its problems) Conventionally, for example, in the manufacturing process of a crystal resonator, when forming electrodes on the surface of a crystal plate, a vacuum deposition apparatus was used to deposit a metal.

In such a vacuum evaporation apparatus, a mask is placed between the quartz crystal plate and the evaporation source in a vacuum, and the evaporation area is regulated by a hole in the mask, and an electrode of a predetermined shape is placed on the surface of the quartz plate. I am trying to evaporate it to

By the way, in such a vapor deposition apparatus, for example, an electric current is passed through the vapor deposited metal stored in the vapor deposition boat, and the Joule heat generated at this time heats the vapor deposited metal to obtain metal vapor.

FIGS. 3A, 3S, and 3C are views showing examples of different conventional vapor deposition boats.

That is, the vapor deposition boat 1 shown in FIG. 3a is of an open boat type, and has a boat-shaped storage tank 2 for storing evaporated metal in the center of a strip-shaped metal plate.

Such a vapor deposition method (1) has a simple structure, but when vapor-deposited metal is heated and melted, it causes so-called bumping, in which droplets of vapor-deposited metal are scattered when the gas component leaves the surface of the molten metal in a vacuum. This tends to occur, and large particles of the vapor-deposited metal may adhere to the vapor-deposited surface, resulting in a problem that the quality of the vapor-deposited surface is low.

In addition, in order to obtain a high-quality evaporation surface, two layers of baffle plates 3 and 4 are provided on the front surface of the evaporation metal storage tank 2 of the evaporation board 1, as shown in FIG. The evaporation source cannot be seen directly from the evaporation material.

In this way, even if bumping occurs in the deposited metal, large particles will not reach the deposition surface, making it an ideal deposition source, but the rate at which the deposited film is formed on the object to be deposited, that is, the deposition rate, is slow. Therefore, there is a problem that the time required to form a desired deposited film becomes longer.

Furthermore, the one shown in FIG.
This prevents large particles of deposited metal from reaching the deposition surface.

However, in such a device, the electrical resistance of the molten evaporated metal in the evaporation boat L is significantly smaller than that of the mesh 5, so most of the current flows through the molten evaporated metal and does not flow into the mesh 5, so the mesh The temperature of No. 5 hardly rises.

Therefore, the generated metal vapor adheres to the mesh having a low temperature, and in extreme cases, there is a problem that the mesh may become clogged. In order to solve this problem, it is necessary to insulate the deposition boat L and the mesh 5 from each other using, for example, two power supplies, and to control the heating by applying electricity to each separately, resulting in a complicated structure and high cost. become.

(Object of the Invention) The present invention has been made in view of the above circumstances, and can reliably prevent the deterioration of the quality of the vapor deposition surface due to bumping of the vapor deposited metal.
The object of the present invention is to provide a vapor deposition apparatus that can perform high-quality vapor deposition.

(Summary of the Invention) The present invention is characterized in that a filler having narrow gaps is impregnated with vapor-deposited metal and stored in a vapor-deposition boat, and the opening of the vapor-deposition boat is covered with a mesh screen. It is.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to a concave surface. FIG. 1 is a perspective view showing an example of a vapor deposition boat of a vapor deposition apparatus according to an embodiment of the present invention, and FIG. 2 is a side sectional view of the vapor deposition boat.

That is, the vapor deposition boat 11 is configured to energize itself and heat the vapor deposited metal using the Joule heat generated at this time. Therefore, in such a device, the evaporation boat 11 has conductivity and does not chemically react with the metal vapor even when heated to a high temperature to generate metal vapor from the evaporated metal 12, or does not react chemically with the metal vapor, or does not react with the metal vapor at a very high temperature. The preferred material is tungsten.

These metal plates are formed into a strip shape, and a boat-shaped storage tank 13 is formed approximately in the center thereof.

Then, a filler 14 having minute gaps and made of a metal or inorganic material that does not react with the vapor-deposited metal is placed in the storage tank 13 of the vapor-deposited metal 11, and is impregnated with a vapor-deposited metal such as gold or silver. I'm trying to save it.

The filler 14 is, for example, a suitable amount of tungsten wire with a diameter of 0.2 mm rolled into a lump.

In this case, if the density of the filler 14 is too high, the amount that can be impregnated with the vapor-deposited metal will be reduced, requiring frequent replenishment, and if the density is too low, the effect of preventing bumping will be reduced, so it is necessary to adjust the density to an appropriate value. There is.

In order to prevent the filler 14 in the deposition boat 11 from falling off during transportation, installation, etc., the upper opening is covered with a mesh screen 15. This screen 15 is made of, for example, 0.3 mm diameter tungsten wire woven into a mesh size of about 3 mm.

The upper surface of the filler 14 and the lower surface of the screen 15 are in a positional relationship in which they are almost in contact with each other, and the space between the upper surface of the screen 15 and the upper end of the opening surface of the vapor deposition bow 11 is necessary for impregnating the filler 14 with the vapor-deposited metal. A space of M amount is formed by providing a gap.

In this way, it is possible to prevent the vapor-deposited metal mass 17 from spilling out from the vapor-deposited bowl 11 when it is melted and impregnated into the filler 14, which will be described later.

A damper/electrode 1 is provided at both ends of the vapor deposition board 11.
6 is provided and is fastened to a terminal (not shown) to supply power therefrom and to hold the vapor deposition board 11 itself.

Note that the vacuum evaporation apparatus is, of course, provided with a vacuum pump for reducing the pressure inside the container to a vacuum, a holding mechanism for holding the object to be evaporated, a mask for regulating the evaporation site with respect to the object to be evaporated, and the like.

With such a configuration, a shutter (not shown) is closed to prevent the vapor-deposited metal 12 heated by the vapor-depositing board 11 from scattering to the outside, and the vapor-deposited metal is placed on the screen 15 as shown by the broken line 17 in FIG. When the lumps are arranged and energized, the vapor-deposited metal lump 17 generates heat, melts, falls under its own weight, and can be impregnated into the gaps in the filler 14. If the shutter is opened in this state and the metal vapor generated is blown onto the object for vapor deposition, a high quality vapor deposition surface can be obtained without bumping or the like.

According to the above-mentioned embodiment, the vapor deposition rate is not particularly reduced, and bumping of the molten vapor-deposited metal can be prevented, so that a high-quality vapor-deposited surface can be obtained.

Note that the present invention is not limited to the above embodiments,
For example, in the above embodiment, a lump of tungsten wire is used as the filler, but it is also possible to use a small granular material, for example, a molybdenum ball with a diameter of about 3 mm.

In this case, the mesh size of the screen must be approximately 2 mm to prevent the above-mentioned particulate matter from spilling out.

Furthermore, when using gold, silver, or the like as the vapor-deposited metal, a conductive metal such as tungsten, molybdenum, or tantalum, which does not react with these vapor-deposited metals, can also be used as the vapor-deposition boat.

Furthermore, in the above embodiments, the deposition boat is heated by being directly energized, but the boat may be heated by other heat sources. In this case, an insulating material such as ceramic can also be used as the vapor deposition boat.

(Effects of the Invention) As detailed above, according to the present invention, with a simple configuration,
It is possible to provide a vapor deposition apparatus that can reliably prevent bumping of vapor-deposited metal without reducing the vapor deposition rate, and thereby obtain a high-quality vapor deposition surface.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a vapor deposition boat according to an embodiment of the present invention, Fig. 2 is a side sectional view of the vapor deposition boat shown in Fig. 1, and Fig. 3 a.
, b, and c are perspective views showing different conventional vapor deposition boats. 1st r! ! 1 1shi 12・ 13・ 14・ 15・ ... Deposition boat ... Deposited metal ... Storage tank ... Filler ... Screen 2nd rM q

Claims (1)

[Claims] A vacuum evaporation system comprising: a evaporation boat for impregnating and storing evaporation metal in a filler having minute gaps; and a mesh screen covering an opening of the evaporation boat. Device.